CN216954831U

CN216954831U - Wireless vibration sensor for monitoring equipment state

Info

Publication number: CN216954831U
Application number: CN202123284024.9U
Authority: CN
Inventors: 孙海波
Original assignee: Tongquan Technology Jiaxing Co ltd
Current assignee: Tongquan Technology Jiaxing Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-07-12
Anticipated expiration: 2031-12-24

Abstract

The utility model discloses a wireless vibration sensor for monitoring equipment state, which is used for monitoring the equipment state and comprises an upper shell, a lower shell and a circuit board, wherein the upper shell and the lower shell are fixedly connected, the circuit board is positioned in a containing cavity formed by the upper shell and the lower shell in a surrounding manner, and the wireless vibration sensor also comprises an antenna pedestal, a battery and a wireless module. The utility model discloses a wireless vibration sensor for monitoring equipment state, which is used for solving the problems of inconvenience in wiring, short wireless transmission distance, low transmission bandwidth, high power consumption and short standby time existing in the traditional vibration sensor and a vibration testing instrument.

Description

Wireless vibration sensor for monitoring equipment state

Technical Field

The utility model belongs to the technical field of vibration sensors, and particularly relates to a wireless vibration sensor for monitoring equipment states.

Background

The conventional vibration sensor is generally based on the principles of piezoelectric type, piezoresistive type, inductive type and capacitive type, and is used for acquiring the vibration of various objects. The traditional vibration sensor comprises elements such as a shell, a sensitive core, a power supply module and a signal conditioning board, and can work only by being matched with a vibration testing instrument which is generally a desk-top case with large volume and high power consumption. The traditional vibration sensor and the vibration testing instrument need to be wired in a long distance and in a complex manner, the field installation is inconvenient, and the interference of the analog small signal is often caused by the long-distance wiring, so that the data reading is influenced.

Compared with the traditional vibration sensor and the vibration testing instrument, the wireless vibration sensor can greatly simplify field wiring, is flexible and convenient to use, and greatly reduces signal interference caused by long cables in wireless digital data transmission. However, the existing wireless vibration sensor generally adopts two technical means: the first is standard communication protocols such as WIFI, Bluetooth and the like, and has the advantages of universal protocol, high data transmission bandwidth and the defects of easy shielding of wireless signals, short transmission distance, high power consumption and short standby time; the second type is a Lora type wireless vibration sensor, which has the advantages of long transmission distance and extremely low data bandwidth and is only suitable for transmitting a small amount of data such as characteristic values.

Therefore, the problems are further improved, and a wireless vibration sensor for equipment state monitoring and considering both transmission distance and data bandwidth is designed.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a wireless vibration sensor for equipment state monitoring, which is used for solving the problems of inconvenient wiring, short wireless transmission distance, low transmission bandwidth, high power consumption and short standby time existing in the traditional vibration sensor and a vibration testing instrument.

In order to achieve the above object, the present invention provides a wireless vibration sensor for monitoring a device status, comprising an upper housing, a lower housing, a circuit board, an antenna holder, a battery and a wireless module, wherein the upper housing is fixedly connected with the lower housing, and the circuit board is located in a containing cavity formed by the upper housing and the lower housing, and the wireless vibration sensor further comprises:

one end of the antenna pedestal is positioned in the accommodating cavity (and is arranged on the lower shell), and one end of the antenna pedestal, which is far away from the accommodating cavity, is provided with an antenna, the battery and the wireless module are both positioned in the accommodating cavity, and the battery and the wireless module are both electrically connected with the circuit board;

the circuit board includes (triaxial MEMS) acceleration sensor (U2), treater (CPU), temperature sensor (U3), power supply circuit and USB circuit, acceleration sensor temperature sensor wireless module power supply circuit (output) with the USB circuit respectively with treater electric connection, power supply circuit's input with battery electric connection.

As a more preferable mode of the above mode, an insulating pad is attached between the wireless module and the battery.

As a further preferable technical solution of the above technical solution, the power supply circuit includes a power supply chip U1, and an input terminal of the power supply chip U1 is connected to an input power supply VBAT;

the output end of the power chip U1 is connected with an output power supply VAA.

As a further preferred technical solution of the above technical solution, a power supply end (3 pins and 7 pins) of the acceleration sensor (U2) is connected to the output power VAA, the acceleration sensor (U2) is electrically connected to the processor through an SPI interface, and the wireless module is electrically connected to the processor through the SPI interface.

As a further preferable technical solution of the above technical solution, power supply terminals (pin 3 and pin 7) of the acceleration sensor (U2) are connected to an output power VAA, the acceleration sensor (U2) is electrically connected to the processor through an SPI interface, and the wireless module is electrically connected to the processor through the SPI interface.

The utility model has the beneficial effects that:

1. the wireless remote transmission can be realized, and the transmission distance is more than 500 meters in open. By adopting the high-power wireless radio frequency module, the wireless transmission distance can be increased, the transmission distance is superior to the mainstream wireless test technologies such as WIFI, Bluetooth and ZigBee which are commonly used at present, and the wireless radio frequency module is very suitable for application occasions in the monitoring field of rotating equipment in factories.

2. The transmission bandwidth is high. The wireless vibration sensor for monitoring the equipment state can realize wireless real-time transmission without packet loss at the rate of more than 10kB/s, meets the use occasions in most of the monitoring field of rotating equipment, and ensures the reliability of data transmission.

3. The power consumption is low, and the remote sleep and wake-up can be realized. Through the low-power-consumption control strategies such as periodic signal acquisition and partial power supply turning-off, the working time of the wireless vibration sensor can be greatly prolonged. The utility model provides a wireless vibration sensor for equipment state monitoring does not have shift knob, accessible wireless instruction remote switch, collection, more is fit for the interior rotation equipment monitoring field of mill.

4. The whole embedment silica gel of inferior valve internal portion, its inside subassembly can reach waterproof, dampproofing, circuit shock attenuation's purpose. A layer of insulating pad is arranged between the wireless module and the battery, and the purposes of insulation and shock absorption are further achieved.

5. A triaxial MEMS acceleration sensor and a temperature sensor are integrated in a wireless vibration sensor for monitoring equipment states, vibration and temperature signals can be measured simultaneously, and later-stage fault analysis of rotating equipment is facilitated.

Drawings

Fig. 1 is a schematic structural diagram of a wireless vibration sensor for equipment condition monitoring according to the present invention.

FIG. 2 is a schematic diagram of a circuit board of a wireless vibration sensor for device condition monitoring of the present invention.

FIG. 3 is a power circuit diagram of a wireless vibration sensor for device condition monitoring of the present invention.

Fig. 4 is a circuit diagram of an acceleration sensor of a wireless vibration sensor for device condition monitoring according to the present invention.

FIG. 5 is a temperature sensor circuit diagram of a wireless vibration sensor for device condition monitoring of the present invention.

Fig. 6 is a flow chart of a wireless protocol stack of a wireless vibration sensor for device condition monitoring according to the present invention.

The reference numerals include: 1. an antenna mount; 2. an antenna; 3. a battery; 4. an upper housing; 5. an insulating pad; 6. a wireless module; 7. a circuit board; 8. a lower housing.

Detailed Description

The following description is provided to disclose the utility model so as to enable any person skilled in the art to practice the utility model. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the utility model, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the utility model.

The utility model discloses a wireless vibration sensor for monitoring equipment state, and the specific embodiment of the utility model is further described in combination with the preferred embodiment.

In the embodiment of the present invention, those skilled in the art note that the upper case, the lower case, the circuit board, and the like, to which the present invention relates, may be regarded as the prior art.

Preferred embodiments.

The utility model discloses a wireless vibration sensor for monitoring equipment state, which is used for monitoring the equipment state and comprises an upper shell 4, a lower shell 8 and a circuit board 7, wherein the upper shell 4 is fixedly connected with the lower shell 8, the circuit board 7 is positioned in a containing cavity formed by the upper shell 4 and the lower shell 8 in an enclosing manner, the wireless vibration sensor also comprises an antenna pedestal 1, a battery 3 and a wireless module 6, wherein:

one end of the antenna pedestal 1 is located in the accommodating cavity (and is mounted on the lower shell), and one end of the antenna pedestal 1, which is far away from the accommodating cavity, is mounted with the antenna 2, the battery 3 and the wireless module 6 are both located in the accommodating cavity, and the battery 3 and the wireless module 6 are both electrically connected with the circuit board 7;

the circuit board 7 includes (triaxial MEMS) acceleration sensor (U2), treater (CPU), temperature sensor (U3), power supply circuit and USB circuit, acceleration sensor temperature sensor wireless module power supply circuit (output) with the USB circuit respectively with treater electric connection, power supply circuit's input with battery electric connection.

Specifically, install insulating pad 5 between wireless module 6 with battery 3 (play insulating and absorbing effect, avoided the impact of vibration in-process battery to wireless module and (acquisition and processing) circuit board, bring the damage of circuit and the distortion of data, be connected through the binding post of aerial butt joint type between battery and the circuit board).

More specifically, the power supply circuit includes a power supply chip U1, an input terminal of the power supply chip U1 is connected to an input power supply VBAT and an input terminal of the power supply chip U1 is also grounded through a capacitor C1;

the output end of the power supply chip U1 is connected with an output power supply VAA and the output end of the power supply chip U1 is grounded through a capacitor C2.

Furthermore, the power supply end (3 pins and 7 pins) of the acceleration sensor (U2) is connected with an output power supply VAA, the acceleration sensor (U2) is electrically connected with the processor through an SPI interface, and the wireless module is electrically connected with the processor through the SPI interface.

Furthermore, a power end (pin 5) of the temperature sensor (U3) is connected to the output power VAA, and an SCL end and an SDA end of the temperature sensor (U3) are respectively electrically connected to the processor.

Preferably, the lower shell 8 is a metal structure with high rigidity, and has a threaded mounting hole M5 at the bottom for connecting with a device to be tested or a magnetic base.

Preferably, the circuit board 7 and the lower shell 8 are rigidly connected through screws, and the MEMS acceleration sensor is mounted on the circuit board 7, so that the acceleration signal can be effectively transmitted, and the distortion of the acceleration signal can be reduced by using the rigid connection.

Preferably, the upper shell 4 and the lower shell 8 are in threaded connection, and the upper part of the upper shell 4 is an anti-slip hexagonal shape, so that the battery can be conveniently detached and replaced.

The wireless module 6 is mounted on the circuit board 7.

The antenna pedestal 1 is arranged on the lower shell 8, and the antenna 2 is arranged on the antenna pedestal 1.

After the components inside the lower shell 8 are all installed, the silica gel is integrally filled and sealed inside the lower shell 8, so that the aims of water resistance, moisture resistance and circuit shock absorption are fulfilled.

The wireless module adopts a high-power wireless transceiver, the transmitting power can reach 20dBm, and the air transmission rate can reach 2 Mbps.

The utility model adopts a periodic acquisition and transmission mode, and only when the working time window of the wireless vibration sensor arrives, the data acquisition and the wireless transmission of the set sampling point number are carried out, and the wireless vibration sensor is in a low-power consumption dormant state at other time.

Preferably, in the accommodating cavity, from bottom to top: antenna pedestal 1, circuit board 7, wireless module 6, insulating pad 5, battery 3, antenna pedestal 1 installs on lower casing 8, is connected with wireless module 6 through the radio frequency line, has special radio frequency line wire hole on the circuit board 7.

The CPU is a core control unit of a wireless vibration sensor for device status monitoring, and employs a low power consumption processor (e.g., STM32 series).

The power circuit is shown in fig. 3, the U1 is a power chip and supplies power for the triaxial MEMS acceleration sensor and the temperature sensor, the U1 can turn off the output power supply through 3 pins, the power supply of the triaxial MEMS acceleration sensor and the temperature sensor can be turned off when the CPU is in dormancy, and the power consumption in dormancy can be saved.

The triaxial MEMS acceleration sensor and temperature sensor circuit are shown in fig. 4 and 5. The triaxial MEMS acceleration sensor U2 is a digital sensor with an SPI interface, is a core sensitive core of a wireless vibration sensor for equipment state monitoring, and is arranged near a screw of an acquisition processing circuit board. The temperature sensor U3 is a digital sensor with IIC interface, and is installed near the screw near the collecting and processing circuit board, and the circuit board is connected with the screw by using large-area copper sheet, so as to facilitate better heat transfer. CPU passes through SPI interface control triaxial MEMS acceleration sensor and realizes data acquisition, realizes temperature data acquisition through IIC interface control temperature sensor, realizes the wireless receiving and dispatching of data through SPI interface control wireless communication module, realizes the configuration and the reading of wireless vibration sensor parameter through the USB circuit.

The principle of the utility model is as follows:

the CPU runs the wireless protocol stack, controls the wireless communication module to communicate with the remote wireless gateway, receives the instruction of the wireless gateway and sends the acquired data to the wireless gateway, and adopts a periodic mode to acquire the data, namely, the data of N sampling points are acquired after each dormancy for a period of T, so that the power consumption of the system can be further reduced. The specific flow of the radio protocol stack is as follows, as shown in fig. 6:

the wireless vibration sensor is in a dormant state by default, and after the dormant time T passes, the wireless vibration sensor is in a wake-up state. In order to prevent data confusion caused by the simultaneous transmission of data from a plurality of wireless vibration sensors to a wireless gateway, the wireless vibration sensors need to detect whether a current channel is busy before data acquisition and data transmission. If the current channel is busy, sleeping randomly for 5-30 s, waiting for the transmission of a certain wireless vibration sensor which works currently to finish and then applying for a signal, but if the wireless vibration sensor is continuously and randomly sleeping for three times, the signal is still busy, and in order to save the power consumption of the wireless vibration sensor, the wireless vibration sensor continuously enters a deep sleep state of sleeping for T time; and if the signal is idle, the wireless vibration sensor applies to the wireless gateway for occupying the current channel, the channel occupation is unique, and once the wireless vibration sensor occupies the channel, the wireless gateway ignores any request from the rest wireless vibration sensors. If the wireless gateway does not allow the channel to be occupied, the wireless vibration sensor enters a deep sleep state of sleep time T; if the wireless gateway allows the channel to be occupied, the wireless vibration sensor is simultaneously issued with control parameters: such as sampling rate f, number of sampling points N, sampling interval time T, etc. After the wireless gateway allows the channel to occupy and issue the parameters, the wireless vibration sensor starts to acquire data of N points according to the issued parameters and the sampling rate f, stores the data into a cache of the CPU, and transmits the data to the wireless gateway. And after the data transmission is finished, the wireless vibration sensor sends exit channel occupation and the like to the wireless gateway, and enters a deep sleep time T state. Thus, the operation is repeated.

The USB circuit is used for realizing the configuration and reading of parameters of the wireless vibration sensor, such as the factory number, the sampling rate, the number of sampling points, the sampling interval time and the like of the wireless vibration sensor.

The power supply circuit realizes the functions of wireless sensor power supply and low power consumption management. The IO pin of the CPU controls the enabling of the power circuit, and the power of the sensor part can be cut off, so that the power consumption during the sleep period is reduced.

The wireless module adopts a high-power 433MHz or 915MHz or 2.4GHz ISM frequency band, can support high-speed data receiving and transmitting, and can ensure the transmission distance.

It should be noted that the technical features of the upper housing, the lower housing, the circuit board, and the like, which are referred to in the patent application of the present invention, should be regarded as the prior art, and the specific structure, the operation principle, the control manner and the spatial arrangement manner that may be referred to in the present application are conventional in the art, and should not be regarded as the utility model point of the present patent, and the present patent is not further specifically described in detail.

It will be apparent to those skilled in the art that modifications and equivalents may be made in the embodiments and/or portions thereof without departing from the spirit and scope of the present invention.

Claims

1. A wireless vibration sensor for equipment condition monitoring, is used for monitoring equipment condition, includes upper housing, lower casing and circuit board, upper housing with lower casing fixed connection and the circuit board is located the upper housing with the chamber that holds that the lower casing surrounds the formation, its characterized in that still includes antenna pedestal, battery and wireless module, wherein:

one end of the antenna pedestal is located in the accommodating cavity, an antenna is installed at one end, away from the accommodating cavity, of the antenna pedestal, the battery and the wireless module are both located in the accommodating cavity, and the battery and the wireless module are both electrically connected with the circuit board;

the circuit board comprises an acceleration sensor, a processor, a temperature sensor, a power circuit and a USB circuit, wherein the acceleration sensor, the temperature sensor, the wireless module, the power circuit and the USB circuit are respectively electrically connected with the processor, and the input end of the power circuit is electrically connected with the battery.

2. A wireless vibration sensor for device condition monitoring according to claim 1, wherein an insulating pad is mounted between the wireless module and the battery.

3. The wireless vibration sensor for device status monitoring as claimed in claim 2, wherein the power circuit comprises a power chip U1, the input terminal of the power chip U1 is connected to an input power VBAT;

4. The wireless vibration sensor for monitoring the status of equipment according to claim 3, wherein the power end of the acceleration sensor is connected to the output power VAA, the acceleration sensor is electrically connected to the processor through the SPI interface, and the wireless module is electrically connected to the processor through the SPI interface.

5. The wireless vibration sensor for equipment condition monitoring according to claim 4, wherein the power end of the temperature sensor is connected to the output power VAA, and the SCL end and the SDA end of the temperature sensor are electrically connected to the processor respectively.