CN217031548U - Heat dissipation support and dehumidifier - Google Patents
Heat dissipation support and dehumidifier Download PDFInfo
- Publication number
- CN217031548U CN217031548U CN202123102553.2U CN202123102553U CN217031548U CN 217031548 U CN217031548 U CN 217031548U CN 202123102553 U CN202123102553 U CN 202123102553U CN 217031548 U CN217031548 U CN 217031548U
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- water
- water receiving
- receiving tank
- guide plate
- fin
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 189
- 239000004065 semiconductor Substances 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims description 32
- 238000005507 spraying Methods 0.000 claims description 18
- 238000005192 partition Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 7
- 238000007791 dehumidification Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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Abstract
The utility model provides a heat dissipation support and a dehumidifier. The heat dissipation bracket comprises a chassis, and a water receiving groove is formed in the chassis; the flow guide mechanism comprises a support frame and a flow guide plate, wherein one end of the support frame is fixed on the chassis, and the other end of the support frame extends towards the upper part of the chassis; the guide plate extends towards the water receiving tank, and the end close to the water receiving tank is obliquely and downwards arranged. The utility model arranges the guide plate and the water receiving tank on the radiating bracket, so that condensed water generated at the cold end is firstly guided to the radiating fins through the guide plate when the semiconductor is dehumidified, and the radiating fins are cooled, thereby improving the dehumidifying efficiency.
Description
Technical Field
The utility model relates to the technical field of dehumidifiers, in particular to a heat dissipation support and a dehumidifier.
Background
Because the semiconductor dehumidifier has the characteristics that the temperature difference of the cold end and the hot end is larger, and the dehumidification efficiency is lower, in order to ensure the dehumidification efficiency of the semiconductor dehumidifier, the heat of the hot end needs to be rapidly transferred in time during design, and the temperature of the hot end is ensured not to be overhigh. At present, an aluminum finned heat dissipation plate is attached to a hot end face of a semiconductor, and a heat dissipation fan is used for forcing cold air to flow through the heat dissipation surface to cool the heat dissipation surface. However, due to the structural limitation of the semiconductor dehumidifier, the heat dissipation effect of the part of the heat dissipation plate which is not covered by the fan is poor, thereby affecting the dehumidification effect.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a heat dissipation bracket and a dehumidifier, which are at least used for solving the technical problem of poor heat dissipation effect of heat dissipation fins in the prior art, and specifically:
the utility model provides a heat dissipation bracket, comprising:
a chassis, on which a water receiving tank is arranged;
the flow guide mechanism comprises a support frame and a flow guide plate, wherein one end of the support frame is fixed on the chassis, and the other end of the support frame extends towards the upper part of the chassis;
the guide plate extends towards the water receiving tank, and the end close to the water receiving tank is obliquely and downwards arranged.
Further optionally, a partition plate is arranged on the bottom wall of the base plate, and the partition plate and the base plate on one side of the partition plate jointly form the water receiving tank; the support frame is arranged on the chassis at the side of the water receiving groove.
Further optionally, a water baffle is arranged on the bottom wall of the base plate, the water baffle is connected with the side wall of the same side of the two ends of the partition plate to form a water collecting part with one open end, which is positioned in the water receiving groove, and the inclined lower end of the guide plate faces the opening of the water collecting part.
Further optionally, a drainage hole is formed in the water baffle, and the drainage hole is located at a position higher than the bottom wall of the water receiving tank.
Further optionally, an installation area is formed between the two water baffles, a supporting rib is arranged on the bottom wall of the water receiving tank, and the supporting rib is located between the two water baffles.
Further optionally, a drain hole is formed in the bottom wall of the water receiving tank, and the bottom wall of the water receiving tank is arranged from the far end of the drain hole to the near end of the drain hole end in a transitional inclined downward manner.
In a second aspect, the present invention provides a dehumidifier, which includes the above-mentioned heat dissipation bracket, and further includes a semiconductor heat sink, which is supported and mounted on the heat dissipation bracket, and a flow guide plate of the heat dissipation bracket receives condensed water flowing down from a cold guide plate of the semiconductor heat sink, and guides the condensed water to a lower end of the semiconductor heat sink for water cooling.
In a third aspect, the present invention provides a dehumidifier comprising:
the heat dissipation bracket;
the semiconductor cooling fin comprises a refrigerating fin, a cooling fin and a cold conducting fin, the cooling fin and the cold conducting fin are arranged on two sides of the refrigerating fin, the cold conducting fin is located on the upper side of the guide plate, the lower portion of the refrigerating fin is in sealing contact with the two water baffle plates, and a gap for condensed water to flow to the drain hole is formed between the refrigerating fin and the bottom wall of the water receiving groove.
Further optionally, a water spraying part is arranged on the refrigerating sheet, the water spraying part is positioned on the lower side of the cold guide sheet, and condensed water flowing down from the guide plate flows to the water spraying part.
Further optionally, the water spraying part includes a diversion water spraying inclined plane, and the water spraying inclined plane diverts the condensed water to make the condensed water flow to the water receiving tank.
According to the utility model, the guide plate and the water receiving tank are arranged on the radiating support, so that condensed water generated at the cold end is firstly guided to the radiating fins through the guide plate when the semiconductor is dehumidified, and the radiating fins are cooled, so that the dehumidifying efficiency is improved.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings. The drawings described below are merely some embodiments of the present disclosure, and other drawings may be derived from those drawings by those of ordinary skill in the art without inventive effort.
FIG. 1 is a schematic structural diagram of a heat dissipation bracket according to an embodiment of the utility model;
FIG. 2 is a schematic view of a heat sink bracket assembly with a semiconductor heat sink and fan according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a semiconductor heat sink according to an embodiment of the present invention.
In the figure:
1. a heat dissipation bracket; 11. a chassis; 12. a baffle; 13. a water receiving tank; 131. a drain hole; 132. supporting ribs; 14. a partition plate; 15. a water baffle; 151. a hydrophobic pore; 2. a semiconductor heat sink; 21. a refrigeration plate; 22. a cold conducting sheet; 23. a heat sink; 24. a water spraying part; 3. a fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in the examples of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and "a" and "an" generally include at least two, but do not exclude at least one, unless the context clearly dictates otherwise.
It should be understood that the term "and/or" as used herein is merely a relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a commodity or system that includes the element.
The utility model arranges the guide plate and the water receiving tank on the radiating bracket, so that condensed water generated at the cold end is firstly guided to the radiating fins through the guide plate when the semiconductor is dehumidified, and the radiating fins are cooled, thereby improving the dehumidifying efficiency. The utility model is described in detail below with reference to specific examples:
as shown in fig. 1, 2 and 3, the present invention provides a heat dissipation support 1 for supporting a semiconductor heat sink 2 in a dehumidifier, including a chassis 11, a water receiving tank 13 formed on the chassis 11, wherein:
the flow guide mechanism comprises a support frame and a flow guide plate, one end of the support frame extends towards the upper part of the chassis, the flow guide plate 12 is fixed on the support frame, the flow guide plate 12 is used for receiving condensed water flowing down on a cold guide plate 22 of the semiconductor cooling fin 2, the flow guide plate 12 extends towards the water receiving tank 13 and is arranged downwards in an inclined manner at the end close to the water receiving tank 13, and the flow guide plate 12 guides the condensed water to the lower end of the semiconductor cooling fin 2 for water cooling;
and the water receiving tank 13 is positioned below the guide plate 12 and is used for receiving the condensed water flowing down from the guide plate 12, and a drain hole 131 is formed in the bottom of the water receiving tank 13.
The guide plate 12 comprises a guide inclined plane which is arranged on the chassis 11 in an inclined state, preferably, a retaining edge is arranged at the partial edge of the guide inclined plane, and the guide inclined plane is positioned at the edge opening of the lower end, so that the guide plate 12 forms a groove-shaped structure, and the guide effect of the guide plate 12 is better.
As shown in fig. 1, a partition plate 14 is disposed in the chassis 11, the partition plate 14 divides the water receiving tank 13 inside the chassis 11, and preferably, the partition plate 14 divides the chassis 11 into two parts, one part of which constitutes the water receiving tank 13 and the other part of which is used for installing a fan or other electrical components, so as to prevent the electrical components from contacting with the condensed water.
The bottom wall of the water receiving tank 13 is provided with a drainage hole 131, and the bottom wall of the water receiving tank 13 is arranged from the far end of the drainage hole 131 to the near end of the drainage hole 131 in a transitional and inclined manner, so that the condensed water can flow to the drainage hole 131. Specifically, in this embodiment, the bottom wall of the water receiving tank 13 is a tapered curved surface, and the curved surface guides the water flow to flow toward the drainage hole 131, specifically, the water receiving tank 13 is gradually lowered from the edge toward the center of the drainage hole 131, so that the condensed water can smoothly flow toward the drainage hole 131.
Two water baffles 15 are arranged on the bottom wall of the water receiving tank 13, the two water baffles 15 are hermetically connected with the partition plate 14 and the bottom wall of the water receiving tank 13, the water baffles 15 and the same side wall at two ends of the partition plate 14 are connected to form a water collecting part with one open end positioned in the water receiving tank 13, and the inclined lower end of the guide plate 12 faces the opening of the water collecting part.
The two water dams 15 constitute a mounting area of the semiconductor heat sink 2 therebetween, and the drain hole 131 is located between the two water dams 15. The semiconductor heat sink 2 and the water baffle 15 can be in sealing contact with each other, so that when the water level in the water receiving tank 13 is low, the condensed water can only flow from the bottom of the semiconductor heat sink 2 and flow into the water discharge hole 131. The water baffle 15 is arranged to store a certain amount of condensed water in the water receiving tank 13 when the amount of condensed water is large in a high-humidity environment, so that the lower portion of the semiconductor heat sink 2 is soaked in the condensed water, and the heat dissipation efficiency is further improved.
Preferably, the water trap 15 is formed with a water drainage hole 151, the position of the water drainage hole 151 is higher than the bottom wall of the water receiving tank 13, when the water level in the water receiving tank 13 is higher, the water can flow into the space between the two water traps 15 through the water drainage hole 151, and then flow into the water drainage hole 131, so as to avoid the water level in the water receiving tank 13 from continuously rising to overflow. Further, the drainage hole 151 may be provided on both the water deflectors 15, one water deflector 15 may be provided for each water deflector 15, or a plurality of water deflectors 15 may be provided for each water deflector.
Preferably, a support rib 132 is disposed on the bottom wall of the water receiving tank 13, the support rib 132 is located between the two water baffles 15 and is used for supporting the semiconductor heat sink 2, and the support rib 132 is disposed to provide sufficient gap between the semiconductor heat sink 2 and the bottom wall of the water receiving tank 13 for water circulation. Further, the support rib 132 is provided with a plurality of around the drain hole 131 to, the support rib 132 extends along the water flow direction, can play the water conservancy diversion effect to the comdenstion water, avoids influencing rivers.
Preferably, in this embodiment, the heat dissipation bracket 1 further includes a water tank mounting portion located at a lower side of the base chassis 11 for mounting the water tank. The drain hole 131 of the water receiving tank 13 communicates with the water tank to receive water in the water receiving tank 13.
Further, baffle 12 and chassis 11 may be formed by integral injection molding, or baffle 12 and chassis 11 may be provided as separate structures and assembled by means of a snap, a connector, or the like.
The present invention also provides a dehumidifier, which includes the above heat dissipation bracket 1, as shown in fig. 2, and further includes:
the semiconductor cooling fin 2 is arranged on the cooling bracket 1;
and the fan 3 is arranged on the heat dissipation support 1 and used for blowing air to the semiconductor cooling fin 2.
Preferably, the semiconductor heat sink 2 includes a cooling fin 21, a heat sink 23 and a cooling conducting fin 22, the heat sink 23 and the cooling conducting fin 22 are disposed on two sides of the cooling fin 21, the cooling conducting fin 22 is located on the upper side of the air deflector 12, the lower portion of the cooling fin 21 is in sealing contact with the two water baffles 15, and a gap for condensed water to flow to the water drain hole 131 is formed between the cooling fin 21 and the bottom wall of the water receiving tank 13.
As shown in fig. 2 and 3, preferably, cooling fin 21 is provided with water spraying portion 24, water spraying portion 24 is located below cooling guide fin 22, and the condensed water flowing down flow guide plate 12 flows onto water spraying portion 24.
The water spraying part 24 comprises a water guiding and spraying inclined plane which guides the condensed water to enable the condensed water to flow to the water receiving groove 13, specifically, the water spraying part 24 forms a structure with a narrow upper part and a wide lower part, the flow area of the water flow is increased, and therefore the water cooling effect is improved.
The utility model radiating bracket 1 has an upper layer guide plate 12, the guide plate 12 is under the cold guide sheet 22, and the surface presents a certain slope, a certain gap is left between the low end of the guide plate 12 and the refrigeration sheet 21, forming a diversion seam for guiding the condensed water generated by the cold guide sheet 22, and automatically flowing to the radiating fin 23 through the design of the guide plate 12 slope. Meanwhile, the heat dissipation bracket 1 is provided with a two-layer water receiving groove 13 structure design and is used for receiving condensed water of a first layer of guide plate 12 after passing through a radiating fin 23, the two-layer water receiving groove 13 is provided with a low-level water drainage hole 131, the position of the water drainage hole 131 is positioned below the radiating fin 23 of the semiconductor system, when the condensed water flows, the radiating fin 23 is further cooled by radiation, the condensed water can be drained to a lower water tank of the semiconductor through the water drainage hole 131, and in order to avoid the accumulation of the condensed water under the high-humidity condition, two sides of the water drainage hole 131 of the two-layer water receiving groove 13 are respectively provided with a drain hole 151. In order to ensure the maximum capability of the one-layer flow guide plate 12 for draining the condensed water, the contact area between the condensed water and the radiating fins 23 needs to be ensured as much as possible, so the lower parts of the radiating fins 23 are designed to be in an inclined trapezoid shape, the lower part is wide and the upper part is narrow, and the lower parts of the radiating fins 23 form an inclined ladder water spraying surface.
When the whole machine is started, the cold guide sheet 22 generates condensed water when meeting humid air, the condensed water flows to the layer of the guide plate 12 of the heat dissipation bracket 1 under the action of gravity and flows to the flow guide seam, and the condensed water is guided to the inclined ladder water spraying surface at the hot end of the heat dissipation sheet 23 through the flow guide seam to form a high-efficiency water cooling effect.
When the dehumidification amount is large in a high-humidity state and water level accumulation is caused, the water drainage holes 151 on two sides of the two-layer water receiving groove 13 can enable water higher than a safe water level to flow to the water drainage hole 131, at the moment, due to the fact that the central axes of the cooling guide fins 22 and the cooling fins 23 of the semiconductor dehumidifier are designed asymmetrically, one part of the lower portion of the cooling fins 23 is lower than the two-layer water receiving groove 13 of the heat dissipation support 1, a part of accumulated condensed water soaks the cooling fins 23 into the water, heat dissipation of the cooling fins 23 is further improved, and high dehumidification efficiency of the semiconductor dehumidifier in the high-humidity state is guaranteed.
Exemplary embodiments of the present disclosure are specifically illustrated and described above. It is to be understood that the disclosure is not limited to the precise construction, arrangements, or instrumentalities described herein; on the contrary, the disclosure is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (10)
1. A heat dissipation support, comprising:
a chassis, on which a water receiving tank is arranged;
the flow guide mechanism comprises a support frame and a flow guide plate, wherein one end of the support frame is fixed on the chassis, and the other end of the support frame extends towards the upper part of the chassis;
the guide plate extends towards the water receiving tank, and the end close to the water receiving tank is obliquely and downwards arranged.
2. The heat dissipation bracket as claimed in claim 1, wherein a partition plate is disposed on a bottom wall of the base plate, and the partition plate and the base plate on one side of the partition plate jointly form the water receiving tank; the support frame is arranged on the chassis at the side of the water receiving groove.
3. The heat dissipating bracket as claimed in claim 2, wherein a water baffle is disposed on the bottom wall of the bottom plate, the water baffle is connected to the side wall of the partition plate on the same side as the two ends of the partition plate to form a water collecting portion with an opening at one end and located in the water receiving tank, and the inclined lower end of the flow guiding plate is disposed toward the opening of the water collecting portion.
4. The heat dissipating bracket of claim 3, wherein the water baffle has a drainage hole formed therein, and the drainage hole is located at a position higher than the bottom wall of the water receiving tank.
5. The bracket as claimed in claim 3, wherein a mounting area is defined between the two water baffles, and a support rib is disposed on a bottom wall of the water receiving tank and located between the two water baffles.
6. The heat dissipating support as claimed in claim 5, wherein the bottom wall of the water receiving tank is provided with a drainage hole, and the bottom wall of the water receiving tank is inclined downward from the distal end of the drainage hole to the proximal end of the drainage hole.
7. A dehumidifier comprising the heat dissipating support of any one of claims 1 to 6, and further comprising a semiconductor heat sink, which is supported and mounted on the heat dissipating support, wherein the flow guide plate of the heat dissipating support receives the condensed water flowing down from the cold guide plate of the semiconductor heat sink, and guides the condensed water to the lower end of the semiconductor heat sink for water cooling.
8. A dehumidifier, comprising:
the heat dissipation bracket of claim 6;
the semiconductor cooling fin comprises a refrigerating fin, a cooling fin and a cold conducting fin, the cooling fin and the cold conducting fin are arranged on two sides of the refrigerating fin, the cold conducting fin is located on the upper side of the guide plate, the lower portion of the refrigerating fin is in sealing contact with the two water baffle plates, and a gap for condensed water to flow to the drain hole is formed between the refrigerating fin and the bottom wall of the water receiving groove.
9. The dehumidifier of claim 8, wherein a water spraying portion is provided on the cooling fin, the water spraying portion is located at a lower side of the cooling guide fin, and the condensed water flowing down the flow guide plate flows onto the water spraying portion.
10. The dehumidifier of claim 9 wherein the shower portion includes a diversion shower ramp that diverts condensate water toward the water receiving sump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123102553.2U CN217031548U (en) | 2021-12-07 | 2021-12-07 | Heat dissipation support and dehumidifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123102553.2U CN217031548U (en) | 2021-12-07 | 2021-12-07 | Heat dissipation support and dehumidifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217031548U true CN217031548U (en) | 2022-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123102553.2U Active CN217031548U (en) | 2021-12-07 | 2021-12-07 | Heat dissipation support and dehumidifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217031548U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114087751A (en) * | 2021-12-07 | 2022-02-25 | 珠海格力电器股份有限公司 | Heat dissipation support and dehumidifier |
-
2021
- 2021-12-07 CN CN202123102553.2U patent/CN217031548U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114087751A (en) * | 2021-12-07 | 2022-02-25 | 珠海格力电器股份有限公司 | Heat dissipation support and dehumidifier |
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