CN217035136U

CN217035136U - Semiconductor storage device

Info

Publication number: CN217035136U
Application number: CN202122872186.8U
Authority: CN
Inventors: 李维超; 魏继昊; 陈真
Original assignee: Jinan Tongxin Electronic Technology Co ltd
Current assignee: Jinan Tongxin Electronic Technology Co ltd
Priority date: 2021-11-23
Filing date: 2021-11-23
Publication date: 2022-07-22
Anticipated expiration: 2031-11-23

Abstract

The utility model belongs to the technical field of semiconductors, and particularly relates to a semiconductor storage device which comprises a main body assembly, a functional assembly and a supporting assembly, wherein the main body assembly comprises a storage box, a control panel is arranged on one side of the storage box, and a storage battery is arranged at the top of the storage box. Through the main part subassembly, the setting of functional unit and supporting component, realize backup pad roll-off storage box, and place the semiconductor in the standing groove of seting up in the backup pad, and the second cylinder drives the semiconductor jack-up of arc with the standing groove, conveniently deposit and take out the semiconductor, and the cushion socket, supporting seat and buffer cushion rock storage device production and cushion, prevent to lead to the damage of the inside semiconductor of storage box because of rocking of storage device, and first cylinder drives and removes the wheel and stretches out, and make and remove the wheel overlap joint subaerial, make and remove the wheel and jack-up storage device, with this convenient removal to storage device.

Description

Semiconductor storage device

Technical Field

The utility model belongs to the technical field of semiconductors, and particularly relates to a semiconductor storage device.

Background

The semiconductor, which refers to a material with a conductivity between conductor and insulator at normal temperature, has been widely used in radio, television and temperature measurement, for example, the diode is a device made of semiconductor, the semiconductor refers to a material with a controllable conductivity ranging from insulator to conductor, the importance of semiconductor is very great from the viewpoint of technology and economic development, most of the electronic products today, such as computers, mobile phones or digital audio recorders, have a very close relationship with semiconductor, the common semiconductor materials include silicon, germanium, gallium arsenide, etc., silicon is the most influential one of various semiconductor materials in commercial application, and the semiconductor needs to be stored after being produced, so a storage device is needed.

As disclosed in chinese patent literature, a storage device for a semiconductor has the following publication numbers: CN209337316U, published date: 20190903, although it solves the problems of the memory device that the internal space is not adjustable, and the heat of the space can not be dissipated, it does not solve the problem of the semiconductor that it is inconvenient to store and take out, and it also can not solve the problem of the memory device that it is inconvenient to move, and the service life is low, therefore, it provides a semiconductor memory device.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a semiconductor storage device, which has the advantages of convenience in storage and taking out of semiconductors, convenience in movement of the storage device and long service life, and solves the problems of inconvenience in storage and taking out of semiconductors, inconvenience in movement of the storage device and low service life of the storage device.

(II) technical scheme

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a semiconductor storage device, includes main part subassembly, functional unit and supporting component, the main part subassembly includes the storage box, one side of storage box is provided with control panel, the top of storage box is provided with the battery, the gas outlet has been seted up at the top of storage box, the inside of gas outlet is provided with the heat dissipation fan, the top of gas outlet is provided with the dust screen, the inlet port has all been seted up to the both sides of storage box, the inside of inlet port is provided with the filter screen, the storage chamber has been seted up to the inside of storage box, the inner wall both sides in storage chamber all are provided with the sliding seat, the spout has all been seted up to the both sides of sliding seat, the inner wall top in storage chamber is provided with temperature sensor.

Preferably, the functional assembly comprises a buffer seat, a supporting seat and an installation box, a buffer cavity is formed in the top of the supporting seat, a buffer piece is arranged at the bottom of the inner wall of the buffer cavity, the top of the buffer piece is fixedly connected to the bottom of the buffer seat, a first installation cavity is formed in the installation box, a first air cylinder is arranged in the first installation cavity, and one end of the first air cylinder penetrates through the installation box to be provided with a moving wheel.

Through adopting above-mentioned scheme, rocking that buffer seat, bolster and supporting seat etc. produced storage device cushions, prevents the semiconductor damage in the storage box, and first cylinder drives and removes the wheel overlap joint and subaerial, makes storage device remove.

Preferably, the bolster includes telescopic link and buffer spring, the one end fixed connection of telescopic link is in the inner wall bottom of cushion chamber, the other end fixed connection of telescopic link is in the bottom of buffing pad, buffer spring cup joints on the surface of telescopic link, buffing pad fixed connection is in the bottom of storage box, the quantity of install bin is two, two install bin difference fixed connection is in the both sides of storage box.

Through adopting above-mentioned scheme, the both sides of two install bin design storage boxes make the removal wheel to carry out the stable support to the storage box, have increased the stability of removal.

Preferably, the supporting component comprises a supporting plate, sliding plates are arranged on two sides of the supporting plate, a storage groove is formed in the top of the supporting plate, a plurality of placing grooves and arc-shaped grooves are formed in the bottom of the inner wall of the storage groove, the arc-shaped plates are overlapped inside the arc-shaped grooves, the arc-shaped plates are connected through connecting plates, a second installation cavity is formed in the supporting plate, a second air cylinder is arranged inside the second installation cavity, one end of the second air cylinder penetrates through the bottom of the supporting plate and is fixedly connected to the bottom of the arc-shaped plates, and an air transmission port is formed in the supporting plate.

Through adopting above-mentioned scheme, the semiconductor can be placed in the standing groove to and stretching out of second cylinder, make the second cylinder drive the arc with the semiconductor in the standing groove ejecting, conveniently take out the semiconductor in the standing groove.

Preferably, the number of the supporting components is multiple, the supporting components are all movably arranged in the storage box, the sliding groove is matched with the sliding plate, the sliding plate is connected in the sliding groove in a sliding mode, and a handle is arranged on one side of the supporting plate.

Through adopting above-mentioned scheme, supporting component slides in the storage box to this convenience is deposited and is taken out storage box semiconductor.

Preferably, the storage battery is respectively and electrically connected with the control panel, the first cylinder, the second cylinder, the heat dissipation fan and the temperature sensor through wires, and the control panel is respectively and electrically connected with the first cylinder, the second cylinder, the heat dissipation fan and the temperature sensor through wires.

Through adopting above-mentioned scheme, the battery provides the required electric energy of work to control panel, first cylinder, second cylinder, heat dissipation fan and the temperature sensor on to storage device to and control panel controls first cylinder, second cylinder, heat dissipation fan and temperature sensor.

(III) advantageous effects

Compared with the prior art, the utility model provides a semiconductor storage device, which has the following beneficial effects:

this semiconductor storage device, through the main part subassembly, the setting of functional unit and supporting component, realize backup pad roll-off storage box, and place the semiconductor in the standing groove of seting up in the backup pad, and the second cylinder drives the semiconductor jack-up of arc with the standing groove, conveniently deposit and take out the semiconductor, and the cushion seat, supporting seat and buffer cushion rock storage device production and cushion, prevent to lead to the damage of the inside semiconductor of storage box because of storage device rocks, and first cylinder drives and removes the wheel and stretches out, and make and remove the wheel overlap joint subaerial, make and remove the wheel and jack-up storage device, with this convenient removal to storage device.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic structural diagram of a front view cross section of the present invention;

FIG. 3 is a schematic structural view of a support plate according to the present invention;

FIG. 4 is a schematic structural view of a buffer member according to the present invention;

in the figure:

1. a body assembly; 101. a storage box; 102. a control panel; 103. a battery; 104. an air intake; 105. A filter screen; 106. a storage chamber; 107. a sliding seat; 108. a chute;

2. a functional component; 201. a buffer base; 202. a supporting base; 203. installing a box; 204. a first mounting cavity; 205. A first cylinder; 206. a moving wheel; 207. a buffer member; 2071. a telescopic rod; 2072. a buffer spring; 208. A buffer chamber;

3. a support assembly; 301. a support plate; 302. a slide plate; 303. a storage tank; 304. a placement groove; 305. an arc-shaped slot; 306. an arc-shaped plate; 307. a second mounting cavity; 308. a second cylinder; 309. a connecting plate; 3010. a temperature sensor; 3011. a gas transfer port; 4. an air outlet; 5. a heat dissipation fan; 6. and (4) a dust screen.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Example one

The utility model provides a semiconductor storage device, includes main part subassembly 1, functional unit 2 and supporting component 3, main part subassembly 1 includes storage box 101, one side of storage box 101 is provided with control panel 102, the top of storage box 101 is provided with battery 103, gas outlet 4 has been seted up at the top of storage box 101, the inside of gas outlet 4 is provided with heat dissipation fan 5, the top of gas outlet 4 is provided with dust screen 6, inlet port 104 has all been seted up to the both sides of storage box 101, the inside of inlet port 104 is provided with filter screen 105, storage chamber 106 has been seted up to the inside of storage box 101, the inner wall both sides of storage chamber 106 all are provided with sliding seat 107, spout 108 has all been seted up to the both sides of sliding seat 107, the inner wall top of storage chamber 106 is provided with temperature sensor 3010.

Functional unit 2 includes buffing pad 201, supporting seat 202 and install bin 203, cushion chamber 208 has been seted up at the top of supporting seat 202, cushion chamber 208's inner wall bottom is provided with bolster 207, the top fixed connection of bolster 207 is in the bottom of buffing pad 201, first installation cavity 204 has been seted up to the inside of install bin 203, the inside of first installation cavity 204 is provided with first cylinder 205, the one end of first cylinder 205 is passed install bin 203 and is provided with and remove wheel 206.

The supporting component 3 comprises a supporting plate 301, sliding plates 302 are arranged on two sides of the supporting plate 301, a storage tank 303 is arranged at the top of the supporting plate 301, a plurality of placing grooves 304 and arc-shaped grooves 305 are arranged at the bottom of the inner wall of the storage tank 303, the arc-shaped grooves 305 are overlapped inside the arc-shaped grooves 306, the arc-shaped plates 306 are connected through a connecting plate 309, a second installation cavity 307 is arranged inside the supporting plate 301, a second air cylinder 308 is arranged inside the second installation cavity 307, one end of the second air cylinder 308 penetrates through the supporting plate 301 and is fixedly connected to the bottom of the arc-shaped plates 306, and an air transmission port 3011 is formed in the supporting plate 301.

Referring to fig. 1 to 4, when the semiconductor storage device is in use, the support plate 301 in the storage box 101 is pulled out by the handle, the semiconductor is placed in the placement groove 304, then the support plate 301 is pushed back into the storage box 101, the temperature sensor 3010 is controlled by the control panel 102 to operate, the temperature sensor 3010 detects the temperature in the storage box 101, when the temperature in the storage box 101 exceeds a predetermined value, the control panel 102 controls the operation of the heat dissipation fan 5, the heat dissipation fan 5 dissipates the heat inside the storage box 101, during the use of the storage device, the buffer base 201, the buffer base 207, the support base 202 and the like buffer the sloshing generated by the storage device, so as to prevent the semiconductor in the storage box 101 from being damaged, when the semiconductor in the storage box 101 needs to be taken out, the support plate 301 is pulled out, and the control panel 102 controls the second cylinder 308 to extend out, the second cylinder 308 drives the arc-shaped plate 306 to eject the semiconductor in the placing groove 304 out, then the semiconductor in the placing groove 304 is taken out, when the storage device needs to be moved, the control panel 102 controls the first cylinder 205 to extend out, so that the first cylinder 205 drives the moving wheel 206 to extend out and lap-joint the moving wheel 206 to the ground, and the extended moving wheel 206 jacks up the storage device and moves the storage device under the action of the moving wheel 206.

Example two

The bolster 207 includes telescopic link 2071 and buffer spring 2072, the one end fixed connection of telescopic link 2071 is in the inner wall bottom of buffer cavity 208, the other end fixed connection of telescopic link 2071 is in the bottom of buffer seat 201, buffer spring 2072 cup joints on the surface of telescopic link 2071, buffer seat 201 fixed connection is in the bottom of storage box 101, the quantity of install bin 203 is two, two install bin 203 is fixed connection in the both sides of storage box 101 respectively.

The number of the supporting components 3 is multiple, the supporting components 3 are all movably arranged in the storage box 101, the sliding groove 108 is matched with the sliding plate 302, the sliding plate 302 is connected in the sliding groove 108 in a sliding mode, and a handle is arranged on one side of the supporting plate 301.

The storage battery 103 is electrically connected with the control panel 102, the first cylinder 205, the second cylinder 308, the heat dissipation fan 5 and the temperature sensor 3010 through wires, and the control panel 102 is electrically connected with the first cylinder 205, the second cylinder 308, the heat dissipation fan 5 and the temperature sensor 3010 through wires.

Referring to fig. 1 to 4, two mounting boxes 203 are designed at both sides of the storage box 101 to allow the moving wheels 206 to stably support the storage box 101, thereby increasing the stability of movement, the support member 3 slides in the storage box 101 to facilitate the storage and removal of the semiconductors in the storage box 101, the storage battery 103 supplies power required for the operation to the control panel 102, the first cylinder 205, the second cylinder 308, the heat dissipating fan 5 and the temperature sensor 3010 on the storage device, and the control panel 102 controls the first cylinder 205, the second cylinder 308, the heat dissipating fan 5 and the temperature sensor 3010.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor storage device, characterized in that: comprises a main body component (1), a functional component (2) and a supporting component (3), wherein the main body component (1) comprises a storage box (101), a control panel (102) is arranged on one side of the storage box (101), a storage battery (103) is arranged on the top of the storage box (101), an air outlet (4) is formed in the top of the storage box (101), a heat dissipation fan (5) is arranged inside the air outlet (4), a dust screen (6) is arranged on the top of the air outlet (4), air inlets (104) are formed in two sides of the storage box (101), a filter screen (105) is arranged inside the air inlets (104), a storage cavity (106) is formed in the storage box (101), sliding seats (107) are arranged on two sides of the inner wall of the storage cavity (106), and sliding grooves (108) are formed in two sides of the sliding seats (107), and a temperature sensor (3010) is arranged on the top of the inner wall of the storage cavity (106).

2. The semiconductor storage device of claim 1, wherein: functional unit (2) are including buffering seat (201), supporting seat (202) and install bin (203), cushion chamber (208) have been seted up at the top of supporting seat (202), the inner wall bottom of cushion chamber (208) is provided with bolster (207), the top fixed connection of bolster (207) is in the bottom of buffering seat (201), first install bin (204) have been seted up to the inside of install bin (203), the inside of first install bin (204) is provided with first cylinder (205), install bin (203) is passed to the one end of first cylinder (205) and is provided with and removes wheel (206).

3. The semiconductor storage device of claim 2, wherein: bolster (207) include telescopic link (2071) and buffer spring (2072), the one end fixed connection of telescopic link (2071) is in the inner wall bottom of cushion chamber (208), the other end fixed connection of telescopic link (2071) is in the bottom of buffer seat (201), buffer spring (2072) cup joint on the surface of telescopic link (2071), buffer seat (201) fixed connection is in the bottom of storage box (101), the quantity of install bin (203) is two, two install bin (203) fixed connection is in the both sides of storage box (101) respectively.

4. The semiconductor storage device of claim 1, wherein: the supporting component (3) comprises a supporting plate (301), sliding plates (302) are arranged on two sides of the supporting plate (301), a storage tank (303) is arranged at the top of the supporting plate (301), a plurality of placing grooves (304) and arc-shaped grooves (305) are arranged at the bottom of the inner wall of the storage tank (303), a plurality of arc-shaped grooves (305) are formed in the inner portion of each arc-shaped groove (306), the arc-shaped plates (306) are connected through connecting plates (309), a second installation cavity (307) is arranged in the supporting plate (301), a second air cylinder (308) is arranged in the second installation cavity (307), one end of the second air cylinder (308) penetrates through the supporting plate (301) and is fixedly connected to the bottom of each arc-shaped plate (306), and an air transmission port (3011) is formed in the supporting plate (301).

5. The semiconductor storage device according to claim 4, wherein: the quantity of supporting component (3) is a plurality of, and is a plurality of supporting component (3) all move about in storage box (101), spout (108) and slide (302) phase-match, slide (302) sliding connection is in spout (108), one side of backup pad (301) is provided with the handle.

6. The semiconductor storage device of claim 1, wherein: the storage battery (103) is electrically connected with the control panel (102), the first cylinder (205), the second cylinder (308), the heat dissipation fan (5) and the temperature sensor (3010) through leads, and the control panel (102) is electrically connected with the first cylinder (205), the second cylinder (308), the heat dissipation fan (5) and the temperature sensor (3010) through leads.