CN216966621U

CN216966621U - Hot press unit for semiconductor processing

Info

Publication number: CN216966621U
Application number: CN202220429880.4U
Authority: CN
Inventors: 冯磊; 王永超; 朱清江
Original assignee: Weihai Mingdao Precision Machinery Co ltd
Current assignee: Weihai Mingdao Precision Machinery Co ltd
Priority date: 2022-03-01
Filing date: 2022-03-01
Publication date: 2022-07-15
Anticipated expiration: 2032-03-01

Abstract

The utility model discloses a hot-pressing device for semiconductor processing, which comprises a machine body and a supporting plate, wherein a machine door is movably mounted on the front surface of the machine body, a sliding groove is formed in the machine body, a mounting plate is detachably mounted on the upper surface of the supporting plate, a bayonet is formed in one side of the mounting plate, a placing plate is detachably mounted on the upper surface of the mounting plate, guide posts are fixedly mounted on two sides of the placing plate, a limiting block is fixedly mounted at one end of each guide post, a spring is sleeved on the outer surface of each guide post, a buckle is fixedly mounted at one end of each spring, a fixed block is fixedly mounted on one side of the upper surface of the supporting plate, and a limiting plate is movably mounted in the fixed block. The utility model facilitates the blanking of the hot pressing device, can directly slide the supporting plate out of the machine body, facilitates the replacement and cleaning of the hot pressing device, can disassemble the mounting plate for cleaning by a simple method, and has practicability.

Description

Hot press unit for semiconductor processing

Technical Field

The utility model relates to the technical field of hot-pressing devices, in particular to a hot-pressing device for semiconductor processing.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor is used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc. a hot press is a device for heating two parts previously plated with flux and tin to a temperature sufficient to melt and flow solder, and after solidification, a permanent electrical-mechanical connection is formed between the parts and the solder. The heating speed can be selected according to different products, and the method can be used for carrying out hot-pressing processing on the semiconductor;

the existing hot pressing device has certain defects, is not convenient to detach and clean, has dirt due to long-time use in the use process, can generate peculiar smell under the hot pressing condition, can move to the hot pressing effect, has certain temperature after the hot pressing on a semiconductor, and cannot be directly taken by hands, so that the hot pressing device for semiconductor processing is provided at present.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a hot pressing device for semiconductor processing, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a hot press unit for semiconductor processing, includes organism and backup pad, the preceding surface movable mounting of organism has the quick-witted door, the spout has been seted up to the inside of organism, the upper surface demountable installation of backup pad has the mounting panel, the bayonet socket has been seted up to one side of mounting panel, the upper surface demountable installation of mounting panel has places the board, the equal fixed mounting in both sides of placing the board has the guide post, the one end fixed mounting of guide post has the stopper, the surface cover of guide post is equipped with the spring, the one end fixed mounting of spring has the buckle, upper surface one side fixed mounting of backup pad has the fixed block, the inside movable mounting of fixed block has the limiting plate, the preceding surface fixed mounting of limiting plate has the fixture block.

Preferably, the lower surface center department fixed mounting of mounting panel has the erection column, the mounting hole has been seted up to the upper surface of backup pad, the erection column on the mounting panel is inserted and is established in the mounting hole in the backup pad.

Preferably, the both sides of the lower surface of backup pad all fixed mounting have the slider, slider slidable mounting is in the spout, the backup pad passes through the inside of slider and spout slip at the organism.

Preferably, the jack has all been seted up to the both sides of mounting panel, the buckle block is in the inside of jack, it passes through jack and buckle and can dismantle with the mounting panel and be connected to place the board.

Preferably, the notch has been seted up to the inside of fixed block, limiting plate slidable mounting is in the inside of notch, the quantity of spring is four groups, two sets of in addition spring fixed mounting is in the inside notch of fixed block, two sets of in addition spring and limiting plate fixed connection.

Preferably, a hinge is fixedly installed at the joint of the machine body and the machine door, and the machine door is fixedly connected with the hinge.

Compared with the prior art, the utility model has the following beneficial effects:

1. the hot-pressing device is convenient to discharge through the arranged sliding block, the sliding groove, the guide post, the limiting block, the buckle, the spring and the clamping block, the supporting plate can be directly slid out of the interior of the machine body, then the buckle is separated from the interior of the bayonet, the placing plate is taken out to discharge, workers are prevented from being scalded, and the use experience of the users is improved;

2. the hot pressing device is convenient to replace and clean through the arranged fixed block, the limiting plate, the mounting plate and the bayonet, the mounting plate can be detached to be cleaned through a simple method, the cleaning convenience is improved, the cleaning personnel is prevented from being cleaned inside the machine body, and meanwhile, the fixing method is simple and convenient and has practicability.

Drawings

FIG. 1 is a schematic view of the overall structure of a hot press apparatus for semiconductor processing according to the present invention;

FIG. 2 is a schematic diagram of an internal structure of a hot press apparatus for semiconductor processing according to the present invention;

FIG. 3 is a schematic view of a connecting structure between a support plate and a body of a hot press apparatus for semiconductor processing according to the present invention;

FIG. 4 is a schematic view of a connection structure between a mounting plate and a supporting plate of a hot press apparatus for semiconductor processing according to the present invention;

FIG. 5 is a schematic view of a connection structure between a mounting plate and a placing plate of a hot press apparatus for semiconductor processing according to the present invention;

fig. 6 is a schematic structural diagram of a fixing block in a hot pressing device for semiconductor processing according to the present invention.

In the figure: 1. a body; 2. a hinge; 3. a machine door; 4. a chute; 5. a support plate; 6. a slider; 7. mounting a plate; 8. a bayonet; 9. a jack; 10. placing a plate; 11. a guide post; 12. a limiting block; 13. buckling; 14. a spring; 15. a clamping block; 16. a fixed block; 17. and a limiting plate.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further explained by combining the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

As shown in fig. 1-6, a hot press unit for semiconductor processing, including organism 1 and backup pad 5, the front surface movable mounting of organism 1 has door 3, spout 4 has been seted up to organism 1's inside, the upper surface demountable installation of backup pad 5 has mounting panel 7, bayonet socket 8 has been seted up to one side of mounting panel 7, the upper surface demountable installation of mounting panel 7 has placed board 10, the equal fixed mounting in both sides of placing board 10 has guide post 11, the one end fixed mounting of guide post 11 has stopper 12, the surface cover of guide post 11 is equipped with spring 14, the one end fixed mounting of spring 14 has buckle 13, upper surface one side fixed mounting of backup pad 5 has fixed block 16, the inside movable mounting of fixed block 16 has limiting plate 17, the fixed surface installs fixture block 15 before limiting plate 17.

The lower surface center department fixed mounting of mounting panel 7 has the erection column, and the mounting hole has been seted up to the upper surface of backup pad 5, and the erection column on the mounting panel 7 is inserted in the mounting hole of establishing in backup pad 5, inserts the erection column under the mounting panel 7 in the mounting hole on backup pad 5, consequently installs.

The equal fixed mounting in lower surface both sides of backup pad 5 has slider 6, and slider 6 slidable mounting slides in spout 4, and backup pad 5 slides in organism 1's inside through slider 6 and spout 4, places the semiconductor on placing board 10, then to organism 1 inside promotion backup pad 5, and slider 6 can be in spout 4 to organism 1 inside slip.

Jack 9 has all been seted up to mounting panel 7's both sides, and buckle 13 block is in the inside of jack 9, places board 10 and can dismantle with mounting panel 7 through jack 9 and buckle 13 and be connected, presses buckle 13 on the guide post 11, and buckle 13 can compression spring 14, and stopper 12 plays spacing effect, then during buckle 13 can block into jack 9 on mounting panel 7.

The inside of fixed block 16 has seted up the notch, and limiting plate 17 slidable mounting is in the inside of notch, and the quantity of spring 14 is four groups, and two sets of spring 14 fixed mounting are in the inside notch of fixed block 16 in addition, and two sets of spring 14 and limiting plate 17 fixed connection in addition.

Hinge 2 is fixedly installed at the junction of organism 1 and door 3, and door 3 and hinge 2 fixed connection utilize hinge 2 to rotate door 3 to this uses organism 1 to semiconductor hot pressing.

The utility model is to be noted that, when the hot pressing device for processing the semiconductor is used, an installation column below an installation plate 7 is inserted into an installation hole on a support plate 5, then a spring 14 inside a fixed block 16 drives a clamping block 15 to be supported into a clamping opening 8 on the installation plate 7 for fixing, a limiting plate 17 has a limiting effect to prevent the clamping block 15 from sliding too much, then a placing plate 10 is placed on the installation plate 7, a clamping buckle 13 on a guide column 11 is pressed, the clamping buckle 13 compresses the spring 14, a limiting block 12 has a limiting effect, then the clamping buckle 13 can be clamped into a jack 9 on the installation plate 7, the semiconductor is placed on the placing plate 10, then the support plate 5 is pushed towards the inside of a machine body 1, a sliding block 6 can slide towards the inside of the machine body 1 in a sliding groove 4, and then a hinge 2 is used for rotating a machine door 3, so that the machine body 1 is used for hot pressing the semiconductor.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The hot pressing device for semiconductor processing comprises a machine body (1) and a supporting plate (5), and is characterized in that a machine door (3) is movably mounted on the front surface of the machine body (1), a sliding groove (4) is formed in the machine body (1), a mounting plate (7) is detachably mounted on the upper surface of the supporting plate (5), a bayonet (8) is formed in one side of the mounting plate (7), a placing plate (10) is detachably mounted on the upper surface of the mounting plate (7), guide columns (11) are fixedly mounted on two sides of the placing plate (10), a limiting block (12) is fixedly mounted at one ends of the guide columns (11), springs (14) are sleeved on the outer surfaces of the guide columns (11), buckles (13) are fixedly mounted at one ends of the springs (14), and a fixing block (16) is fixedly mounted on one side of the upper surface of the supporting plate (5), the inside movable mounting of fixed block (16) has limiting plate (17), the front surface fixed mounting of limiting plate (17) has fixture block (15).

2. The hot pressing device for processing the semiconductor as claimed in claim 1, wherein a mounting post is fixedly mounted at the center of the lower surface of the mounting plate (7), a mounting hole is formed in the upper surface of the supporting plate (5), and the mounting post on the mounting plate (7) is inserted into the mounting hole on the supporting plate (5).

3. The hot pressing device for processing the semiconductor according to claim 1, wherein sliding blocks (6) are fixedly mounted on both sides of the lower surface of the supporting plate (5), the sliding blocks (6) are slidably mounted in the sliding grooves (4), and the supporting plate (5) slides inside the machine body (1) through the sliding blocks (6) and the sliding grooves (4).

4. The hot-pressing device for semiconductor processing according to claim 1, wherein the mounting plate (7) has insertion holes (9) formed on both sides thereof, the fasteners (13) are engaged with the insertion holes (9), and the placing plate (10) is detachably connected to the mounting plate (7) through the insertion holes (9) and the fasteners (13).

5. The hot-pressing device for semiconductor processing according to claim 1, wherein the fixed block (16) is provided with a notch therein, the limiting plates (17) are slidably mounted inside the notch, the number of the springs (14) is four, the other two sets of the springs (14) are fixedly mounted in the notch inside the fixed block (16), and the other two sets of the springs (14) are fixedly connected with the limiting plates (17).

6. The hot pressing device for semiconductor processing according to claim 1, wherein a hinge (2) is fixedly installed at a joint of the machine body (1) and the machine door (3), and the machine door (3) is fixedly connected with the hinge (2).