CN216982403U

CN216982403U - Quick heat conduction silica gel pad for electronic appliance

Info

Publication number: CN216982403U
Application number: CN202220605908.5U
Authority: CN
Inventors: 刘余良
Original assignee: Xiamen Denghong Electronic Technology Co ltd
Current assignee: Xiamen Denghong Electronic Technology Co ltd
Priority date: 2022-03-18
Filing date: 2022-03-18
Publication date: 2022-07-15
Anticipated expiration: 2032-03-18

Abstract

The utility model discloses a quick heat-conducting silica gel pad for electronic and electric appliances, which comprises a heat-conducting silica gel pad main body, wherein the heat-conducting silica gel pad main body is annular and comprises a filling layer, and a reinforcing structure is embedded in the filling layer along the circumferential direction; the reinforced structure includes that four prop piece and a plurality of cross prop, prop the piece cross-section and be the arc, four prop the piece inboard and enclose into the cross-section and be the circular shape and consolidate the chamber, the cross prop set up in consolidate the intracavity, it is a plurality of the cross props the edge consolidate the even setting of chamber circumferencial direction, four prop the piece inboard with four spike fixed connection that the cross propped. Through embedding reinforced structure in the filling layer, strengthened the structural strength of whole heat conduction pad, utilize reinforced structure to make heat evenly distributed in the heat conduction pad simultaneously to reach better radiating effect.

Description

Quick heat conduction silica gel pad for electronic appliance

Technical Field

The utility model relates to the technical field of silica gel pads, in particular to a quick heat conduction silica gel pad for an electronic appliance.

Background

The heat-conducting silica gel pad in the electronic industry is widely applied, the heat-conducting silica gel sheet has good heat-conducting capacity and high-grade pressure resistance, and the air gap is eliminated by adopting the heat-conducting silica gel sheet, so that the shock absorption can be realized, the integral heat conversion capacity can be improved, the electronic and electrical equipment can timely dissipate heat during the middle work, the use experience of the electronic and electrical equipment is improved, and the service life of the electronic and electrical equipment is prolonged. But also notice simultaneously, because the silica gel pad is comparatively soft, probably produce great deformation when receiving the exogenic action, can produce great damage to the silica gel pad, can lead to the heat dissipation inhomogeneous moreover after warping, so when guaranteeing the heat-conducting capacity, prevent the damage of heat conduction silica gel pad.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a quick heat-conducting silica gel pad for an electronic appliance, which improves the deformation prevention capability of the heat-conducting silica gel pad and improves the heat dissipation performance.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a quick heat-conducting silica gel pad for electronic and electric appliances, which comprises a heat-conducting silica gel pad main body, wherein the heat-conducting silica gel pad main body is annular and comprises a filling layer, and a reinforcing structure is embedded in the filling layer along the circumferential direction; the reinforced structure includes that four prop piece and a plurality of cross prop, prop the piece cross-section and be the arc, four prop the piece inboard and enclose into the cross-section and be the circular shape and consolidate the chamber, the cross prop set up in consolidate the intracavity, it is a plurality of the cross props the edge consolidate the even setting of chamber circumferencial direction, four prop the piece inboard with four spike fixed connection that the cross propped.

The utility model preferably adopts the technical scheme that wear-resistant layers are fixedly arranged on two sides of the filling layer. To protect the fill layer.

The utility model preferably adopts the technical scheme that arc-shaped bulges are uniformly arranged on the surface of the wear-resistant layer so as to play the roles of shock absorption and skid resistance.

The utility model preferably adopts the technical scheme that the filling layer and the wear-resistant layer are bonded by using super glue.

The utility model has the preferable technical scheme that a reinforcing ring is fixedly arranged on the outer side of the filling layer.

The utility model has the preferable technical scheme that the supporting sheet and the cross brace are both made of metal materials.

The beneficial effects of the utility model are as follows:

through embedding reinforced structure in the filling layer, strengthened the structural strength of whole heat conduction pad, utilize reinforced structure simultaneously to add the heat to each part of heat conduction pad for the heat evenly distributed in the heat conduction pad, in order to reach better radiating effect.

Drawings

Fig. 1 is a schematic cross-sectional view of a rapid thermal conductive silicone pad for electronic and electrical devices according to an embodiment of the present invention;

fig. 2 is a schematic view of a reinforced structure of a rapid thermal conductive silica gel pad for electronic and electrical devices according to an embodiment of the present invention;

in the figure:

1. a thermally conductive silicone pad body; 11. a filling layer; 12. reinforcing the structure; 13. a wear layer; 121. supporting the sheet; 122. a cross brace; 1211. reinforcing the cavity; 131. an arc-shaped bulge; 14. and (7) reinforcing the ring.

Detailed Description

The technical scheme of the utility model is further explained by the specific implementation mode in combination with the attached drawings.

As shown in the figures, the embodiment provides a rapid heat conduction silica gel pad for electronic and electrical devices, which includes a heat conduction silica gel pad main body 1, the heat conduction silica gel pad main body 1 is annular, the heat conduction silica gel pad main body 1 includes a filling layer 11, and a reinforcing structure 12 is embedded in the filling layer 11 along a circumferential direction; the reinforcing structure 12 includes four supporting pieces 121 and a plurality of cross braces 122, the cross section of the supporting piece 121 is arc-shaped, a reinforcing cavity 1211 with a circular cross section is enclosed by the inner sides of the four supporting pieces 121, the cross braces 122 are disposed in the reinforcing cavity 1211, the cross braces 122 are uniformly disposed along the circumferential direction of the reinforcing cavity 1211, and the inner sides of the four supporting pieces 121 are fixedly connected with four supporting legs of the cross braces 122. Preferably, the brace pieces 121 and the cross brace 122 are made of metal material. Through embedding reinforced structure 12 in filling layer 11 for the performance that heat conduction silica gel pad main part 1 bore pressure is strengthened, and reinforced structure 12 adopts metal material to make simultaneously, and when making the heat dissipation, the heat can better equipartition and heat conduction silica gel pad main part 1, thereby carries out better heat dissipation.

In order to protect the filling layer 11, preferably, wear-resistant layers 13 are fixedly arranged on both sides of the filling layer 11. Because the filling layer 11 is made of silica gel material, in order to reduce abrasion, the two outer sides of the filling layer are provided with abrasion resistant layers 13.

Preferably, the surface of the wear-resistant layer 13 is uniformly provided with arc-shaped protrusions 131 for shock absorption and skid resistance.

Preferably, the filling layer 11 and the wear-resistant layer 13 are bonded by using super glue.

In order to prevent the filling layer 11 from deforming in the middle, it is preferable that a reinforcing ring 14 is fixed outside the filling layer 11.

While the utility model has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the utility model. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.

Claims

1. The utility model provides an electron electrical apparatus is with quick heat conduction silica gel pad, includes heat conduction silica gel pad main part (1), heat conduction silica gel pad main part (1) is cyclic annular, its characterized in that: the heat-conducting silica gel pad main body (1) comprises a filling layer (11), and a reinforcing structure (12) is embedded in the filling layer (11) along the circumferential direction;

reinforced structure (12) prop (122) including four pieces prop piece (121) and a plurality of cross, prop piece (121) cross-section and be the arc, four prop piece (121) inboard enclose into the cross-section for circular shape reinforcement chamber (1211), cross prop (122) set up in consolidate the chamber (1211) in, a plurality of cross prop (122) and follow consolidate chamber (1211) circumferencial direction and evenly set up, four prop piece (121) inboard with four arm-braces fixed connection that cross propped (122).

2. The rapid heat conduction silica gel pad for the electronic and electric appliances according to claim 1, characterized in that:

and wear-resistant layers (13) are fixedly arranged on two sides of the filling layer (11).

3. The rapid heat conduction silica gel pad for electronic and electrical appliances according to claim 2, characterized in that:

arc-shaped bulges (131) are uniformly arranged on the surface of the wear-resistant layer (13) to play a role in shock absorption and skid prevention.

4. The rapid heat conduction silica gel pad for electronic and electrical appliances according to claim 2, wherein:

the filling layer (11) and the wear-resistant layer (13) are bonded by super glue.

5. The rapid heat conduction silica gel pad for the electronic and electric appliances according to claim 1, characterized in that:

and a reinforcing ring (14) is fixedly arranged on the outer side of the filling layer (11).

6. The rapid heat conduction silica gel pad for electronic and electrical appliances according to claim 1, wherein:

the supporting sheet (121) and the cross brace (122) are both made of metal materials.