CN216958480U - Packaged antenna, radio device and radar sensor - Google Patents

Abstract

The application discloses a packaged antenna, a radio device and a radar sensor. The packaged antenna comprises a chip and a Substrate Integrated Waveguide (SIW) slot antenna; the redistribution layer on the chip and the metal layer of the printed circuit board form the upper wall and the lower wall of the SIW slot antenna, a metal connecting structure for connecting the redistribution layer and the metal layer is used as a metal side wall of the SIW slot antenna, a slot is formed in the redistribution layer, and an air medium is arranged between the redistribution layer and the metal layer; the redistribution layer is used for feeding power to the slot, and the metal layer is used for being connected with the grounding end of the bare chip included by the chip. This encapsulation antenna directly utilizes metal connection structure as the metal lateral wall of slot antenna, has reduced the mechanical manufacturing process of processing copper post, simultaneously, has widened the bandwidth of encapsulation antenna, has improved the gain of encapsulation antenna.

Description

Packaged antenna, radio device and radar sensor

Technical Field

The embodiment of the application relates to the technical field of millimeter wave radar antennas, in particular to a packaged antenna, a radio device and a radar sensor.

Background

With the development of millimeter wave communication technology, a package antenna technology for integrating an antenna into a chip has been developed. Packaged antennas are widely used due to their advantages of small size, low cost, low loss, high integration level, etc. Meanwhile, the design of the packaged antenna is a key factor affecting the performance of the whole system.

The traditional packaged antenna forms mainly include dipole antennas, microstrip antennas, diamond antennas, folded dipole antennas and the like, but the traditional packaged antenna structures have the defects of narrow bandwidth, low gain and the like. An Embedded Wafer Level Ball Grid Array (EWLB) is one of the most advanced packaging technologies at present, has smaller and thinner packaging, good electrical performance and lower parasitic parameters, and is suitable for high-frequency millimeter wave application. In order to fully exert the advantages of an EWLB package structure, a Substrate Integrated Waveguide (SIW) slot structure is added to the EWLB package structure in the conventional packaged antenna scheme, but the difference between the bandwidth and the gain performance of a SIW slot antenna designed by using the structure and a conventional packaged antenna unit is not large, and the defects of narrow band, low gain and the like exist.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a packaged antenna, a radio device and a radar sensor, so that the bandwidth and the gain of the packaged antenna are improved.

In a first aspect, an embodiment of the present application provides a packaged antenna, including:

the packaged antenna comprises a chip and a Substrate Integrated Waveguide (SIW) slot antenna; the redistribution layer on the chip and the metal layer of the printed circuit board form the upper wall and the lower wall of the SIW slot antenna, a metal connecting structure connecting the redistribution layer and the metal layer is used as a metal side wall of the SIW slot antenna, a slot is formed in the redistribution layer, and an air medium is arranged between the redistribution layer and the metal layer;

wherein the redistribution layer feeds the slot, and the metal layer is used for being connected with a ground terminal of a bare chip included in the chip.

Optionally, the chip includes a bare chip, a plastic mold for encapsulating the bare chip, and the redistribution layer, the metal layer is disposed on one side of the printed circuit board facing the plastic mold, the redistribution layer is disposed on one side of the plastic mold facing the printed circuit board, the metal connection structure is configured to couple the redistribution layer and the radiation end of the bare chip, the metal connection structure includes solder balls for connecting first solder joints and second solder joints, the number of the first solder joints and the second solder joints is multiple, the first solder joints are solder joints on the chip connected to the level end of the bare chip, and the second solder joints are located on the metal layer.

Optionally, the slot and the projection of the bare chip on the redistribution layer are not coincident.

Optionally, the slot is rectangular.

Optionally, the length and the width of the slot are determined according to a waveguide wavelength corresponding to the center frequency of the SIW slot antenna.

Optionally, the metal connection structures are solder balls, the number of the solder balls is multiple, each solder ball is arranged to form a first connection structure, a second connection structure and a third connection structure, a straight line where the first connection structure is located is parallel to a straight line where the second connection structure is located, two end points of a line segment formed by the third connection structure are respectively connected with end points of the first connection structure and the second connection structure, and a straight line where the third connection structure is located is perpendicular to the straight line where the first connection structure is located.

Optionally, a ratio of a distance between the solder balls to a diameter of the solder balls is smaller than a first set threshold, a ratio of the diameter of the solder balls to a target distance is smaller than a second set threshold, and the target distance is a distance between the first connection structure and the second connection structure.

Optionally, the length of a line segment formed from the center of the slot to the third connection structure is determined according to a waveguide wavelength corresponding to the center frequency of the SIW slot antenna.

In a second aspect, embodiments of the present application further provide a radio device, including:

the packaging structure comprises a rewiring layer provided with a slot, wherein the rewiring layer is used for feeding electricity to the slot;

a die packaged in the package structure and having a radiating end coupled to the redistribution layer;

a printed circuit board comprising a metal layer; wherein the metal layer is used for connecting with the grounding terminal of the bare chip; the redistribution layer and the metal layer form an upper wall and a lower wall of the SIW slot antenna;

and a metal connection structure connecting the redistribution layer and the metal layer to serve as a metal sidewall of the SIW slot antenna.

Optionally, the bare chip is packaged in a package structure to form a chip, the chip includes a bare chip, a plastic mold for packaging the bare chip, and the redistribution layer, the printed circuit board is provided with the metal layer toward one side of the plastic mold, the plastic mold is provided with the redistribution layer toward one side of the printed circuit board, the metal connection structure is used for coupling the redistribution layer and the radiation end of the bare chip, the metal connection structure includes solder balls for connecting a first solder joint and a second solder joint, the number of the first solder joint and the second solder joint is multiple, the first solder joint is a solder joint on the chip connected with the level end of the bare chip, and the second solder joint is located on the metal layer.

In a third aspect, an embodiment of the present application further provides a radar sensor, including:

the radio device of the second aspect;

the radio is used for target detection and/or communication to provide reference information for operation of the radar sensor.

The embodiment of the application provides a packaged antenna, a radio device and a radar sensor, wherein the packaged antenna comprises a chip and a Substrate Integrated Waveguide (SIW) slot antenna; the redistribution layer on the chip and the metal layer of the printed circuit board form the upper wall and the lower wall of the SIW slot antenna, a metal connecting structure connecting the redistribution layer and the metal layer is used as a metal side wall of the SIW slot antenna, a slot is formed in the redistribution layer, and an air medium is arranged between the redistribution layer and the metal layer; the redistribution layer is used for feeding power to the slot, and the metal layer is used for being connected with a grounding end of a bare chip included by the chip. By utilizing the technical scheme, the metal connecting structure is directly used as the metal side wall of the slot antenna, the mechanical process of processing the copper column is reduced, meanwhile, the bandwidth of the packaged antenna is widened, and the gain of the packaged antenna is improved.

Drawings

Fig. 1 is a side view of a packaged antenna according to an embodiment of the present disclosure;

FIG. 2 is a side view of another packaged antenna configuration;

fig. 3 is a top view of a conventional packaged antenna structure;

fig. 4 is a top view of a packaged antenna according to an embodiment of the present application;

FIG. 5 is a comparison graph of return loss coefficients provided in accordance with an embodiment of the present application;

FIG. 6 is a comparison graph of E-plane patterns provided in accordance with one embodiment of the present application;

FIG. 7 is a graph comparing gain values within a bandwidth range according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a radio device according to the second embodiment of the present application;

fig. 9 is a schematic structural diagram of a radar sensor according to a third embodiment of the present application.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures.

Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like. In addition, the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

The term "include" and its variants, as used herein, are intended to be inclusive in an open-ended manner, i.e., "including but not limited to". The term "based on" is "based, at least in part, on". The term "one embodiment" means "at least one embodiment".

It should be noted that the terms "first", "second", etc. mentioned in the present application are only used for distinguishing the corresponding contents, and are not used for limiting the order or interdependence relationship.

It is noted that references to "a", "an", and "the" modifications in this application are intended to be illustrative rather than limiting, and that those skilled in the art will recognize that reference to "one or more" unless the context clearly dictates otherwise.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, and thus, should not be construed as limiting the present application. In addition, the technical features mentioned in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.

Example one

Fig. 1 is a side view of a packaged antenna structure provided in an embodiment of the present application, which may be applied to a case of performing communication based on a millimeter wave packaged antenna, where the packaged antenna is included in a radio device, where the radio device is generally integrated on a radar sensor, and in this embodiment, the radar sensor includes, but is not limited to: millimeter wave radar sensors, and the like.

It should be noted that, compared to a Fan-in Wafer Level (WLP) package, the EWLB as a Fan-out WLP package has more Integrated Circuit (IC) signal output pins, has smaller and thinner package, good electrical performance, and lower parasitic parameters, and is suitable for high-frequency millimeter wave applications. In general, in the SIW, a metal pillar is used as a metal sidewall of the SIW, metal plates on both upper and lower surfaces of a substrate are used as upper and lower walls, and a slot is formed in the upper wall of the SIW to cut a surface current, thereby forming an SIW slot antenna, which can radiate energy to a space.

In order to realize a SIW gap structure in an EWLB package structure, in the conventional package antenna scheme, a copper pillar is used as a SIW side wall, a plastic film (MC) layer is used as a dielectric layer, redistribution layers (RDLs) on the upper side and the lower side of the MC layer are used as an upper wall and a lower wall, and a gap is formed in the redistribution layer on the upper side. Fig. 2 is a side view of another structure of a package antenna, as shown in fig. 2, the package antenna includes a die 9, solder balls 10, redistribution layers (RDLs) 11 and 12, a plastic film 13, copper pillars 14, a metal layer 15, and a Printed Circuit Board (PCB) 16. RDLs 11 and 12 are used to connect supply voltage, ground and control signals and may also be used to form the antenna elements. Fig. 3 is a top view of a conventional packaged antenna, and as shown in fig. 3, the packaged antenna includes a plurality of copper pillars 14, and a slot 17 is formed on a redistribution layer 11.

Based on the above, the application provides a design of a package antenna, which directly utilizes the solder ball of the EWLB package structure as a side wall, thereby reducing the mechanical process of processing the copper column; meanwhile, the air layer is used as the medium layer, so that the bandwidth and the gain of the SIW slot antenna are improved, and the packaged antenna radiation unit with simple structure and high bandwidth gain is realized.

As shown in fig. 1, a packaged antenna provided in an embodiment of the present application includes a chip 1 and a substrate integrated waveguide SIW slot antenna 2; the redistribution layer 3 on the chip 1 and the metal layer 5 of the printed circuit board 4 form the upper and lower walls of the SIW slot antenna 2, a metal connecting structure 6 connecting the redistribution layer 3 and the metal layer 5 is used as a metal side wall of the SIW slot antenna 2, a slot is arranged on the redistribution layer 3, and an air medium is arranged between the redistribution layer 3 and the metal layer 5; wherein, the rewiring layer 3 is used for feeding power to the slot, and the metal layer 5 is used for connecting with the ground terminal of the bare chip 7 included in the chip 1.

In this embodiment, the chip 1 includes a bare chip 7, a plastic mold 8 for packaging the bare chip 7, and a redistribution layer 3, a metal layer 5 is disposed on a side of the printed circuit board 4 facing the plastic mold 8, the redistribution layer 3 is disposed on a side of the plastic mold 8 facing the printed circuit board 4, the metal connection structure 6 is configured to couple the redistribution layer 3 and a radiation end of the bare chip 7, the metal connection structure 6 includes a plurality of solder balls for connecting a first solder joint and a second solder joint, the first solder joint is a solder joint on the chip 1 connected to a level end of the bare chip 7, and the second solder joint is located on the metal layer 5.

The chip 1 may be regarded as a general term of a semiconductor element, and the die 7 may be regarded as a bare semiconductor element, mainly in a wafer form or a single chip form, wherein the die 7 includes a plurality of ports, such as a radiation port, a level port, a ground port, and the like. The radiation terminal is a port for radiating electromagnetic waves, and the level terminal (also called a data signal terminal) is a port for transmitting electrical signals. The ground terminal is a port for connecting to ground.

The plastic mold 8 is a mold made of plastic and used for encapsulating the silicon wafer 7.

The redistribution layer 3 can be understood as a radiation layer structure with slot slots for feeding power to the slot slots. The redistribution layer 3 may be coupled to a port of the signal transceiver in the die 7 by a microstrip line, a coaxial line, or the like. The redistribution layer 3 may be located above the metal layer 5 and the dielectric layer and form a corresponding metal wiring pattern, and the redistribution layer 3 may perform redistribution on the ports of the chip 1, and distribute the ports of the chip 1 to a new area with looser pitch occupation. In addition, a slit groove is provided on the rewiring layer 3, wherein the shape of the slit groove is rectangular as an example; the slot notch is located at a position on the redistribution layer 3 where the projection of the die 7 on the redistribution layer 3 does not coincide. The length and width of the slot are determined according to the waveguide wavelength corresponding to the center frequency of the SIW slot antenna 2.

Fig. 4 is a top view of a package antenna according to an embodiment of the present application, and as shown in fig. 4, the package antenna includes a plurality of metal connection structures 6, and a slot 18 is disposed on the redistribution layer 3. Referring to fig. 4, the length of the slot 18 may be denoted as L, the width of the slot 18 may be denoted as W, and the waveguide wavelength corresponding to the center frequency of the SIW slot antenna 2 may be denoted as λ, alternatively, the length of the slot 18 may be determined according to the formula L ═ λ/2, and the width of the slot 18 may be determined according to the formula W < λ.

The printed circuit board 4 is provided with a metal layer 5 on the side facing the plastic mould 8. In this embodiment, the metal layer 5 may be considered as a reference ground structure for connecting with the ground of the die 7 included in the chip 1. The thickness and material of the metal layer 5 are not limited, and this embodiment does not expand the above.

The metal connection structure 6 can be understood as a metal pillar for forming a sidewall of the SIW, and forms a SIW feeding structure with the redistribution layer 3 and the metal layer 5. The redistribution layer 3 is provided with transmission structures such as microstrip lines and coplanar waveguides, so that the bare chip 7 can be connected with the SIW feed structure. The metal connection structure 6 may comprise a plurality of solder structures arranged around the slit slot 18, which may be used to fix the package structure to the printed circuit board 4, between the radiation layer structure and the reference ground structure, i.e. between the redistribution layer 3 and the metal layer 5, wherein a portion of the solder structures may comprise solder balls connecting the first pads and the second pads, but not solder balls connecting the rf terminals.

In this embodiment, the shape and material of the metal connection structures 6 are not limited, and the number of the metal connection structures 6 may be multiple, for example, the size of each metal connection structure 6 may be the same or different; the metal connection structures 6 may be arranged according to a certain rule, for example, according to a specific number shape, or may be arranged arbitrarily, which is not limited in this embodiment.

Specifically, the metal connection structure 6 is configured to couple the redistribution layer 3 and the radiation end of the die 7, and the metal connection structure 6 may include a solder ball for connecting a first solder joint and a second solder joint, where the number of the first solder joint and the second solder joint may be multiple, where the first solder joint may be understood as a solder joint on the chip 1 connected to a level end of the die 7, and the second solder joint may be understood as a solder joint on the metal layer 5 connected to the solder ball.

Optionally, the metal connection structures 6 are solder balls, the number of the solder balls is multiple, each solder ball is arranged to form a first connection structure, a second connection structure and a third connection structure, a straight line where the first connection structure is located is parallel to a straight line where the second connection structure is located, two end points of a line segment formed by the third connection structure are respectively connected with end points of the first connection structure and the second connection structure, and a straight line where the third connection structure is located is perpendicular to the straight line where the first connection structure is located.

As shown in fig. 4, the first connection structure may be a structure formed by arranging a left row of solder balls, the second connection structure may be a structure formed by arranging a right row of solder balls, the third connection structure may be a structure formed by arranging a middle row of solder balls, and the first, second, and third connection structures are only used to help understanding the arrangement of the connection structures, for example, a straight line where the first connection structure is located may be parallel to a straight line where the second connection structure is located, two end points of a line segment formed by the third connection structure may be connected to end points of the first and second connection structures, and a straight line where the third connection structure is located may be perpendicular to a straight line where the first connection structure is located.

In addition, the pitch of the solder balls is not limited in this embodiment, as long as the redistribution layer 3 and the radiation end of the die 7 can be coupled. For example, the pitch of the solder balls may be equal to the diameter of the solder balls, or the pitch of the solder balls may be smaller than the diameter of the solder balls, etc.

In one embodiment, a ratio of a pitch between the solder balls to a diameter of the solder balls is smaller than a first set threshold, a ratio of the diameter of the solder balls to a target pitch is smaller than a second set threshold, and the target pitch is a pitch between the first connection structure and the second connection structure.

In this embodiment, the first threshold may be a threshold of a ratio of a pitch between solder balls to a diameter of the solder balls, the second threshold may be a threshold of a ratio of a diameter of the solder balls to a target pitch, the target pitch is a pitch between the first connecting structure and the second connecting structure, wherein, the first setting threshold and the second setting threshold are only used for distinguishing different objects, and the first setting threshold and the second setting threshold can be set by related personnel, the first setting threshold can be selected to be 2 in the embodiment, and the second setting threshold is 0.2, for example, see fig. 4, the distance between the solder balls can be recorded as p, the diameter of the solder balls as d, and the target distance as a, so that the relationship between the distance between the solder balls and the diameter of the solder balls can be determined by the formula p/d < 2, and the relationship between the diameter of the solder balls and the target distance can be determined by the formula d/a < 0.2.

In one embodiment, the length of a line segment formed from the center of the slot to the third connecting structure is determined according to a waveguide wavelength corresponding to the center frequency of the SIW slot antenna.

As shown in fig. 4, the length of the line segment formed by the center of the slot 18 and the third connection structure may refer to the distance from the center of the slot 18 to the SIW short-circuit edge, which is denoted as S. Alternatively, the length of the line segment formed by the center of the slit groove 18 and the third connecting structure is determined according to the formula S ═ λ/4.

As can be seen from the above description, in the embodiment of the present application, the metal connection structure of the package structure is directly used as the sidewall, so that the mechanical process for processing the copper pillar is reduced; meanwhile, the air layer is used as the medium layer of the SIW slot antenna, and the air layer has low dielectric constant and lower loss factor, so that the bandwidth of the packaged antenna is widened, and the gain of the packaged antenna is improved.

In the following, from two aspects of bandwidth and gain, the conventional package antenna using the copper pillar as the SIW sidewall structure is compared with the package antenna of the present application using the solder ball as the SIW sidewall structure.

Fig. 5 is a comparison graph of return loss coefficients provided in an embodiment of the present application, and as shown in fig. 5, the frequency that can be covered by the conventional packaged antenna when the return loss coefficient is-10 dB is 75.8 to 78GHz, while the frequency that can be covered by the packaged antenna of the present application when the return loss coefficient is-10 dB is 70 to 84GHz, it can be found by comparison that the impedance bandwidth of the packaged antenna provided by the present application is widened by 11.8GHz, so that the bandwidth performance is improved.

Fig. 6 is a comparison graph of an E-plane directional diagram provided in the first embodiment of the present application, and as shown in fig. 6, the gain of the packaged antenna provided in the present application is about 2.5dB higher than that of the packaged antenna in the prior art at each angle in the E-plane direction.

Fig. 7 is a comparison graph of gain values within a bandwidth range according to an embodiment of the present invention, and as shown in fig. 7, it shows that the gain of the slot antenna using the solder ball as the SIW sidewall structure is higher than that of the slot antenna using the copper pillar as the SIW sidewall structure within a frequency range, where the gain is 2dB higher at the lowest and 8dB higher at the highest, when the conventional packaged antenna and the packaged antenna provided by the present invention are within a frequency range of 70 to 84GHz and the gain varies with the frequency. Therefore, the gain performance of the packaged antenna is greatly improved.

Example two

Similarly to the first embodiment, please refer to fig. 8, and fig. 8 is a schematic structural diagram of a radio device provided in the second embodiment of the present application, where the radio device includes a package structure 19, and the package structure 19 includes a redistribution layer provided with a slot, where the redistribution layer is used for feeding power to the slot; a die 20 packaged in the package structure 19 and having its radiating end coupled to the redistribution layer; a printed circuit board 21 including a metal layer; wherein the metal layer is used for connecting with the ground terminal of the bare chip 20; the redistribution layer and the metal layer form an upper wall and a lower wall of the SIW slot antenna; and a metal connection structure 22 connecting the redistribution layer and the metal layer to serve as a metal sidewall of the SIW slot antenna.

In this embodiment, the position relationship among the package structure 19, the printed circuit board 21, and the metal connection structure 22 is not limited, for example, the package structure 19 may be located above the metal connection structure 22, the printed circuit board 21 is located below the metal connection structure 22, and the metal connection structure 22 is used for connecting the package structure 19 and the printed circuit board 21.

Optionally, the bare chip 20 is packaged in the package structure 19 to form a chip, the chip includes the bare chip 20, a plastic mold for packaging the bare chip 20, and the redistribution layer, the printed circuit board 21 is provided with the metal layer toward one side of the plastic mold, the plastic mold is provided with the redistribution layer toward one side of the printed circuit board 21, the metal connection structure 22 is used for coupling the redistribution layer and the radiation end of the bare chip 20, the metal connection structure 22 includes solder balls for connecting a first solder joint and a second solder joint, the number of the first solder joint and the second solder joint is multiple, the first solder joint is a solder joint connected with a level end of the bare chip 20 on the chip, and the second solder joint is located on the metal layer.

Optionally, the slot notch and the projection of the die 20 on the redistribution layer do not coincide.

Optionally, the slot is rectangular.

Optionally, the length and the width of the slot are determined according to a waveguide wavelength corresponding to the center frequency of the SIW slot antenna.

Optionally, the metal connection structures 22 are solder balls, the number of the solder balls is multiple, each solder ball is arranged to form a first connection structure, a second connection structure and a third connection structure, a straight line where the first connection structure is located is parallel to a straight line where the second connection structure is located, two end points of a line segment formed by the third connection structure are respectively connected with end points of the first connection structure and the second connection structure, and a straight line where the third connection structure is located is perpendicular to the straight line where the first connection structure is located.

Optionally, a ratio of a distance between the solder balls to a diameter of the solder balls is smaller than a first set threshold, a ratio of the diameter of the solder balls to a target distance is smaller than a second set threshold, and the target distance is a distance between the first connection structure and the second connection structure.

Optionally, the length of a line segment formed from the center of the slot to the third connection structure is determined according to a waveguide wavelength corresponding to the center frequency of the SIW slot antenna.

In some implementations, the radio device includes a chip as described above, and peripheral circuitry disposed on the printed circuit board 21. The radio device transmits a probe signal wave by using the antenna in the embodiment of the present application, and receives an echo signal wave formed by reflecting the probe signal wave by a surrounding object. The radio device also measures a physical quantity between it and an object in the surrounding environment using the probe signal wave and the echo signal. Wherein, the physical quantity includes at least one of measuring relative speed, relative angle, relative distance, and measuring three-dimensional profile of the object.

Here, the radio device further comprises a signal transceiver integrated in a chip; and may even contain a signal processor. Wherein the signal transceiver comprises a signal transmitter and a signal receiver. Here, the package antenna provided in the embodiment of the present application may be arranged on the redistribution layer of the package structure 19 in the form of an antenna array, and the signal transceiver and the signal processor may determine the circuit structure according to the ambient environment measured by the radio device, so as to send out the probe signal wave and receive the echo signal wave at a preset frequency band or at a fixed frequency, and perform signal processing on the corresponding varying electrical signal.

The signal transmitter is used for transmitting a radio-frequency transmitting electric signal to a transmitting antenna in the antenna array so as to radiate a detection signal wave. Specifically, the signal transmitter frequency modulates/phase modulates the reference electrical signal provided by the signal source into a transmission electrical signal in a radio frequency band, and outputs the transmission electrical signal to the transmitting antenna. For example, the signal transmitter modulates the probing electrical signal to a radio frequency and feeds the transmitting antenna so that the transmitting antenna generates a probing signal wave having a center frequency in a frequency band such as 64GHz, or 77 GHz. The signal transmitter can generate a probe signal wave with a fixed center frequency or a probe signal wave swept by the center frequency and a preset bandwidth. Taking the example that the detection signal wave comprises at least one chirp signal, wherein the chirp signal is an electromagnetic wave signal formed based on a chirp period, and the signal transmitter performs frequency multiplication processing based on a signal source of the chirp period and feeds the signal to a transmitting antenna so as to transmit the detection signal wave containing the chirp signal. When the probe signal wave is reflected by the object, an echo signal wave is formed. The receiving antenna receives the echo signal wave to generate an echo electric signal.

The signal receiver is configured to demodulate, filter, and the like an echo electric signal output from a receiving antenna in the antenna array using a transmission electric signal that generates a probe signal wave, so as to output a baseband digital signal.

The signal processor is connected with the signal transceiver and used for extracting and outputting the measurement data from the baseband digital signal through signal processing. The signal processing comprises the step of carrying out digital signal processing calculation such as phase, frequency, time domain and the like on at least one path of signals to be processed provided by at least one path of receiving antenna. The measurement data includes at least one of: distance data representing a relative distance of the detected at least one object; velocity data representing a relative velocity of the detected at least one object; angle data indicative of the relative angle of the detected at least one object, and the like.

In still other implementations, the radio device utilizes the antenna provided in embodiments of the present application to transmit radio signals for data interaction. For example, the radio device includes an encoder, a signal modulator, a signal transmitter, a signal receiver, a signal demodulator, a signal decoder, and the like. The encoder encodes data to be transmitted to other terminal devices or relay devices, such as at least one of pictures, characters, voice, video and the like, according to a transmission protocol. The signal modulator modulates the encoded signal. The signal transmitter amplifies the modulated signal and transmits it through an antenna. The signal receiver receives a signal carrying data to be extracted sent by external equipment through the antenna. The signal demodulator receives the signal from the signal receiver and demodulates the signal to be decoded. The signal decoder decodes the signal output from the signal demodulator using a transmission protocol, thereby obtaining data for communication with an external device.

EXAMPLE III

Third embodiment of the present application provides a radar sensor, fig. 9 is a schematic structural diagram of a radar sensor provided in third embodiment of the present application, refer to fig. 9, and the radar sensor includes: the radio device 23 as described in embodiment two; the radio device 23 is used for target detection and/or communication to provide reference information for the operation of the radar sensor. The reference information may be information required by the radar sensor in target detection and/or communication. For example, the reference information includes the above measurement data for the radar sensor to predict whether a safety interval is provided between the surrounding object and the radar sensor. As another example, the reference information includes instruction information received via communication for the radar sensor to start, pause, etc. according to the received instruction information.

The radio device 23 may be the radio device described in the second embodiment of the present application, and the structure and the operation principle of the radio device 23 have been described in detail in the above embodiments, which are not described herein again.

It should be noted that the radio device 23 can implement functions such as target detection and/or communication by transmitting and receiving radio signals to provide detected target information and/or communication information to the radar sensor, thereby assisting and even controlling the operation of the radar sensor.

It is to be noted that the foregoing is only illustrative of the presently preferred embodiments and application of the principles of the present invention. It will be understood by those skilled in the art that the present application is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the application. Therefore, although the present application has been described in more detail with reference to the above embodiments, the present application is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims (11)

1. A packaged antenna, comprising a chip and a Substrate Integrated Waveguide (SIW) slot antenna; the redistribution layer on the chip and the metal layer of the printed circuit board form the upper wall and the lower wall of the SIW slot antenna, a metal connecting structure connecting the redistribution layer and the metal layer is used as a metal side wall of the SIW slot antenna, a slot is formed in the redistribution layer, and an air medium is arranged between the redistribution layer and the metal layer;

the redistribution layer is used for feeding power to the slot, and the metal layer is used for being connected with a grounding end of a bare chip included by the chip.

2. The packaged antenna according to claim 1, wherein the chip comprises a bare chip, a plastic mold for packaging the bare chip, and the redistribution layer, the printed circuit board is provided with the metal layer on a side facing the plastic mold, the plastic mold is provided with the redistribution layer on a side facing the printed circuit board, the metal connection structure is configured to couple the redistribution layer and the radiation end of the bare chip, the metal connection structure comprises a plurality of solder balls for connecting a first solder joint and a second solder joint, the first solder joint is a solder joint connected with a level end of the bare chip on the chip, and the second solder joint is located on the metal layer.

3. The packaged antenna of claim 2, wherein the slot and the projection of the die on the redistribution layer are not coincident.

4. The packaged antenna of claim 1, wherein the slot is rectangular.

5. The packaged antenna of claim 4, wherein the length and width of the slot are determined according to a waveguide wavelength corresponding to a center frequency of the SIW slot antenna.

6. The packaged antenna of claim 1, wherein the metal connection structures are solder balls, the number of the solder balls is plural, each solder ball is arranged to form a first connection structure, a second connection structure and a third connection structure, a straight line of the first connection structure is parallel to a straight line of the second connection structure, two end points of a line segment formed by the third connection structure are respectively connected to end points of the first connection structure and the second connection structure, and a straight line of the third connection structure is perpendicular to the straight line of the first connection structure.

7. The package antenna of claim 6, wherein a ratio of a pitch between the solder balls to a diameter of the solder balls is smaller than a first predetermined threshold, a ratio of the diameter of the solder balls to a target pitch is smaller than a second predetermined threshold, and the target pitch is a pitch between the first connecting structure and the second connecting structure.

8. The packaged antenna of claim 6, wherein the length of the line segment formed by the center of the slot to the third connection structure is determined according to the waveguide wavelength corresponding to the center frequency of the SIW slot antenna.

9. A radio device, comprising:

the packaging structure comprises a rewiring layer provided with a slot, wherein the rewiring layer is used for feeding electricity to the slot;

a bare chip packaged in the packaging structure, wherein the radiation end of the bare chip is coupled to the redistribution layer;

a printed circuit board comprising a metal layer; wherein the metal layer is used for connecting with the grounding terminal of the bare chip; the redistribution layer and the metal layer form an upper wall and a lower wall of the SIW slot antenna;

and the metal connecting structure is used for connecting the redistribution layer and the metal layer to be used as a metal side wall of the SIW slot antenna.

10. The radio device of claim 9,

the bare chip package forms the chip in packaging structure, the chip includes bare chip, encapsulation the plastic mold of bare chip and rewiring layer, printed circuit board orientation plastic mold one side is provided with the metal level, the plastic mold orientation printed circuit board one side is provided with rewiring layer, metal connection structure is used for coupling rewiring layer with the radiating end of bare chip, metal connection structure is including the solder ball that is used for connecting first solder joint and second solder joint, first solder joint with the number of second solder joint is a plurality of, first solder joint on the chip with the solder joint of the level end connection of bare chip, the second solder joint is located on the metal level.

11. A radar sensor, comprising:

the radio device of claim 9;

the radio is used for target detection and/or communication to provide reference information for operation of the radar sensor.

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