CN217018877U - Semiconductor blade with chip guide groove - Google Patents
Semiconductor blade with chip guide groove Download PDFInfo
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- CN217018877U CN217018877U CN202123081131.1U CN202123081131U CN217018877U CN 217018877 U CN217018877 U CN 217018877U CN 202123081131 U CN202123081131 U CN 202123081131U CN 217018877 U CN217018877 U CN 217018877U
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- chip guide
- semiconductor
- water conservancy
- conservancy diversion
- guide grooves
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Abstract
The utility model relates to the technical field of cutters, in particular to a semiconductor blade with chip guide grooves. The semiconductor forming cutter has the flow guide structure convenient to adjust, and solves the problem that the conventional semiconductor forming cutter lacks the flow guide structure convenient to adjust, so that waste materials are easy to scatter and break away when the cutter performs cutting work, and the cutting effect is influenced.
Description
Technical Field
The utility model relates to the technical field of cutters, in particular to a semiconductor blade with chip guide grooves.
Background
The tool is a tool for cutting machining in machine manufacturing, also called a cutting tool, the semiconductor tool is a tool for machining semiconductor materials, and most of the tools are machine tools but also hand tools. Since the tools used in machine manufacturing are basically used for cutting metal materials.
Through retrieval, the publication number is CN212284322U, and the shearing tool comprises a hexagonal tool body and three working ends uniformly distributed along the outer edge of the tool body, wherein the center of the tool body is provided with a mounting hole which is hexagonal, the working ends are positioned on the side edges of the outer edge of the hexagonal tool body, the outer edge of the working end is provided with a cutting edge, and the cutting edge comprises a body extending along the outer edge of the tool body, and a rough shearing head and a fine shearing head which are positioned at two ends of the cutting edge body; the rough cutting head is far away from one end of the blade body is a linear rough cutting blade, and the fine cutting head is far away from one end of the blade body is a linear fine cutting blade. The shearing tool is made of the aluminum-nickel-cobalt permanent magnet alloy, so that the wear resistance of the tool is greatly improved; meanwhile, three working ends are adopted for exchange cutting, so that the service life of the crusher blade can be prolonged by one time, the consumption of the crusher blade in the crushing process is reduced, and the crushing cost is saved.
To sum up, current semiconductor shaping cutter lacks the water conservancy diversion structure of convenient regulation for the cutter is when carrying out cutting work, and the waste material collapses and separates easily, influences the effect of cutting.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a semiconductor insert provided with chip guide grooves to solve the problems set forth in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a semiconductor blade with chip groove, includes the cylinder, spacing hole, water conservancy diversion strip, recess and the sword body, cylinder one side is provided with the sword body, sword body both sides are provided with the recess, the inside spacing hole that is linear array and distributes that is provided with of recess, sword body both sides are provided with the water conservancy diversion strip, the water conservancy diversion strip with recess looks adaptation.
Preferably, the outer wall of the column body is provided with three mounting holes distributed in a linear array. The column body can be conveniently fixed at the upper end of a specific machine tool through the arrangement of the mounting hole, and the column body is not easy to fall off.
Preferably, the outer wall of one side of the column body is provided with a round angle. The round angle can reduce accidental scratching of the outer wall of the column body to a user.
Preferably, a rotating shaft is arranged on one side of the middle of the flow guide strip and is rotatably connected with the outer walls of the two sides of the cutter body. The arrangement of the rotating shaft can enable the guide strips to rotate by a certain angle relative to the cutter body, so that the adjustment of the chip guide angle is realized.
Preferably, the outer wall of one side of the flow guide strip is provided with a limiting block, and the limiting block is matched with the limiting hole. The guide plate rotating angle can be fixed through the matching of the limiting block and the limiting hole, and the deviation can not occur.
Preferably, one end of the flow guide strip is provided with a conical head. The effect of water conservancy diversion strip can be optimized through the setting of conical head.
Preferably, one side of the column body is provided with an inclined surface. The installation and the disassembly of the column body can be facilitated through the arrangement of the inclined plane.
Compared with the prior art, the utility model has the beneficial effects that: the water conservancy diversion strip that this device set up can be manual stir, utilizes the cooperation of spacing hole and stopper, realizes the regulation of the different angles of water conservancy diversion strip, conveniently adjusts the orientation that breaks away from of cutting waste material when the sword body cuts, optimizes the specific result of use of sword.
Drawings
FIG. 1 is a first angled three-dimensional perspective view of the present invention;
FIG. 2 is a second perspective view of the present invention;
fig. 3 is a schematic view of the tie bar of the present invention.
In the figure:
1. a cylinder; 2. mounting holes; 3. round corners; 4. a bevel; 5. a limiting hole; 6. a flow guide strip; 7. a groove; 8. a tool body; 9. a limiting block; 10. a conical head; 11. a rotating shaft.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 3, the present invention provides two embodiments:
the first embodiment is as follows:
the utility model provides a semiconductor blade with chip guide groove, including cylinder 1, spacing hole 5, water conservancy diversion strip 6, recess 7 and the tool body 8, 1 outer wall of cylinder is provided with the mounting hole 2 that is linear array distribution, the quantity of mounting hole 2 is three, can make things convenient for cylinder 1 to fix in specific lathe upper end through setting up of mounting hole 2, it drops to be difficult for taking place to drop, 1 one side outer wall of cylinder is provided with fillet 3, can reduce 1 outer wall of cylinder to the unexpected scratch of user through setting up of fillet 3, 1 one side of cylinder is provided with the tool body 8, 8 both sides of the tool body are provided with recess 7, the inside spacing hole 5 that is linear array distribution that is provided with of recess 7, 8 both sides of the tool body are provided with water conservancy diversion strip 6, water conservancy diversion strip 6 and recess 7 looks adaptation.
The second embodiment:
the utility model provides a semiconductor blade with chip groove, 6 middle part one sides of water conservancy diversion strip are provided with pivot 11, pivot 11 rotates with the 8 both sides outer walls of the tool body and is connected, setting up through pivot 11 can make water conservancy diversion strip 6 rotate certain angle relatively the tool body, the realization is to the regulation of piece water conservancy diversion angle, 6 one side outer walls of water conservancy diversion strip are provided with stopper 9, stopper 9 and 5 looks adaptations in spacing hole, can fix guide plate pivoted angle through stopper 9 and the cooperation in spacing hole 5, can not take place the skew, 6 one end of water conservancy diversion strip is provided with conical head 10, the effect of 6 water conservancy diversion of water conservancy diversion strip can be optimized in setting through conical head 10, 1 one side of cylinder is provided with inclined plane 4, can make things convenient for the installation and the dismantlement of cylinder 1 through the setting of inclined plane 4.
The working principle is as follows: the water conservancy diversion strip 6 that this device set up can be stirred manually, utilizes spacing hole 5 and stopper 9's cooperation, realizes the regulation of the different angles of water conservancy diversion strip 6, conveniently adjusts the position that breaks away from of cutting waste material when the cutter body 8 cuts, optimizes the result of use of the cutter body 8, and the utility model has the water conservancy diversion structure of conveniently adjusting, has solved the problem that current semiconductor shaping cutter lacks the convenient water conservancy diversion structure of adjusting for the cutter is when carrying out cutting work, and the waste material is easily scattered and is broken away from, influences the effect of cutting.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. The utility model provides a semiconductor blade with chip guide groove, includes cylinder (1), spacing hole (5), water conservancy diversion strip (6), recess (7) and the tool body (8), its characterized in that: the utility model discloses a cutting tool, including cylinder (1), the cylinder (8), the tool body (8) both sides are provided with recess (7), the inside spacing hole (5) that are the linear array and distribute that is provided with of recess (7), the tool body (8) both sides are provided with water conservancy diversion strip (6), water conservancy diversion strip (6) with recess (7) looks adaptation.
2. A semiconductor blade provided with chip guide grooves according to claim 1, wherein: the outer wall of the column body (1) is provided with mounting holes (2) distributed in a linear array, and the number of the mounting holes (2) is three.
3. A semiconductor blade provided with chip guide grooves according to claim 1, wherein: the outer wall of one side of the cylinder (1) is provided with a fillet (3).
4. The semiconductor blade provided with chip guide grooves according to claim 1, wherein: one side of the middle part of the diversion strip (6) is provided with a rotating shaft (11), and the rotating shaft (11) is rotatably connected with the outer walls of the two sides of the cutter body (8).
5. A semiconductor blade provided with chip guide grooves according to claim 1, wherein: the outer wall of one side of the flow guide strip (6) is provided with a limiting block (9), and the limiting block (9) is matched with the limiting hole (5).
6. The semiconductor blade provided with chip guide grooves according to claim 1, wherein: one end of the flow guide strip (6) is provided with a conical head (10).
7. A semiconductor blade provided with chip guide grooves according to claim 1, wherein: an inclined plane (4) is arranged on one side of the column body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123081131.1U CN217018877U (en) | 2021-12-09 | 2021-12-09 | Semiconductor blade with chip guide groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123081131.1U CN217018877U (en) | 2021-12-09 | 2021-12-09 | Semiconductor blade with chip guide groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217018877U true CN217018877U (en) | 2022-07-22 |
Family
ID=82440831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123081131.1U Active CN217018877U (en) | 2021-12-09 | 2021-12-09 | Semiconductor blade with chip guide groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217018877U (en) |
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2021
- 2021-12-09 CN CN202123081131.1U patent/CN217018877U/en active Active
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