CN217036302U

CN217036302U - Laser device

Info

Publication number: CN217036302U
Application number: CN202220635087.XU
Authority: CN
Inventors: 王文华; 沈昌荣
Original assignee: Makeblock Co Ltd
Current assignee: Makeblock Co Ltd
Priority date: 2022-03-22
Filing date: 2022-03-22
Publication date: 2022-07-22
Anticipated expiration: 2032-03-22

Abstract

The application provides a laser device, laser device includes casing and laser structure, the laser structure accept with sliding in the casing. The laser structure comprises a laser and a heat dissipation component, the laser is contained in the shell, and the laser comprises a first side surface, a second side surface and a third side surface which are connected; the heat dissipation member is fixed on the laser and is contained in the shell in a sliding mode, and the heat dissipation member covers the first side face, the second side face and the third side face. The laser device provided by the application covers the heat dissipation component on the first side face, the second side face and the third side face of the laser structure, so that the heat dissipation area of the laser structure is increased, the heat dissipation of the laser structure is facilitated, and the heat dissipation performance of the laser device is improved.

Description

Laser device

Technical Field

The application belongs to the technical field of laser heat dissipation, and particularly relates to a laser device.

Background

The laser device uses laser as processing medium to achieve the purpose of processing. With the development of laser processing equipment, the requirements of a processing center on the comprehensive performance of a laser processing device are higher and higher, and as a laser structure in the laser device generates heat in the processing process, the heat dissipation performance of the laser device in the processing process becomes an important reference item for evaluating the comprehensive performance of the laser device. Traditional laser device is direct to set up the heat dissipation scale on laser structure's shell, because there is certain clearance between the heat dissipation scale, can not cover completely on laser structure's side, laser structure's heat radiating area is little, is unfavorable for laser structure's heat dissipation.

SUMMERY OF THE UTILITY MODEL

To the not enough of prior art existence, this application provides one kind can increase heat radiating area, and then improves heat dispersion's laser device.

The application provides a laser device includes:

a housing; and

a laser structure, slidingly received in the housing, comprising,

the laser is accommodated in the shell and comprises a first side surface, a second side surface and a third side surface which are connected; and

and the heat dissipation component is fixed on the laser and is contained in the shell in a sliding manner, and the heat dissipation component covers the first side surface, the second side surface and the third side surface.

In a possible embodiment, the heat dissipation component includes a first heat dissipation element, a second heat dissipation element, and a fixing element, the first heat dissipation element and the second heat dissipation element are fixedly connected by the fixing element, the first heat dissipation element and the second heat dissipation element enclose a heat dissipation cavity, the laser is accommodated and fixed in the heat dissipation cavity, the first heat dissipation element covers the first side surface and the second side surface, and the second heat dissipation element covers the third side surface.

In a possible implementation manner, one side of the first heat dissipation element, which deviates from the first side surface, is provided with a first heat dissipation scale, one side of the first heat dissipation element, which deviates from the second side surface, is provided with a second heat dissipation scale, and one side of the second heat dissipation element, which deviates from the third side surface, is provided with a third heat dissipation scale.

In a possible implementation manner, the laser device further includes a first optical axis fixedly arranged in the housing, a first guide hole matched with the first optical axis is arranged on the second heat dissipation element, and the first optical axis penetrates through the first guide hole in a sliding manner.

In a possible embodiment, the laser device further comprises a sleeve, and the sleeve is fixedly accommodated in the first guide hole; the first optical axis penetrates through the sleeve in a sliding mode, and the outer side wall of the first optical axis is in surface contact with the inner side wall of the first guide hole.

In a possible implementation manner, the second heat dissipation element is further provided with a second guide hole, the second guide hole and the first guide hole are arranged at an interval, the laser device further comprises a second optical axis fixed in the housing, the second optical axis is parallel to the first optical axis, and the outer side wall of the second optical axis is in line contact with the inner side wall of the second guide hole.

In one possible embodiment, a cross section of the second guide hole in an axial direction perpendicular to the second optical axis has an elliptical shape.

In a possible embodiment, the oval shape includes a major axis and a minor axis, the first guide hole and the second guide hole are arranged in a line along the major axis, and the second optical axis is in line contact with an inner sidewall of the second guide hole along the minor axis.

In a possible implementation manner, the laser device further includes a cutter structure, and the second heat dissipation member further has a receiving hole, and the cutter structure is mounted in the receiving hole.

In a possible embodiment, the laser device further includes a fan rotatably housed in the housing, the fan being disposed opposite to the heat dissipation member, the fan being configured to form an air flow that can flow in the housing; the shell is provided with an air inlet and an air outlet, and the flowing air flow enters the shell from the air inlet and flows out of the shell from the air outlet through the heat dissipation component.

In a possible embodiment, the laser device further comprises a driving member for driving the laser structure to move in the housing.

The application provides a laser device covers heat radiation component on the first side, the second side and the third side of laser structure to make laser structure's heat radiating area increase, be favorable to laser structure's heat dissipation, and then improve laser device's heat dispersion.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below. It should be apparent that the drawings in the following description are merely some of the implementations provided by the embodiments of the present application, and that other drawings may be derived from those drawings by those skilled in the art without inventive effort.

Fig. 1 is a schematic diagram of a laser device according to an embodiment of the present application;

FIG. 2 is an exploded view of the laser structure shown in FIG. 1;

fig. 3 is a schematic structural view of the first heat dissipation element shown in fig. 2;

fig. 4 is a schematic structural view of the second heat dissipation element shown in fig. 2;

FIG. 5 is a bottom view of a laser apparatus provided in an embodiment of the present application;

fig. 6 is an assembly view of the first optical axis, the second optical axis and the second heat dissipation element shown in fig. 5;

FIG. 7 is an enlarged schematic view of the A configuration shown in FIG. 5;

fig. 8 is an enlarged schematic view of the B structure shown in fig. 5.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that, the terms "first", "second", "third" and "fourth" are used herein only for convenience of description and are not intended to limit the present application.

Referring to fig. 1, fig. 1 is a schematic view of a laser device according to an embodiment of the present disclosure.

The laser device 100 provided by the embodiment of the present application includes a housing 10 and a laser structure 20, and the laser structure 20 is slidably accommodated in the housing 10. The laser structure 20 slides in the housing 10, so that a proper processing distance is formed between the laser structure 20 and the workpiece to be processed, and the laser structure 20 is further facilitated to emit laser to process the workpiece to be processed. It is understood that the laser structure 20 emits laser light to process the workpiece to be processed, including but not limited to cutting, engraving, indenting, and the like.

Specifically, the laser structure 20 includes a laser 21 and a heat dissipation member 22, the laser 21 is accommodated in the housing 10, and the heat dissipation member 22 is fixed on the laser 21 and slidably accommodated in the housing 10. The laser 21 is used for emitting laser to process a workpiece to be processed, and the heat dissipation member 22 is used for dissipating heat of the laser 21, so that the laser 21 does not overheat in the process of processing the workpiece to be processed, and the stability of the laser 21 in operation is improved.

Referring to fig. 2, fig. 2 is an exploded view of the laser structure shown in fig. 1.

In the embodiment of the present application, the laser 21 includes a first side 211, a second side 212, a third side 213, and a fourth side 214, and the first side 211, the second side 212, the third side 213, and the fourth side 214 are sequentially connected end to end. The heat dissipation member 22 covers at least the first side 211, the second side 212, and the third side 213 of the laser 21, so as to increase the heat dissipation area of the laser 21, which is beneficial for heat dissipation of the laser 21, thereby improving the heat dissipation performance of the laser structure 20 and improving the working stability of the laser device 100.

It can be understood that, at least one of the first side 211, the second side 212, the third side 213, and the fourth side 214 of the laser 21 is made of aluminum, and by using aluminum to make the side of the laser 21, the heat dissipation performance of the laser structure 20 is further improved,

specifically, the heat dissipation member 22 includes a first heat dissipation member 221, a second heat dissipation member 222 and a fixing member 223, and the first heat dissipation member 221 and the second heat dissipation member 222 are fixedly connected through the fixing member 223. The first heat dissipation member 221 and the second heat dissipation member 222 enclose a heat dissipation cavity, and the laser 21 is fixedly accommodated in the heat dissipation cavity. The first heat dissipation element 221 covers the first side 211 and the second side 212 of the laser 21, and the second heat dissipation element 222 covers the third side 213 of the laser 21. The first heat dissipation element 221 and the second heat dissipation element 222 are fixedly connected by the fixing element 223, so that when the laser 21 needs to be maintained or replaced, the laser 21 can be conveniently detached from the heat dissipation component 22, which is beneficial to improving the maintenance efficiency of the laser structure 20.

More specifically, the fixing element 223 is a screw, a first threaded hole 2210 is formed in the first heat dissipating element 221, a second threaded hole 2220 is formed in the second heat dissipating element 222, and the fixing element 223 sequentially penetrates through the second threaded hole 2220 and the first threaded hole 2210, so that the first heat dissipating element 221 and the second heat dissipating element 222 are fixedly connected.

In other embodiments, the first heat dissipation element 221 and the second heat dissipation element 222 may be welded, adhered, clamped, and the like, which is not limited in the present application.

Referring to fig. 1, fig. 2 and fig. 3, fig. 3 is a schematic structural diagram of the first heat dissipation element shown in fig. 2.

In the embodiment of the present application, the first heat dissipation member 221 includes a first heat dissipation plate 2211, a second heat dissipation plate 2212, a first heat dissipation scale 2213, and a second heat dissipation scale 2214, and the first heat dissipation plate 2211 is connected to the second heat dissipation plate 2212. The first heat dissipation plate 2211 is disposed corresponding to the first side 211 of the laser 21, and the first heat dissipation plate 2211 covers the first side 211 of the laser 21. The second heat dissipation plate 2212 is disposed corresponding to the second side 212 of the laser 21, and the second heat dissipation plate 2212 covers the second side 212 of the laser 21. The first heat dissipation scale 2213 is disposed on a side of the first heat dissipation plate 2211 away from the first side 211 of the laser 21, and the second heat dissipation scale 2214 is disposed on a side of the second heat dissipation plate 2212 away from the second side 212 of the laser 21.

By arranging the first heat dissipation scale 2213 and the second heat dissipation scale 2214 on the first heat dissipation member 221, the heat dissipation area between the heat dissipation member 22 and the laser 21 is further increased, and further, the heat dissipation area of the laser structure 20 is increased, the heat dissipation performance of the laser structure 20 is improved, and the working stability of the laser device 100 is improved.

Referring to fig. 1, fig. 2 and fig. 4, fig. 4 is a schematic structural view of the second heat dissipation element shown in fig. 2.

In the embodiment of the present invention, the second heat dissipation element 222 includes a third heat dissipation plate 2221, a fourth heat dissipation plate 2222, and third heat dissipation scales 2223, and the third heat dissipation plate 2221 and the fourth heat dissipation plate 2222 are connected. The third heat sink 2221 corresponds to the third side surface 213 of the laser 21, the third heat sink 2221 covers the third side surface 213 of the laser 21, and the third heat sink scale 2223 is disposed on a side of the third heat sink 2221 away from the third side surface 213 of the laser 21. The fourth heat sink 2222 is provided corresponding to the fourth side 214 of the laser 21.

By arranging the third heat dissipation scale 2223 on the second heat dissipation member 222, the heat dissipation area between the heat dissipation member 22 and the laser 21 is further increased, and thus the heat dissipation area of the laser structure 20 is increased, the heat dissipation performance of the laser structure 20 is improved, and the working stability of the laser device 100 is improved.

Referring to fig. 1, 5, 6, and 7, fig. 5 is a bottom view of a laser device according to an embodiment of the present disclosure, fig. 6 is an assembly view of a first optical axis, a second optical axis, and a second heat sink shown in fig. 5, and fig. 7 is an enlarged view of a structure a shown in fig. 5.

In the embodiment of the present application, the laser apparatus 100 further includes a first optical axis 30, the first optical axis 30 is fixedly disposed in the housing 10, and the first optical axis 30 is used for providing a guiding function for the laser structure 20.

The second heat sink 222 is provided with a first guide hole 2224, and the first optical axis 30 slidably penetrates through the first guide hole 2224, so that the second heat sink 222 and the laser structure 20 move in a direction perpendicular to the extending direction of the first optical axis 30, and a suitable processing distance is formed between the laser structure 20 and the workpiece to be processed, which is beneficial for the laser structure 20 to emit laser to process the workpiece to be processed.

The end of the first optical axis 30 may be one of a rounded corner and a chamfered corner, and the rounded corner and the chamfered corner are advantageous for improving the assembling efficiency between the first optical axis 30 and the first guide hole 2224.

The laser device 100 further includes a sleeve 40, the sleeve 40 is fixedly received in the first guide hole 2224, and an outer sidewall of the sleeve 40 is engaged with an inner sidewall of the first guide hole 2224. The first optical axis 30 is slidably disposed through the sleeve 40, an outer sidewall of the first optical axis 30 is engaged with an inner sidewall of the sleeve 40, and the outer sidewall of the first optical axis 30 is in surface contact with the inner sidewall of the sleeve 40. By the provision of the sleeve 40, the fitting accuracy between the first optical axis 30 and the second heat sink 222 can be improved. In the process that the laser structure 20 moves along the axial direction of the first optical axis 30, the first optical axis 30 makes surface contact with the inner side wall of the sleeve 40, so that the shake of the first optical axis 30 in the direction perpendicular to the axial direction of the first optical axis 30 can be reduced, the improvement of the precision of the laser structure 20 moving along the axial direction of the first optical axis 30 is facilitated, and the working stability of the laser device 100 is further improved.

It is understood that the sleeve 40 may be made of other materials such as copper, which is not limited in this application.

Referring to fig. 5, 6, 7 and 8, fig. 8 is an enlarged schematic view of the structure B shown in fig. 5.

In the embodiment of the present application, the laser device 100 further includes a second optical axis 50, and the second optical axis 50 is parallel to the first optical axis 30. The second optical axis 50 is fixedly disposed in the housing 10, and the second optical axis 50 is used for providing a guiding function for the laser structure 20.

The second heat dissipating member 222 is further provided with a second guiding hole 2225, and the second optical axis 50 is slidably disposed through the second guiding hole 2225, so that the second heat dissipating member 222 and the laser structure 20 move along a direction perpendicular to the extending direction of the second optical axis 50. Since the second optical axis 50 is disposed parallel to the first optical axis 30, a direction perpendicular to the extending direction of the second optical axis 50 is the same as a direction perpendicular to the extending direction of the first optical axis 30. The first optical axis 30 and the second optical axis 50 arranged in parallel provide a guiding function for the laser structure 20, so that the sliding of the laser structure 20 in the housing 10 is more stable.

The end of the second optical axis 50 may be one of a rounded corner and a chamfered corner, and the rounded corner and the chamfered corner are advantageous for improving the assembling efficiency between the second optical axis 50 and the second guide hole 2225.

The outer sidewall of the second optical axis 50 is in line contact with the inner sidewall of the second guide hole 2225. In other words, a part of the outer sidewall of the second optical axis 50 contacts the inner sidewall of the second guide hole 2225, and another part of the outer sidewall of the second optical axis 50 is spaced apart from the inner sidewall of the second guide hole 2225. Through the line contact between the outer side wall of the second optical axis 50 and the inner side wall of the second guide hole 2225, the frictional resistance between the second optical axis 50 and the second guide hole 2225 is reduced, which is beneficial to the laser structure 20 sliding in the housing 10 and forming a proper processing distance with the workpiece to be processed.

The cross section of the second optical axis 50 in the axial direction perpendicular to the second optical axis 50 is circular, the cross section of the second guide hole 2225 in the axial direction perpendicular to the second optical axis 50 is elliptical, and the cylindrical second optical axis 50 is slidably received in the elliptical second guide hole 2225 such that the outer sidewall of the cylindrical second optical axis 50 is in line contact with the inner sidewall of the elliptical second guide hole 2225.

The ellipse includes a major axis and a minor axis. In the present embodiment, the first guide hole 2224 and the second guide hole 2225 are arranged along the major axis direction of the oval shape, so that the second optical axis 50 and the inner side wall of the second guide hole 2225 have a margin in the major axis direction, that is, the second optical axis 50 has a shift space in the major axis direction of the oval second guide hole 2225.

In the ideal setting, two guiding holes are the circular port, and two optical axes slide to wear to locate in two guiding holes one-to-one. Due to manufacturing errors, there is an error between the actual distance between the two optical axes on the finished product and the preset distance (design distance). Thus, the two optical axes may not be mounted in the corresponding guide holes.

In the embodiment of the present application, since the first guide holes 2224 and the second guide holes 2225 are arranged along the long axis direction of the oval shape, and the inner side walls of the second optical axes 50 and the second guide holes 2225 have margins in the long axis direction, a large error in the distance between the first optical axes 30 and the second optical axes 50 can be tolerated, so that the first optical axes 30 and the second optical axes 50 can be conveniently assembled on the laser structure 20, the assembly difficulty of the laser device 100 is reduced, and the defective rate of products is reduced. For example, when the actual distance between the first optical axis 30 and the second optical axis 50 is smaller than the preset distance, the center of the second optical axis 50 may be located on one side of the second guiding hole 2225 close to the first optical axis 30. For example, the center of the second optical axis 50 may be located at a side of the second guide hole 2225 away from the first optical axis 30.

The second optical axis 50 is in line contact with the inner sidewall of the second guide hole 2225 in the short axis direction, so that the second optical axis 50 is limited in the short axis direction when moving in the axial direction of the second optical axis 50.

It is understood that the shape of the second optical axis 50 is not limited, and the outer sidewall of the second optical axis 50 is in line contact with the inner sidewall of the second guide hole 2225 corresponding to the short axis direction and is spaced apart from the inner sidewall of the second guide hole 2225 corresponding to the long axis direction. For example, in other embodiments, a cross section of the second optical axis 50 in a direction perpendicular to the axial direction of the second optical axis 50 is an ellipse, an outer sidewall corresponding to a long axis of the second optical axis 50 may be in linear contact with an inner sidewall corresponding to a long axis of the second guide hole 2225, and an outer sidewall corresponding to a short axis of the second optical axis 50 and an inner sidewall corresponding to a short axis of the second guide hole 2225 are spaced apart from each other, so that the outer sidewall corresponding to the short axis of the second optical axis 50 has an offset space in the short axis direction of the elliptical second guide hole 2225, which may reduce the machining precision of the second guide hole 2225, may allow a larger production error of components, may facilitate improving the production efficiency of the components, and may reduce the difficulty in assembling the second optical axis 50 and the second guide hole 2225.

It can be understood that the second optical axis is slidably disposed in the second guide hole, the second optical axis is parallel to the first optical axis, and the outer sidewall of the second optical axis is in line contact with the inner sidewall of the second guide hole.

It is understood that the cross-section of the second guide hole 2225 perpendicular to the extending direction of the second optical axis 50 may have a triangular shape, a rhombic shape, or the like, which is not limited in this application.

Referring to fig. 1, fig. 4 and fig. 5, in the embodiment of the present application, the laser apparatus 100 further includes a tool structure 60, and the tool structure 60 is used for assisting the laser structure 20 to process a workpiece to be processed. The second heat dissipating member 222 further has a receiving hole 2226, and the receiving hole 2226 is disposed on the fourth heat dissipating plate 2222 of the second heat dissipating member 222 corresponding to the fourth side surface 214. It will be appreciated that the tool structure 60 performs a process on the workpiece to be processed including, but not limited to, cutting, engraving, indenting, and the like. The laser device 100 realizes the integration of the laser 21 and the cutter structure 60 through the heat dissipation member 22, so that the laser device 100 can process the workpiece to be processed through the laser 21 by using laser as a processing medium, and also can process the workpiece to be processed by using a cutter as a processing medium, and the laser device is simple and convenient to operate, is beneficial to reducing the processing time and the processing cost of the workpiece to be processed, and improves the applicability of the laser device 100.

Referring to fig. 1, fig. 2 and fig. 5, in the present embodiment, the laser device 100 further includes a fan 70, the fan 70 is rotatably accommodated in the housing 10, the fan 70 is disposed opposite to the heat dissipation member 22, the fan 70 is configured to form an airflow capable of flowing in the housing 10, the flowing airflow is formed by the fan 70 rotating in the housing 10, and the flowing airflow passes through the first heat dissipation scale 2213, the second heat dissipation scale 2214 and the third heat dissipation scale 2223, which is beneficial to improving the heat dissipation effect of the heat dissipation member 22 and the laser structure 20.

The opposite ends of the housing 10 are respectively provided with the air inlet 11 and the air outlet 12, the air inlet 11 and the air outlet 12 are respectively disposed on the opposite sides of the fan 70, and the air inlet 11 and the air outlet 12 are disposed to communicate the air flowing in the housing 10 with the outside air, which is beneficial to further improving the heat dissipation effect of the heat dissipation member 22 and the laser structure 20.

Referring to fig. 1 and fig. 5, in the present embodiment, the laser apparatus 100 further includes a driving member 80, the driving member 80 is connected to the laser structure 20, and the driving member 80 is used for driving the laser structure 20 to move in the housing 10. Specifically, the driving member 80 is connected to the laser structure 20 through a gear and a rack, so that the rotational motion of the driving member 80 is converted into the linear motion of the laser structure 20. Through the setting of driving piece 80 to make laser structure 20 move in casing 10, and then make laser structure 20 and wait to form suitable processing distance between the processing work piece, be favorable to laser structure 20 to launch the laser and wait to process the processing work piece.

The foregoing are some embodiments of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the scope of protection of the present application.

Claims

1. A laser device, comprising:

a housing; and

a laser structure slidingly received in the housing, comprising,

2. The laser apparatus of claim 1,

the heat dissipation component comprises a first heat dissipation member, a second heat dissipation member and a fixing member, the first heat dissipation member is fixedly connected with the second heat dissipation member through the fixing member, the first heat dissipation member and the second heat dissipation member form a heat dissipation cavity in a surrounding mode, the laser is contained and fixed in the heat dissipation cavity, the first heat dissipation member covers the first side face and the second side face, and the second heat dissipation member covers the third side face.

3. The laser apparatus of claim 2,

first radiating part deviates from one side of first side is equipped with first heat dissipation scale, first radiating part deviates from one side of second side is equipped with second heat dissipation scale, second radiating part deviates from one side of third side is equipped with third heat dissipation scale.

4. The laser apparatus of claim 2,

the laser device further comprises a first optical axis fixedly arranged in the shell, a first guide hole matched with the first optical axis is formed in the second heat dissipation piece, and the first optical axis penetrates through the first guide hole in a sliding mode.

5. The laser apparatus of claim 4,

the laser device further comprises a sleeve, and the sleeve is fixedly accommodated in the first guide hole;

the first optical axis penetrates through the sleeve in a sliding mode, and the outer side wall of the first optical axis is in surface contact with the inner side wall of the first guide hole.

6. Laser apparatus according to claim 4,

still be equipped with the second guiding hole on the second heat-dissipating piece, the second guiding hole with first guiding hole interval sets up, laser device is still including being fixed in second optical axis in the casing, the second optical axis wears to locate with sliding in the second guiding hole, the second optical axis with first optical axis is parallel, the lateral wall of second optical axis with line contact between the inside wall of second guiding hole.

7. The laser apparatus of claim 6,

the shape of the axial cross section of the second guide hole perpendicular to the second optical axis is elliptical.

8. The laser apparatus of claim 7,

the oval shape comprises a long axis and a short axis, the first guide holes and the second guide holes are arranged in an arrayed mode along the direction of the long axis, and the second optical axis is in line contact with the inner side wall of the second guide holes in the direction of the short axis.

9. The laser apparatus of claim 1,

the laser device further comprises a fan which is rotatably accommodated in the shell, the fan is arranged opposite to the heat dissipation component, and the fan is used for forming airflow capable of flowing in the shell; the shell is provided with an air inlet and an air outlet, and the flowing air flow enters the shell from the air inlet and flows out of the shell from the air outlet through the heat dissipation component.

10. Laser apparatus according to claim 1,

the laser device further comprises a driving piece, and the driving piece is used for driving the laser structure to move in the shell.