CN216930398U - A high frequency circuit board for 5G communication - Google Patents
A high frequency circuit board for 5G communication Download PDFInfo
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- CN216930398U CN216930398U CN202220069604.1U CN202220069604U CN216930398U CN 216930398 U CN216930398 U CN 216930398U CN 202220069604 U CN202220069604 U CN 202220069604U CN 216930398 U CN216930398 U CN 216930398U
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Abstract
The utility model discloses a high-frequency circuit board for 5G communication, which belongs to the technical field of circuit boards and comprises a circuit board body, wherein mounting holes are formed in four corners of the circuit board body in a penetrating manner, an end sealing groove is formed in the top surface of one end of the circuit board body in a surrounding manner, a limiting connecting notch is formed in one end, far away from the end sealing groove, of the circuit board body, side sealing grooves are symmetrically formed in the top surface of the circuit board body on two sides of the limiting connecting notch, a bottom heat dissipation sealing box is arranged on the lower side of the circuit board body, an end sealing cover plate is arranged on one end, close to the end sealing groove, of the bottom heat dissipation sealing box, and side sealing cover plates are symmetrically arranged on two sides, close to the side sealing groove; the air cooling device can improve the contact area of the air cooling source and the circuit board while reducing the contact area with the bottom surface of the circuit board, and further improve the radiation area of the air cooling source, so that the heat dissipation effect is more prominent, and the failure rate of the circuit board is reduced.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-frequency circuit board for 5G communication.
Background
Along with the continuous progress of science and technology, people have researched and developed the high frequency circuit board that supports 5G communication, and the circuit board is when carrying out a large amount of receiving and dispatching signals, and its circuit board itself can produce higher heat, and the heat is higher then can make the components and parts on the circuit board take place to damage, consequently need cooperate cooling module to use simultaneously at the during operation.
For example, the high-frequency circuit board provided by the application number 202110862157.5 can cool the circuit board through the S-shaped pipeline attached to the bottom surface of the circuit board, but when the S-shaped pipeline is attached to the bottom surface of the circuit board, pins on the bottom surface of the circuit board are likely to be abraded and damaged due to long-time work, the failure rate of the circuit board is improved, and although a plurality of air exhaust holes are formed in the top surface of the S-shaped pipeline to cool the circuit board, the radiation area of a cold air source is limited, so that the heat dissipation effect is not so prominent.
SUMMERY OF THE UTILITY MODEL
1. Technical problem to be solved
Aiming at the problems in the prior art, the utility model aims to provide a high-frequency circuit board for 5G communication, which can reduce the contact area with the bottom surface of the circuit board, improve the contact area between an air cooling source and the circuit board, further improve the radiation area of the air cooling source, make the heat dissipation effect more prominent and reduce the failure rate of the circuit board.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A high-frequency circuit board for 5G communication comprises a circuit board body, wherein mounting holes are formed in four corners of the circuit board body in a penetrating manner, an end sealing groove is formed in the top surface of one end of the circuit board body in a surrounding manner, a limiting connecting gap is formed in the end, far away from the end sealing groove, of the circuit board body, side sealing grooves are symmetrically formed in the top surface of the circuit board body on two sides of the limiting connecting gap, a bottom heat dissipation sealing box is arranged on the lower side of the circuit board body, an end sealing cover plate is arranged at one end, close to the end sealing groove, of the bottom heat dissipation sealing box, side sealing cover plates are symmetrically arranged on two sides, close to the side sealing groove, of the end sealing cover plates and the side sealing cover plates surround and wrap the side edge of the circuit board body, an installation support plate is arranged at one end, far away from the end sealing cover plate, and a refrigeration mechanism for providing a wind cold source is fixedly installed on the top surface of the installation support plate, the bottom heat dissipation sealing box is provided with an air inlet close to one end of the installation support plate, the air inlet is connected with the refrigerating mechanism, and air outlet holes are formed in the inner side surfaces of the end sealing cover plate and the side sealing cover plate in a penetrating mode.
Furthermore, the end sealing cover plate and the bottom surface of the side sealing cover plate are all provided with sealing rubber strips in a surrounding mode, and the sealing rubber strips are embedded into the end sealing grooves and are in interference fit with the end sealing grooves.
Furthermore, the bottom heat dissipation sealing box inner cavity equidistance staggered array is provided with a spacing plate, and the spacing plate separates the bottom heat dissipation sealing box inner cavity to form an S-shaped circular extension channel.
Furthermore, the top surface of the partition board is attached to the bottom surface of the circuit board body, and the rubber layer is wrapped on the attaching surface of the partition board.
Furthermore, the four corners of the bottom heat dissipation sealing box are provided with connecting support legs, the central hole of each connecting support leg is the same as the diameter of the mounting hole, and the central axes of the connecting support legs coincide with each other.
Furthermore, refrigeration mechanism includes casing and fixed mounting in the blast pipe of casing air outlet, the casing is keeping away from blast pipe one end has been seted up the fresh air inlet, the casing is inside being close to blast pipe one end fixed mounting has fan assembly, the casing is inside fan assembly with fixed mounting has the refrigeration piece between the fresh air inlet, the blast pipe is kept away from casing one end with the air intake is connected.
Furthermore, the casing top surface is in the refrigeration piece with seted up the installation notch between the fresh air inlet, the inside filter screen that can dismantle the grafting of installation notch.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages that:
this scheme is provided with end heat dissipation seal box and refrigeration mechanism and cooperatees, can form "S" shape ventiduct between circuit board body bottom surface and end heat dissipation seal box inner chamber, when reducing with circuit board body bottom surface area of contact, improve the area of contact of wind cold source and circuit board, and then can reduce the fault rate of circuit board, cold wind source can not cause the secondary heating to the circuit board body after the while heat absorption, also avoided piling up in circuit board body bottom surface simultaneously, the discharge is more smooth, thereby can great degree improve radiating efficiency and radiating effect.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic structural view of a bottom heat dissipation sealing box according to the present invention;
FIG. 4 is a schematic view of a bottom heat dissipation sealing case according to the present invention;
fig. 5 is an exploded view of the refrigeration mechanism of the present invention.
The reference numbers in the figures illustrate:
1. a circuit board body; 2. mounting holes; 3. a limiting connection gap; 4. an end seal groove; 5. a side seal groove; 6. a bottom heat dissipation seal box; 7. an end seal cover plate; 8. a side sealing cover plate; 9. a partition plate; 10. an air outlet; 11. sealing rubber strips; 12. an air inlet; 13. mounting a support plate; 14. connecting support legs; 15. a housing; 16. an air supply pipe; 17. a refrigeration plate; 18. a fan assembly; 19. an air inlet hole; 20. installing a notch; 21. and (4) a filter screen.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
Example 1:
referring to fig. 1-5, a high frequency circuit board for 5G communication comprises a circuit board body 1, wherein four corners of the circuit board body 1 are penetrated by mounting holes 2, an end sealing groove 4 is formed around the top surface of one end of the circuit board body 1, a limit connecting notch 3 is formed at one end of the circuit board body 1 away from the end sealing groove 4, side sealing grooves 5 are symmetrically formed on two sides of the limit connecting notch 3 on the top surface of the circuit board body 1, a bottom heat dissipation sealing box 6 is arranged on the lower side of the circuit board body 1, an end sealing cover plate 7 is arranged on one end of the bottom heat dissipation sealing box 6 close to the end sealing groove 4, side sealing cover plates 8 are symmetrically arranged on two sides close to the side sealing groove 5, the end sealing cover plate 7 and the side sealing cover plate 8 surround the side edge of the circuit board body 1, and a mounting support plate 13 is arranged on one end of the bottom heat dissipation sealing box 6 away from the end sealing cover plate 7, the top surface of the installation support plate 13 is fixedly provided with a refrigeration mechanism for providing an air cooling source, the bottom heat dissipation sealing box 6 is close to one end of the installation support plate 13 and is provided with an air inlet 12, the air inlet 12 is connected with the refrigeration mechanism, and the inner side surfaces of the end sealing cover plate 7 and the side sealing cover plate 8 are provided with air outlet holes 10 in a penetrating mode.
Referring to fig. 2 and 3, sealing rubber strips 11 are arranged on the bottom surfaces of the end sealing cover plate 7 and the side sealing cover plate 8 in a surrounding manner, and meanwhile, the sealing rubber strips 11 are embedded in the end sealing grooves 4 and are in interference fit, so that the connection sealing performance between the bottom heat dissipation sealing box 6 and the circuit board body 1 can be ensured.
Referring to fig. 3 and 4, the bottom heat dissipation sealing box 6 is provided with the partition plates 9 in the equidistantly staggered array in the inner cavity, and the partition plates 9 can be used to partition the inner cavity of the bottom heat dissipation sealing box 6 into the S-shaped circular extension channel, so that the cold air source can flow around the inner part of the bottom heat dissipation sealing box 6, and the contact area and the contact time with the circuit board body 1 are increased, thereby improving the heat dissipation effect.
Referring to fig. 3 and 4, a sealed S-shaped air duct can be formed by attaching the top surface of the partition board 9 to the bottom surface of the circuit board body 1, and the adhesive surface of the partition board 9 is covered with a rubber layer, so that the pins of the bottom contact surface of the circuit board body 1 can be protected, the pins are prevented from being worn, and the failure rate of the device is reduced.
Referring to fig. 1-3, the bottom heat dissipation sealing box 6 is provided with connecting support legs 14 at four corners, and the central hole of the connecting support leg 14 has the same diameter as the mounting hole 2 and the central axis coincides with the central axis, so that the device can be fixed by using the fixing screw of the circuit board body 1 without separately arranging a fixing mechanism, thereby facilitating the fixed connection of the device and saving the cost.
Referring to fig. 2 and 5, the refrigeration mechanism includes a housing 15 and a blast pipe 16 fixedly installed at an air outlet of the housing 15, an air inlet 19 is opened at one end of the housing 15 far away from the blast pipe 16, a fan assembly 18 is fixedly installed at one end of the housing 15 close to the blast pipe 16, a refrigeration sheet 17 is fixedly installed between the fan assembly 18 and the air inlet 19 inside the housing 15, the fan assembly 18 can be used to suck external air through the air inlet 19 to generate an air source, and then the air source is formed after the temperature of the refrigeration sheet 17 is reduced, and meanwhile, one end of the blast pipe 16 far away from the housing 15 is connected with the air inlet 12, so that the air source can be sent into the bottom heat dissipation sealing box 6 through the blast pipe 16.
Referring to fig. 5, an installation notch 20 is formed in the top surface of the housing 15 between the refrigeration sheet 17 and the air inlet 19, and meanwhile, a filter screen 21 is detachably inserted into the installation notch 20, so that gas sucked from the outside can be filtered, dust is prevented from blocking an air outlet of the refrigeration mechanism, and the use reliability of the device is improved.
When in use: the circuit board body 1 and the bottom heat dissipation seal box 6 are assembled into a whole, the side edges are sealed through the end seal cover plate 7 and the side seal cover plate 8, the top surface of the partition plate 9 is attached to the bottom surface of the circuit board body 1, an S-shaped ventilation channel is formed between the bottom surface of the circuit board body 1 and the inner cavity of the bottom heat dissipation seal box 6, the contact area of an air cooling source and a circuit board is increased while the contact area with the bottom surface of the circuit board body 1 is reduced, the cooling source can be transmitted into the bottom heat dissipation seal box 6 through the air inlet 12 by the refrigeration mechanism, the heat can be absorbed by the uniform flow of the S-shaped ventilation channel on the bottom surface of the circuit board body 1 and discharged from the air outlet 10 after flowing through the inside of the bottom heat dissipation seal box 6 and the end seal cover plate 7, and then discharged out of the device, secondary heating of the circuit board body 1 cannot be caused, and meanwhile accumulation on the bottom surface of the circuit board body 1 is avoided, the cold air source is discharged more smoothly after heat absorption, and further the heat dissipation efficiency and the heat dissipation effect can be improved to a greater degree.
The foregoing is only a preferred embodiment of the present invention; the scope of the utility model is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (7)
1. A high frequency circuit board for 5G communication, includes circuit board body (1), its characterized in that: the four corners of the circuit board body (1) are penetrated and provided with mounting holes (2), the top surface of one end of the circuit board body (1) is surrounded and provided with an end sealing groove (4), the end of the circuit board body (1) far away from the end sealing groove (4) is provided with a limiting connecting notch (3), the top surface of the circuit board body (1) is symmetrically provided with side sealing grooves (5) at two sides of the limiting connecting notch (3), the lower side of the circuit board body (1) is provided with a bottom heat dissipation sealing box (6), one end of the bottom heat dissipation sealing box (6) close to the end sealing groove (4) is provided with an end sealing cover plate (7), and two sides of the bottom heat dissipation sealing box (6) close to the side sealing groove (5) are symmetrically provided with side sealing cover plates (8), and the end sealing cover plates (7) and the side sealing cover plates (8) surround and wrap the side sealing cover plates (8) of the circuit board body (1), end heat dissipation seal box (6) are keeping away from end seal cover board (7) one end is provided with installation extension board (13), installation extension board (13) top surface fixed mounting has the refrigeration mechanism who is used for providing the air cooling source, end heat dissipation seal box (6) are being close to installation extension board (13) one end has seted up air intake (12), air intake (12) with refrigeration mechanism is connected, end seal cover board (7) with side seal cover board (8) inboard surface all runs through and has seted up exhaust vent (10).
2. A high-frequency wiring board for 5G communication according to claim 1, characterized in that: and sealing rubber strips (11) are arranged on the bottom surfaces of the end sealing cover plate (7) and the side sealing cover plate (8) in a surrounding manner, and the sealing rubber strips (11) are embedded into the end sealing groove (4) and are in interference fit with each other.
3. A high-frequency wiring board for 5G communication according to claim 1, characterized in that: the bottom heat dissipation sealing box (6) inner cavity equidistance staggered array is provided with a spacing plate (9), the spacing plate (9) separates the bottom heat dissipation sealing box (6) inner cavity to form an S-shaped circulation extension channel.
4. A high-frequency wiring board for 5G communication according to claim 3, characterized in that: the top surface of the spacing plate (9) is attached to the bottom surface of the circuit board body (1), and the rubber layer wraps the attaching surface of the spacing plate (9).
5. A high-frequency wiring board for 5G communication according to claim 1, characterized in that: the four corners of the bottom heat dissipation sealing box (6) are provided with connecting support legs (14), a central hole of each connecting support leg (14) is identical to the diameter of the corresponding mounting hole (2), and the central axes of the connecting support legs coincide with the central axes of the mounting holes.
6. A high-frequency wiring board for 5G communication according to claim 1, characterized in that: refrigeration mechanism includes casing (15) and fixed mounting in blast pipe (16) of casing (15) air outlet, casing (15) are keeping away from blast pipe (16) one end has seted up fresh air inlet (19), casing (15) are inside being close to blast pipe (16) one end fixed mounting has fan assembly (18), casing (15) are inside fan assembly (18) with fixed mounting has refrigeration piece (17) between fresh air inlet (19), blast pipe (16) are kept away from casing (15) one end with air intake (12) are connected.
7. A high-frequency circuit board for 5G communication according to claim 6, characterized in that: the top surface of the shell (15) is provided with a mounting notch (20) between the refrigeration sheet (17) and the air inlet hole (19), and a filter screen (21) is detachably inserted in the mounting notch (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220069604.1U CN216930398U (en) | 2022-01-12 | 2022-01-12 | A high frequency circuit board for 5G communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220069604.1U CN216930398U (en) | 2022-01-12 | 2022-01-12 | A high frequency circuit board for 5G communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216930398U true CN216930398U (en) | 2022-07-08 |
Family
ID=82262489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220069604.1U Active CN216930398U (en) | 2022-01-12 | 2022-01-12 | A high frequency circuit board for 5G communication |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216930398U (en) |
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2022
- 2022-01-12 CN CN202220069604.1U patent/CN216930398U/en active Active
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