CN216977254U

CN216977254U - Condenser capable of accelerating heat dissipation efficiency

Info

Publication number: CN216977254U
Application number: CN202220618231.9U
Authority: CN
Inventors: 张道斌; 乔雁苹; 王永利
Original assignee: Xinxiang Huatai Refrigeration Co ltd
Current assignee: Xinxiang Huatai Refrigeration Co ltd
Priority date: 2022-03-21
Filing date: 2022-03-21
Publication date: 2022-07-15
Anticipated expiration: 2032-03-21

Abstract

The utility model discloses a condenser for accelerating heat dissipation efficiency, which comprises a shell and a condenser body fixedly connected inside the shell, wherein a plurality of groups of heat dissipation holes are formed in the shell, a plurality of groups of heat dissipation fans are fixedly connected inside the shell corresponding to the heat dissipation holes, a cooling water tank is fixedly connected to one side of the shell, a heat exchange pipeline is fixedly connected inside the shell, one end of the heat exchange pipeline is connected with the cooling water tank through a water outlet pipeline, the other end of the heat exchange pipeline is connected with the cooling water tank through a water inlet pipeline, a suction pump is fixedly connected to the water inlet pipeline and fixedly connected to the cooling water tank, and a semiconductor refrigeration device is fixedly connected to the cooling water tank. The utility model relates to the technical field of condensers, and has the advantages of excellent heat dissipation effect and excellent heat exchange effect of the condenser.

Description

Condenser capable of accelerating heat dissipation efficiency

Technical Field

The utility model relates to the technical field of condensers, in particular to a condenser capable of accelerating heat dissipation efficiency.

Background

The condenser is a component of a refrigeration system, belonging to a type of heat exchanger, which can convert gas or vapor into liquid and transfer the heat in the tube to the air near the tube in a quick manner. The condenser operation is exothermic, so the condenser temperature is high. The used condenser of refrigerator car at present all installs on the roof to the outside cover of condenser has the shell, because of the continuous heat that gives off of condenser, can make the inside heat of shell have and pile up, thereby influence the heat transfer effect of condenser, mostly all go on through the louvre on the shell to the heat dissipation of on-vehicle condenser among the prior art, the radiating effect is poor, is difficult to give off the inside heat of shell.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide the condenser with excellent heat dissipation effect.

The technical scheme adopted by the utility model for realizing the purpose is as follows: the utility model provides a accelerate radiating efficiency's condenser, includes shell and fixed connection be in the inside condenser body of shell, be provided with the multiunit louvre on the shell, the shell is inside to be corresponded louvre fixedly connected with multiunit radiator fan, shell one side fixedly connected with cooling water tank, the inside fixedly connected with heat transfer pipeline of shell, heat transfer pipeline one end with connect through outlet conduit between the cooling water tank, heat transfer pipeline's the other end with connect through inlet conduit between the cooling water tank, fixedly connected with pump on the inlet conduit, pump fixed connection be in on the cooling water tank, fixedly connected with semiconductor refrigerating plant on the cooling water tank.

In some implementations, a mounting rack is fixedly connected to the inside of the housing corresponding to the heat dissipation holes, and the heat dissipation fan is fixedly connected to the mounting rack.

In some of these implementations, the heat exchange tubes are arranged in a serpentine configuration within the housing.

In some of the implementations, a water adding pipe is fixedly connected to the cooling water tank, and a pipe cover is connected to the water adding pipe in a threaded mode.

In some of them implementation, inside first temperature sensor of fixedly connected with of cooling water tank and level sensor, fixedly connected with second temperature sensor in the shell, fixedly connected with control box on the cooling water tank, fixedly connected with singlechip in the control box, first temperature sensor, second temperature sensor, level sensor and radiator fan, pump, semiconductor refrigerating plant all with singlechip signal connection, singlechip is the central accuse end of signal connection still.

In some implementations, a dust screen is fixedly connected to a surface of the mounting bracket near the heat dissipation holes.

In some of these implementations, the cooling water tank is fixedly attached to a top surface of the housing.

The utility model has the beneficial effects that: can be external with the heat discharge that the condenser body gived off through radiator fan, can cool off the inside water of coolant tank through semiconductor refrigerating plant moreover, water after the cooling gets into in the heat transfer pipeline to inside the heat transfer of carrying on the shell, water after the heat transfer is through the suction pump once more in the suction coolant tank, thereby form the circulation, it is excellent to this cooling effect of guaranteeing to the shell inside, then avoid the inside high temperature of shell, influence the heat transfer effect of condenser.

Drawings

FIG. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a schematic view of another embodiment of the present invention;

FIG. 3 is a schematic diagram of the connection structure of the single chip microcomputer in the utility model.

In the figure: the heat exchanger comprises a shell 1, a condenser body 2, heat dissipation holes 3, a heat dissipation fan 4, a cooling water tank 5, a heat exchange pipeline 6, a water outlet pipeline 7, a water inlet pipeline 8, a pump 9, a mounting rack 10, a water adding pipe 11, a first temperature sensor 12, a liquid level sensor 13, a second temperature sensor 14, a control box 15, a single chip microcomputer 16, a central control end 17 and a semiconductor refrigerating device 18.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, a condenser for increasing heat dissipation efficiency comprises a housing 1 and a condenser body 2 fixedly connected inside the housing 1, wherein a plurality of heat dissipation holes 3 are formed in the housing 1, a plurality of heat dissipation fans 4 are fixedly connected inside the housing 1 corresponding to the heat dissipation holes 3, heat dissipated from the condenser body 2 can be quickly exhausted to the outside through the heat dissipation fans 4, a cooling water tank 5 is fixedly connected to one side of the housing 1, a heat exchange pipe 6 is fixedly connected inside the housing 1, one end of the heat exchange pipe 6 is connected with the cooling water tank 5 through a water outlet pipe 7, the other end of the heat exchange pipe 6 is connected with the cooling water tank 5 through a water inlet pipe 8, a pump 9 is fixedly connected to the water inlet pipe 8, the pump 9 is fixedly connected to the cooling water tank 5, a semiconductor refrigeration device 18 is fixedly connected to the cooling water tank 5, and thus the semiconductor refrigeration device 18 can cool water inside the cooling water tank 5, and in cooling water entering heat transfer pipeline 6 in the coolant tank 5, carry out the heat transfer in shell 1 inside to reduce the inside temperature of shell 1, the water pump after 9 will exchanging the heat is gone into coolant tank 5 again and is cooled off, circulates with this, guarantees with this that the inside temperature of shell 1 is lower, guarantees the heat transfer effect of condenser.

In some of the embodiments, the cooling water tank 5 is fixedly connected to the top surface of the housing 1, and the installation arrangement is reasonable.

In some of them implementation, the inside 3 fixedly connected with mounting bracket 10 that correspond the louvre of shell 1, radiator fan 4 fixed connection is on mounting bracket 10 to this realizes radiator fan 4's installation, and fixedly connected with dust filter screen on the face that mounting bracket 10 is close to louvre 3, reduces outside dust through the dust filter screen and gets into inside shell 1.

In some of the implementation, heat transfer pipeline 6 adopts snakelike structure to arrange in shell 1, can increase heat transfer pipeline 6's length like this to increase heat transfer area, guarantee that the heat transfer effect is excellent.

In some of the embodiments, a water adding pipe 11 is fixedly connected to the cooling water tank 5, and a pipe cover is screwed to the water adding pipe 11, so that water can be added into the cooling water tank 5 by unscrewing the pipe cover.

In some of the embodiments, a first temperature sensor 12 and a liquid level sensor 13 are fixedly connected inside the cooling water tank 5, a second temperature sensor 14 is fixedly connected inside the housing 1, a control box 15 is fixedly connected on the cooling water tank 1, a single chip microcomputer 16 is fixedly connected inside the control box 15, the first temperature sensor 12, the second temperature sensor 14, the liquid level sensor 13, the heat dissipation fan 4, the pump 9 and the semiconductor refrigeration device 18 are all in signal connection with the single chip microcomputer 16, the single chip microcomputer 16 is also in signal connection with a central control end 17, so that the water temperature inside the cooling water tank 5 can be detected in real time through the first temperature sensor 12, the water level inside the cooling water tank 5 can be detected through the liquid level sensor 13, the temperature inside the housing 1 can be detected through the second temperature sensor 14, the detected data can be transmitted to the single chip microcomputer 16, and the single chip microcomputer 16 controls the heat dissipation fan 4 and the pump 9 according to the change of the temperature inside the housing 1, The work of semiconductor refrigerating plant 18 realizes the effect of automatic temperature control, for example when the temperature that second temperature sensor 14 detected is in first interval, singlechip 16 only controls radiator fan 4 work, when the temperature that second temperature sensor 14 detected is in the second interval, singlechip 16 controls radiator fan 4 and semiconductor refrigerating plant 18, the work of pump 9, strengthen the heat dissipation, and the temperature value in first interval, second interval is set for according to actual conditions, can look over and manually control the work of dispelling the heat to the temperature data that detects, water level data through the touch-sensitive screen on well accuse end 17.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a accelerate radiating efficiency's condenser, includes shell (1) and fixed connection in the inside condenser body (2) of shell (1), its characterized in that: be provided with multiunit louvre (3) on shell (1), shell (1) is inside to be corresponded louvre (3) fixedly connected with multiunit radiator fan (4), shell (1) one side fixedly connected with cooling water tank (5), shell (1) inside fixedly connected with heat transfer pipeline (6), heat transfer pipeline (6) one end with connect through outlet conduit (7) between cooling water tank (5), the other end of heat transfer pipeline (6) with connect through inlet channel (8) between cooling water tank (5), fixedly connected with pump (9) on inlet channel (8), pump (9) fixed connection be in on cooling water tank (5), fixedly connected with semiconductor refrigerating plant (18) on cooling water tank (5).

2. The condenser for increasing heat dissipation efficiency according to claim 1, wherein: the heat dissipation device is characterized in that a mounting frame (10) is fixedly connected to the inside of the shell (1) corresponding to the heat dissipation holes (3), and the heat dissipation fan (4) is fixedly connected to the mounting frame (10).

3. The condenser for increasing heat dissipation efficiency according to claim 1, wherein: the heat exchange pipeline (6) is arranged in the shell (1) in a snake-shaped structure.

4. The condenser for improving heat dissipation efficiency according to claim 1, wherein: fixedly connected with adds water pipe (11) on cooling water tank (5), it has the tube cap to add threaded connection on water pipe (11).

5. The condenser for increasing heat dissipation efficiency according to claim 1, wherein: the cooling water tank (5) is internally and fixedly connected with a first temperature sensor (12) and a liquid level sensor (13), the shell (1) is internally and fixedly connected with a second temperature sensor (14), the cooling water tank (5) is fixedly connected with a control box (15), the control box (15) is internally and fixedly connected with a single chip microcomputer (16), the first temperature sensor (12), the second temperature sensor (14), the liquid level sensor (13), a cooling fan (4), a suction pump (9) and a semiconductor refrigerating device (18) are all in signal connection with the single chip microcomputer (16), and the single chip microcomputer (16) is further in signal connection with a central control end (17).

6. The condenser for increasing heat dissipation efficiency according to claim 2, wherein: and a dust filter screen is fixedly connected to the surface, close to the heat dissipation holes (3), of the mounting rack (10).

7. The condenser for increasing heat dissipation efficiency according to claim 1, wherein: and the cooling water tank (5) is fixedly connected to the top surface of the shell (1).