CN216992589U

CN216992589U - Guiding device for large-size silicon wafer wire return cutting

Info

Publication number: CN216992589U
Application number: CN202220448697.9U
Authority: CN
Inventors: 冯震坤; 王成俊
Original assignee: Wuxi Jingyuntong Technology Co Ltd
Current assignee: Wuxi Jingyuntong Technology Co Ltd
Priority date: 2022-03-03
Filing date: 2022-03-03
Publication date: 2022-07-19
Anticipated expiration: 2032-03-03

Abstract

The utility model discloses a guide device for large-size silicon wafer return wire cutting, which comprises a base plate, wherein the top of the base plate is provided with a plurality of guide notches, one end of the bottom of the base plate is rotatably connected with two land wheels, the other end of the bottom of the base plate is rotatably inserted with a rotating rod, both ends of the rotating rod are respectively fixed with a rotating wheel, the bottom of the base plate is fixedly connected with a plurality of support plates, a support rod is fixedly connected between every two support plates, a first one-way threaded rod is also rotatably inserted between every two support plates, one end of the first one-way threaded rod is fixedly sleeved with an adjusting knob, the outer wall of the first one-way threaded rod is sleeved with a sliding strip, the sliding strip is connected with the support rod in a sliding manner, and the other end of the sliding strip is fixedly connected with a connecting rod. The utility model can avoid the deviation of the moving route of the guide device during cutting, improve the processing precision of the silicon wafer, and ensure that the silicon wafer is positioned at the longitudinal center position of the guide device so as to ensure the accuracy of silicon wafer cutting.

Description

Guiding device for large-size silicon wafer return wire cutting

Technical Field

The utility model relates to the technical field of silicon wafer cutting, in particular to a guide device for large-size silicon wafer return wire cutting.

Background

With the transformation and upgrade of the industry in China, the electronic industry such as integrated circuits and the like is rapidly developed, the demand of the market on silicon wafers is increasing day by day, the silicon wafers are mainly obtained by cutting silicon rods, a guide device is needed when large-size silicon wafers are subjected to wire return cutting, and the existing guide device for the wire return cutting of the large-size silicon wafers cannot meet the demand.

At present, most of the existing guide devices for the wire return cutting of large-size silicon wafers have the following defects: when the silicon wafer is cut, the stability of the moving line of the guide device cannot be ensured, so that the silicon wafer is deviated during cutting, the processing precision of the silicon wafer is influenced, and in conclusion, most of the existing guide devices for cutting the return wire of the large-size silicon wafer cannot well meet the actual requirements.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a guide device for large-size silicon wafer back wire cutting.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a guider that jumbo size silicon chip returns wire-electrode cutting used, includes the backing plate, the top of backing plate is equipped with a plurality of direction notches, and the one end of backing plate bottom is rotated and is connected with two land wheels, and the other end of backing plate bottom is rotated and is pegged graft and have the dwang, and the both ends of dwang all are fixed with the runner, a plurality of backup pads of bottom fixedly connected with of backing plate, fixedly connected with bracing piece between per two backup pads still rotate between per two backup pads and peg graft and have first one-way threaded rod, and the fixed cover in first one-way threaded rod one end is equipped with adjust knob, and the outer wall thread bush of first one-way threaded rod is equipped with the slip strip, and the slip strip is established with bracing piece slip cap and is connected, and the other end fixedly connected with connecting rod of slip strip, and the other end of connecting rod rotates and is connected with universal ball.

Furthermore, the top of backing plate is equipped with two through-holes, and adjust knob passes the through-hole.

Further, two risers of top fixedly connected with of backing plate, two guide bars of fixedly connected with between two risers rotate between two risers and peg graft and have the one-way threaded rod of second, and the outer wall thread bush of the one-way threaded rod of second is equipped with the sliding plate, and the guide bar is established with the sliding plate slip cap and is connected.

Furthermore, one side fixedly connected with connecting plate of sliding plate, the other end fixedly connected with trapezoidal plate of connecting plate, one side of trapezoidal plate is equipped with a plurality of side channels, and the side channel communicates with the direction notch.

Furthermore, the top of backing plate fixedly connected with a plurality of trapezoidal blocks, trapezoidal block and trapezoidal plate set up relatively.

Further, one side fixedly connected with side piece of trapezoidal plate, the fixed dead lever of pegging graft between the both sides of side piece, it has two-way threaded rod still to rotate to peg graft between the both sides of side piece, and the outer wall thread bush of two-way threaded rod is equipped with splint, and splint establish with the dead lever slip cap and be connected, one side fixedly connected with regulating plate of splint.

Furthermore, the both ends of dead lever are the equal fixedly connected with fixed plate, and the fixed plate rotates with two-way threaded rod to overlap and establishes and be connected.

The utility model has the beneficial effects that:

1. according to the silicon wafer cutting device, the first one-way threaded rod rotates, so that the sliding strip moves along the first guide threaded rod, the two universal balls are abutted to two sides of the cutting device, the moving route of the guide device is prevented from being deviated during cutting, and the processing precision of a silicon wafer is improved.

2. According to the silicon wafer cutting device, the clamping plate is driven to move on the bidirectional threaded rod by rotating the bidirectional threaded rod, so that the two adjusting plates are driven to move towards the middle, the silicon wafer is further driven to move on the base plate, and the silicon wafer is located at the longitudinal center of the guide device, so that the silicon wafer cutting accuracy is guaranteed.

3. According to the silicon wafer cutting machine, the second one-way threaded rod is rotated to drive the sliding plate to move on the second one-way threaded rod, so that the trapezoidal plate is driven to move, the silicon wafer is pushed to approach the trapezoidal block, and the silicon wafer is clamped under the matching use of the trapezoidal block, so that the silicon wafer is conveniently cut.

Drawings

FIG. 1 is a schematic diagram of a right side perspective structure of a guide device for cutting a large-size silicon wafer back wire according to the present invention;

FIG. 2 is a schematic bottom view of a guide device for back cutting of large-sized silicon wafers according to the present invention;

FIG. 3 is a schematic diagram of a partially enlarged structure of a guide device for back cutting of a large-sized silicon wafer according to the present invention;

FIG. 4 is a schematic left side perspective view of a guiding device for large-sized silicon wafer back-line cutting according to the present invention;

fig. 5 is a schematic view of a partially enlarged structure of a guiding device for cutting a return wire of a large-size silicon wafer according to the present invention.

In the figure: 1. a base plate; 2. a guide slot opening; 3. a land wheel; 4. rotating the rod; 5. a rotating wheel; 6. a support plate; 7. a support bar; 8. a first one-way threaded rod; 9. a slide bar; 10. a connecting rod; 11. a universal ball; 12. adjusting a knob; 13. a port; 14. a vertical plate; 15. a guide bar; 16. a sliding plate; 17. a connecting plate; 18. a trapezoidal plate; 19. a trapezoidal block; 20. a second one-way threaded rod; 21. a side groove; 22. a side block; 23. fixing the rod; 24. a bidirectional threaded rod; 25. a fixing plate; 26. a splint; 27. an adjusting plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Referring to fig. 1-5, a guiding device for large-size silicon wafer back-line cutting comprises a backing plate 1, a plurality of guiding notches 2 are formed in the top of the backing plate 1, the guiding notches 2 facilitate the cutting of a cutting device so as to avoid damaging the cutting device, two land wheels 3 are rotatably connected to one end of the bottom of the backing plate 1, a rotating rod 4 is rotatably inserted into the other end of the bottom of the backing plate 1, rotating wheels 5 are fixed to both ends of the rotating rod 4, the land wheels 2 and the rotating wheels 5 roll to drive the guiding device to move, a plurality of supporting plates 6 are fixed to the bottom of the backing plate 1 through bolts, a supporting rod 7 is fixed between every two supporting plates 6 through bolts, a first one-way threaded rod 8 is further rotatably inserted between every two supporting plates 6, an adjusting knob 12 is fixedly sleeved at one end of the first one-way threaded rod 8, a sliding strip 9 is sleeved on the outer wall of the first one-way threaded rod 8, the slip strip 9 is established with bracing piece 7 slip cap and is connected, the other end of slip strip 9 has connecting rod 10 through the bolt fastening, the other end of connecting rod 10 is rotated and is connected with universal ball 11, it rotates to rotate adjust knob 12 and drive first one-way threaded rod 8, thereby make slip strip 9 remove along first direction threaded rod 8 and bracing piece 7, thereby drive connecting rod 10 and remove, and then make two universal balls 11 support the both sides at cutting device, guider moving path takes place the skew when avoiding cutting.

The top of the backing plate 1 is provided with two through holes 13, an adjusting knob 12 penetrates through the through holes 13 so as to adjust the rotation of the adjusting knob 12, the top of the backing plate 1 is fixedly provided with two vertical plates 14 through bolts, two guide rods 15 are fixedly arranged between the two vertical plates 14 through bolts, a second one-way threaded rod 20 is rotatably inserted between the two vertical plates 14, the outer wall thread of the second one-way threaded rod 20 is sleeved with a sliding plate 16, the guide rods 15 are slidably sleeved and connected with the sliding plate 16, one side of the sliding plate 16 is fixedly provided with a connecting plate 17 through bolts, the other end of the connecting plate 17 is fixedly provided with a trapezoidal plate 18 through bolts, one side of the trapezoidal plate 18 is provided with a plurality of side grooves 21, the side grooves 21 are communicated with the guide groove openings 2 so as to facilitate the cutting of silicon wafers, the top of the backing plate 1 is fixedly provided with a plurality of trapezoidal blocks 19 through bolts, the trapezoidal blocks 19 are arranged opposite to the trapezoidal plate 18, the sliding plate 16 is driven to move on the second one-way threaded rod 20 and the guide rods 15 by rotating the second one-way threaded rod 20, thereby driving the connecting plate 17 and the trapezoidal plate 18 to move, further pushing the silicon wafer to approach the trapezoidal block 19, then clamping the silicon wafer under the cooperation of the trapezoidal block 19, one side of the trapezoidal plate 18 is fixed with a side block 22 through a bolt, a fixing rod 23 is fixed between two sides of the side block 22, a bidirectional threaded rod 24 is also rotatably inserted between two sides of the side block 22, a clamping plate 26 is sleeved on the outer wall thread of the bidirectional threaded rod 24, the clamping plate 26 is slidably sleeved with the fixing rod 23, an adjusting plate 27 is fixed on one side of the clamping plate 26 through a bolt, the clamping plate 26 is driven to move on the bidirectional threaded rod 24 and the fixing rod 23 by rotating the bidirectional threaded rod 24, thereby driving the two clamping plates 26 and the two adjusting plates 27 to move towards the middle, further moving the silicon wafer on the backing plate 1, so that the silicon wafer is located at the longitudinal central position of the guiding device, and fixing plates 25 are fixed at two ends of the fixing rod 23 through bolts, the fixing plate 25 is rotatably sleeved with the bidirectional threaded rod 24.

The working principle of the embodiment is as follows: when in use, firstly, the guiding device is placed in front of the cutting mechanism of the cutting device according to the requirement of silicon wafer cutting, then the adjusting knob 12 is rotated to drive the first one-way threaded rod 8 to rotate, so that the sliding strip 9 moves along the first guiding threaded rod 8 and the supporting rod 7, so as to drive the connecting rod 10 to move, so as to enable the two universal balls 11 to abut against the two sides of the cutting device, thereby avoiding the deviation of the moving route of the guiding device during cutting, then the silicon wafer is placed above the backing plate 1, then the two-way threaded rod 24 is rotated to drive the clamping plate 26 to move on the two-way threaded rod 24 and the fixing rod 23, so as to drive the two clamping plates 26 and the two adjusting plates 27 to move towards the middle, so as to enable the silicon wafer to be positioned at the longitudinal center position of the guiding device, then the second one-way threaded rod 20 is rotated to drive the sliding plate 16 to move on the second one-way threaded rod 20 and the guiding rod 15, thereby drive connecting plate 17 and trapezoidal plate 18 and remove, and then promote the silicon chip and close to trapezoidal piece 19, again clamp the silicon chip under the cooperation of trapezoidal piece 19 is used, then, the manual guider that promotes removes to the cutting of silicon chip.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the utility model concepts of the present invention in the scope of the present invention.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

Claims

1. A guiding device for large-size silicon wafer return wire cutting comprises a base plate (1) and is characterized in that a plurality of guiding notches (2) are formed in the top of the base plate (1), two land wheels (3) are rotatably connected to one end of the bottom of the base plate (1), a rotating rod (4) is rotatably inserted into the other end of the bottom of the base plate (1), rotating wheels (5) are fixed to two ends of the rotating rod (4), a plurality of supporting plates (6) are fixedly connected to the bottom of the base plate (1), a supporting rod (7) is fixedly connected between every two supporting plates (6), a first one-way threaded rod (8) is rotatably inserted into the space between every two supporting plates (6), an adjusting knob (12) is fixedly arranged at one end of the first one-way threaded rod (8), a sliding strip (9) is sleeved on the outer wall of the first one-way threaded rod (8), and the sliding strip (9) is connected with the supporting rod (7) in a sliding manner, the other end of the sliding strip (9) is fixedly connected with a connecting rod (10), and the other end of the connecting rod (10) is rotatably connected with a universal ball (11).

2. The guide device for wire return cutting of large size silicon wafers as claimed in claim 1, wherein the top of the backing plate (1) is provided with two through openings (13), and the adjusting knob (12) passes through the through openings (13).

3. The guiding device for the back line cutting of the large-size silicon wafers as claimed in claim 1, wherein two vertical plates (14) are fixedly connected to the top of the base plate (1), two guide rods (15) are fixedly connected between the two vertical plates (14), a second one-way threaded rod (20) is rotatably inserted between the two vertical plates (14), a sliding plate (16) is sleeved on the outer wall of the second one-way threaded rod (20) in a threaded manner, and the guide rods (15) are slidably sleeved and connected with the sliding plate (16).

4. The guide device for wire return cutting of the large-size silicon wafers as claimed in claim 3, wherein a connecting plate (17) is fixedly connected to one side of the sliding plate (16), a trapezoidal plate (18) is fixedly connected to the other end of the connecting plate (17), a plurality of side grooves (21) are formed in one side of the trapezoidal plate (18), and the side grooves (21) are communicated with the guide groove opening (2).

5. The guide device for the wire return cutting of the large-size silicon wafers as claimed in claim 4, wherein a plurality of trapezoidal blocks (19) are fixedly connected to the top of the backing plate (1), and the trapezoidal blocks (19) are arranged opposite to the trapezoidal plates (18).

6. The guiding device for wire return cutting of the large-size silicon wafers as claimed in claim 5, wherein a side block (22) is fixedly connected to one side of the trapezoidal plate (18), a fixing rod (23) is fixedly inserted between two sides of the side block (22), a bidirectional threaded rod (24) is rotatably inserted between two sides of the side block (22), a clamping plate (26) is sleeved on the outer wall of the bidirectional threaded rod (24) in a threaded manner, the clamping plate (26) is slidably sleeved and connected with the fixing rod (23), and an adjusting plate (27) is fixedly connected to one side of the clamping plate (26).

7. The guiding device for cutting the return wire of the large-size silicon wafer as claimed in claim 6, wherein the two ends of the fixing rod (23) are fixedly connected with fixing plates (25), and the fixing plates (25) are rotatably sleeved with the two-way threaded rod (24).