CN216977801U - Tool capable of detecting thickness of semiconductor wafer - Google Patents

Tool capable of detecting thickness of semiconductor wafer Download PDF

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Publication number
CN216977801U
CN216977801U CN202123285157.8U CN202123285157U CN216977801U CN 216977801 U CN216977801 U CN 216977801U CN 202123285157 U CN202123285157 U CN 202123285157U CN 216977801 U CN216977801 U CN 216977801U
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China
Prior art keywords
fixedly connected
tool
box
slide rail
casing
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CN202123285157.8U
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Chinese (zh)
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陈长贵
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Taizhou Haitian Electronic Technology Co ltd
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Taizhou Haitian Electronic Technology Co ltd
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Abstract

The utility model discloses a tool for detecting the thickness of a semiconductor wafer, which belongs to the technical field of wafer detection equipment and comprises a shell, a support box, a support plate, an electric slide rail and a base, wherein the support box is fixedly connected in the middle of the bottom of an inner cavity of the shell, the support plate is positioned in the middle of the inner cavity of the shell, the electric slide rail is fixedly connected at the top of the inner cavity of the shell, and the base is fixedly connected at the bottom of the shell, so that the tool for detecting the thickness of the semiconductor wafer has reasonable structural design, avoids the influence of manual detection on the working efficiency in production and processing, is favorable for improving the quality detection effect of equipment products, ensures the processing of subsequent products, improves the yield of the products after the production, is convenient for placing and taking out the products when the equipment is actually used, improves the practicability when the equipment is actually used, and is favorable for protecting the products, unnecessary resource consumption is avoided, and cost control in production is facilitated.

Description

Tool capable of detecting thickness of semiconductor wafer
Technical Field
The utility model relates to the technical field of wafer detection equipment, in particular to a tool capable of detecting the thickness of a semiconductor wafer.
Background
Semiconductor materials are a class of electronic materials having semiconductor properties that can be used to fabricate semiconductor devices and integrated circuits, and substances in natural environments can be simply classified into conductors, semiconductors, and insulators, although different materials can change under different actions and cannot be classified according to their properties.
Semiconductor wafer adds the back and need detect its thickness, the use of being convenient for the later stage to extend, present detection mode adopts the manual work to detect mostly, be unfavorable for the work efficiency in the production and processing, there is great error in the manual work detection simultaneously, influence the processing of follow-up product, cause the product yields low, and adopt equipment to examine time measuring all be fixed examine test table, it is difficult when leading to the product to place to take out, the practicality when causing equipment in-service use is low, cause the destruction to the product easily simultaneously, cause unnecessary resource consumption, the cost of production has been increased, we have proposed a frock of detectable semiconductor wafer thickness for this reason.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a tool capable of detecting the thickness of a semiconductor wafer, and aims to solve the problems that the work efficiency in production and processing is not facilitated, the processing of subsequent products is influenced, the yield of the products is low, the practicability of the equipment in actual use is low, and unnecessary resource consumption is caused in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a frock of detectable semiconductor wafer thickness, includes casing, supporting box, backup pad, electronic slide rail and base, supporting box fixed connection be in the middle of the inner chamber bottom of casing, the backup pad is located in the middle of the inner chamber of casing, electronic slide rail fixed connection be in the inner chamber top of casing, base fixed connection be in the bottom of casing.
Preferably, the front side wall of the shell is hinged with a door body, and the right side of the front side wall of the door body is welded with a handle.
Preferably, the top left and right sides fixedly connected with fixed block of supporting box, the inner chamber bottom left and right sides fixedly connected with dead lever of fixed block, the backup pad cup joints between the lateral wall downside of dead lever.
Preferably, the middle of the top of the supporting plate is fixedly connected with a detection box, and the top of the detection box is provided with a placing groove.
Preferably, the inner cavity of the electric slide rail is connected with an electric slide block in a sliding manner, the bottom of the electric slide block is fixedly connected with an installation block, the bottom left side of the installation block is fixedly connected with a camera, the bottom of the installation block is fixedly connected with a lamp holder, and the bottom right side of the installation block is fixedly connected with a structural light generator.
Preferably, the top left side fixedly connected with control box of base, the top fixedly connected with control panel of control box, electronic slide rail of control box electric connection, electronic slider, camera, lamp holder, structure light generator and control panel.
Compared with the prior art, the utility model has the beneficial effects that:
1. this frock of detectable semiconductor wafer thickness adopts three-dimensional imaging's device in equipment, the lamp holder shines the product and forms the light source, structure light generator shines the product simultaneously and forms three-dimensional lines, shoot the three-dimensional image that forms the product through the camera at last, three-dimensional image contrasts with the target figure after will scanning, the work efficiency in having avoided artifical detection to influence production and processing, be favorable to improving the effect that equipment product quality detected, the processing of follow-up product has been guaranteed, the yields after the product output has been improved.
2. This frock of detectable semiconductor wafer thickness, the fixed block has been increased in equipment, dead lever and backup pad, the inner chamber at the fixed block is pegged graft to the dead lever, the backup pad is connected with the detection case, place the product inside the standing groove of detection case during the use, cup joint the backup pad between the lateral wall of dead lever again, accomplish placing of product, the product when being convenient for equipment in-service use is placed and is taken out, practicality when having improved equipment in-service use, be favorable to protecting itself of product simultaneously, unnecessary resource consumption has been avoided, be favorable to controlling the cost in the production.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a front sectional view of the present invention;
FIG. 3 is a schematic right sectional view of the present invention;
FIG. 4 is a schematic top sectional view of the present invention.
In the figure: 100. a housing; 110. a door body; 120. a handle; 200. a support box; 210. a fixed block; 220. fixing the rod; 300. a support plate; 310. a detection box; 320. a placement groove; 400. an electric slide rail; 410. an electric slider; 420. mounting blocks; 430. a camera; 440. a lamp cap; 450. a structured light generator; 500. a base; 510. a control box; 520. a control panel.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model provides a tool capable of detecting the thickness of a semiconductor wafer, which is beneficial to improving the quality detection effect of equipment products, improving the yield of the products after the products are produced, improving the practicability of the equipment in practical use and being beneficial to controlling the cost in production, and please refer to fig. 1-4, and the tool comprises a shell 100, a supporting box 200, a supporting plate 300, an electric sliding rail 400 and a base 500;
referring to fig. 1-4 again, the housing 100 is used to connect and mount the supporting box 200, the supporting plate 300, the electric sliding rail 400 and the base 500;
referring to fig. 1-4 again, the supporting box 200 is fixedly connected to the middle of the bottom of the inner cavity of the housing 100, and the supporting box 200 is used for connecting the mounting fixing block 210;
referring to fig. 1-4 again, the supporting plate 300 is sleeved between the lower sides of the outer sidewalls of the fixing rods 220, and the supporting plate 300 is used for connecting and installing the detection box 310;
referring to fig. 1-3, an electric slide rail 400 is fixedly connected to the top of the inner cavity of the housing 100, and the electric slide rail 400 is used for slidably connecting an electric slider 410;
referring to fig. 1-4 again, the base 500 is fixedly connected to the bottom of the housing 100, and the base 500 is used to connect and mount the control box 510.
Referring to fig. 1-4 again, in order to avoid the influence of the external light source on the inside of the device, the front side wall of the casing 100 is hinged to the door body 110, and the handle 120 is welded on the right side of the front side wall of the door body 110.
Referring to fig. 1 to 4 again, in order to facilitate installation of the supporting plate 300, fixing blocks 210 are fixedly connected to the left and right sides of the top of the supporting box 200, fixing rods 220 are fixedly connected to the left and right sides of the bottom of the inner cavity of the fixing blocks 210, and the supporting plate 300 is sleeved between the lower sides of the outer side walls of the fixing rods 220.
Referring to fig. 1 to 4 again, in order to protect the product, a detection box 310 is fixedly connected to the middle of the top of the supporting plate 300, and a placement groove 320 is formed at the top of the detection box 310.
Referring to fig. 1-3 again, in order to perform three-dimensional scanning, an inner cavity of the electric slide rail 400 is slidably connected with an electric slider 410, a bottom of the electric slider 410 is fixedly connected with an installation block 420, a left side of the bottom of the installation block 420 is fixedly connected with a camera 430, a middle of the bottom of the installation block 420 is fixedly connected with a lamp cap 440, and a right side of the bottom of the installation block 420 is fixedly connected with a structured light generator 450.
Referring to fig. 1-4 again, in order to control the devices in the apparatus, a control box 510 is fixedly connected to the left side of the top of the base 500, a control panel 520 is fixedly connected to the top of the control box 510, and the control box 510 is electrically connected to the electric slide rail 400, the electric slide 410, the camera 430, the lamp head 440, the structured light generator 450 and the control panel 520.
In particular use, the person skilled in the art, before performing the operation, needs the power of the device to be switched on, the power switch of the device is turned on by inputting an instruction through the control panel 520, the device in the device is controlled by the control box 510, the door body 110 is opened by the handle 120, the product is placed in the placing groove 320 of the detection box 310 when the device is used, the supporting plate 300 is sleeved between the outer side walls of the fixing rods 220 to complete the placement of the product, after the door body 110 is closed, the lamp holder 440 irradiates the product to form a light source, meanwhile, the structured light generator 450 irradiates the product to form a three-dimensional line, and finally, a three-dimensional image of the product is shot by the camera 430, the scanned three-dimensional image is compared with a target image, and the electric slider 410 drives the mounting block 420 to move left and right, and detecting all products, marking the positions of defective products, and disconnecting the power supply of the equipment when the use is finished.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While the utility model has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the various features of the disclosed embodiments of this invention can be used in any combination with one another as long as no structural conflict exists, and the combination is not exhaustively described in this specification merely for the sake of brevity and resource savings. Therefore, it is intended that the utility model not be limited to the particular embodiments disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims (6)

1. The utility model provides a frock of detectable semiconductor wafer thickness which characterized in that: including casing (100), supporting box (200), backup pad (300), electronic slide rail (400) and base (500), supporting box (200) fixed connection be in the middle of the inner chamber bottom of casing (100), backup pad (300) are located in the middle of the inner chamber of casing (100), electronic slide rail (400) fixed connection be in the inner chamber top of casing (100), base (500) fixed connection be in the bottom of casing (100).
2. The tool of claim 1, wherein the tool comprises: the front side wall of the shell (100) is hinged with a door body (110), and a handle (120) is welded on the right side of the front side wall of the door body (110).
3. The tool of claim 1, wherein the tool comprises: the supporting box is characterized in that fixing blocks (210) are fixedly connected to the left side and the right side of the top of the supporting box (200), fixing rods (220) are fixedly connected to the left side and the right side of the bottom of an inner cavity of each fixing block (210), and the supporting plate (300) is sleeved between the lower sides of the outer side walls of the fixing rods (220).
4. The tool of claim 1, wherein the tool comprises: the middle of the top of the supporting plate (300) is fixedly connected with a detection box (310), and the top of the detection box (310) is provided with a placing groove (320).
5. The tool of claim 1, wherein the tool comprises: the inner chamber sliding connection of electronic slide rail (400) has electronic slider (410), the bottom fixedly connected with installation piece (420) of electronic slider (410), the bottom left side fixedly connected with camera (430) of installation piece (420), fixedly connected with lamp holder (440) in the middle of the bottom of installation piece (420), the bottom right side fixedly connected with structure light generator (450) of installation piece (420).
6. The tool of claim 1, wherein the tool comprises: the utility model discloses a Light Emitting Diode (LED) lamp, including base (500), the top left side fixedly connected with control box (510) of base (500), the top fixedly connected with control panel (520) of control box (510), electronic slide rail (400), electronic slider (410), camera (430), lamp holder (440), structure light generator (450) and control panel (520) of control box (510) electric connection.
CN202123285157.8U 2021-12-24 2021-12-24 Tool capable of detecting thickness of semiconductor wafer Active CN216977801U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123285157.8U CN216977801U (en) 2021-12-24 2021-12-24 Tool capable of detecting thickness of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123285157.8U CN216977801U (en) 2021-12-24 2021-12-24 Tool capable of detecting thickness of semiconductor wafer

Publications (1)

Publication Number Publication Date
CN216977801U true CN216977801U (en) 2022-07-15

Family

ID=82348024

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123285157.8U Active CN216977801U (en) 2021-12-24 2021-12-24 Tool capable of detecting thickness of semiconductor wafer

Country Status (1)

Country Link
CN (1) CN216977801U (en)

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