CN216947205U - Micro-etching device for processing copper substrate - Google Patents
Micro-etching device for processing copper substrate Download PDFInfo
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- CN216947205U CN216947205U CN202220522929.0U CN202220522929U CN216947205U CN 216947205 U CN216947205 U CN 216947205U CN 202220522929 U CN202220522929 U CN 202220522929U CN 216947205 U CN216947205 U CN 216947205U
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Abstract
The utility model relates to a microetching device for processing a copper substrate, which comprises a placing disc, wherein the outer wall of the placing disc is respectively connected with two clamping blocks through two clamping assemblies, the two clamping blocks are positioned above the placing disc, the outer wall of the placing disc is connected with a container through a mounting assembly, the container contains microetching liquid, the container is connected with a limiting assembly through a connecting assembly, the limiting assembly is used for accurately controlling the position of the microetching liquid on a copper coating layer of the substrate, the two clamping assemblies are symmetrically arranged, the clamping assemblies comprise fixed blocks fixedly connected with the placing disc, each fixed block is provided with a sliding hole, and the inner wall of each sliding hole is connected with a sliding rod in a sliding manner. According to the utility model, the two first plate bodies and the two second plate bodies are positioned at the micro-etching position on the substrate through the movement limiting assembly, and the pulling plate is pulled, so that the micro-etching liquid flows out and contacts with the copper coating on the substrate, the accurate micro-etching operation of the copper coating of the substrate is realized, and the problem of uneven edges in the micro-etching of the copper coating in the prior art is solved.
Description
[ technical field ] A
The utility model relates to the technical field of substrate processing, in particular to a micro-etching device for processing a copper substrate.
[ background of the utility model ]
The copper substrate is one kind of base plate, the base plate can utilize the microetching liquid to corrode the copper coating on the base plate after corresponding cutting and polishing, the microetching liquid generally adopts "weak ammonia water + hydrogen peroxide solution" (volume ratio 3-10% ammonia water 300cc, add fresh effectual hydrogen peroxide solution 2-3 drips can), dip in the microetching liquid with the cotton stick, wipe to the copper coating, the copper coating can produce the microbubble fast, later reuse paper handkerchief wipes futilely, this kind of operation is that the staff holds the cotton stick operation, can make the erosion edge uneven, can not the specific erosion area on the copper coating of accurate control.
Therefore, the application provides a micro-etching device for processing a copper substrate.
[ Utility model ] content
The utility model aims to solve the defects of the existing microetching operation on a substrate, and provides a microetching device for processing a copper substrate.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a copper substrate processing is with declining device, includes that one places the dish, it is connected with two grip blocks, two respectively through two centre gripping subassemblies to place a set outer wall the grip block is located place the top of dish, the outer wall of placing the dish is connected with the container through the installation component, contain the declining liquid in the container, the container is connected with the restriction subassembly through coupling assembling, the restriction subassembly is used for the position of accurate control declining liquid on base plate copper coating.
Preferably, two centre gripping subassembly symmetry sets up, just the centre gripping subassembly includes and places a set fixedly connected with fixed block, the fixed block has a slide opening, slide opening inner wall sliding connection has the slide bar, the one end fixedly connected with movable plate of slide bar, the other end and corresponding grip block fixed connection, slide bar outer wall cover is equipped with first spring, the both ends of first spring are connected with movable plate and fixed block respectively.
Preferably, the installation component includes and places a set fixed connection's installation piece, the installation piece rotates and is connected with the pole of buckling, the fixed ring body that has cup jointed in one end of the pole of buckling, the container outward appearance is the cylinder form, the container has a circular slot and two round holes, the outer wall of the pole of buckling passes one of them round hole, the ring body is located the circular slot, be provided with the second spring on the ring body.
Preferably, coupling assembling is including fixed cover spacing ring on the container outer wall, the container connection has the connecting block, the connecting block has a spacing groove and a connecting groove, set up two lines of parallel arrangement's spout on the connecting block.
Preferably, the limiting assembly comprises two sliding blocks, the two sliding blocks are respectively located in corresponding sliding grooves, and the sliding blocks are fixedly connected with a first plate body and two second plate bodies, and the two second plate bodies are fixedly connected with the first plate body.
Preferably, one of them the second plate body has seted up the cell body, another the kerve has been seted up to the second plate body, two the first fixed plate of second plate body fixedly connected with, the kerve sliding connection has the arm-tie, the arm-tie passes through the third spring and one of them the second plate body is connected, arm-tie fixedly connected with second fixed plate, a plurality of through-holes have all been seted up on first fixed plate and the second fixed plate.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the two first plate bodies and the two second plate bodies are positioned at the micro-etching position on the substrate through the movement limiting assembly, and the pulling plate is pulled, so that the micro-etching liquid flows out and contacts with the copper coating on the substrate, the accurate micro-etching operation of the copper coating of the substrate is realized, and the problem of uneven edges in the micro-etching of the copper coating in the prior art is solved.
[ description of the drawings ]
FIG. 1 is a schematic structural diagram of a microetching device for processing a copper substrate according to the present invention;
FIG. 2 is an exploded view of a clamping assembly of the microetching device for processing a copper substrate according to the present invention;
FIG. 3 is a schematic view of a connection structure between a bending rod and a slider in the microetching device for processing a copper substrate according to the present invention;
FIG. 4 is an enlarged schematic view of the structure at A in FIG. 3;
fig. 5 is a schematic view of a connection structure between a first plate and a third spring in the microetching device for processing a copper substrate according to the present invention;
FIG. 6 is an exploded view of FIG. 5;
fig. 7 is a schematic view of the structure of fig. 6 from another view angle.
In the figure: 1. placing a tray; 2. a clamping block; 3. a container; 4. a fixed block; 5. a slide hole; 6. a slide bar; 7. moving the plate; 8. a first spring; 9. mounting blocks; 10. a bending rod; 11. a ring body; 12. a circular groove; 13. a circular hole; 14. a limiting ring; 15. connecting blocks; 16. a limiting groove; 17. a communicating groove; 18. a chute; 19. a slider; 20. a first plate body; 21. a second plate body; 22. a trough body; 23. groove drawing; 24. a first fixing plate; 25. pulling a plate; 26. a third spring; 27. a second fixing plate; 28. a through hole; 29. a second spring.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
Referring to fig. 1-7, a copper base plate processing is with declining device, including one place set 1, place set 1 outer wall and be connected with two grip blocks 2 respectively through two centre gripping subassemblies, two grip blocks 2 are located the top of placing set 1, place set 1's outer wall and be connected with container 3 through the installation component, contain the declining liquid in the container 3, container 3 is connected with the restriction subassembly through coupling assembling, the restriction subassembly is used for accurate control to lose the position of liquid on the base plate copper coating a little.
Further, two centre gripping subassemblies symmetry set up, and the centre gripping subassembly include with place 1 fixedly connected with fixed block 4 of dish, fixed block 4 has a slide opening 5, and slide opening 5 inner wall sliding connection has slide bar 6, the one end fixedly connected with movable plate 7 of slide bar 6, the other end and corresponding grip block 2 fixed connection, and 6 outer wall covers of slide bar are equipped with first spring 8, and the both ends of first spring 8 are connected with movable plate 7 and fixed block 4 respectively.
Referring to fig. 2, when no substrate is placed on the placing tray 1, the two clamping blocks 2 are located at the position where the two clamping blocks are closest to each other, if the substrate is placed on the placing tray 1, the two moving plates 7 are pulled, the two clamping blocks 2 are away from each other through conduction of the sliding rods 6, the two first springs 8 are stretched, after the substrate is placed on the placing tray 1, the acting force on the two moving plates 7 is released, and under the elastic force action of the first springs 8, the two clamping blocks 2 clamp the substrate in a limiting manner.
Further, the installation component includes and places 1 fixed connection's of dish installation piece 9, and installation piece 9 rotates and is connected with the pole 10 of buckling, and the fixed ring body 11 that has cup jointed in one end of pole 10 of buckling, and the container 3 outward appearance is the cylinder form, and container 3 has a circular slot 12 and two round holes 13, and one of them round hole 13 is passed to the outer wall of pole 10 of buckling, and ring body 11 is located circular slot 12, is provided with second spring 29 on the ring body 11.
Referring to fig. 1 and 3, the microetching liquid is located in the circular groove 12, and the two circular holes 13 are both communicated with the circular groove 12, so that the container 3 is of a hollow structure; in addition, one end of the second spring 29 is connected to the ring body 11, and the other end is connected to the inner wall of the circular groove 12.
Further, coupling assembling is including the fixed spacing ring 14 that cup joints on the outer wall of container 3, and container 3 is connected with connecting block 15, and connecting block 15 has a spacing groove 16 and a connecting groove 17, sets up two lines of parallel arrangement's spout 18 on the connecting block 15.
Referring to fig. 3 and 4, the micro-etching solution enters the communicating groove 17 on the connecting block 15 under the action of gravity; the connection block 15 can be rotated around the central axis of the container 3 by the arrangement of the limiting ring 14 and the limiting groove 16.
Further, the limiting assembly comprises two sliding blocks 19, the two sliding blocks 19 are respectively located in the corresponding sliding grooves 18, the sliding blocks 19 are fixedly connected with first plate bodies 20, and the two first plate bodies 20 are fixedly connected with two second plate bodies 21.
Referring to fig. 4, the cross-section of each of the sliding blocks 19 and the sliding grooves 18 is in a "convex" shape, so that the sliding blocks 19 can slide in the corresponding sliding grooves 18 without falling.
A groove body 22 has been seted up to one of them second plate body 21, pull groove 23 has been seted up to another second plate body 21, the first fixed plate 24 of two second plate body 21 fixedly connected with, pull groove 23 sliding connection has the arm-tie 25, the arm-tie 25 is connected with one of them second plate body 21 through third spring 26, arm-tie 25 fixedly connected with second fixed plate 27, all seted up a plurality of through-holes 28 on first fixed plate 24 and the second fixed plate 27.
Referring to fig. 5, 6 and 7, it should be noted that when the pulling plate 25 is not acted by an artificial main force, the third spring 26 connected to the pulling plate 25 drives one side of the second fixing plate 27 into the slot 22, and at this time, the through holes 28 on the first fixing plate 24 and the second fixing plate 27 do not correspond to each other, that is: the micro-etching liquid in the connecting block 15 stays on the first fixing plate 24 and does not fall down.
The working principle of the utility model is as follows:
using two clamping components, placing the substrate to be subjected to the micro-etching operation on the placing disc 1 and clamping the substrate;
by rotating the bending rod 10, rotating the connecting block 15 and pulling the connecting block 15 to move downwards, the two first plate bodies 20 and the two second plate bodies 21 are contacted with the copper coating on the base plate;
the pulling plate 25 is pulled instantly to drive the second fixing plate 27 to move instantly towards the direction far away from the groove body 22, at a certain moment, the through holes 28 on the first fixing plate 24 and the second fixing plate 27 are communicated with each other, the micro-etching liquid uniformly falls on the copper coating layer on the base plate to carry out micro-etching operation, the connecting block 15 is loosened, under the action of the second spring 29, the connecting block 15 moves upwards to drive the two first plate bodies 20 and the two second plate bodies 21 to be far away from the base plate, residual micro-etching liquid on the copper coating layer is wiped by a paper towel, the base plate is taken down, and the operation is finished.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (6)
1. The utility model provides a copper base plate processing is with declining device, its characterized in that, includes that one places dish (1), it is connected with two grip blocks (2), two respectively through two centre gripping subassemblies to place dish (1) outer wall grip block (2) are located place the top of dish (1), the outer wall of placing dish (1) is connected with container (3) through the installation component, contain the little liquid that loses in container (3), container (3) are connected with the restriction subassembly through coupling assembling, the restriction subassembly is used for the position of accurate control little liquid that loses on base plate copper coating.
2. The microetching device for processing the copper substrate according to claim 1, wherein the two clamping assemblies are symmetrically arranged, each clamping assembly comprises a fixed block (4) fixedly connected with the placing plate (1), each fixed block (4) is provided with a sliding hole (5), a sliding rod (6) is slidably connected to the inner wall of each sliding hole (5), one end of each sliding rod (6) is fixedly connected with the moving plate (7), the other end of each sliding rod is fixedly connected with the corresponding clamping block (2), a first spring (8) is sleeved on the outer wall of each sliding rod (6), and two ends of each first spring (8) are respectively connected with the moving plate (7) and the corresponding fixed block (4).
3. The microetching device for processing the copper substrate according to claim 1, wherein the mounting assembly comprises a mounting block (9) fixedly connected with the placing disc (1), the mounting block (9) is rotatably connected with a bending rod (10), a ring body (11) is fixedly sleeved at one end of the bending rod (10), the container (3) is cylindrical in appearance, the container (3) is provided with a circular groove (12) and two circular holes (13), the outer wall of the bending rod (10) penetrates through one of the circular holes (13), the ring body (11) is located in the circular groove (12), and a second spring (29) is arranged on the ring body (11).
4. The microetching device for processing the copper substrate according to claim 1, wherein the connecting assembly comprises a limiting ring (14) fixedly sleeved on the outer wall of the container (3), the container (3) is connected with a connecting block (15), the connecting block (15) is provided with a limiting groove (16) and a connecting groove (17), and two rows of sliding grooves (18) arranged in parallel are formed in the connecting block (15).
5. The microetching device for processing the copper substrate according to claim 4, wherein the limiting assembly comprises two sliding blocks (19), the two sliding blocks (19) are respectively positioned in the corresponding sliding grooves (18), the sliding blocks (19) are fixedly connected with first plate bodies (20), and the two first plate bodies (20) are fixedly connected with second plate bodies (21).
6. The microetching device for processing the copper base plate according to claim 5, wherein one of the second plate bodies (21) is provided with a groove body (22), the other second plate body (21) is provided with a pull groove (23), the two second plate bodies (21) are fixedly connected with a first fixing plate (24), the pull groove (23) is slidably connected with a pull plate (25), the pull plate (25) is connected with one of the second plate bodies (21) through a third spring (26), the pull plate (25) is fixedly connected with a second fixing plate (27), and the first fixing plate (24) and the second fixing plate (27) are respectively provided with a plurality of through holes (28).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220522929.0U CN216947205U (en) | 2022-03-09 | 2022-03-09 | Micro-etching device for processing copper substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220522929.0U CN216947205U (en) | 2022-03-09 | 2022-03-09 | Micro-etching device for processing copper substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216947205U true CN216947205U (en) | 2022-07-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220522929.0U Active CN216947205U (en) | 2022-03-09 | 2022-03-09 | Micro-etching device for processing copper substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216947205U (en) |
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- 2022-03-09 CN CN202220522929.0U patent/CN216947205U/en active Active
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Address after: 27th floor, Olympic building, No.2 Shangbao Road, Futian District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Jialichuang Technology Group Co.,Ltd. Address before: 27th floor, Olympic building, No.2 Shangbao Road, Futian District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN JIALICHUANG TECHNOLOGY DEVELOPMENT CO.,LTD. |