CN216958849U

CN216958849U - Laser sintering pressure frock

Info

Publication number: CN216958849U
Application number: CN202123100443.2U
Authority: CN
Inventors: 李冲; 叶杨椿; 路哲
Original assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Current assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Priority date: 2021-12-10
Filing date: 2021-12-10
Publication date: 2022-07-12
Anticipated expiration: 2031-12-10

Abstract

The utility model belongs to the technical field of lasers, and discloses a laser sintering pressure tool, which comprises: the sintering limit cover is provided with a plurality of limit holes which can correspond to the connecting seats on the laser base and are used for accommodating the chip modules; the pressing piece limiting block is provided with a plurality of through holes; the pressing sheet is provided with a plurality of pressing sheets, penetrates through the penetrating holes and can be abutted against the chip module. This laser instrument sintering pressure frock through setting up a plurality of spacing holes and a plurality of holes of wearing to establish to cooperate a plurality of preforming, can realize exerting pressure to the chip module through a plurality of preforming simultaneously, thereby make chip module and laser instrument base laminating inseparable, improve production efficiency. In addition, the optional preforming of different weight of using realizes that pressure is adjustable, and the different product demands of adaptation can improve welding quality through setting for suitable pressure, and then promotes product reliability.

Description

Laser sintering pressure tool

Technical Field

The utility model belongs to the technical field of lasers, and particularly relates to a laser sintering pressure tool.

Background

In the manufacturing process of a pumping source of a core device of a semiconductor laser, the connection process of a chip module and a metal base is very important, and the performance and the reliability of the laser are directly determined by the welding quality.

At present, the common connection method is eutectic, and the common connection method is also called chip module sintering in the industry. The main effect of sintering is determined by whether the chip module is sintered at the correct position and whether the chip module is tightly attached to the metal base without a hole, wherein the former can be ensured by a relevant jig, and the latter is always ensured by applying pressure to the chip module in the sintering process.

This pressure is often ensured in the current process in the form of a pin or tablet. However, as the integration level of the laser is higher and higher, a plurality of or dozens of new modules are often integrated in one laser, and the plurality of clamps with the pressing sheets are too cumbersome in the actual operation process, so that the production efficiency is affected.

Therefore, a laser sintering pressure tool is needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a laser sintering pressure tool to solve the problem that production efficiency is affected due to the fact that a plurality of clamps with pressing sheets are complex in the actual operation process in the prior art.

In order to achieve the above object, the present application provides a laser sintering pressure tool, including:

the sintering limiting cover is provided with a plurality of limiting holes which can correspond to the connecting seats on the laser base and are used for accommodating the chip modules;

the pressing piece limiting block is provided with a plurality of through holes;

the pressing sheet is provided with a plurality of groups, each group of pressing sheets has different weights, and the pressing sheet can penetrate through the penetrating holes and is abutted against the chip module.

As an optimal technical scheme of the laser sintering pressure tool, two penetrating holes are formed in the pressing limiting block corresponding to each limiting hole.

As an optimal technical scheme of the laser sintering pressure tool, the laser sintering pressure tool further comprises a positioning piece, a first positioning hole is formed in the laser base, a second positioning hole is formed in the sintering limiting cover, and the positioning piece can penetrate through the second positioning hole and stretch into the first positioning hole.

As a preferred technical scheme of the laser sintering pressure tool, a third positioning hole for the positioning piece to pass through is formed in the pressing limiting block. As a preferred technical scheme of the laser sintering pressure tool,

as an optimal technical scheme of a laser sintering pressure tool, along a first direction, the depth of the limiting hole is gradually increased;

the laser device comprises a laser device base and is characterized in that the laser device base is provided with a plurality of connecting seats, and the connecting seats are arranged in a step shape and gradually decrease along the first direction.

As an optimal technical scheme of a laser sintering pressure tool, the sintering limiting cover is provided with a containing cavity capable of containing a plurality of laser bases, and the limiting holes are communicated with the containing cavity.

As a preferred technical solution of the laser sintering pressure tool, the laser sintering pressure tool further includes a pressing plate limiting cover, the pressing plate limiting cover is connected to the pressing plate limiting block, and the pressing plate limiting cover is configured in the axial direction of the through hole to limit the displacement of the pressing plate.

As an optimal technical scheme of the laser sintering pressure tool, the tabletting limiting cover comprises a limiting plate, and the distance between the limiting plate and the tabletting limiting block is smaller than the length of the tabletting in the axis direction of the through hole.

As a preferred technical scheme of the laser sintering pressure tool, a fastening hole is formed in the laser base, a through hole is formed in the sintering limiting cover, and a fastening piece can penetrate through the through hole and extend into the fastening hole to achieve connection of the laser base and the sintering limiting cover.

Compared with the prior art, the utility model has the following beneficial effects:

this laser instrument sintering pressure frock through setting up a plurality of spacing holes and a plurality of holes of wearing to establish to cooperate a plurality of preforming, can realize exerting pressure to the chip module through a plurality of preforming simultaneously, thereby make chip module and laser instrument base laminating inseparable, improve production efficiency. In addition, the preforming of optional different weight realizes that pressure is adjustable, and the different product demand of adaptation can improve welding quality through setting for suitable pressure, and then promotes product reliability.

Drawings

Fig. 1 is a schematic structural diagram of a laser sintering pressure tool provided in this embodiment;

fig. 2 is a cross-sectional view of a laser sintering pressure tool provided in this embodiment;

fig. 3 is a disassembly schematic view of the laser sintering pressure tool provided in this embodiment.

Wherein:

1. sintering the limit cover; 11. a limiting hole; 12. an accommodating chamber; 13. a second positioning hole;

2. a pressing limiting block; 21. a third positioning hole;

3. tabletting;

4. a positioning member;

5. a tablet pressing limit cover; 51. a limiting plate; 52. a connecting plate;

6. a chip module;

7. a laser base; 71. a connecting seat; 72. a first locating hole.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that are usually placed when the products of the present invention are used, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

As shown in fig. 1 to 3, the present embodiment provides a laser sintering pressure tool, which is mainly used for sintering a laser base 7 and a chip module 6 of a semiconductor laser. The laser sintering pressure tool comprises a sintering limiting cover 1, a pressing piece limiting block 2 and a pressing piece 3. Wherein, be provided with on the spacing cover 1 of sintering can correspond with connecting seat 71 on the laser base 7 and be used for holding a plurality of spacing holes 11 of chip module 6, that is to say be provided with on the spacing cover 1 of sintering can correspond with connecting seat 71 spacing hole 11, and spacing hole 11 is used for holding chip module 6, carries on spacingly to chip module 6 simultaneously. A plurality of through holes are arranged on the tabletting limiting block 2. The preforming 3 is equipped with the multiunit, and the weight of every group preforming 3 is different, and the perforation can be worn to locate by the preforming 3, and supports and press in chip module 6. Each set of the tablets 3 includes a plurality of tablets 3, and the weight of the tablets 3 can be changed by changing the material or the size (thickness, etc.).

It can be understood that through setting up a plurality of spacing holes 11 and a plurality of wear to establish the hole to cooperate a plurality of preforming 3, can realize coming to exert pressure to chip module 6 through a plurality of preforming 3 simultaneously, thereby make chip module 6 and the laminating of laser base 7 inseparable, improve production efficiency. In addition, the optional preforming of different weight of using realizes that pressure is adjustable, and the different product demands of adaptation can improve welding quality through setting for suitable pressure, and then promotes product reliability.

Furthermore, two penetrating holes are arranged on the pressing sheet limiting block 2 corresponding to each limiting hole 11. It can be understood that two pressing sheets 3 are pressed against one chip module 6, so that the stress of the chip module 6 is ensured to be uniform, and the problems of tilting, shifting and the like of the chip module 6 due to nonuniform stress are avoided. Specifically, in this embodiment, the number of the chip modules 6 is nine, and the number of the corresponding pressing sheets is eighteen, but in other embodiments, the number of the chip modules 6 may be set according to actual needs.

Referring to fig. 1 and fig. 3, the laser sintering pressure tool further includes a positioning element 4, a first positioning hole 72 is formed in the laser base 7, a second positioning hole 13 is formed in the sintering limiting cover 1, and the positioning element 4 can penetrate through the second positioning hole 13 and extend into the first positioning hole 72.

Furthermore, a third positioning hole 21 for the positioning element 4 to pass through is formed in the pressing sheet limiting block 2.

Specifically, in the present embodiment, the positioning member 4 is preferably a positioning pin. Through setting up setting element 4 and first locating hole 72, second locating hole 13 and third locating hole 21, can fix a position laser instrument base 7, sintering spacing cover 1 and 2 three of preforming stopper for connecting seat 71, spacing hole 11 and the through-hole can correspond, and the stable pressure is applyed to chip module 6 to the preforming 3 of being convenient for.

Optionally, a fastening hole is formed in the laser base 7, a through hole is formed in the sintering limiting cover 1, and a fastening member (not shown in the figure) can penetrate through the through hole and extend into the fastening hole to connect the laser base 7 and the sintering limiting cover 1. The above-mentioned fastener is preferably the bolt, and the fastening hole is for can with bolt matched with screw hole, so set up the installation and the dismantlement of laser base 7 and sintering spacing cover 1 of being convenient for, be convenient for take off sintering spacing cover 1 after sintering chip module 6 and laser base 7 again.

Referring to fig. 2 and 3, the depth of the stopper hole 11 gradually increases in the first direction. Correspondingly, the laser base 7 is provided with a plurality of connecting seats 71, and the connecting seats 71 are arranged in a step shape and gradually decrease along the first direction. Wherein the first direction is the ba direction in fig. 2. Specifically, in this embodiment, the laser base 7 is provided with nine connecting seats 7, the corresponding limiting holes 11 are provided with nine, and the limiting holes 11 correspond to the connecting seats 7 one to one. Of course, in other embodiments, the number of the limiting holes 11 can be more than nine, so that the sintering limiting cover 1 can be applied to other laser bases 7.

Further, the sintering limiting cover 1 is provided with an accommodating cavity 12 capable of accommodating the laser base 7, and the limiting hole 11 is communicated with the accommodating cavity 12.

Referring to fig. 1 and 3, the laser sintering pressure tool further comprises a pressing plate limiting cover 5, the pressing plate limiting cover 5 is connected to the pressing plate limiting block 2, and the pressing plate limiting cover 5 is used for limiting the displacement of the pressing plate 3 in the west and the west of the axis of the penetrating hole.

Further, the tabletting limiting cover 5 comprises a limiting plate 51, and in the axis direction of the through hole, the distance between the limiting plate 51 and the tabletting limiting block 2 is less than the length of the tabletting 3. So set up, come to carry on spacingly to preforming 3 through limiting plate 51, avoid preforming 3 to deviate from in the through-going hole.

In addition, the tablet limiting cover 5 further comprises a connecting plate 52, and the connecting plate 52 is connected to the limiting plate 51 and connected to the tablet limiting block 2. Specifically, the connecting plate 52 is detachably connected to the tablet limiting block 2, so that the tablet limiting cover 5 can be conveniently disassembled and assembled.

In this embodiment, the pressing sheet 3 is pressed against the chip module 6 by its own weight. That is to say, this laser instrument sintering pressure frock is during operation, and the axis direction of wearing to establish the hole is vertical direction.

The operation of the laser sintering pressure tool will be described in detail below.

First fix a position laser base 7 and spacing cover 1 of sintering through setting element 4, every connecting seat 71 corresponds a spacing hole 11 this moment, place solder and chip module 6 in every spacing hole 11 afterwards, fix a position preforming stopper 2 through setting element 4 and spacing cover 1 of sintering (preforming 3 wears to locate to wear to establish downtheholely or preforming stopper 2 and spacing cover 1 of sintering fix a position the back preforming 3 of packing into this moment), make every preforming 3 support and press in corresponding chip module 6, place this laser sintering pressure frock in the sintering furnace and accomplish the sintering at last.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The utility model provides a laser instrument sintering pressure frock which characterized in that includes:

the sintering limiting cover (1) is provided with a plurality of limiting holes (11) which can correspond to the connecting seats (71) on the laser base (7) and are used for accommodating the chip modules (6);

the pressing piece limiting block (2) is provided with a plurality of through holes;

the pressing sheets (3) are provided with a plurality of groups, each group of pressing sheets (3) is different in weight, and the pressing sheets (3) can penetrate through the penetrating holes and are pressed against the chip modules (6).

2. The laser sintering pressure tool according to claim 1, wherein two through holes are formed in the pressing limiting block (2) corresponding to each limiting hole (11).

3. The laser sintering pressure tool according to claim 1, further comprising a positioning element (4), wherein a first positioning hole (72) is formed in the laser base (7), a second positioning hole (13) is formed in the sintering limiting cover (1), and the positioning element (4) can penetrate through the second positioning hole (13) and extend into the first positioning hole (72).

4. The laser sintering pressure tool according to claim 3, wherein a third positioning hole (21) for the positioning element (4) to pass through is formed in the pressing limiting block (2).

5. The laser sintering pressure tool according to claim 1, characterized in that the depth of the limiting hole (11) is gradually increased along a first direction;

the laser device base (7) is provided with a plurality of connecting seats (71), and the connecting seats (71) are arranged in a step shape and gradually decrease along the first direction.

6. The laser sintering pressure tool according to claim 5, characterized in that the sintering limiting cover (1) is provided with a containing cavity (12) capable of containing a plurality of laser bases (7), and the limiting hole (11) is communicated with the containing cavity (12).

7. The laser sintering pressure tool according to claim 1, further comprising a pressing plate limiting cover (5), wherein the pressing plate limiting cover (5) is connected to the pressing plate limiting block (2), and the pressing plate limiting cover (5) is configured to limit the displacement of the pressing plate (3) in the axial direction of the through hole.

8. The laser sintering pressure tool according to claim 7, wherein the pressing sheet limiting cover (5) comprises a limiting plate (51), and the distance between the limiting plate (51) and the pressing sheet limiting block (2) in the axial direction of the through hole is smaller than the length of the pressing sheet (3).

9. The laser sintering pressure tool according to claim 8, wherein a fastening hole is formed in the laser base (7), a through hole is formed in the sintering limiting cover (1), and a fastening piece can penetrate through the through hole and extend into the fastening hole to achieve connection of the laser base (7) and the sintering limiting cover (1).