CN216992590U

CN216992590U - Large-size silicon wafer diamond wire positioning cutting device

Info

Publication number: CN216992590U
Application number: CN202220475708.2U
Authority: CN
Inventors: 冯震坤
Original assignee: Wuxi Rongneng Semiconductor Material Co ltd
Current assignee: Wuxi Rongneng Semiconductor Material Co ltd
Priority date: 2022-03-07
Filing date: 2022-03-07
Publication date: 2022-07-19
Anticipated expiration: 2032-03-07

Abstract

The utility model discloses a large-size silicon wafer diamond wire positioning and cutting device which comprises a supporting plate and diamond wire cutting equipment, wherein the upper surface of the supporting plate is fixedly connected with two vertical plates, two guide rods are fixedly connected between the vertical plates, a first threaded rod is movably connected between the vertical plates, one side of the first threaded rod is movably connected with a sliding plate, the sliding plate is movably connected with the guide rods, one side of the sliding plate is fixedly connected with two side plates, two movable rods are inserted into one side of the sliding plate in a penetrating manner, a first spring is sleeved on one side of the circumference of each movable rod, one side of the circumference of each movable rod is fixedly connected with the same inverted U-shaped plate, and one side of each inverted U-shaped plate is fixedly connected with a clamping block. The silicon wafer cutting device can be pre-fixed when a large-size silicon wafer is cut by using the diamond wire cutting device, so that the phenomenon that the position of the silicon wafer is easy to deviate when the silicon wafer is fixed is avoided, and the cutting accuracy of the silicon wafer is guaranteed.

Description

Diamond wire positioning and cutting device for large-size silicon wafers

Technical Field

The utility model relates to the technical field of silicon wafer cutting, in particular to a large-size silicon wafer diamond wire positioning and cutting device.

Background

With the rapid development of the photovoltaic industry, the solar power generation cost is greatly reduced, silicon wafers serving as basic materials of the photovoltaic industry and the production and processing of the silicon wafers, particularly the cutting of silicon rods to obtain qualified silicon wafers, are important in the whole industrial chain, and in the field of silicon wafer production and processing, the slicing processing is a main process for determining the quality of the silicon wafers.

At present, most of the existing large-size silicon wafer diamond wire cutting devices have the following defects: when a diamond wire cutting device is used for cutting a large-size silicon wafer, the silicon wafer cannot be pre-fixed, so that the position of the fixed silicon wafer is easy to deviate, the accurate cutting of the silicon wafer is influenced, and in conclusion, most of the existing diamond wire cutting devices for the large-size silicon wafer cannot well meet actual requirements.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art, and provides a large-size silicon wafer diamond wire positioning and cutting device.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a jumbo size silicon chip buddha's warrior attendant line location cutting device, includes backup pad and buddha's warrior attendant line cutting equipment, two risers of last fixed surface of backup pad, two guide bars of fixedly connected with between the riser, swing joint has first threaded rod between the riser, one side swing joint of first threaded rod has the sliding plate, sliding plate and guide bar swing joint, two curb plates of one side fixedly connected with of sliding plate, and one side of sliding plate runs through to peg graft and has two movable rods, and first spring has been cup jointed on one side of the circumference of movable rod, the same U-shaped plate that falls of circumference one side fixedly connected with of movable rod, one side fixedly connected with clamp splice of the U-shaped plate that falls, and circumference one side fixedly connected with spacing ring of movable rod.

Furthermore, the upper surface of clamp splice is fixedly connected with two montants, the top fixedly connected with limiting plate of montant, and the upper surface swing joint of clamp splice has the second threaded rod.

Furthermore, one side swing joint of second threaded rod has the fixed plate, fixed plate and montant swing joint.

Furthermore, the upper surface of fixed plate runs through to peg graft there are two slide bars, and the bottom fixedly connected with clamp plate of slide bar, the bottom fixedly connected with rubber pad of clamp plate.

Furthermore, a second spring is sleeved on one side of the circumference of the sliding rod, and a fixing ring is fixedly connected to one side of the circumference of the sliding rod.

Further, the bottom of buddha's warrior attendant wire-electrode cutting equipment is fixedly connected with a plurality of connecting rods, and the connecting rod passes the backup pad.

Furthermore, the bottom of the diamond wire cutting equipment is fixedly connected with a baffle which penetrates through the supporting plate.

Further, the bottom fixedly connected with electric putter of backup pad, electric putter's output passes the backup pad, and electric putter's output and buddha's warrior attendant wire-electrode cutting equipment fixed connection.

The utility model has the beneficial effects that:

1. according to the utility model, through the arrangement of the mutually combined use of the clamping block and the side plate, the large-size silicon wafer can be pre-fixed when being cut by using the diamond wire cutting device, so that the phenomenon that the position is easy to deviate when the silicon wafer is fixed is avoided, and the cutting accuracy of the silicon wafer is ensured.

2. According to the silicon wafer cutting device, the pressing plate is arranged, so that the pressing plate can be tightly attached to the upper surface of the silicon wafer under the tension of the second spring, the silicon wafer can be further fixed, and the stability of the silicon wafer during cutting is guaranteed.

3. According to the silicon wafer cutting device, due to the arrangement of the baffle, the scraps generated in the silicon wafer cutting process can be separated and blocked, so that the collection of the silicon wafer scraps is ensured, the silicon wafer scraps can be uniformly processed in the later period, and the practicability is good.

Drawings

FIG. 1 is a schematic left side perspective view of a large-sized silicon wafer diamond wire positioning cutting device according to the present invention;

FIG. 2 is a schematic view of a partially enlarged structure of a large-sized silicon wafer diamond wire positioning cutting device according to the present invention;

FIG. 3 is a right side perspective view of a large-sized silicon wafer diamond wire positioning cutting device according to the present invention;

fig. 4 is a schematic partial three-dimensional structure diagram of a large-size silicon wafer diamond wire positioning cutting device provided by the utility model.

In the figure: 1. a support plate; 2. a diamond wire cutting device; 3. a vertical plate; 4. a guide bar; 5. a first threaded rod; 6. a sliding plate; 7. a side plate; 8. a movable rod; 9. an inverted U-shaped plate; 10. a limiting ring; 11. a first spring; 12. a clamping block; 13. a vertical rod; 14. a second threaded rod; 15. a fixing plate; 16. a slide bar; 17. pressing a plate; 18. a rubber pad; 19. a fixing ring; 20. a second spring; 21. a connecting rod; 22. an electric push rod; 23. and a baffle plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-4, a diamond wire positioning cutting device for large-size silicon wafers comprises a support plate 1 and a diamond wire cutting device 2, wherein two vertical plates 3 are fixed on the upper surface of the support plate 1 through bolts, two guide rods 4 are inserted between the vertical plates 3, a first threaded rod 5 is rotatably connected between the vertical plates 3, one side of the first threaded rod 5 is in threaded connection with a sliding plate 6, the sliding plate 6 is in sliding connection with the guide rods 4, two side plates 7 are fixed on one side of the sliding plate 6 through bolts, two movable rods 8 are inserted through one side of the sliding plate 6, a first spring 11 is sleeved on one side of the circumference of each movable rod 8, the same inverted U-shaped plate 9 is sleeved on one side of the circumference of each movable rod 8, a clamping block 12 is fixed on one side of the inverted U-shaped plate 9 through bolts, and pre-fixing can be performed when the diamond wire cutting device is used for large-size silicon wafers through the design that the clamping block 12 and the side plates 7 are combined with each other, the silicon wafer cutting device has the advantages that the phenomenon that the position is easy to deviate when the silicon wafer is fixed is avoided, the cutting accuracy of the silicon wafer is guaranteed, and one side of the circumference of the movable rod 8 is sleeved with the limiting ring 10.

The upper surface of the clamping block 12 is spliced with two vertical rods 13, the top ends of the vertical rods 13 are fixedly provided with a limiting plate through bolts, the upper surface of the clamping block 12 is in threaded connection with a second threaded rod 14, one side of the second threaded rod 14 is in threaded connection with a fixed plate 15, the fixed plate 15 is in sliding connection with the vertical rods 13, the upper surface of the fixed plate 15 is penetrated and spliced with two sliding rods 16, the bottom ends of the sliding rods 16 are fixedly provided with a pressing plate 17 through bolts, the bottom of the pressing plate 17 is bonded with a rubber pad 18, the rubber pad 18 is designed to play a role of protection when the pressing plate 17 fixes a silicon wafer so as not to scratch the surface of the silicon wafer caused by the pressing plate 17, one side of the circumference of the sliding rod 16 is sleeved with a second spring 20, through the design of the pressing plate 17, the pressing plate 17 can be tightly attached to the upper surface of the silicon wafer under the tension of the second spring 20, the silicon wafer can be further fixed so as to ensure the stability of the silicon wafer during cutting, and circumference one side of slide bar 16 is fixed with solid fixed ring 19 through the bolt fastening, the bottom of buddha's warrior attendant wire-electrode cutting equipment 2 is fixed with a plurality of connecting rods 21 through the bolt fastening, connecting rod 21 passes backup pad 1, the bottom of buddha's attendant wire-electrode cutting equipment 2 is fixed with baffle 23 through the bolt fastening, the design of baffle 23, the piece that produces when can cutting the silicon chip separates the fender, in order to guarantee the clastic concentration of silicon chip, so that the later stage is handled the clastic unified of silicon chip, the practicality is good, baffle 23 passes backup pad 1, the bottom of backup pad 1 is fixed with electric putter 22 through the bolt fastening, backup pad 1 is passed to electric putter 22's output, and electric putter 22's output and buddha's attendant wire-electrode cutting equipment 2 fixed connection.

The working principle of the embodiment is as follows: when the silicon wafer cutting device is used, firstly, the U-shaped plate 9 is pulled down manually, the movable rod 8 moves towards one side, the clamping block 12 leaves the sliding plate 6, at the moment, the first spring 11 is compressed, then, a silicon wafer to be detected is placed on the sliding plate 6, the edge of the silicon wafer is attached to the side plate 7, then, the inverted U-shaped plate 9 is loosened by hand, the movable rod 8 is reset under the tension of the first spring 11, the clamping block 12 is reset, then, the silicon wafer can be pre-fixed by being combined with the side plate 7, then, the second adjusting knob is rotated to drive the second threaded rod 14 to rotate, under the screw action of the second threaded rod 14, the fixing plate 15 moves downwards, the pressing plate 17 moves downwards and is attached to the upper surface of the silicon wafer, the silicon wafer can be further fixed, the stability of the silicon wafer during cutting is guaranteed, and then, rotatory first adjust knob drives first threaded rod 5 and rotates, under the screw thread effect of first threaded rod 5 for sliding plate 6 removes to the direction that is close to diamond wire-electrode cutting equipment 2 along guide bar 4, and then makes and wait to cut the silicon chip and be located diamond wire-electrode cutting equipment 2's below, then, starts diamond wire-electrode cutting equipment 2 and electric putter 22 simultaneously, and electric putter 22 drives diamond wire-electrode cutting equipment 2 and moves down, can cut the operation to the silicon chip.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

Claims

1. A large-size silicon wafer diamond wire positioning and cutting device comprises a support plate (1) and diamond wire cutting equipment (2), and is characterized in that two vertical plates (3) are fixedly connected to the upper surface of the support plate (1), two guide rods (4) are fixedly connected between the vertical plates (3), a first threaded rod (5) is movably connected between the vertical plates (3), a sliding plate (6) is movably connected to one side of the first threaded rod (5), the sliding plate (6) is movably connected with the guide rods (4), two side plates (7) are fixedly connected to one side of the sliding plate (6), two movable rods (8) are inserted into one side of the sliding plate (6) in a penetrating manner, a first spring (11) is sleeved on one side of the circumference of each movable rod (8), the same inverted U-shaped plate (9) is fixedly connected to one side of the circumference of each movable rod (8), and a clamping block (12) is fixedly connected to one side of the inverted U-shaped plate (9), and one side of the circumference of the movable rod (8) is fixedly connected with a limit ring (10).

2. The large-size silicon wafer diamond wire positioning and cutting device as claimed in claim 1, wherein two vertical rods (13) are fixedly connected to the upper surface of the clamping block (12), a limiting plate is fixedly connected to the top ends of the vertical rods (13), and a second threaded rod (14) is movably connected to the upper surface of the clamping block (12).

3. The wire positioning and cutting device for the large-size silicon wafers and the diamond wires as claimed in claim 2, wherein a fixing plate (15) is movably connected to one side of the second threaded rod (14), and the fixing plate (15) is movably connected with the vertical rod (13).

4. The wire positioning and cutting device for the large-size silicon wafers as claimed in claim 3, wherein two sliding rods (16) are inserted through the upper surface of the fixed plate (15), a pressing plate (17) is fixedly connected to the bottom ends of the sliding rods (16), and a rubber pad (18) is fixedly connected to the bottom of the pressing plate (17).

5. The device for positioning and cutting the diamond wires of the large-size silicon wafers as claimed in claim 4, wherein a second spring (20) is sleeved on one side of the circumference of the sliding rod (16), and a fixed ring (19) is fixedly connected on one side of the circumference of the sliding rod (16).

6. The diamond wire positioning and cutting device for the large-size silicon wafers as set forth in claim 1, wherein a plurality of connecting rods (21) are fixedly connected to the bottom of the diamond wire cutting device (2), and the connecting rods (21) penetrate through the support plate (1).

7. The diamond wire positioning and cutting device for the large-size silicon wafers as set forth in claim 6, wherein a baffle plate (23) is fixedly connected to the bottom of the diamond wire cutting device (2), and the baffle plate (23) penetrates through the support plate (1).

8. The device for positioning and cutting the diamond wires of the large-size silicon wafers according to claim 7, wherein an electric push rod (22) is fixedly connected to the bottom of the supporting plate (1), the output end of the electric push rod (22) penetrates through the supporting plate (1), and the output end of the electric push rod (22) is fixedly connected with the diamond wire cutting equipment (2).