CN216957827U - Membrane switch - Google Patents
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- CN216957827U CN216957827U CN202220076802.0U CN202220076802U CN216957827U CN 216957827 U CN216957827 U CN 216957827U CN 202220076802 U CN202220076802 U CN 202220076802U CN 216957827 U CN216957827 U CN 216957827U
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Abstract
The utility model provides a membrane switch, and relates to the technical field of electronic switches. A membrane switch comprising a switch body, the switch body comprising: the first base material layer is a transparent flexible base material layer; the first circuit layer is arranged on the first base material layer, the first circuit layer is a flexible transparent circuit layer, and the first circuit layer is connected with a leading-out wire; an adhesive layer disposed on the first circuit layer; the second circuit layer is arranged on the bonding layer and is a flexible transparent circuit layer; the second substrate layer is arranged on the second circuit layer and is a transparent flexible substrate layer; and the protective layer is arranged on the second base material layer. This application can make membrane switch's outward appearance obtain obviously improving, makes overall structure more frivolous, and adopts transparent flexible material structure, and this membrane switch can realize bending or folding.
Description
Technical Field
The utility model relates to the technical field of electronic switches, in particular to a membrane switch.
Background
The membrane switch is an operation system integrating a key function, an indicating element and an instrument panel, has the characteristics of light and thin volume, strict structure, small sound generated during pressing and the like, and is widely applied to various fields, such as electronic communication, electronic measurement instruments, industrial control, medical working equipment, automobile industry, intelligent toys, household appliances and the like.
The traditional membrane switch is generally a solid key, and has a thicker structure, namely, thicker thickness, complex structure and poorer practicability; the appearance is also older, and the outward appearance of current membrane switch is opaque mostly, needs external display, and the aesthetic property still needs to be improved.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned problems, the present invention is directed to solving, at least to some extent, one of the technical problems in the related art. Therefore, the membrane switch provided by the utility model has the advantages that the overall structure is lighter and thinner, the appearance of the membrane switch is obviously improved, the structure is simple, the practicability is high, and the defects in the prior art can be overcome.
In order to solve the technical problem, the utility model adopts the following technical scheme:
according to an aspect of the present invention, there is provided a membrane switch including a switch body, the switch body including:
the first base material layer is a transparent flexible base material layer;
the first circuit layer is arranged on the first base material layer, the first circuit layer is a flexible transparent circuit layer, and the first circuit layer is connected with a leading-out wire;
an adhesive layer disposed on the first circuit layer;
the second circuit layer is arranged on the bonding layer and is a flexible transparent circuit layer;
the second substrate layer is arranged on the second circuit layer and is a transparent flexible substrate layer;
and the protective layer is arranged on the second base material layer.
In some of these embodiments, the first substrate layer has a thickness of 10 μm to 500 μm;
and/or the thickness of the second substrate layer is 10-500 μm.
In some of these embodiments, the first substrate layer is made from PET, CPI, COP, PE, BOPET, TPU, or PC;
and/or the second substrate layer is made of PET, CPI, COP, PE, BOPET, TPU or PC.
In some embodiments, the first circuit layer is made of PEDOT, gold nanowire, silver nanowire, copper nanowire, carbon nanotube, or graphene;
and/or the square resistance of the first circuit layer does not exceed 300 omega/sq.
In some embodiments, the second circuit layer is made of PEDOT, gold nanowire, silver nanowire, copper nanowire, carbon nanotube, or graphene;
and/or the square resistance of the second circuit layer does not exceed 300 omega/sq.
In some embodiments, the protective layer has a thickness of 0.5 μm to 50 μm.
In some of these embodiments, the adhesive layer has a thickness of 5 μm to 500 μm;
and/or the bonding layer adopts transparent optical glue.
In some embodiments, one end of the lead is connected to the first circuit layer, and the other end of the lead is connected to an external circuit chip.
In some embodiments, the lead wire is made of conductive copper paste, conductive silver paste, conductive gold paste, conductive palladium paste, conductive nickel paste, conductive aluminum paste or conductive carbon paste.
In some embodiments, the thickness of the switch body is no more than 100 μm.
The technical scheme of the utility model at least has the following beneficial effects:
the application provides a membrane switch, including the switch body, the switch body is including the first substrate layer, first circuit layer, adhesive linkage, second circuit layer, second substrate layer and the protective layer that set gradually, and first circuit layer wherein is connected with the lead-out wire, and first substrate layer and second substrate layer all can be flexible transparent substrate layer, and first circuit layer and second circuit layer all can be flexible transparent circuit layer. So, through the setting of above-mentioned structure, enable membrane switch's outward appearance and obviously improve, the transmissivity promotes by a wide margin, and overall structure's transmissivity can reach 75% or more than 80%, compares in current opaque or translucent membrane switch, and the membrane switch aesthetic measure of this application improves by a wide margin. Moreover, the membrane switch is simple in structure, reduces materials, greatly reduces the overall thickness of the membrane switch, and is very light and thin. Simultaneously, this application enables membrane switch's buckling to become possible, can use the membrane switch of this application on some products that need fold or the surface is the curved surface, has promoted the feasibility that different scenes used.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
FIG. 1 is a schematic diagram of a membrane switch according to some embodiments of the present invention;
fig. 2 is a schematic top view of a membrane switch according to some embodiments of the present invention.
In the figure:
101-a first substrate layer; 102-a first circuit layer; 103-an adhesive layer; 104-a second circuit layer; 105-a second substrate layer; 106-protective layer; 107-outlet.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
As will be appreciated by those skilled in the art, as is the background art, the related art thin film switch structure has certain disadvantages to a greater or lesser extent. For example, conventional membrane switches are heavy and have a poor appearance. Therefore, it is necessary to improve the structure of the membrane switch to achieve the purposes of improving the aesthetic property of the membrane switch, reducing the thickness of the switch, simplifying the structure and enhancing the use effect of the membrane switch. See below for a description of specific solutions.
Referring to fig. 1 to 2, in some embodiments of the present application, there is provided a membrane switch including a switch body, the switch body including:
the first substrate layer 101, wherein the first substrate layer 101 is a transparent flexible substrate layer;
the first circuit layer 102 is arranged on the first base material layer 101, the first circuit layer 102 is a flexible transparent circuit layer, and the first circuit layer 102 is connected with a lead wire 107;
an adhesive layer 103 provided on the first circuit layer 102;
a second circuit layer 104 disposed on the adhesive layer 103, wherein the second circuit layer 104 is a flexible transparent circuit layer;
a second substrate layer 105 disposed on the second circuit layer 104, wherein the second substrate layer 105 is a transparent flexible substrate layer;
and a protective layer 106 provided on the second substrate layer 105.
According to the embodiment of the application, the membrane switch that provides includes the switch body, the switch body includes by lower supreme first substrate layer 101 that sets gradually, first circuit layer 102, adhesive linkage 103, second circuit layer 104, second substrate layer 105 and protective layer 106, wherein first circuit layer 102 is connected with lead-out wire 107, first substrate layer 101 and second substrate layer 105 all can adopt the flexible transparent substrate layer that flexible transparent material made, first circuit layer 102 and second circuit layer 104 all can adopt the flexible transparent circuit layer that flexible transparent material made, that is, first substrate layer 101 and second substrate layer 105 all can adopt flexible transparent material, first circuit layer 102 and second circuit layer 104 all can adopt flexible transparent material. The first substrate layer 101 may serve as a main body receiving structure, the first circuit layer 102 or the second circuit layer 104 may function as a transparent electrode, and the outgoing line 107 may also be referred to as an external lead, and may be configured to transmit an electrical signal to an external chip, and finally, process feedback after obtaining a response signal from the external chip.
Therefore, through the arrangement of the structure, the structure is simplified, the structure of the membrane switch is simple, the material consumption is reduced, and the whole thickness of the membrane switch is greatly reduced, such as the thickness of the membrane switch can reach below 100 μm, and the membrane switch is very light and thin. And because the transparent flexible circuit is used, the appearance of the membrane switch is obviously improved, the transmittance is greatly improved, the transmittance (the average transmittance in a visible light region such as 450nm-800nm wavelength) of the whole structure can reach more than 75% or 80%, and compared with the existing opaque or semitransparent membrane switch, the membrane switch of the embodiment of the application has the advantage that the aesthetic degree is greatly improved. Simultaneously, through the substrate layer or the circuit layer etc. that adopt above-mentioned flexible transparent material, this application enables membrane switch's buckling to become possible, can use the membrane switch of this application embodiment on some products that need fold or the surface is the curved surface, has promoted the feasibility that different scenes used.
Therefore, compare in current membrane switch, the membrane switch that this application embodiment provided has that thickness is thinner, the aesthetic property is better, the transmissivity is high, can realize buckling, excellent characteristics such as simple structure, and low cost, the practicality is strong, has good application prospect.
In some embodiments, the thickness of the first substrate layer 101 is 10 μm to 500 μm. In some embodiments, the thickness of the first substrate layer 101 is 10 μm to 300 μm. In some embodiments, the thickness of the first substrate layer 101 is 10 μm to 100 μm; in some embodiments, the thickness of the first substrate layer 101 is 10 μm to 50 μm. In some embodiments, the thickness of the first substrate layer 101 may be, for example, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 80 μm, 100 μm, 200 μm, 300 μm, and the like.
In some embodiments, the first substrate layer 101 is made of PET (film), CPI (film), COP (film), PE (film), BOPET (film), TPU (film), or PC (film). For example, the first substrate layer 101 may be a PET film, a CPI film, a COP film, a PE film, a BOPET film, a TPU film, a PC film, or the like, or a composite film formed by two or more of the above films, or other similar flexible transparent films.
The relevant materials referred to in this application are described below:
PET is polyethylene terephthalate, commonly called polyester resin; CPI is transparent polyimide; COP is a cycloolefin polymer which is an optical material; PE is polyethylene; BOPET is biaxially oriented polyester; the TPU is thermoplastic polyurethane elastomer rubber; PC is polycarbonate; these are flexible and foldable polymer films having high transmittance.
In some embodiments, the thickness of the second substrate layer 105 is 10 μm to 500 μm. In some embodiments, the thickness of the second substrate layer 105 is 10 μm to 300 μm. In some embodiments, the thickness of the second substrate layer 105 is 10 μm to 100 μm; in some embodiments, the thickness of the second substrate layer 105 is 10 μm to 50 μm. In some embodiments, the thickness of the second substrate layer 105 may be, for example, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 80 μm, 100 μm, 200 μm, 300 μm, and the like.
In some embodiments, the second substrate layer 105 is made of PET (film), CPI (film), COP (film), PE (film), BOPET (film), TPU (film), or PC (film). For example, the second substrate layer 105 may be a PET film, a CPI film, a COP film, a PE film, a BOPET film, a TPU film, a PC film, or the like, or a composite film formed of two or more of the above films, or other similar flexible transparent films.
Here, the above materials are all conventional materials, and are all flexible transparent materials. The examples of the present application do not limit the sources, specific types, or components, etc. of the flexible transparent materials such as PET and CPI, which may be commercially available products, and the examples of the present application do not relate to the improvement of the material components.
According to the embodiment of the present application, the materials of the first substrate layer 101 and the second substrate layer 105 may be the same or different. For example, a PET film, a CPI film, a COP film, or the like is used for each of the first substrate layer 101 and the second substrate layer 105. As another example, the first substrate layer 101 is a PET film, and the second substrate layer 105 is a COP film; alternatively, a CPI film is used for the first substrate layer 101, and a TPU film or the like is used for the second substrate layer 105. For convenience of manufacturing and simplification of the structure, it is preferable that in some embodiments, the first substrate layer 101 and the second substrate layer 105 are made of the same material.
It should be understood that the type of material of the first substrate layer and the second substrate layer of the present application is not limited thereto, but various other transparent flexible materials well known or commonly used in the art may also be used.
Above-mentioned substrate layer is like first substrate layer 101, mainly can play the effect of support, can make other effectual structure bearings above that. Generally, a common polymer film which can be flexibly folded on the market can be selected, and the required transmittance is high, the haze is small, such as PET, CPI, COP, PE, BOPET, TPU, PC and the like, the source is wide, and the application effect is good. The thickness of the first substrate layer and the second substrate layer is generally in the range of 10 μm to 500 μm, more preferably in the range of 10 μm to 50 μm; if the thickness of the substrate layer is too thick, the bending performance is affected, and the whole thickness is too thick, so that cracks and breakage are easy to occur; if the thickness of the base material layer is too thin, the supporting function is not obvious, and collapse, unevenness and the like are likely to occur.
In some embodiments, the first circuit layer 102 is made of PEDOT, gold nanowire, silver nanowire, copper nanowire, carbon nanotube, or graphene. Wherein PEDOT is a polymer of EDOT (3, 4-ethylene dioxythiophene monomer). Illustratively, PEDOT, a nano gold wire, a nano silver wire, a nano copper wire, a nano carbon tube, graphene, or the like may be used as the first circuit layer 102, and other similar flexible transparent electrode materials may also be used.
In some embodiments, the second circuit layer 104 is made of PEDOT, gold nanowire, silver nanowire, copper nanowire, carbon nanotube, or graphene. Illustratively, the second circuit layer 104 may be PEDOT, a nano gold wire, a nano silver wire, a nano copper wire, a nano carbon tube, graphene, or the like, and may also be made of other similar flexible transparent electrode materials.
In some embodiments, the sheet resistance of the first circuit layer 102 does not exceed 300 Ω/sq (≦ 300 Ω/sq).
In some embodiments, the sheet resistance of the second circuit layer 104 does not exceed 300 Ω/sq (≦ 300 Ω/sq).
According to the embodiment of the present disclosure, the first circuit layer 102 and the second circuit layer 104 may be made of the same material or different materials. For example, the first circuit layer 102 and the second circuit layer 104 both use nano silver wires, or both use nano copper wires, etc. For another example, the first circuit layer 102 is made of nano silver wires, and the second circuit layer 104 is made of nano copper wires; alternatively, the first circuit layer 102 uses nano copper wires, and the second circuit layer 104 uses carbon nanotubes or the like. For convenience of manufacturing and simplification of the structure, it is preferable that in some embodiments, the first circuit layer 102 and the second circuit layer 104 are made of the same material.
The circuit layers, such as the first circuit layer 102 and the second circuit layer 104, are transparent flexible circuits, and mainly function as transparent circuits or transparent electrodes, so that current signals can be effectively transmitted when touch pressure is obtained. The circuit layer is generally made of a transparent electrode material commonly found in the market, such as PEDOT, nano gold wire, nano silver wire, nano copper wire, nano carbon tube, graphene, and the like. Depending on the material, a suitable protective coating may be applied to the outer layer of the lead to protect the electrode material from physical or chemical damage. Because the electrode is a transparent electrode, certain requirements are generally required on the performance of the electrode, for example, the transmittance is required to be more than 75%, the sheet resistance is required to be less than 300 omega/sq, and the uniformity and stability of the whole sheet resistance are ensured.
In some embodiments, one end of the lead-out line 107 is connected to the first circuit layer 102, and the other end of the lead-out line 107 is connected to an external circuit chip (not shown).
Alternatively, in other embodiments, the connection of the outlet to the first circuit layer connection, the other end of the outlet may be provided with a dupont plug or other type of plug.
In some embodiments, the lead wires 107 are made of conductive copper paste, conductive silver paste, conductive gold paste, conductive palladium paste, conductive nickel paste, conductive aluminum paste, or conductive carbon paste. Illustratively, the lead wire 107 may be made of conductive copper paste, conductive silver paste, conductive gold paste, conductive palladium paste, conductive nickel paste, conductive aluminum paste, conductive carbon paste, or the like, and may be made of other similar conductive materials.
The lead wire 107 may also be referred to as an external lead wire, and may be connected to an external chip of an external circuit, so as to conduct an electrical signal collected by the transparent flexible circuit to the chip for processing and feedback. The lead-out wire can be generally made of one or more common electrode conductive materials on the market, such as copper paste, silver paste, gold paste, palladium paste, nickel paste, aluminum paste, carbon paste and the like.
In some embodiments, the adhesive layer 103 has a thickness of 5 μm to 500 μm. In some embodiments, the adhesive layer 103 has a thickness of 5 μm to 300 μm. In some embodiments, the adhesive layer 103 has a thickness of 5 μm to 100 μm. In some embodiments, the adhesive layer 103 has a thickness of 5 μm to 80 μm. The adhesive layer 103 may have a thickness of, for example, 5 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, or the like.
In some embodiments, the adhesive layer 103 is made of transparent optical glue. The bonding layer can be made of common double-sided adhesive tape or 3M double-sided adhesive tape, or can also be made of transparent optical adhesive tape such as OCA, and has the characteristics of proper bonding force, good bonding effect and the like.
The adhesive layer 103 is disposed between the first circuit layer 102 and the second circuit layer 104, and mainly serves to bond the upper and lower layers, thereby connecting the entire structure. The thickness of the adhesive layer is generally 5 μm to 500. mu.m, more preferably 5 μm to 100. mu.m; by making the thickness of the adhesive layer within this range, the bonding force between the layers is improved, so that the connection structure is more stable and reliable. If the thickness of the bonding layer is too thick, the whole structure is too thick and too soft, and displacement or damage to the circuit is easily caused; if the thickness of the adhesive layer is too thin, the adhesion effect may not be good. It is therefore necessary to select a suitable adhesive force or adhesive thickness to match the overall membrane switch configuration.
In some embodiments, the protection layer 106 may be made of a hard material, i.e., the protection layer 106 may be a hardened protection layer. The specific material of the hardened protective layer is of various types, and the specific material type of the protective layer is not limited in the embodiments of the present application.
In some embodiments, the protective layer 106 has a thickness of 0.5 μm to 50 μm. In some embodiments, the protective layer 106 has a thickness of 0.5 μm to 40 μm. In some embodiments, the protective layer 106 has a thickness of 0.5 μm to 30 μm. In some embodiments, the protective layer 106 has a thickness of 1 μm to 20 μm. The thickness of the protective layer 106 may be, for example, 0.5 μm, 1 μm, 2 μm, 5 μm, 8 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, or 50 μm.
The protective layer 106 is disposed on the second substrate layer 105, i.e., on the outermost layer, and mainly functions to protect the entire membrane switch structure on the outermost layer and prevent the inner structure from physical or chemical influences. The thickness of the protective layer is generally 0.5 μm to 50 μm, and more preferably 0.5 μm to 30 μm, and by making the thickness of the protective layer in this range, it is helpful to protect the remaining layer structure, making the optical transmittance, flexibility, and the like of the entire structure more desirable. If the thickness of the protective layer is too thin, the protective effect will be affected, and if the thickness of the protective layer is too thick, the optical property, flexibility and the like will be affected to a certain extent.
In some embodiments, the thickness of the switch body does not exceed 100 μm. Further, in some embodiments, the thickness of the switch body is 10 μm to 100 μm. Further, in some embodiments, the thickness of the switch body is no more than 20 μm-90 μm. The switch body is light and thin in thickness, light in weight and convenient to use.
In the embodiment of the present application, the membrane switch includes a switch body, and may further include other structures. For example, a display area, a key convex surface, a control button, or the like provided in a protective layer of the switch body may be further included, or a display light source, or the like may be further included. It should be noted that, the embodiments of the present application are not limited to other structures of the membrane switch, and the core of the membrane switch includes the switch body provided in the embodiments of the present application.
In summary, the membrane switch provided has at least the following features: (1) in the aspect of appearance, wholly used transparent flexible conductive ink printed circuit, used flexible transparent substrate, overall structure's transmissivity can reach 75% or more than 80% at least, can accomplish to see through the object at whole membrane switch observation rear, and then make whole membrane switch's outward appearance obviously improve, the aesthetic property is better. (2) In the aspect of thickness, the thin film is used for replacing a thick circuit board, the light and thin degree is obviously improved, the whole structure is lighter and thinner, and the minimum thickness can reach below 100 mu m. (3) The hardening protective layer is used for replacing protective cover plates such as surface glass and the like, so that the cost can be reduced, and the process can be reduced. In addition, most structures of membrane switch have adopted flexible construction and flexible material, have improved the pliability, compare in the tradition and do not have the membrane switch of the effect that the softness is buckled, this application changes after using flexible material and structure for membrane switch buckles and becomes possible.
The utility model has not been described in detail and is in part known to those of skill in the art.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A membrane switch comprising a switch body, wherein the switch body comprises:
the first base material layer is a transparent flexible base material layer;
the first circuit layer is arranged on the first base material layer, the first circuit layer is a flexible transparent circuit layer, and the first circuit layer is connected with a leading-out wire;
an adhesive layer disposed on the first circuit layer;
the second circuit layer is arranged on the bonding layer and is a flexible transparent circuit layer;
the second substrate layer is arranged on the second circuit layer and is a transparent flexible substrate layer;
and the protective layer is arranged on the second base material layer.
2. The membrane switch of claim 1, wherein the thickness of the first substrate layer is 10 μ ι η -500 μ ι η;
and/or the thickness of the second substrate layer is 10-500 μm.
3. The membrane switch of claim 1, wherein the first substrate layer is made of PET, CPI, COP, PE, BOPET, TPU, or PC;
and/or the second substrate layer is made of PET, CPI, COP, PE, BOPET, TPU or PC.
4. The membrane switch of claim 1, wherein the first circuit layer is made of PEDOT, gold nanowire, silver nanowire, copper nanowire, carbon nanotube, or graphene;
and/or the square resistance of the first circuit layer does not exceed 300 omega/sq.
5. The thin film switch of claim 1, wherein the second circuit layer is made of PEDOT, gold nanowire, silver nanowire, copper nanowire, carbon nanotube or graphene;
and/or the square resistance of the second circuit layer does not exceed 300 omega/sq.
6. The membrane switch of claim 1, wherein the protective layer has a thickness of 0.5 μm to 50 μm.
7. The membrane switch of claim 1, wherein the adhesive layer has a thickness of 5 μm to 500 μm;
and/or the bonding layer adopts transparent optical glue.
8. The membrane switch according to any one of claims 1 to 7, wherein one end of the lead is connected to the first circuit layer, and the other end of the lead is connected to an external circuit chip.
9. The membrane switch of claim 8, wherein the lead wires are made of conductive copper paste, conductive silver paste, conductive gold paste, conductive palladium paste, conductive nickel paste, conductive aluminum paste, or conductive carbon paste.
10. Membrane switch according to one of claims 1 to 7, characterized in that the thickness of the switch body does not exceed 100 μm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220076802.0U CN216957827U (en) | 2022-01-12 | 2022-01-12 | Membrane switch |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220076802.0U CN216957827U (en) | 2022-01-12 | 2022-01-12 | Membrane switch |
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| CN216957827U true CN216957827U (en) | 2022-07-12 |
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| CN202220076802.0U Active CN216957827U (en) | 2022-01-12 | 2022-01-12 | Membrane switch |
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