CN216989322U

CN216989322U - Bending device and solder strip processing equipment

Info

Publication number: CN216989322U
Application number: CN202123045537.4U
Authority: CN
Inventors: 不公告发明人
Original assignee: Wuxi Lead Intelligent Equipment Co Ltd
Current assignee: Wuxi Lead Intelligent Equipment Co Ltd
Priority date: 2021-12-06
Filing date: 2021-12-06
Publication date: 2022-07-19
Anticipated expiration: 2031-12-06

Abstract

The utility model relates to a bending device which comprises a base, a clamping assembly and a bending assembly. The clamping component is fixedly connected to the base and used for clamping one end of a workpiece; the bending assembly is rotatably connected to the base around a rotating axis and is provided with a bending channel matched with the workpiece, and an initial position is formed in the rotating process of the bending assembly; when the bending assembly is located at the initial position, the bending assembly and the clamping assembly are sequentially arranged in a first direction perpendicular to the rotation axis, and the other end of the workpiece, far away from the clamping assembly, penetrates through the bending channel. One end of a workpiece is clamped by the clamping assembly, the other end of the workpiece penetrates through the bending channel of the bending assembly, then the bending assembly is rotated, and one end of the workpiece, far away from the clamping assembly, is bent in the rotating process of the bending assembly, so that the workpiece bending efficiency is effectively improved. The utility model also relates to solder strip processing equipment.

Description

Bending device and solder strip processing equipment

Technical Field

The utility model relates to the technical field of automation equipment, in particular to a bending device and welding strip processing equipment.

Background

During the welding process of the battery string, a bent welding strip needs to be provided, and the conventional welding strip bending mechanism is usually complex, so that the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

In view of this, it is necessary to provide a bending apparatus and a solder strip processing apparatus with high production efficiency, which are directed to the problem of low production efficiency of the conventional bent solder strip.

A bending device, comprising:

a base;

the clamping assembly is fixedly connected to the base and used for clamping one end of a workpiece; and

the bending assembly is rotatably connected to the base around a rotating axis and is provided with a bending channel matched with a workpiece, and an initial position is formed in the rotating process of the bending assembly;

when the bending assembly is located at the initial position, the bending assembly and the clamping assembly are sequentially arranged along a first direction perpendicular to the rotation axis, and the other end, far away from the clamping assembly, of the workpiece penetrates through the bending channel.

By the aid of the bending device, the bending assembly is located at an initial position, then one end of the workpiece is clamped by the clamping assembly, the other end of the workpiece penetrates through the bending channel of the bending assembly, then the bending assembly is rotated, and one end, far away from the clamping assembly, of the workpiece is bent in the rotating process of the bending assembly. Therefore, the workpiece bending efficiency is effectively improved.

In one embodiment, the bending assembly includes a rotating base and a limiting member, the rotating base is rotatably connected to the base around the rotation axis, and the rotating base is provided with an accommodating groove extending in a direction perpendicular to the rotation axis, and the limiting member is connected to the base and is configured to cover the accommodating groove to form the bending channel.

In one embodiment, the limiting member is connected to the rotating base in a reciprocating manner along a second direction parallel to the rotating axis, so as to cover or expose the accommodating groove during the moving process.

In one embodiment, the bending device comprises a plurality of clamping assemblies which are arranged at intervals along a second direction perpendicular to the rotation axis;

the bending assembly comprises a plurality of limiting pieces, the limiting pieces are arranged at intervals along the second direction, the rotating base is provided with a plurality of accommodating grooves, the accommodating grooves are arranged at intervals along the second direction, and each limiting piece is used for covering a corresponding accommodating groove to form a bending channel;

when the rotating base is located at the initial position, each clamping assembly and one bending channel are arranged at intervals in the first direction.

In one embodiment, the clamping assembly comprises a fixed block and a movable block, the fixed block is fixedly connected to the base, the movable block and the fixed block are arranged at intervals along a second direction parallel to the rotation axis, and the movable block can move back and forth along the second direction to be matched with the fixed block to clamp or release a workpiece.

In one embodiment, the bending device further comprises a driving mechanism, and the driving mechanism is arranged on the base and is in transmission connection with the bending assembly so as to drive the bending assembly to rotate around the rotation axis.

A welding strip processing device comprises the bending device.

In one embodiment, the solder strip processing apparatus further comprises a base, a first cutting device and a strip pulling device, wherein the first cutting device and the bending device are arranged on the base at intervals along the first direction, the first cutting device is used for cutting off the solder strip, and the strip pulling device is arranged on the base in a reciprocating manner along the first direction and is used for pulling the solder strip from the first cutting device to the bending device and placing the solder strip on the bending device, so that the clamping assembly clamps the solder strip and the solder strip passes through the bending channel.

In one embodiment, the welding strip processing equipment comprises n bending devices, the welding strip processing equipment further comprises n-1 second cutting devices, the first cutting devices and the n bending devices are sequentially arranged at intervals along the first direction, the strip pulling device is used for pulling the welding strip towards the bending devices and placing the welding strip on the n bending devices, one second cutting device is arranged between every two adjacent bending devices, and the second cutting devices are used for cutting off the welding strip.

In one embodiment, each second cutting device is connected to one side of the bending device, which faces away from the first cutting device;

each bending device is arranged on the base in a reciprocating mode along the first direction, the welding strip processing equipment further comprises n driving devices, the n driving devices are arranged on the base, and each driving device is in transmission connection with one base to drive the base to reciprocate along the first direction.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a bending apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic top view of the bending apparatus shown in FIG. 1;

FIG. 3 is a schematic structural diagram of a solder strip processing apparatus according to another embodiment of the present invention;

fig. 4 is a schematic structural diagram of a first cutting device in the solder strip processing apparatus shown in fig. 3.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.

As shown in fig. 1 and 2, a bending apparatus 10 according to an embodiment of the present invention includes a base 11, a bending assembly 12, and a clamping assembly 13.

The clamping assembly 13 is fixedly connected to the base 11 and used for clamping one end of a workpiece, the bending assembly 12 is rotatably connected to the base 11 around a rotating axis, the bending assembly 12 is provided with a bending channel matched with the workpiece, and an initial position is formed in the rotating process of the bending assembly 12.

When the bending assembly 12 is located at the initial position, the bending assembly 12 and the clamping assembly 13 are sequentially arranged along a first direction perpendicular to the rotation axis, and the other end of the workpiece far away from the clamping assembly 13 penetrates through the bending channel.

The first direction is the left-right direction in fig. 1 and 2, and the rotation axis is the axis perpendicular to the paper in fig. 1 and the up-down direction in fig. 2.

By arranging the bending device 10, the bending assembly 12 is located at an initial position, one end of the workpiece is clamped by the clamping assembly 13, the other end of the workpiece passes through the bending channel of the bending assembly 12, and then the bending assembly 12 is rotated, so that the end of the workpiece, which is far away from the clamping assembly 13, is bent during the rotation of the bending assembly 12. Therefore, the workpiece bending efficiency is effectively improved.

In the embodiment, the workpiece is a solder strip, and the bending device 10 can rapidly bend the solder strip, so that the production efficiency is higher. Of course, in other embodiments, the bending apparatus 10 may be used to bend other materials.

It should be explained that the matching of the bending channel and the workpiece means that the workpiece passes through the bending channel, and the shape and size of the cross section of the bending channel are close to those of the cross section of the workpiece, so as to ensure that the workpiece can be bent in the process of rotating the bending component.

In addition, when the bending assembly 12 is located at the initial position, one end of the workpiece is clamped by the clamping assembly 13, and the other end of the workpiece passes through the bending passage, so that the workpiece extends along the first direction, and when the bending assembly 12 rotates around the rotating axis, the moving path of the bending assembly 12 is not straight, so that the workpiece can be bent.

In some embodiments, bending apparatus 10 further includes a driving mechanism 14, wherein driving mechanism 14 is disposed on base 11 and is in driving connection with bending assembly 12 to drive bending assembly 12 to rotate about the rotation axis.

In practical applications, the driving mechanism 14 has a telescopic end, the driving mechanism 14 is rotatably connected to the base 11 around an axis parallel to the rotation axis, and the telescopic end of the driving mechanism 14 is pivotally connected to the rotating base 121 to drive the rotating base 121 to rotate around the rotation axis during the telescopic process. Specifically, the drive mechanism 14 is a cylinder.

In some embodiments, the bending assembly 12 includes a rotating base 121 and a limiting member 122, the rotating base 121 is rotatably connected to the base 11 around a rotation axis, the rotating base 121 defines a receiving groove 1211, the receiving groove 1211 extends in a direction perpendicular to the rotation axis, and the limiting member 122 is connected to the base 11 for covering the receiving groove 1211 to form the bending channel.

It is understood that the rotary base 121 is rotatable about the rotation axis, so that the rotary base 121 has the initial position described above. Meanwhile, since the rotating base 121 is rotatable, the extending direction of the receiving groove 1211 is changeable, but the receiving groove 1211 extends in a direction perpendicular to the rotation axis, so that it can be determined that when the rotating base 121 is located at the initial position, the receiving groove 1211 extends in the first direction, and after the limiting member 122 covers the receiving groove 1211 to form the bending channel, the workpiece can pass through the bending channel.

In practical applications, the limiting member 122 is connected to the rotating base 121 in a reciprocating manner along a second direction parallel to the rotation axis, so as to cover or expose the receiving groove 1211 during the moving process. Thus, when the receiving groove 1211 is exposed, the workpiece can be conveniently placed in the receiving groove 1211, and then the limiting member 122 is moved until the receiving groove 1211 is covered, so as to form a bent channel.

The second direction is a direction perpendicular to the paper surface in fig. 1, and is a vertical direction in fig. 2.

It can be determined that, as shown in fig. 1 and fig. 2, the receiving groove 1211 is opened at the top of the rotating base 121, when the receiving groove 1211 is exposed, the workpiece can be directly placed in the receiving groove 1211 from top to bottom, and after the limiting member 122 covers the receiving groove 1211 to form the above-mentioned bending channel, in the process of rotating and bending the workpiece by the rotating base 121, the workpiece abuts against the limiting member 122, and the limiting member 122 rotating with the rotating base 121 bends the workpiece.

In some embodiments, the bending assembly 12 includes a plurality of limiting members 122, the limiting members 122 are arranged at intervals along the second direction, the rotating base 121 is provided with a plurality of receiving grooves 1211, and each limiting member 122 is configured to cover a corresponding receiving groove 1211 to form a bending channel.

Further, the bending apparatus 10 includes a plurality of clamping assemblies 13, the plurality of clamping assemblies 13 are arranged at intervals along the second direction, and when the rotating base 121 is located at the initial position, each clamping assembly 13 and a bending channel are arranged at intervals along the first direction.

In this way, each clamping assembly 13 clamps one end of a workpiece, and the workpiece passes through the corresponding bending channel, so that a plurality of workpieces are bent simultaneously, and the efficiency is further improved.

It should be noted that the plurality of limiting members 122 may be connected through a linkage structure, so that the plurality of limiting members 122 move synchronously along the second direction, and only the linkage structure needs to prevent the workpiece from being placed in the accommodating groove 1211, that is, the linkage structure is preferably disposed below the rotating base 121, and one end of the corresponding limiting member 122 may extend to below the rotating base 121 and be connected with the linkage structure.

In addition, a driving piece can be arranged to drive the linkage structure to move.

In some embodiments, the clamping assembly 13 includes a fixed block 131 and a movable block 132, the fixed block 131 is fixedly connected to the base 11, the movable block 132 is spaced apart from the fixed block 131 along a second direction perpendicular to the first direction, and the movable block 132 is reciprocally movable along the second direction to clamp or release the workpiece in cooperation with the fixed block 131.

It will be appreciated that the workpiece extends in a first direction, the fixed block 131 is fixed relative to the base 11, the workpiece is first positioned adjacent to the fixed block 131 with the workpiece between the fixed block 131 and the movable block 132, and then the movable block 132 is positioned adjacent to the fixed block 131 until the workpiece is clamped.

In some embodiments, the plurality of fixing blocks 131 are arranged at intervals along the second direction, and the receiving channel 133 is formed between any two adjacent fixing blocks 131, and each solder strip can sequentially pass through a receiving groove 1211 and the receiving channel 133 and pass through a position between a corresponding fixing block 131 and a corresponding movable block 132, so that the solder strip can be conveniently positioned when the solder strip is placed from top to bottom.

It should be noted that, as shown in fig. 2, there is a receiving channel 133 formed by the fixing block 131 and the base 11.

Referring to fig. 3, another embodiment of the present invention provides a solder strip processing apparatus, including the bending device 10 in the above embodiment, that is, the workpiece in the above embodiment is a solder strip, and the bending device 10 is used for bending the solder strip.

It should be noted that the first direction in the above-mentioned embodiment is the left-right direction in fig. 3, the rotation axis in the above-mentioned embodiment is the axis along the up-down direction in fig. 3, and the corresponding second direction is the up-down direction.

In some embodiments, the solder strip processing apparatus further includes a base (not shown) and a first cutting device 20, the first cutting device 20 and the bending device 10 are spaced apart from each other along the first direction, and the first cutting device 20 is configured to cut off the solder strip.

Referring to fig. 4, further, the first cutting device 20 includes a fixed cutter 21, a movable cutter 22 and a cutting driving member 23, the fixed cutter 21 and the cutting driving member 23 are disposed on the base, and the cutting driving member 23 is in transmission connection with the movable cutter 22 to drive the movable cutter 22 to approach or separate from the fixed cutter 21, so as to cut off the welding strip passing between the fixed cutter 21 and the movable cutter 22 when approaching the fixed cutter 21.

In practical application, the movable cutter 22 includes a plurality of blades 221, and the blades 221 are arranged at intervals along the second direction to correspondingly bend a plurality of accommodating grooves 1211 and a plurality of clamping assemblies 13 on the assembly 12, and simultaneously cut off a plurality of solder strips, so that the assembly 12 can be conveniently bent and the plurality of solder strips can be simultaneously bent.

It should be noted that, the plurality of limiting members 122 may be configured in a structure similar to the movable cutting blade 22, but the limiting members 122 do not need to have the cutting edge 221, and in fig. 3, the limiting members 122 move in the up-down direction, and only need to cover or expose the receiving groove 1211 during the moving process.

Specifically, the cutting driving member 23 is an air cylinder, and the cutting driving member 23 is configured to drive the movable cutter 22 to reciprocate along a fourth direction perpendicular to the first direction and the second direction.

The second direction is a left-right direction in fig. 4, the fourth direction is a direction perpendicular to the paper surface in fig. 3, and the fourth direction is a top-bottom direction in fig. 4.

In some embodiments, the solder strip processing apparatus further includes a strip pulling device 30, the strip pulling device 30 is reciprocally disposed on the base along a first direction, and is used for pulling the solder strip from the first cutting device 20 toward the bending device 10 and placing the solder strip on the bending device 10, so that the clamping component 13 of the bending device 10 clamps the solder strip and the solder strip passes through the bending channel.

Specifically, referring to fig. 3, initially, the accommodating groove 1211 is in an exposed state, the distance between the movable block 132 and the fixed block 131 is relatively large, the tape pulling device 30 moves to the left to clamp the head end of the solder tape, and then pulls the solder tape towards the right until the head end of the solder tape is pulled to the right side of the bending device 10, at this time, the solder tape is located above the accommodating groove 1211, and then the tape pulling device 30 places the solder tape from top to bottom in the accommodating groove 1211, the accommodating channel 133, and between the fixed block 131 and the movable block 132.

After the solder strip is placed, the limiting member 122 moves to a position covering the receiving groove 1211 to form a bending channel, and at this time, the solder strip passes through the bending channel, and the movable block 132 moves towards the fixed block 131 to clamp the solder strip. Then the first cutting device 20 acts to cut off the solder strip, and finally the bending component 12 rotates to realize the bending of the solder strip.

In some embodiments, the tape drawing device 30 includes a translation mechanism (not shown), an elevating mechanism 31 and a clamping mechanism 32, the translation mechanism is disposed on the base and is in transmission connection with the elevating mechanism 31 for driving the elevating mechanism 31 to reciprocate along a first direction, the elevating mechanism 31 is in transmission connection with the clamping mechanism 32 for driving the clamping mechanism 32 to reciprocate along a fourth direction, and the clamping mechanism 32 is used for clamping the solder tape.

As will be described with reference to fig. 3, initially, when the clamping mechanism 32 is located at a height higher than the top of the bending apparatus 10 and the solder strip needs to be pulled out from the first cutting apparatus 20, the translation mechanism moves the lifting mechanism 31 and the clamping mechanism 32 to the left, the lifting mechanism 31 drives the clamping mechanism 32 to descend so as to clamp the head end of the solder strip passing through the first cutting apparatus 20, then the lifting mechanism 31 drives the clamping mechanism 32 to ascend, then the translation mechanism operates again to move the lifting mechanism 31 and the clamping mechanism 32 to the right side of the bending apparatus 10, and then the lifting mechanism 31 drives the clamping mechanism 32 to descend, so that the solder strip is placed between the accommodating groove 1211, the accommodating channel 133, and the fixed block 131 and the movable block 132.

In addition, the clamping mechanism 32 releases the welding strip after the welding strip is cut off and then ascends to the initial position, so that the welding strip is tensioned and is convenient to cut.

In some embodiments, the solder strip processing apparatus includes n number of bending devices 10, the solder strip processing apparatus further includes n-1 number of second cutting devices 40, the first cutting devices 20 and the n number of bending devices 10 are sequentially arranged at intervals along the first direction, the tape drawing device 30 is configured to draw the solder strip toward the bending devices 10 and place the solder strip on the n number of bending devices 10, one second cutting device 40 is disposed between every two adjacent bending devices 10, and the second cutting device 40 is configured to cut off the solder strip.

It can be understood that n bending devices 10 are arranged at intervals along the first direction, so that the solder strip can sequentially pass through the n bending devices 10 along the first direction, the solder strip is pulled towards the bending devices 10 only through the strip pulling device 30 until the solder strip extends out of the bending device 10 which is farthest away from the first cutting device 20, and then the solder strip is lowered, so that the solder strip can be placed in the plurality of bending devices 10.

In addition, after the welding strips are placed on the plurality of bending devices 10 by the strip pulling device 30, the second cutting device 40 located between two adjacent bending devices 10 can cut off the welding strips, so that a plurality of welding strips can be bent at the same time. Meanwhile, by combining the bending devices 10 in the above embodiments to bend a plurality of solder strips, the arrangement of the bending devices 10 further improves the production efficiency.

In practical application, the solder strip processing apparatus includes four bending devices 10, and the number of the second cutting devices 40 is three, so as to cut the solder strip into four sections, and each bending device 10 bends one section.

In some embodiments, each bending device 10 is reciprocally movably disposed on the base along the first direction, the solder strip processing apparatus further includes n driving devices 50, the n driving devices 50 are disposed on the base, and each driving device 50 is in transmission connection with the base 11 of one bending device 10 to drive the base 11 to reciprocally move along the first direction, so as to adjust the distance between adjacent bending devices 10 and adjust the length of the solder strip bent by each bending device 10.

In practical application, each driving device 50 comprises a motor, two belt wheels and a transmission belt, the motor is arranged on the base and is in transmission connection with one of the belt wheels, the two belt wheels are arranged at intervals in the first direction and can rotate, the transmission belt is connected between the two belt wheels, and the base 11 of each bending device 10 is fixedly connected with the transmission belt in one driving device 50.

In a specific embodiment, each second cutting device 40 is connected to a side of the bending device 10 facing away from the first cutting device 20, i.e. each of the remaining bending devices 10, except the bending device 10 which is the farthest away from the first cutting device 20, has a second cutting device 40 connected thereto, so as to move with the bending device 10 in the first direction.

In practice, the clamping assembly 13 of each bending device 10 is located on the side of the bending assembly 12 remote from the first cutting device 20. Therefore, after the second cutting device 40 cuts the solder strip, the solder strip can extend out of the bending channel for a longer distance, and the solder strip is convenient to bend.

It should be noted that the structure of the second cutting assembly is the same as that of the first cutting assembly, and is not described herein again.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the utility model, and these changes and modifications are all within the scope of the utility model. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A bending device, comprising:

a base;

2. The bending apparatus according to claim 1, wherein the bending assembly comprises a rotating base and a limiting member, the rotating base is rotatably connected to the base around the rotation axis, the rotating base defines a receiving slot extending in a direction perpendicular to the rotation axis, and the limiting member is connected to the base and covers the receiving slot to form the bending channel.

3. The bending apparatus according to claim 2, wherein the stopper is reciprocally movably coupled to the rotating base in a second direction parallel to the rotation axis to cover or expose the accommodating groove during the movement.

4. The bending device according to claim 2, comprising a plurality of said clamping assemblies, the plurality of clamping assemblies being spaced apart in a second direction perpendicular to the axis of rotation;

when the rotating base is located at the initial position, each clamping assembly and one bent channel are arranged at intervals in the first direction.

5. The bending device according to claim 1, wherein the clamping assembly comprises a fixed block and a movable block, the fixed block is fixedly connected to the base, the movable block and the fixed block are arranged at intervals along a second direction parallel to the rotation axis, and the movable block is capable of moving back and forth along the second direction to clamp or release a workpiece in cooperation with the fixed block.

6. The bending device according to claim 1, further comprising a driving mechanism disposed on the base and in transmission connection with the bending assembly to drive the bending assembly to rotate about the rotation axis.

7. A solder strip processing apparatus characterized by comprising the bending device according to any one of claims 1 to 6.

8. The solder strip processing apparatus according to claim 7, further comprising a base, a first cutting device and a tape pulling device, wherein the first cutting device and the bending device are arranged on the base at intervals along the first direction, the first cutting device is used for cutting off the solder strip, and the tape pulling device is arranged on the base in a reciprocating manner along the first direction and used for pulling the solder strip from the first cutting device to the bending device and placing the solder strip on the bending device, so that the clamping assembly clamps the solder strip and the solder strip passes through the bending channel.

9. The solder strip processing apparatus according to claim 8, wherein the solder strip processing apparatus includes n number of bending devices, the solder strip processing apparatus further includes n-1 number of second cutting devices, the first cutting devices and the n number of bending devices are sequentially arranged at intervals along the first direction, the tape pulling device is configured to pull the solder strip toward the bending devices and place the solder strip on the n number of bending devices, one second cutting device is disposed between every two adjacent bending devices, and the second cutting device is configured to cut off the solder strip.

10. The solder strip processing apparatus according to claim 9, wherein each of the second cutting devices is connected to a side of one of the bending devices facing away from the first cutting device;

each bending device is arranged on the base in a reciprocating mode along the first direction, the welding strip processing equipment further comprises n driving devices, the n driving devices are arranged on the base, and each driving device is in transmission connection with the base to drive the base to reciprocate along the first direction.