CN216957978U

CN216957978U - Wafer turnover box

Info

Publication number: CN216957978U
Application number: CN202123021168.5U
Authority: CN
Inventors: 张俊杰
Original assignee: Shanghai Crystal Silicon Material Co ltd
Current assignee: Shanghai Crystal Silicon Material Co ltd
Priority date: 2021-12-03
Filing date: 2021-12-03
Publication date: 2022-07-12
Anticipated expiration: 2031-12-03

Abstract

The utility model relates to a wafer turnover box which comprises an upper cover and a lower cover, wherein the top surface in the upper cover is a smooth surface, the bottom surface in the lower cover is provided with a fixing groove for fixing a supporting leg of a wafer frame, and after the upper cover and the lower cover are closed, the distance between the top surface and the bottom surface is larger than the diameter of a wafer so as to form a space between the top surface and the placed wafer. The wafer turnover box is specially designed for wafer turnover in the production process, and compared with the clamping type design of a universal wafer box, the wafer turnover box can stably place a rack, and wafers are not clamped with the top surface in the upper cover any more when placed in the wafer turnover box, but a certain interval is formed, so that the wafers are prevented from being damaged due to the turnover of the wafers in the production process.

Description

Wafer turnover box

Technical Field

The utility model relates to a wafer turnover box.

Background

In the prior art, the universal wafer box with the same structure is adopted no matter in the wafer production and transfer process or after the production is finished. Although the general wafer box can meet the basic requirements of wafer bearing, the states of wafers are different and the requirements on the wafer box are different due to the fact that the wafers are transferred in the production process and stored and collected after the production is finished. The wafer box for transporting in production needs to be continuously taken out and put in wafers, the clamping grooves for fixing the wafers in the general wafer box are easily worn and easily generate the problem of dust collection, in the transporting process, the wafer frame for transporting cannot be put in the general wafer box, the wafer box is carried, the wafers need to be moved to other wafer frames from the transported wafer frame and then put in the wafer box, and the wafer box is quite inconvenient, and all the problems are caused along with the wafer damage.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to solve the problems that the conventional universal wafer box cannot be well adapted to wafer transfer in the production process and is easy to damage wafers in the production process.

In order to achieve the above object, the present invention provides a wafer transferring cassette, comprising an upper cover and a lower cover,

the top surface in the upper cover is a smooth surface,

the bottom surface in the lower cover is provided with a fixing groove for fixing the supporting leg of the sheet frame,

the top surface in the upper cover is set as follows: after the upper cover and the lower cover are covered, the top surface and the top of the placed wafer are arranged at intervals.

In some embodiments of the utility model, the lower cover has concave parts at two sides, the lower cover has an upper concave part at the center of the bottom, and the concave parts at two sides and the upper concave part at the center are spaced to form fixing grooves.

The wafer turnover box is specially designed for wafer turnover in the production process, and compared with the clamping type design of a universal wafer box, the wafer turnover box can stably place a rack, and wafers are not clamped with the top surface in the upper cover any more when placed in the wafer turnover box, but a certain interval is formed, so that the wafers are prevented from being damaged due to the turnover of the wafers in the production process.

Drawings

Fig. 1 is a schematic diagram of a wafer transfer cassette loaded with a wafer rack.

Fig. 2 is a schematic view of a wafer transfer cassette loading a wafer and a cassette.

Fig. 3 is a plan view of the lower cover.

In the figure: 100. top cover, 200, bottom cover, 300, wafer holder, 400, top surface (in top cover), 210, fixing groove, 220, inner concave portion, 310, wafer holder support leg, d, space.

Detailed Description

In a related embodiment, a general wafer cassette includes an upper cover and a lower cover, and after a cassette in which wafers are placed is placed in the lower cover, the upper cover is covered on the lower cover to complete storage of the wafers. In order to solve the above problems, the present invention provides a wafer turnover box with an improved structure, in which a top surface 110 in an upper cover 100 is a smooth surface, a bottom surface in a lower cover 200 is provided with a fixing groove 210 for fixing a support leg 310 of a wafer rack, and the top surface 110 in the upper cover is configured to: when the upper and

lower covers

100 and 200 are closed, the top surface 110 is spaced apart from the top of the wafer 400. The upper cover 100 and the lower cover 200 are snap-coupled.

The wafer rack for loading the wafer is the existing wafer rack, and the structure of the wafer rack can refer to fig. 2, besides the basket structure for loading the wafer vertically, the wafer rack supporting feet 310 for helping the wafer stand are arranged at the bottom of the wafer rack. When transferring the wafer, the wafer 400 to be transferred is vertically inserted into the basket structure of the wafer rack 300, the support legs 310 of the wafer rack are inserted into the corresponding fixing slots 210 at the bottom of the lower cover, and then the upper cover 100 is closed. The fixing groove 210 of the lower cap may be formed by forming the inner recesses 220 inwardly from both sides and the upper recess 230 from the center of the bottom when the lower cap is manufactured, and forming the fixing groove 230 at a space between the two inner recesses 220 and the middle upper recess 230. The spacing d between the top surface 110 of the upper lid 100 and the top of the wafer can be achieved by increasing the distance from the top surface 110 to the opening of the upper lid according to the size of the wafer to be loaded when the upper lid is manufactured. The manufacturing process of the upper cover and the lower cover is a conventional process, such as injection molding.

When the wafer turnover box is used, the support leg 310 of the wafer frame can be inserted into the fixing groove 210 of the lower cover 200 for fixing, and the top surface 110 in the upper cover 110 is spaced from the wafer by a distance d, so that the wafer is not damaged in the transferring process, the problem of dust deposition is less generated on the smooth top surface 110, and the wafer turnover box is more suitable for transferring in the production process.

The embodiments of the present invention are illustrative only and should not be construed as limiting the scope of the claims, and other substantially equivalent alternatives that may be apparent to those skilled in the art are also within the scope of the utility model.

Claims

1. Wafer turnover spool box, including upper cover and lower cover, its characterized in that:

the top surface in the upper cover is a smooth surface,

the top surface in the upper cover is set as follows: after the upper cover and the lower cover are closed, the top surface and the top of the wafer placed on the top surface are arranged at intervals.

2. The wafer turnover cassette of claim 1, wherein the lower cover has concave portions at both sides, and an upper concave portion at the bottom center of the lower cover, and the concave portions at both sides and the upper concave portion at the center are spaced to form fixing grooves.