CN216972738U - Anti-deformation device for installation of heater at bottom of semiconductor single crystal furnace - Google Patents
Anti-deformation device for installation of heater at bottom of semiconductor single crystal furnace Download PDFInfo
- Publication number
- CN216972738U CN216972738U CN202123436655.8U CN202123436655U CN216972738U CN 216972738 U CN216972738 U CN 216972738U CN 202123436655 U CN202123436655 U CN 202123436655U CN 216972738 U CN216972738 U CN 216972738U
- Authority
- CN
- China
- Prior art keywords
- single crystal
- crystal furnace
- heater
- plate
- bottom heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Furnace Details (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Resistance Heating (AREA)
Abstract
The utility model discloses a deformation preventing device for installing a heater at the bottom of a semiconductor single crystal furnace, which comprises: a single crystal furnace bottom heater with two stress buffer tanks; the heater at the bottom of the single crystal furnace comprises a heating plate and two leg parts; threaded holes are formed in the top surfaces of the heating plate and the leg part, and a bolt penetrates through the threaded hole of the heating plate to be in threaded connection with the threaded hole of the leg part; the heating plate comprises a plurality of U-shaped plates which are connected end to end; the device also comprises a transverse plate, two transition plates respectively fixed at the bottoms of the two ends of the transverse plate, a supporting piece fixed at the bottom of the transition plate and a fitting piece; the bottom support piece is inserted into the stress buffer groove, and two side surfaces of the bottom support piece are respectively contacted with the inner side surface of the stress buffer groove; the fitting piece penetrates through the transverse plate and the transition plate to enable the transition plate to be tightly abutted against the top surface of the heater at the bottom of the single crystal furnace. The utility model can prevent the bottom heater of the semiconductor single crystal furnace from deforming when the fixing bolt is installed, and avoids the adverse effect on the centering installation of the bottom heater.
Description
Technical Field
The utility model relates to the technical field of semiconductor single crystal furnace installation, in particular to an anti-deformation device for installation of a heater at the bottom of a semiconductor single crystal furnace.
Background
Patent application No. CN2017102454267 discloses a semiconductor grade silicon single crystal furnace bottom heater; when the bottom heater of the semiconductor single crystal furnace and the heater fixing support are fastened through the fixing bolt, the bottom heater is made of graphite and the rigidity of the annular fan-shaped structure is weak, so that the bottom heater structure is easy to deform under the action of torque, and the deformation can increase the centering difficulty of the bottom heater in use, so that the bottom heater is difficult to center.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: aiming at the defects, the utility model provides the anti-deformation device for mounting the bottom heater of the semiconductor single crystal furnace, which can prevent the bottom heater of the semiconductor single crystal furnace from deforming when a fixing bolt is mounted, and further avoid the adverse effect on the centering mounting of the bottom heater.
The technical scheme is as follows: in order to solve the above problems, the present invention provides a device for preventing deformation of a heater installed at the bottom of a semiconductor single crystal furnace, comprising: the single crystal furnace bottom heater is provided with two stress buffer grooves, and the two stress buffer grooves are positioned on the upper surface of the single crystal furnace bottom heater and are respectively positioned on two symmetrical sides of a symmetrical center shaft of the single crystal furnace bottom heater; the heater at the bottom of the single crystal furnace comprises a heating plate which is encircled into a circle, and two leg parts which are positioned at the bottoms of two sides of the heating plate and extend downwards; the top surface and the leg part of the heating plate are provided with threaded holes, and a bolt penetrates through the threaded hole of the heating plate to be in threaded connection with the threaded hole of the leg part; the heating plate comprises a plurality of U-shaped plates which are connected end to end; the device also comprises a transverse plate, two transition plates respectively fixed at the bottoms of the two ends of the transverse plate, a supporting piece fixed at the bottom of the transition plate and a matching piece; the bottom support piece is inserted into a stress buffer groove of the bottom heater of the single crystal furnace, and two side surfaces of the bottom support piece are respectively contacted with the inner side surface of the stress buffer groove; the fitting piece penetrates through the transverse plate and the transition plate, and the transition plate is abutted against the top surface of the heater at the bottom of the single crystal furnace by the fitting piece.
Has the advantages that: compared with the prior art, the utility model has the following remarkable advantages: the supporting piece is arranged to be abutted against the side face of the stress buffer groove, so that the force generated in the process that the transition plate is abutted against the top face of the heater at the bottom of the single crystal furnace by the matching piece is transmitted to the side face of the stress buffer groove through the abutted position, the rigidity of the stressed part of the heater at the bottom is increased, and the heater at the bottom is protected.
Furthermore, two threaded holes are formed in the heating plate and are respectively located on the outer side of the stress buffer groove, and the two threaded holes of the heating plate are respectively located on two symmetrical sides of a symmetrical center shaft of the heater at the bottom of the single crystal furnace.
Furthermore, a through hole is formed in the center of the transverse plate, and the through hole is formed in the center of the transverse plate and used for fixing the transverse plate on a crucible shaft of the semiconductor single crystal furnace. Through having seted up the through-hole at the center of diaphragm, can inject the position of diaphragm when the centering installation at the bottom heater, can adjust bottom heater position through this diaphragm, play bottom heater centering calibration effect.
Furthermore, two side surfaces of the bottom supporting piece are completely attached to the inner side surface of the stress buffer groove respectively. When the stress buffer groove is completely attached, the force generated in the process of tightly abutting the transition plate and the top surface of the heater at the bottom of the single crystal furnace can be better transmitted to the side surface of the stress buffer groove.
Further, the length of the transverse plate is larger than the radial size of the inner ring of the bottom heater and smaller than the radial size of the outer ring of the bottom heater.
Furthermore, the transverse plate, the transition plate and the supporting piece are fixed through the step pin.
Furthermore, the supporting piece is fixed at the bottom of the transition plate through a hexagon countersunk head screw.
Furthermore, the supporting piece is fixed at the bottom of the transition plate through a straight pin.
Furthermore, the fitting piece is a plum-blossom handle.
Drawings
FIG. 1 is a sectional view showing an installation of a bottom heater of a semiconductor single crystal furnace with an anti-deformation device according to the present invention;
FIG. 2 is a sectional view showing that a semiconductor single crystal furnace bottom heater mounting deformation preventing device of the present invention is mounted on a semiconductor single crystal furnace bottom heater;
FIG. 3 is a schematic view showing that the anti-deformation device for mounting a bottom heater of a semiconductor single crystal furnace according to the present invention is mounted on the bottom heater of the semiconductor single crystal furnace.
Detailed Description
The utility model will be further described with reference to the accompanying drawings.
As shown in figure 1, the device for preventing deformation during installation of the bottom heater of the semiconductor single crystal furnace comprises a transverse plate 1, a transition plate 2, a supporting piece 3, a fitting piece 4 and a bottom heater 5.
The single crystal furnace bottom heater 5 comprises a heating plate 51, and two legs 52 which are located at the bottom of both sides of the heating plate 51 and extend downward. The upper surface of the bottom heater 5 is provided with two stress buffer grooves 6, and the two stress buffer grooves 6 are respectively positioned at two symmetrical sides of a symmetrical center shaft of the bottom heater 5 of the single crystal furnace. The heating plate 51 is of an annular plate-shaped structure and comprises a plurality of U-shaped plates which are connected end to end, and the opening edges of one side of each adjacent U-shaped plate are connected; the heating plate 51 is provided with two threaded holes which are respectively positioned at two symmetrical sides of a symmetrical center shaft of the heater at the bottom of the single crystal furnace, and each threaded hole is positioned at the outer side of the stress buffer groove 6 at the same side of the symmetrical center shaft of the heater at the bottom of the single crystal furnace. The top surfaces of the two legs 52 are also provided with threaded holes, and the bottom heater fixing bolts 10 are threaded through the threaded holes of the heating plate 52 and the threaded holes of the legs 52.
The two transition plates 2 are respectively fixed at the bottoms of the two ends of the transverse plate 1, the supporting piece 3 is fixed at the bottom of the transition plate 2, the supporting piece 3 and the transition plate 2 are fixed by inserting the hexagonal countersunk head screw 7 and the straight pin 8 into the supporting piece 3 and the transition plate 2 from top to bottom, and the transverse plate 1, the transition plate 2 and the supporting piece 3 are fixed by the step pin 9. The fitting piece 4 is a plum blossom handle, and the fitting piece 4 penetrates through the transverse plate 1 and the transition plate 2.
As shown in fig. 2 to 3, the length of the transverse plate 1 is larger than the inner ring radial dimension of the bottom heater 5 and smaller than the outer ring radial dimension, and the bottom support 3 is inserted into the stress buffer groove 6 of the bottom heater 5 of the single crystal furnace from top to bottom. Two side surfaces of the bottom support 3 are completely attached to the inner side surfaces of the stress buffer grooves 6 respectively; the fitting piece 4 tightly presses the transition plate 2 against the top surface of the heater 5 at the bottom of the single crystal furnace. The center of the transverse plate 1 is provided with a through hole 12, and the size of the through hole 12 is matched with that of the crucible shaft 11 of the semiconductor single crystal furnace.
The working principle is as follows: firstly, a through hole on a transverse plate 1 is assembled with a crucible shaft 11 of a semiconductor single crystal furnace, then a supporting piece 3 is clamped with a stress buffer groove 6, and finally a transition plate 2 is abutted against the top surface of a heater 5 at the bottom of the single crystal furnace through a fitting piece 4, so that the rigidity of the stressed part of the heater 5 at the bottom of the single crystal furnace is increased, the heater 5 at the bottom of the single crystal furnace is protected, the heater 5 at the bottom of the single crystal furnace is prevented from deforming when a heating plate 51 is in threaded connection with a leg part 52 through a fixing bolt 10 of the heater at the bottom of the single crystal furnace, and further, the centering installation of the heater 5 at the bottom of the single crystal furnace is prevented from being adversely affected.
Claims (9)
1. A bottom heater installation anti-deformation device of a semiconductor single crystal furnace comprises: the single crystal furnace bottom heater (5) is provided with two stress buffer grooves (6), and the two stress buffer grooves (6) are positioned on the upper surface of the single crystal furnace bottom heater (5) and are respectively positioned on two symmetrical sides of a symmetrical central axis of the single crystal furnace bottom heater (5); the single crystal furnace bottom heater (5) comprises a heating plate (51) which is encircled into a circle, and two legs (52) which are positioned at the bottoms of two sides of the heating plate (51) and extend downwards; threaded holes are formed in the top surfaces of the heating plate (51) and the leg portion (52), and bolts penetrate through the threaded holes of the heating plate (51) to be in threaded connection with the threaded holes of the leg portion (52); the heating plate (51) comprises a plurality of U-shaped plates which are connected end to end; the device is characterized by also comprising a transverse plate (1), two transition plates (2) respectively fixed at the bottoms of the two ends of the transverse plate (1), a supporting piece (3) fixed at the bottom of the transition plates (2) and a matching piece (4); the supporting piece (3) is inserted into a stress buffer groove (6) of a heater (5) at the bottom of the single crystal furnace, and two side surfaces of the supporting piece (3) are respectively contacted with the inner side surface of the stress buffer groove (6); the fitting piece (4) penetrates through the transverse plate (1) and the transition plate (2), and the transition plate (2) is tightly abutted against the top surface of the heater (5) at the bottom of the single crystal furnace by the fitting piece (4).
2. The mounting deformation preventing device for the bottom heater of the semiconductor single crystal furnace according to claim 1, wherein two threaded holes are formed in the heating plate (51) and are respectively located on the outer sides of the stress buffering grooves (6), and the two threaded holes of the heating plate (51) are respectively located on two symmetrical sides of a symmetrical central axis of the bottom heater (5) of the single crystal furnace.
3. The bottom heater installation deformation preventing device for the semiconductor single crystal furnace according to claim 1, wherein a through hole is formed in the center of the transverse plate (1), and the through hole is used for fixing the transverse plate (1) on a crucible shaft (11) of the semiconductor single crystal furnace.
4. The bottom heater installation deformation preventing device for the semiconductor single crystal furnace according to claim 1, wherein two side surfaces of the support member (3) are respectively and completely attached to the inner side surfaces of the stress buffering grooves (6).
5. The bottom heater installation deformation preventing device of the semiconductor single crystal furnace according to claim 1, wherein the length of the transverse plate (1) is greater than the radial dimension of the inner ring of the bottom heater (5) and less than the radial dimension of the outer ring.
6. The bottom heater installation deformation preventing device for the semiconductor single crystal furnace according to claim 1, wherein the transverse plate (1), the transition plate (2) and the support member (3) are fixed by a step pin.
7. The bottom heater installation deformation preventing device for the semiconductor single crystal furnace according to claim 6, wherein the supporting member (3) is fixed to the bottom of the transition plate (2) by a hexagon countersunk head screw.
8. The bottom heater installation deformation preventing device of the semiconductor single crystal furnace according to claim 6, wherein the support member (3) is fixed to the bottom of the transition plate (2) by a straight pin.
9. The semiconductor single crystal furnace bottom heater installation deformation preventing device of any one of claims 1 to 6, wherein the fitting piece (4) is a plum blossom handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123436655.8U CN216972738U (en) | 2021-12-30 | 2021-12-30 | Anti-deformation device for installation of heater at bottom of semiconductor single crystal furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123436655.8U CN216972738U (en) | 2021-12-30 | 2021-12-30 | Anti-deformation device for installation of heater at bottom of semiconductor single crystal furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216972738U true CN216972738U (en) | 2022-07-15 |
Family
ID=82349676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123436655.8U Active CN216972738U (en) | 2021-12-30 | 2021-12-30 | Anti-deformation device for installation of heater at bottom of semiconductor single crystal furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216972738U (en) |
-
2021
- 2021-12-30 CN CN202123436655.8U patent/CN216972738U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012149764A (en) | Screw | |
| CN216972738U (en) | Anti-deformation device for installation of heater at bottom of semiconductor single crystal furnace | |
| JP2009228880A (en) | Pipe support structure and support method | |
| US20060117861A1 (en) | Material tester | |
| CN217206589U (en) | Connecting structure for cylinder body and bearing box in steam turbine | |
| CN217679799U (en) | Thin-wall cavity wallboard connecting mechanism suitable for high-risk areas | |
| CN215830987U (en) | Movable triple-force-transmission anti-torque device for large-scale transmission friction disc | |
| CN211553631U (en) | Material symmetrical loading three-point bending fatigue experimental device | |
| CN210034252U (en) | Disc spring compression ring structure | |
| CN210093145U (en) | Mounting fixture and photovoltaic system | |
| CN211852459U (en) | Auxiliary nut mounting structure | |
| CN216742384U (en) | Embedded flange welded nut | |
| CN110686989A (en) | Material symmetrical loading three-point bending fatigue experimental device | |
| CN211496601U (en) | Lifting lug for water supply device | |
| CN220612397U (en) | Guide rod pin hole positioning drilling device | |
| CN216371087U (en) | Pressing plate structural part | |
| CN205533707U (en) | Thread connection pretension structure | |
| CN213729742U (en) | Sprocket that is difficult for pine to take off | |
| CN205341866U (en) | Die casting machine armature assembly auxiliary device | |
| CN216066290U (en) | Mounting and dismounting structure of ship rudder stock | |
| CN208311268U (en) | A kind of press crankshaft support sleeve mounting structure convenient for assembly | |
| CN210648334U (en) | Novel fixed frock of shifting fork forging | |
| CN214686346U (en) | Fastening device | |
| CN211525266U (en) | Novel connecting structure | |
| CN112855816B (en) | Detect frock of friction riveting intensity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |