CN216960462U - Ka frequency channel power amplifier module of easily integrateing - Google Patents
Ka frequency channel power amplifier module of easily integrateing Download PDFInfo
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- CN216960462U CN216960462U CN202220042145.8U CN202220042145U CN216960462U CN 216960462 U CN216960462 U CN 216960462U CN 202220042145 U CN202220042145 U CN 202220042145U CN 216960462 U CN216960462 U CN 216960462U
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Abstract
The utility model relates to the technical field of radio frequency communication, in particular to an easily-integrated Ka frequency band power amplifier module, which comprises a carrier, wherein a first glass insulator, a waveguide structure, a feedthrough capacitor and a connecting structure are arranged on the carrier, a PCB for integrating a power amplifier chip is arranged in the carrier, and the first glass insulator, the waveguide structure and the feedthrough capacitor are respectively connected with a signal input end, a signal output end and the power amplifier chip of the PCB from the outside of the carrier to the inside. The Ka-band power amplifier module easy to integrate not only can integrate a power amplifier structure of a Ka-band, but also has a simplified structure, is easy to mount and butt-joint to a whole machine system, can realize high-power output, and realizes the effects of low cost and high power.
Description
Technical Field
The utility model relates to the technical field of radio frequency communication, in particular to an easily-integrated Ka frequency band power amplifier module.
Background
In the prior art, a Ka band with high capacity is widely applied to the field of satellite communication, and because the Ka band is high in frequency band, short in wavelength and large in transmission loss, the design requirement of a Ka band power amplifier structure is generally higher, and the Ka band power amplifier structure is required to be miniaturized and convenient to integrate with a whole machine while meeting the performance.
However, there are two main types of Ka-band power amplifier structure technologies in the prior art: one is that both input and output ends are in the form of glass insulators, and the other is that both input and output ends are in the form of waveguides. The first solution is easy to integrate with the system, but has the disadvantages that the output form of the glass insulator is difficult to realize high-power output and the power is low; the second scheme has the disadvantages of large volume and high cost due to the fact that the power amplifier front stage needs to design a waveguide or waveguide conversion for matching, and the structure and the process are relatively complex.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects in the prior art, the utility model provides the Ka frequency band power amplifier module easy to integrate, which not only can integrate the power amplifier structure of the Ka frequency band, but also has the advantages of simplified structure, easy installation and butt joint to a whole machine system, realization of high-power output, low cost and high power.
The utility model relates to an easily-integrated Ka frequency band power amplifier module, which comprises a carrier, wherein a first glass insulator, a waveguide structure, a feedthrough capacitor and a connecting structure are arranged on the carrier, a PCB (printed circuit board) for integrating a power amplifier chip is arranged in the carrier, and the first glass insulator, the waveguide structure and the feedthrough capacitor are respectively connected with a signal input end, a signal output end and the power amplifier chip of the PCB from the outside of the carrier inwards.
According to the easily-integrated Ka-band power amplifier module, the carrier comprises a loading box, a top cover plate and side cover plates, wherein a mounting groove for loading the PCB is formed in the loading box, the top cover plate covers the mounting groove and is detachably connected with the loading box through a screw, the waveguide structure comprises an open groove formed in the side face of the loading box, and the side cover plates cover the open groove and are detachably connected with the loading box through screws.
According to the easily-integrated Ka-band power amplifier module, the connecting structure comprises a plurality of first threaded holes, and the first threaded holes are formed in the side face of the loading box and close to the signal input end of the PCB.
According to the easily-integrated Ka-band power amplifier module, the connecting structure comprises a plurality of mounting through holes, and the mounting through holes are distributed around the periphery of the loading box.
According to the easy-to-integrate Ka frequency band power amplifier module, the waveguide structure further comprises a second glass insulator arranged in the open slot, and the second glass insulator and the first glass insulator are respectively arranged on two opposite sides of the loading box and have the same size.
According to the easily-integrated Ka-band power amplifier module, the axis of the second glass insulator is perpendicular to the bottom of the open slot and is at a distance from the side wall of the open slot and the inner wall of the side cover plate.
According to the easy-to-integrate Ka frequency band power amplifier module, the number of the feedthrough capacitors is a plurality, and each feedthrough capacitor is used for being respectively connected with each power supply pin of the power amplifier chip on the PCB.
According to the easy-to-integrate Ka frequency band power amplifier module, the number of the feedthrough capacitors is four, two of the feedthrough capacitors are used for being respectively connected with two grids VG of a power amplifier chip on the PCB, and the other two feedthrough capacitors are used for being respectively connected with two drains VD of the power amplifier chip on the PCB.
According to the easily-integrated Ka frequency band power amplifier module, the diameters of the first glass insulator and the second glass insulator are both 0.2-0.8 mm.
According to the easy-to-integrate Ka frequency band power amplifier module, the size of the open slot of the waveguide structure is the size of standard waveguide WR 28.
The utility model provides an easy-to-integrate Ka frequency band power amplifier module, which comprises a carrier, wherein a PCB (printed Circuit Board) for integrating a power amplifier chip is arranged in the carrier 1, and a first glass insulator, a waveguide structure, a feedthrough capacitor and a connecting structure are arranged on the carrier; in addition, because the carrier is provided with the connecting structure, the power amplifier module can be fixedly connected to an external whole machine system through the connecting structure, and because the first glass insulator, the waveguide structure and the feedthrough capacitor are respectively and inwardly connected with the signal input end, the signal output end and the power amplifier chip of the PCB from the outside of the carrier, the power amplifier module and the external whole machine system can be simply and directly installed and butted through the first glass insulator, the waveguide structure and the feedthrough capacitor from the outside of the carrier to be respectively and electrically connected with the whole machine system, so that the integration is convenient. Therefore, the Ka-band power amplifier module easy to integrate not only can integrate the power amplifier structure of the Ka-band, but also has the advantages of simplified structure, easy installation and butt joint to a whole machine system, high-power output, low cost and high power.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic top view of the present invention (top cover plate 6 installed);
FIG. 2 is a schematic bottom view of the present invention (top cover panel 6 and side cover panel 7 installed);
FIG. 3 is a schematic perspective view of the present invention (top cover plate 6 and side cover plate 7 are not installed);
FIG. 4 is a schematic perspective view of the present invention (with the top cover plate 6 installed);
fig. 5 is a schematic perspective view of the present invention (with the top cover plate 6 and the side cover plate 7 installed).
The attached drawings are marked as follows:
1. a carrier;
2. a first glass insulator;
3. a waveguide structure, 3-1, an open slot, 3-2 a second glass insulator;
4. a feedthrough capacitor;
5. a loading box 5-1 and an installation groove;
6. a top cover plate;
7. a side cover plate;
8. a first threaded hole;
9. mounting a through hole;
10. a mounting seat;
11. a second threaded hole;
12. and a third threaded hole.
Detailed Description
It should be noted that, in order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In embodiments of the utility model, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Example one
As shown in fig. 1-5, an easily integrated Ka frequency band power amplifier module comprises a carrier 1, wherein a first glass insulator 2, a waveguide structure 3, a feedthrough capacitor 4 and a connection structure are arranged on the carrier 1, a PCB (not shown in the figure) for integrating a power amplifier chip is arranged in the carrier 1, and the first glass insulator 2, the waveguide structure 3 and the feedthrough capacitor 4 are respectively connected with a signal input end, a signal output end and a power amplifier chip of the PCB from the outside of the carrier 1.
Namely, one end of each of the first glass insulator 2, the waveguide structure 3 and the feedthrough capacitor 4 is located outside the carrier 1, and the other end of each of the first glass insulator 2, the waveguide structure 3 and the feedthrough capacitor 4 penetrates through the carrier 1 and is connected to the PCB board located inside the carrier 1, so that the first glass insulator 2 can internally connect a signal input end of the PCB board, the waveguide structure 3 can internally connect a signal output end of the PCB board, and the feedthrough capacitor 4 can internally connect a power amplifier chip of the PCB board.
It can be understood that, in this embodiment, since the first glass insulator 2 and the waveguide structure 3 are respectively connected to the signal input end and the signal output end of the PCB, it can be realized that the input end of the power amplifier is in the form of a glass insulator and the output end is in the form of a waveguide, it can be understood that the input end of the power amplifier is in the form of a glass insulator and can be easily integrated with a system, and the output end is in the form of direct waveguide output and can realize high-power output, so that the power amplifier structure can be simplified, the cost is lower, and the power is high; in addition, because the carrier 1 is provided with the connecting structure, the power amplifier module can be fixedly connected to an external whole machine system through the connecting structure, and because the first glass insulator 2, the waveguide structure 3 and the feedthrough capacitor 4 are respectively and inwardly connected with a signal input end, a signal output end and a power amplifier chip of the PCB from the outside of the carrier 1, the power amplifier module and the external whole machine system can be simply and directly installed and butted through the first glass insulator 2, the waveguide structure 3 and the feedthrough capacitor 4 from the outside of the carrier 1 to be respectively and electrically connected with the whole machine system, and the integration is convenient. Therefore, the Ka-band power amplifier module easy to integrate not only can integrate the power amplifier structure of the Ka-band, but also has the advantages of simplified structure, easy installation and butt joint to a whole machine system, high-power output, low cost and high power.
In one embodiment, the carrier 1 is assembled by a loading box 5, a top cover plate 6 and a side cover plate 7, wherein the loading box 5 is integrally formed with a mounting groove 5-1, the mounting groove 5-1 is used for loading a PCB so that the PCB can be fixedly mounted in the mounting groove 5-1, the top cover plate 6 is used for covering the mounting groove 5-1, and the top cover plate 6 is detachably connected with the loading box 5 through a screw, the waveguide structure 3 comprises an open groove 3-1, the open groove 3-1 is integrally formed at the side of the loading box 5 so as to allow the power amplification module to realize output in a waveguide form, the side cover plate 7 is used for covering the open groove 3-1, and the side cover plate 7 is detachably connected with the loading box 5 through a screw.
It can be understood that because the top cover plate 6 and the side cover plate 7 respectively constitute the equipment through screw and loading box 5 to need not laser sealing, convenient dismantlement and installation are particularly suitable for the debugging work of power amplifier module, and the dismouting debugging of being convenient for, therefore the packaging technology is simpler, and the cost is lower.
Specifically, the middle part of the mounting groove 5-1 is a wide groove and the opposite sides are narrow grooves.
In one embodiment, the connecting structure includes a plurality of first threaded holes 8, and the plurality of first threaded holes 8 are disposed at a side surface of the loading box 5 and close to the signal input end of the PCB, i.e. the plurality of first threaded holes 8 are located at a side of the signal input end of the PCB.
It can be understood, because load box 5 and reserve in the one side that is located PCB board signal input part and be provided with the first screw hole 8 of a plurality of, in the debugging process, outside erection joint ware can constitute detachable through each first screw hole 8 and load box 5 and be connected, thereby can be convenient for outside erection joint ware to carry out the debugging alone to the power amplifier module, thereby the debugging process is more nimble convenient, also be convenient for solve the problem location of power amplifier module, wait to debug and tear the connector out after finishing again, at last again power amplifier module integrated connection to outside complete machine system's PCB.
In one embodiment, the connection structure further includes a plurality of mounting through holes 9, each mounting through hole 9 is distributed around the periphery of the loading box 5, and each mounting through hole 9 can facilitate a screw to pass through, so that the power amplifier module can be fixedly connected to an external complete machine system through the screw, thereby facilitating disassembly and assembly and also facilitating heat dissipation of the power amplifier module on the external complete machine system.
Specifically, the connection structure further includes a plurality of mounting seats 10, each mounting seat 10 is distributed around the outer periphery of the loading box 5, and each mounting through hole 9 is formed on each mounting seat 10.
Specifically, the number of the mounting seats 10 is four, and four mounting seats 10 are distributed at four corners of the loading cassette 5 so as to constitute a stable mounting.
In one embodiment, the waveguide structure 3 further comprises a second glass insulator 3-2, the second glass insulator 3-2 is disposed in the open slot 3-1, the second glass insulator 3-2 has the same size as the first glass insulator 2, and the second glass insulator 3-2 and the first glass insulator 2 are respectively disposed on two opposite sides of the loading box 5.
In one embodiment, the axis of the second glass insulator 32 is perpendicular to the bottom of the open slot 31, and the second glass insulator 32 is at a distance from the side wall of the open slot 31 and from the inner wall of the side cover plate 7. In an initial state, the second glass insulator 32 is located in the center of the open slot 31, and during debugging, the required frequency and bandwidth matching can be achieved by adjusting the distance between the second glass insulator 32 and the side wall of the open slot 31 or adjusting the distance between the second glass insulator 32 and the inner wall of the side cover plate 7.
In an embodiment, the number of the feedthrough capacitors 4 is several, and each feedthrough capacitor 4 is used to connect each power supply pin of the power amplifier chip on the PCB board, specifically, considering that the power amplifier chip usually has four power supply pins, i.e. two gates VG and two drains VD, in this embodiment, the number of the feedthrough capacitors 4 is four, wherein two feedthrough capacitors 4 are used to connect two gates VG of the power amplifier chip on the PCB board respectively, so as to supply power to the gates VG of the power amplifier, and the other two feedthrough capacitors 4 are used to connect two drains VD of the power amplifier chip on the PCB board respectively, so as to supply power to the drains VD of the power amplifier.
In one embodiment, the first glass insulator 2 and the second glass insulator 32 each have a diameter of 0.2mm to 0.8mm, and in this embodiment, a diameter of 0.3mm to 0.7mm, so as to be in line-width matching butt joint with a conventional ohmic microstrip on the whole system.
In one embodiment, the slot 31 of the waveguide structure 3 is facing downwards, the size of the slot 31 being the size of a standard waveguide WR 28.
In one embodiment, the loading box 5 and the top cover plate 6 are respectively provided with a plurality of second screw holes 11, and when the top cover plate 6 is assembled on the surface of the loading box 5, the second screw holes 11 of the loading box 5 and the second screw holes 11 of the top cover plate 6 correspond to each other and are connected by screw.
In one embodiment, the loading box 5 and the side cover 7 are respectively provided with a plurality of third threaded holes 12, and when the side cover 7 is assembled on the side of the loading box 5, the third threaded holes 12 of the loading box 5 and the third threaded holes 12 of the top cover 6 correspond to each other and are connected by screws.
Based on the above embodiment, when the power amplifier module of this embodiment needs to be integrally installed with an external complete machine system, the power amplifier module is fixed to the external complete machine system by using pan head screws through the installation through holes 9 on the four installation seats 10, and then the outer ends of the first glass insulator 2, the feedthrough capacitor 4 and the second glass insulator 3-2 are respectively welded to the corresponding circuit positions of the PCB of the external complete machine system, so that the integrated installation of the power amplifier module can be easily and conveniently realized, and the high power can be realized in the form of direct waveguide output.
Example two
This embodiment is similar to the embodiment, and its difference lies in, and the connection structure on the carrier 1 is magnet, and each magnet encircles the periphery that distributes at loading box 5 to can inhale fixed connection in outside complete machine system to power amplifier module magnetism through magnet, the quick dismantlement and the installation of being convenient for more.
EXAMPLE III
The embodiment is similar to the embodiment, and the difference is that the connection structure on the carrier 1 is the plug pins, and the plug pins are distributed around four corners of the loading box 5, so that the power amplifier module can be fixedly connected to an external whole system in a plug-in manner through the plug pins, and the quick detachment and installation are facilitated.
Example four
The embodiment is similar to the embodiment, and the difference is that the connecting structure on the carrier 1 is welding pins, and the welding pins are distributed around the periphery of the loading box 5, so that the power amplifier module can be fixedly welded to an external whole system through the welding pins, and the power amplifier module is convenient to rapidly detach and install.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The utility model provides an easily integrated Ka frequency channel power amplifier module, its characterized in that, includes carrier (1), be provided with first glass insulator (2), waveguide structure (3), feedthrough electric capacity (4) and connection structure on carrier (1), be provided with the PCB board that is used for integrated power amplifier chip in carrier (1), first glass insulator (2), waveguide structure (3) and feedthrough electric capacity (4) are followed the outside of carrier (1) is inwards connected respectively the signal input part, the signal output part and the power amplifier chip of PCB board.
2. The Ka frequency band power amplifier module easy to integrate as claimed in claim 1, wherein said carrier (1) comprises a loading box (5), a top cover plate (6) and a side cover plate (7), wherein a mounting groove (5-1) for loading said PCB is formed in said loading box (5), said top cover plate (6) covers said mounting groove (5-1) and is detachably connected to said loading box (5) by screws, said waveguide structure (3) comprises an open slot (3-1) formed in a side surface of said loading box (5), and said side cover plate (7) covers said open slot (3-1) and is detachably connected to said loading box (5) by screws.
3. The easy-to-integrate Ka-band power amplifier module according to claim 2, wherein said connecting structure comprises a plurality of first threaded holes (8), and a plurality of said first threaded holes (8) are disposed at the side of said loading box (5) and close to the signal input end of said PCB.
4. The Ka-band power amplifier module easy to integrate as claimed in claim 2, wherein said connecting structure comprises a plurality of mounting holes (9), and each of said mounting holes (9) is distributed around the periphery of said loading box (5).
5. The Ka-band power amplifier module easy to integrate according to claim 2, wherein said waveguide structure (3) further comprises a second glass insulator (3-2) disposed in said open slot (3-1), said second glass insulator (3-2) and said first glass insulator (2) being separated at opposite sides of said loading box (5) and having the same size.
6. The easy-to-integrate Ka-band power amplifier module according to claim 5, wherein the axis of the second glass insulator (3-2) is perpendicular to the bottom of the open slot (3-1) and is at a distance from the side wall of the open slot (3-1) and from the inner wall of the side cover plate (7).
7. The Ka-band power amplifier module easy to integrate according to claim 1, wherein the number of the feedthrough capacitors (4) is several, and each feedthrough capacitor (4) is used for being connected to each power supply pin of the power amplifier chip on the PCB respectively.
8. The Ka frequency band power amplifier module easy to integrate as claimed in claim 7, wherein the number of the feedthrough capacitors (4) is four, two of the feedthrough capacitors (4) are used for connecting two gates VG of the power amplifier chip on the PCB respectively, and the other two feedthrough capacitors (4) are used for connecting two drains VD of the power amplifier chip on the PCB respectively.
9. The Ka frequency band power amplifier module easy to integrate according to claim 5, wherein the diameters of the first glass insulator (2) and the second glass insulator (3-2) are 0.2 mm-0.8 mm.
10. The Ka-band power amplifier module easy to integrate according to claim 2, wherein the open slot (3-1) of the waveguide structure (3) has the size of a standard waveguide WR 28.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220042145.8U CN216960462U (en) | 2022-01-07 | 2022-01-07 | Ka frequency channel power amplifier module of easily integrateing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220042145.8U CN216960462U (en) | 2022-01-07 | 2022-01-07 | Ka frequency channel power amplifier module of easily integrateing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216960462U true CN216960462U (en) | 2022-07-12 |
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ID=82314112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220042145.8U Active CN216960462U (en) | 2022-01-07 | 2022-01-07 | Ka frequency channel power amplifier module of easily integrateing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216960462U (en) |
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2022
- 2022-01-07 CN CN202220042145.8U patent/CN216960462U/en active Active
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