CN216989654U

CN216989654U - Mould pressing device for rapid cold forming of diode

Info

Publication number: CN216989654U
Application number: CN202123449509.9U
Authority: CN
Inventors: 华国铭; 罗伟忠; 周天成
Original assignee: Suzhou Formosa Electronic Co ltd
Current assignee: Suzhou Formosa Electronic Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-07-19
Anticipated expiration: 2031-12-30

Abstract

The utility model provides a mould pressing device for rapid cold forming of a diode, which comprises: the device comprises a supporting platform, a movable part, a distance adjusting part and a control part, wherein the supporting platform is slidably provided with the movable part, the movable part is provided with a mounting groove for mounting a diode, and the diode is mounted in the mounting groove through the distance adjusting part; the pressing die assembly is fixed at one end of the supporting platform and is provided with a pressing block part which moves in the pressing vertical direction; the pushing assembly is arranged on the supporting platform and provided with an output end used for pushing the moving part to move. This scheme can carry out compression molding to a small amount of diode in the diode sample stage, when the parameter that needs the mould pressing in the sample stage is adjusted repeatedly, and the unsuitable big equipment that uses the batch forming has simple efficient advantage with this scheme.

Description

Mould pressing device for rapid cold forming of diode

Technical Field

The utility model relates to the technical field of diode production and preparation, in particular to a die pressing device for rapid cold forming of a diode.

Background

The existing diode forming equipment adopts a scheme of continuous automatic feeding and is used for carrying out compression molding on a lead of a diode. However, this solution is not suitable for the production of test specimens, for example, a few samples are transported and then introduced into the molding apparatus through a single process, which is time consuming and inconvenient for adjusting the working parameters of the test specimen product back and forth. When a small part or a single sample is sampled, the existing scheme is generally carried out in a manual operation mode, but the error of the scheme is too large, and the irregularity of the lead is easily caused.

In view of this, it is desirable to provide an apparatus capable of press molding a diode at a sample stage.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a die pressing device for rapid cold forming of diodes, which can be used for die pressing of a small number of diodes in a diode sample stage, and is not suitable for large batch forming equipment when die pressing parameters need to be adjusted repeatedly in the sample stage. And through setting up the removal portion, can realize installing at a station, after the installation, the removal portion sends the diode to the lower extreme of briquetting portion to separate charging area and mould pressing district, have fine security.

Specifically, the utility model provides a mould pressing device for rapid cold forming of a diode, which comprises:

the diode support device comprises a support platform, a movable part and a diode, wherein the support platform is slidably provided with the movable part, the movable part is provided with a mounting groove for mounting a diode, and the diode is mounted in the mounting groove through a distance adjusting piece;

the pressing die assembly is fixed at one end of the supporting platform and is provided with a pressing block part which moves in the pressing vertical direction;

the pushing assembly is installed on the supporting platform and provided with an output end used for pushing the moving part to move.

The beneficial effect of this scheme lies in: can carry out compression molding to a small amount of diodes at the diode sample stage, when the parameter that needs the mould pressing in the sample stage is adjusted repeatedly, be unsuitable with fashioned big equipment in batches, with this scheme have simple efficient advantage. And through setting up the removal portion, can realize installing at a station, after the installation, the removal portion sends the diode to the lower extreme of briquetting portion to separate charging area and mould pressing district, have fine security.

Preferably, the mounting groove includes:

the diode body groove is used for mounting a diode body of the diode and is positioned in the middle of the moving part;

and the two lead grooves are respectively positioned at two sides of the pipe body groove and are used for communicating the side surface of the moving part with the pipe body groove.

Further, the pipe body groove is of a semi-cylindrical structure, and the length of the pipe body groove in the axis direction of the pipe body groove is larger than that of the pipe body in the axis direction.

The beneficial effect of this scheme lies in: the diode body can move in the diode body groove conveniently, and therefore the position of the diode can be adjusted conveniently.

Preferably, the distance adjusting member includes:

the push plate is arranged in the pipe body groove through an elastic piece, and the telescopic direction of the elastic piece is consistent with the axial direction of the pipe body;

the cushion block is arranged on one side, away from the elastic piece, of the pipe body groove, and the pipe body is installed between the cushion block and the push plate.

The beneficial effect of this scheme lies in: according to the position of bending the lead, the cushion block with the thickness is selected, so that the bent part of the lead can be adjusted. And the combination of the push plate and the elastic piece can always effectively limit the diode, thereby avoiding the movement of the diode.

Preferably, one end of the moving part, which is close to the pressing part, is detachably provided with a limiting part, and the lower surface of the limiting part is pressed on the lead and used for preventing the lead from moving upwards.

The technical effect of the scheme is as follows: the lead is used for avoiding the twisting of the lead close to the tube body.

Preferably, a T-shaped insertion groove is formed in the moving portion, a T-shaped insertion portion is arranged at the lower end of the limiting portion, and the T-shaped insertion portion and the T-shaped insertion groove are inserted and arranged.

The beneficial effect of this scheme lies in: the spacing portion of difference can be changed when the lead wire of different diameters needs to be locked to the dismantlement and the installation of the spacing portion of being convenient for.

Preferably, the supporting platform comprises two side plates, the two side plates are respectively arranged on two sides of the moving portion, the length direction of the side plates is parallel to the axis direction of the pipe body, a strip-shaped opening is formed in each side plate along the length direction of the side plate, and the sliding connecting piece on the moving portion can be slidably arranged in the strip-shaped opening.

The beneficial effect of this scheme lies in: the stability of the moving part in linear motion is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments or the description of the prior art will be briefly described below.

FIG. 1 is a schematic perspective view of a molding apparatus for rapid cold forming of a diode according to the present embodiment;

FIG. 2 is a schematic structural diagram of a side view of a molding device for rapid cold forming of a diode according to the present embodiment;

fig. 3 is a schematic view of the connection relationship between the pushing assembly and the moving part in the present embodiment;

fig. 4 is a partially enlarged schematic view of a portion a in fig. 3.

Wherein the reference numbers referred to in the figures are as follows:

11-a support platform; 12-a moving part; 13-mounting grooves; 14-a die assembly; 15-a briquetting section; 16-a push component; 17-pipe body groove; 18-a lead slot; 19-push plate; 20-cushion block; 21-an elastic member; 22-a limiting part; 23-T-shaped insertion grooves; 24-T shaped plug-in part; 25-side plate; 26-a strip-shaped opening; 27-sliding connection.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1 to 4, the present embodiment proposes a molding apparatus for rapid cold forming of a diode, including:

the diode support device comprises a support platform 11, wherein a moving part 12 is slidably arranged on the support platform 11, an installation groove 13 for installing a diode is arranged on the moving part 12, and the diode is installed in the installation groove 13 through a distance adjusting piece;

a die assembly 14, the die assembly 14 is fixed at one end of the supporting platform 11, and the die assembly 14 is provided with a pressing block part 15 which moves in a pressing vertical direction;

a pushing assembly 16, wherein the pushing assembly 16 is mounted on the supporting platform 11, and the pushing assembly 16 has an output end for pushing the moving part 12.

The beneficial effect of this scheme lies in: can carry out compression molding to a small amount of diodes at the diode sample stage, when the parameter that needs the mould pressing in the sample stage is adjusted repeatedly, be unsuitable with fashioned big equipment in batches, with this scheme have simple efficient advantage. And through setting up removal portion 12, can realize installing at a station, after the installation, removal portion 12 sends the diode to the lower extreme of briquetting portion 15 to separate the charge space and mould pressing district, have fine security.

As an embodiment of the present embodiment, as shown in fig. 4, the mounting groove 13 includes:

a body groove 17, wherein the body groove 17 is used for installing a body of the diode, and the body groove 17 is positioned in the middle of the moving part 12;

and lead grooves 18, wherein the two lead grooves 18 are respectively positioned at two sides of the tube body groove 17, and the lead grooves 18 are used for communicating the side surface of the moving part 12 with the tube body groove 17.

Further, the pipe body groove 17 is a semi-cylindrical structure, and the length of the pipe body groove 17 in the axis direction is greater than that of the pipe body.

The beneficial effect of this scheme lies in: facilitating movement of the body of the diode in the body slot 17 and thereby facilitating adjustment of the position of the diode.

As an embodiment of this embodiment, as shown in fig. 4, the distance adjusting member includes:

the push plate 19, the push plate 19 is installed in tube body trough 17 through the elastic component 21, the flexible direction of the elastic component 21 is unanimous with axial direction of the tube body;

a spacer 20, the spacer 20 being disposed on a side of the tube slot 17 remote from the resilient member 21, the tube being mounted between the spacer 20 and the pusher plate 19.

The beneficial effect of this scheme lies in: the thickness of the pad 20 is selected according to the position of bending the lead, so that the bent part of the lead can be adjusted. And the combination of the push plate 19 and the elastic piece 21 can always and effectively limit the diode, thereby avoiding the movement of the diode.

As an embodiment of the present embodiment, as shown in fig. 4, one end of the moving part 12 near the pressing part 15 is detachably provided with a stopper part 22, and a lower surface of the stopper part 22 is pressed on the lead wire and is used for preventing the lead wire from moving upward. Wherein, the air cylinder of the die assembly 14 drives the pressing block part 15 to move in the vertical direction.

As an embodiment of this embodiment, as shown in fig. 4, a T-shaped insertion groove 23 is provided on the moving portion 12, a T-shaped insertion portion 24 is provided at the lower end of the limiting portion 22, and the T-shaped insertion portion 24 and the T-shaped insertion groove 23 are inserted into each other.

The beneficial effect of this scheme lies in: the disassembly and the installation of the limiting parts 22 are convenient, and when the leads with different diameters need to be locked, different limiting parts 22 can be replaced.

As an embodiment of the present embodiment, as shown in fig. 1 and 2, the supporting platform 11 includes two side plates 25, the two side plates 25 are respectively disposed at two sides of the moving portion 12, the length direction of the side plates 25 is parallel to the axial direction of the pipe body, the side plates 25 are provided with strip-shaped openings 26 along the length direction thereof, and the sliding connectors 27 on the moving portion 12 are slidably disposed in the strip-shaped openings 26.

The beneficial effect of this scheme lies in: the smoothness of the moving portion 12 in the linear motion is improved.

In operation, the diode is installed in the installation groove 13, the position of the diode is adjusted through the cushion block 20, then the pushing assembly 16 pushes the moving part 12 to a working area, at the moment, the die assembly 14 works, and the pressing block part 15 in the die assembly performs die forming on the lead of the diode.

It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the utility model.

Claims

1. A molding device for rapid cold forming of diodes is characterized by comprising:

the diode support device comprises a support platform (11), wherein a moving part (12) is slidably arranged on the support platform (11), an installation groove (13) for installing a diode is formed in the moving part (12), and the diode is installed in the installation groove (13) through a distance adjusting piece;

a die assembly (14), wherein the die assembly (14) is fixed at one end of the supporting platform (11), and the die assembly (14) is provided with a pressing block part (15) which moves in a pressing vertical direction;

a pushing assembly (16), wherein the pushing assembly (16) is installed on the supporting platform (11), and the pushing assembly (16) is provided with an output end used for pushing the moving part (12) to move.

2. Embossing apparatus for the rapid cold forming of diodes according to claim 1, characterized in that said mounting groove (13) comprises:

a tube groove (17), wherein the tube groove (17) is used for installing a tube of the diode, and the tube groove (17) is positioned in the middle of the moving part (12);

and the two lead grooves (18) are respectively positioned at two sides of the pipe body groove (17), and the lead grooves (18) are used for communicating the side surface of the moving part (12) with the pipe body groove (17).

3. The embossing device for the rapid cold forming of diodes as claimed in claim 2, wherein the tube body groove (17) has a semi-cylindrical structure, and the length of the tube body groove (17) in the direction of the axis thereof is greater than the length of the tube body in the direction of the axis thereof.

4. The embossing apparatus for rapid cold forming of diodes as claimed in claim 3, wherein the distance adjusting member comprises:

the push plate (19) is installed in the pipe body groove (17) through an elastic piece (21), and the stretching direction of the elastic piece (21) is consistent with the axial direction of the pipe body;

the cushion block (20), the cushion block (20) is placed on one side, away from the elastic piece (21), of the pipe body groove (17), and the pipe body is installed between the cushion block (20) and the push plate (19).

5. The embossing device for rapid cold forming of diodes as claimed in claim 4, wherein one end of the moving part (12) near the pressing part (15) is detachably provided with a limiting part (22), and the lower surface of the limiting part (22) is pressed on the lead and is used for preventing the lead from moving upwards.

6. The molding device for rapid cold molding of diodes as claimed in claim 5, wherein the moving part (12) is provided with a T-shaped insertion groove (23), the lower end of the limiting part (22) is provided with a T-shaped insertion part (24), and the T-shaped insertion part (24) and the T-shaped insertion groove (23) are inserted and arranged.

7. The embossing device for the rapid cold forming of diodes as claimed in claim 2, characterized in that the supporting platform (11) comprises two side plates (25), the two side plates (25) are respectively arranged at two sides of the moving part (12), the length direction of the side plates (25) is parallel to the axial direction of the tube body, the side plates (25) are provided with strip-shaped openings (26) along the length direction, and the sliding connectors (27) on the moving part (12) are slidably arranged in the strip-shaped openings (26).