CN216941715U - Water cooling plant is used in sizing material cooling - Google Patents
Water cooling plant is used in sizing material cooling Download PDFInfo
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- CN216941715U CN216941715U CN202220575810.XU CN202220575810U CN216941715U CN 216941715 U CN216941715 U CN 216941715U CN 202220575810 U CN202220575810 U CN 202220575810U CN 216941715 U CN216941715 U CN 216941715U
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- water
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- heat exchange
- sizing material
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Abstract
The utility model provides a water cooling device for rubber material cooling, which comprises a shell, wherein a water storage tank and a heat exchange region are arranged in the shell, the heat exchange region is positioned below the water storage tank, a fin heat exchange tube group, a circulating water pump and a cooling fan are arranged in the heat exchange region, the input end of the fin heat exchange tube group is connected with the water storage tank, the output end of the fin heat exchange tube group is connected with the input end of the circulating water pump, the output end of the circulating water pump supplies water to the water storage tank, the left side and the right side of the heat exchange region are respectively provided with an air inlet and an air outlet, and the cooling fan is arranged at the air inlet. This water cooling device can carry out endless cooling to pond water for the cooling and handle to pond water cycle uses, and the water economy resource ensures that the sizing material can carry out rapid cooling in the water temperature of lower temperature, and in addition, cooling device possesses supplementary cooling subassembly, can play supplementary cooling effect when pond water temperature is higher.
Description
[ technical field ] A
The utility model relates to the field of water cooling, in particular to a water cooling device for cooling sizing materials.
[ background ] A method for producing a semiconductor device
After the injection plastic material is produced, the surface has a high problem, the temperature of the adhesive material must be reduced before the next production is carried out, water cooling is a common cooling mode, the adhesive material can be rapidly cooled by being soaked in water, but the temperature of the water can be gradually increased, when the water temperature is increased to a certain degree, the cooling effect on the adhesive material is greatly reduced, the cooling time is also increased, the low water temperature is mainly kept by injecting fresh cold water at present, but the cost is increased.
For this reason, further improvements are necessary.
[ Utility model ] A method for manufacturing a semiconductor device
The utility model aims to overcome the problems and provides a water cooling device for sizing material cooling, which can perform circulating cooling treatment on pool water and ensure that the pool water is kept at a low water temperature.
In order to achieve the purpose, the utility model provides a water cooling device for cooling sizing materials, which comprises a shell, wherein a water storage tank and a heat exchange region are arranged in the shell, the heat exchange region is positioned below the water storage tank, a fin heat exchange tube group, a circulating water pump and a cooling fan are arranged in the heat exchange region, the input end of the fin heat exchange tube group is connected with the water storage tank, the output end of the fin heat exchange tube group is connected with the input end of the circulating water pump, the output end of the circulating water pump supplies water to the water storage tank, the left side and the right side of the heat exchange region are respectively provided with an air inlet and an air outlet, and the cooling fan is arranged at the air inlet.
In one or more embodiments, an air guide plate is disposed at an air outlet end of the heat dissipation fan, and the air guide plate is used for guiding air to the fin heat exchange tube set.
In one or more embodiments, the fin heat exchange tube group comprises a plurality of layers of fin heat exchange tubes, and each layer of fin heat exchange tube is arranged in a roundabout manner.
In one or more embodiments, be provided with supplementary cooling assembly on the casing, supplementary cooling assembly includes semiconductor refrigeration piece and radiator, and the cold junction of semiconductor refrigeration piece is laminated in the outer wall of cistern, and the radiator is laminated in the hot junction of semiconductor refrigeration piece.
In one or more embodiments, the auxiliary cooling component further includes a heat dissipation fan, and an air outlet end of the heat dissipation fan corresponds to the heat sink.
In one or more embodiments, the water reservoir is provided with a temperature sensor for monitoring the temperature of the water in the water reservoir, and the semiconductor chilling plate works when the temperature of the water in the water reservoir is higher than a set temperature.
In one or more embodiments, a thermal insulation layer is disposed between the water reservoir and the heat exchange region.
Compared with the background technology, the utility model has the following effects: this water cooling plant can carry out the cooling processing that circulates to pond water for the cooling to pond water circulation uses, and the water economy resource ensures that the sizing material can carry out rapid cooling in the water temperature of low temperature, and in addition, cooling plant possesses supplementary cooling subassembly, can play supplementary cooling effect when pond water temperature is higher.
[ description of the drawings ]
Fig. 1 is a schematic structural diagram of a water cooling apparatus according to an embodiment of the present invention.
[ detailed description ] embodiments
For the purpose of enhancing the understanding of the present invention, the present invention will be further described in detail with reference to the following examples and the accompanying drawings, which are only used for explaining the present invention and are not to be construed as limiting the scope of the present invention.
Referring to the attached drawing 1, the utility model provides a water cooling device for cooling sizing material, which comprises a shell 1, wherein a water storage tank 2 and a heat exchange area 3 are arranged in the shell 1, the heat exchange area 3 is positioned below the water storage tank 2, a heat insulation layer is arranged between the water storage tank 2 and the heat exchange area 3 to reduce the transfer of heat, the heat insulation layer can adopt asbestos, a vacuum plate and the like, a fin heat exchange tube set 4, a circulating water pump 5 and a heat dissipation fan 6 are arranged in the heat exchange area 3, the input end of the fin heat exchange tube set 4 is connected with the water storage tank 2, the output end of the fin heat exchange tube set 4 is connected with the input end of the circulating water pump 5, the output end of the circulating water pump 5 supplies water to the water storage tank 2, the water in the water storage tank is output to the water storage tank again after heat exchange through the fin heat exchange tube set, the left side and the right side of the heat exchange area 3 are respectively provided with an air inlet and an air outlet, and the heat dissipation fan 6 is arranged at the air inlet, the heat radiating fan blows external cold air to the fin heat exchange tube group, the cold air takes away heat of the fin heat exchange tube group, so that the temperature of the fin heat exchange tube group is reduced, and the fin heat exchange tube group with the reduced temperature is beneficial to cooling pool water in the water storage pool.
The air outlet end of the heat dissipation fan 6 is provided with an air deflector 7, and the air deflector 7 is used for guiding air to the fin heat exchange tube group 4, so that the heat dissipation fan can cool the fin heat exchange tube group better, and meanwhile, the air is prevented from being mixed in the heat exchange area. The fin heat exchange tube set 4 comprises a plurality of layers of fin heat exchange tubes, and each layer of fin heat exchange tube is arranged in a roundabout mode, so that the fin heat exchange tube set has more heat exchange areas, and the cooling efficiency is improved.
Be provided with supplementary cooling assembly on casing 1, supplementary cooling assembly includes semiconductor refrigeration piece 8 and radiator 9, and the cold junction laminating of semiconductor refrigeration piece 8 in the outer wall of cistern 2, radiator 9 laminate in the hot junction of semiconductor refrigeration piece 8, and semiconductor refrigeration piece during operation, cold junction are to cistern refrigeration treatment, and the radiator is the hot junction heat dissipation of semiconductor refrigeration piece, supplementary cooling assembly still includes radiator fan 10, and radiator fan 10's air-out terminal corresponds radiator 9 to dispel the heat with higher speed to the radiator.
The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiment, but equivalent modifications or changes made by those skilled in the art according to the present disclosure should be included in the scope of the present invention as set forth in the appended claims.
Claims (7)
1. The utility model provides a sizing material cooling water cooling plant which characterized in that: including casing (1), be equipped with cistern (2) and heat transfer region (3) in casing (1), heat transfer region (3) are located the below of cistern (2), be equipped with fin heat transfer pipe group (4), circulating water pump (5) and cooling fan (6) in heat transfer region (3), the input and the cistern (2) of fin heat transfer pipe group (4) are connected, and the output of fin heat transfer pipe group (4) is connected with circulating water pump (5)'s input, and circulating water pump (5)'s output supplies water for cistern (2), and the left and right sides of heat transfer region (3) is equipped with air intake and air outlet respectively, and air intake department is located in cooling fan (6).
2. The water cooling device for sizing material cooling according to claim 1, characterized in that: and an air guide plate (7) is arranged at the air outlet end of the heat dissipation fan (6), and the air guide plate (7) is used for guiding air to the fin heat exchange tube set (4).
3. The water cooling device for sizing material cooling according to claim 1, characterized in that: the fin heat exchange tube group (4) comprises a plurality of layers of fin heat exchange tubes, and each layer of fin heat exchange tube is arranged in a roundabout mode.
4. The water cooling device for sizing material cooling according to claim 1, characterized in that: be provided with supplementary cooling assembly on casing (1), supplementary cooling assembly includes semiconductor refrigeration piece (8) and radiator (9), and the cold junction laminating of semiconductor refrigeration piece (8) is in the outer wall of cistern (2), and radiator (9) laminate in the hot junction of semiconductor refrigeration piece (8).
5. The water cooling device for sizing material cooling according to claim 4, characterized in that: the auxiliary cooling assembly further comprises a heat dissipation fan (10), and the air outlet end of the heat dissipation fan (10) corresponds to the radiator (9).
6. The water cooling device for sizing material cooling according to claim 4, characterized in that: the cistern (2) is equipped with temperature-sensing ware (11) that are used for monitoring pond water temperature, when pond water temperature is greater than and when setting for the temperature, semiconductor refrigeration piece (8) work.
7. The water cooling device for sizing material cooling according to claim 1, characterized in that: and a heat insulation layer is arranged between the water storage tank (2) and the heat exchange area (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220575810.XU CN216941715U (en) | 2022-03-16 | 2022-03-16 | Water cooling plant is used in sizing material cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220575810.XU CN216941715U (en) | 2022-03-16 | 2022-03-16 | Water cooling plant is used in sizing material cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216941715U true CN216941715U (en) | 2022-07-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220575810.XU Active CN216941715U (en) | 2022-03-16 | 2022-03-16 | Water cooling plant is used in sizing material cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216941715U (en) |
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2022
- 2022-03-16 CN CN202220575810.XU patent/CN216941715U/en active Active
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