CN216928303U - Controller structure and thin film capacitor group thereof - Google Patents

Abstract

The utility model discloses a controller structure and a thin film capacitor group thereof, wherein the thin film capacitor group comprises: the film core is arranged in the shell; the positive plate and the negative plate are arranged in the shell, the positive plate is electrically connected with the positive electrode of the film core, and the negative plate is electrically connected with the negative electrode of the film core; the positive input pin is fixedly connected with the positive plate and is partially exposed out of the shell, and the negative input pin is fixedly connected with the negative plate and is partially exposed out of the shell; the positive output pins are fixedly connected with the positive plate and partially exposed out of the shell, and the negative output pins are fixedly connected with the negative plate and partially exposed out of the shell. The structural design of the thin film capacitor bank can reduce the development investment of a mold and reduce the occupied space.

Description

Controller structure and thin film capacitor group thereof

Technical Field

The utility model relates to the technical field of electric elements, in particular to a controller structure and a thin film capacitor bank thereof.

Background

The thin film capacitor is an important component inside the motor controller, and generally, a thin film capacitor needs to be configured in one controller. In the prior art, some electric vehicles are provided with two motor controllers, and some electric vehicles are provided with a dual-module motor controller, or some electric vehicles are provided with a motor controller and a generator controller, and at the moment, each controller needs to be provided with a thin film capacitor, and the electric vehicles need to be provided with two thin film capacitors which are integrated with the two controllers in two control boxes respectively. So, a plurality of moulds need to be opened to different film capacitor and controller, and product development mould expense and research and development resource input are great, and two control box assemble respectively, and occupation space is great.

SUMMERY OF THE UTILITY MODEL

In view of the above, a first object of the present invention is to provide a thin film capacitor bank, which has a structure designed to reduce the investment of mold development and reduce the occupied space, and a second object of the present invention is to provide a controller structure including the thin film capacitor bank.

In order to achieve the first object, the utility model provides the following technical scheme:

a thin film capacitor bank, comprising:

the film core is arranged in the shell;

the positive plate and the negative plate are arranged in the shell, the positive plate is electrically connected with the positive electrode of the film core, and the negative plate is electrically connected with the negative electrode of the film core;

the positive input pin is fixedly connected with the positive plate and is partially exposed out of the shell, and the negative input pin is fixedly connected with the negative plate and is partially exposed out of the shell;

the positive output pins are fixedly connected with the positive plate and partially exposed out of the shell, and the negative output pins are fixedly connected with the negative plate and partially exposed out of the shell.

Preferably, in the thin film capacitor bank, the plurality of thin film cores are divided into a plurality of groups of thin film cores;

the negative plate includes a plurality of negative plates of branch, and a plurality of negative plates of branch are connected with the negative pole electricity of multiunit film core respectively, and are a plurality of divide the equal fixedly connected with negative pole keysets of negative plate, adjacent two divide and connect through current sensor electricity between the negative pole keysets of negative plate.

Preferably, in the above thin film capacitor bank, at least one wall of the housing is a heat dissipation plate and a heat dissipation channel is disposed inside the heat dissipation plate; or a heat dissipation plate is arranged on the outer side of at least one wall of the shell, and a heat dissipation channel is arranged in the heat dissipation plate; or the bottom wall of the shell is a heat dissipation plate, and a heat dissipation channel is arranged in the heat dissipation plate.

A controller structure comprising a thin film capacitor bank as claimed in any one of the preceding claims.

Preferably, the controller structure further includes:

the power supply comprises a box body, a power supply circuit and a power supply control circuit, wherein a positive electrode input end, a negative electrode input end and at least one group of three-phase connecting terminals are arranged on the box body, and the three-phase connecting terminals comprise a U connecting terminal, a V connecting terminal and a W connecting terminal; the thin film capacitor bank is arranged in the box body, the positive input end of the thin film capacitor bank is electrically connected with the positive input pin of the thin film capacitor bank, and the negative input end of the thin film capacitor bank is electrically connected with the negative input pin of the thin film capacitor bank;

the power module is arranged in the box body and comprises a plurality of positive pins and a plurality of negative pins corresponding to the positive pins respectively, the positive pins are electrically connected with a plurality of positive output pins of the thin film capacitor bank respectively, and the negative pins are electrically connected with a plurality of negative output pins of the thin film capacitor bank respectively; the power module includes at least a set of three-phase terminal, the three-phase terminal includes U terminal, V terminal and W terminal, arbitrary a set of three-phase connection terminal on the box is connected with at least a set of three-phase terminal electricity of power module.

Preferably, in the above controller structure, the power module is electrically connected to the three-phase connection terminal of the box body through a switching assembly.

Preferably, in the above controller structure, the adapter assembly includes an insulating wire holder, and the insulating wire holder is used for fixing the connecting guide piece.

Preferably, in the controller structure, the adapter assembly further includes a plurality of first guide connectors, a plurality of second guide connectors, and a main guide connector, the plurality of first guide connectors, the plurality of second guide connectors, and the main guide connector are all fixedly connected to the insulating wire holder, and the plurality of first guide connectors and the plurality of second guide connectors are all lapped with the main guide connector;

the first guide connecting pieces are electrically connected with the positive pins and the negative pins of the power module respectively, and the second guide connecting pieces are electrically connected with the three-phase connecting terminals on the box body respectively.

Preferably, in the above controller structure, the adapter module further includes two dc connectors fixedly connected to the insulating wire holder, and the two dc connectors are used to electrically connect the positive input terminal and the negative input terminal of the box body to the positive input pin and the negative input pin of the thin film capacitor bank, respectively.

Preferably, in the above controller structure, the controller further includes a control board, and a communication output end of the control board is connected to a communication input end of the power module.

Preferably, in the controller structure, the power module is electrically connected to the box body through a switching assembly, the switching assembly includes an insulating wiring seat, two dc connecting pieces, a plurality of first connecting pieces, a plurality of second connecting pieces, and a main connecting piece, the two dc connecting pieces, the plurality of first connecting pieces, the plurality of second connecting pieces, and the main connecting piece are all fixedly connected to the insulating wiring seat, and the plurality of first connecting pieces and the plurality of second connecting pieces are all lapped with the main connecting piece;

the two direct current conducting connectors are used for enabling the positive input end and the negative input end on the box body to be electrically connected with the positive input pin and the negative input pin of the thin film capacitor bank respectively; the first guide connecting pieces are respectively and electrically connected with the positive pins and the negative pins of the power module, and the second guide connecting pieces are respectively and electrically connected with the three-phase connecting terminals on the box body;

the controller structure also comprises a current sampling plate, and a plurality of first guide connecting pieces penetrate through the current sampling plate; and the communication output end of the current sampling plate is connected with the communication input end of the control plate.

Preferably, in the controller structure, the bus bar is a laminated bus bar.

Preferably, in the controller structure, the thin film capacitor bank is the thin film capacitor bank as described above, and a communication output terminal of the current sensor is connected to a communication input terminal of the control board.

Preferably, in the controller structure, a set of three-phase connection terminals is disposed on the box body, the number of the power modules is one, and the power modules include two sets of three-phase terminals; the three-phase connecting terminal is connected with an arbitrary set of three-phase terminal, or the three-phase connecting terminal is connected with two sets of three-phase terminals.

Preferably, in the above controller structure, the power module includes a plurality of sub-power modules; or the power module comprises a first power splitting module and a second power splitting module.

The thin film capacitor bank provided by the utility model comprises a plurality of positive output pins and a plurality of negative output pins, wherein the negative output pins correspond to the positive output pins respectively, so that the positive output pins and the negative output pins can be matched with a plurality of power modules, and further the positive output pins and the negative output pins can be matched with a plurality of controllers for use, namely, one thin film capacitor bank can be matched with a plurality of controllers for use. In addition, the thin film capacitor bank has higher integration level and reduces the occupied space.

In order to achieve the second object, the present invention further provides a controller structure, which includes any one of the thin film capacitor banks described above. Since the thin film capacitor bank has the above technical effects, the controller structure having the thin film capacitor bank should also have corresponding technical effects.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a thin film capacitor bank according to a first embodiment of the present invention;

FIG. 2 is an exploded view of the thin film capacitor bank of FIG. 1;

fig. 3 is a schematic structural diagram of a thin film capacitor bank according to a second embodiment of the present invention;

FIG. 4 is an exploded view of the thin film capacitor bank of FIG. 3;

fig. 5 is a schematic structural diagram of a controller structure according to a third embodiment of the present invention;

fig. 6 is a schematic structural diagram of an adapter assembly according to a third embodiment of the present invention;

fig. 7 is a schematic structural diagram of a controller structure according to a fourth embodiment of the present invention;

fig. 8 is a schematic structural diagram of a controller structure according to a fifth embodiment of the present invention;

fig. 9 is a schematic structural diagram of a junction assembly in a fourth embodiment and a fifth embodiment of the present invention.

In fig. 1-9:

1-thin film capacitor group, 11-positive input pin, 12-negative input pin, 13-shell, 14-positive output pin, 15-negative output pin, 16-thin film core, 17-negative plate, 171-divided negative plate, 18-positive plate, 19-heat dissipation plate, 20-negative adapter plate, 2-control plate, 3-power module, 31-positive pin, 32-negative pin, 4-adapter component, 41-insulating connector base, 42-total connector, 43-first connector, 44-current sampling plate, 45-direct current connector, 46-second connector, 47-laminated busbar, 5-box, 51-positive input end, 52-negative input end, 53-U connecting terminal, 54-V connecting terminal, 55-W connection terminal.

Detailed Description

The first objective of the present invention is to provide a thin film capacitor bank, the structure design of which can reduce the investment of mold development and reduce the occupied space, and the second objective of the present invention is to provide a controller structure comprising the thin film capacitor bank.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left" and "right", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the positions or elements referred to must have specific orientations, be constructed in specific orientations, and be operated, and thus are not to be construed as limitations of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Referring to fig. 1 to 4, a thin film capacitor assembly according to an embodiment of the present invention includes a case 13, a thin film core 16, a positive electrode plate 18, a negative electrode plate 17, a positive input pin 11, a negative input pin 12, a plurality of positive output pins 14, and a plurality of negative output pins 15.

Wherein the film core 16 is disposed in the housing 13, the number of the film cores 16 may be plural. Specifically, the number of the film cores 16 may be 18, 12 or 24, and of course, the number of the film cores 16 may be set according to the actual situation. The film core 16 may be fixed within the housing 13.

Positive electrode plate 18 and negative electrode plate 17 are both disposed within can 13. The positive electrode plate 18 is electrically connected to the positive electrode of the film core 16, specifically, the positive electrode plate 18 is in contact with the positive electrode of the film core 16, or the positive electrode plate 18 is electrically connected to the positive electrode of the film core 16 through a lead, a guide plate, or the like. The negative plate 17 is electrically connected to the negative electrode of the film core 16, and specifically, the negative plate 17 is in contact with the negative electrode of the film core 16, or the negative plate 17 is electrically connected to the negative electrode of the film core 16 through a wire, a guide plate, or the like.

The positive electrode plate 18 and the negative electrode plate 17 may be both copper plates, but the positive electrode plate 18 and the negative electrode plate 17 may be made of other conductive materials, and are not limited herein.

The positive input pin 11 is fixedly connected to the positive plate 18 and partially exposed to the case 13, that is, a portion of the positive input pin 11 is located in the case 13, and another portion of the positive input pin 11 is located outside the case 13. The positive input pin 11 and the positive plate 18 may be of a unitary structure, or the positive input pin 11 and the positive plate 18 may be welded together. The positive input pin 11 is sealed with the housing 13 to improve the sealing performance of the housing 13.

The negative input pin 12 is fixedly connected to the negative plate 17 and partially exposed out of the case 13, i.e., a portion of the negative input pin 12 is located in the case 13 and another portion of the negative input pin 12 is located outside the case 13. The negative input pin 12 and the negative electrode plate 17 may be of an integral structure, or the negative input pin 12 and the negative electrode plate 17 may be welded together. The negative input pin 12 is sealed with the housing 13 to improve the sealing performance of the housing 13.

The positive input pin 11 and the negative input pin 12 are used to be electrically connected to the positive and negative poles of the power supply, respectively.

The plurality of negative output pins 15 correspond to the plurality of positive output pins 14, respectively. Positive output pins 14 are fixedly connected to positive plate 18, and positive output pins 14 are partially exposed from case 13. Specifically, positive output pin 14 and positive plate 18 may be of a unitary structure, or positive output pin 14 and positive plate 18 may be welded together. A portion of positive output pin 14 is located within housing 13 and another portion of positive output pin 14 is located outside housing 13. The positive output pin 14 is sealed with the housing 13 to improve the sealing of the housing 13.

The negative output pins 15 are fixedly connected with the negative plate 17, and the negative output pins 15 are partially exposed out of the shell 13. Specifically, the negative output pin 15 and the negative electrode plate 17 may be of an integral structure, or the negative output pin 15 and the negative electrode plate 17 may be welded together. A portion of the negative output pin 15 is located inside the housing 13 and another portion of the negative output pin 15 is located outside the housing 13. The negative output pin 15 is sealed with the housing 13 to improve the sealing performance of the housing 13.

The thin film capacitor group provided by the utility model comprises a plurality of positive output pins 14 and a plurality of negative output pins 15, and the plurality of negative output pins 15 respectively correspond to the plurality of positive output pins 14, so that the plurality of positive output pins 14 and the plurality of negative output pins 15 can be matched with the plurality of power modules 3, and then the plurality of positive output pins 14 and the plurality of negative output pins 15 can be matched with a plurality of controllers for use, namely, one thin film capacitor group can be matched with a plurality of controllers for use, and the thin film capacitor group integrates a plurality of thin film capacitors. In addition, the thin film capacitor bank 1 is higher in integration level, and occupied space is reduced.

As shown in fig. 1 and fig. 2, in the first embodiment of the present application, the number of the positive output pins 14 and the number of the negative output pins 15 are both 6, and the number of the film cells is 18. Of course, the number of the positive output pins 14 and the negative output pins 15 can be set according to the actual situation, and is not limited herein.

As shown in fig. 3 to 4, in the second embodiment of the present application, the plurality of film cores 16 is divided into a plurality of groups of film cores 16. The negative plate 17 includes a plurality of branch negative plates 171, and a plurality of branch negative plates 171 are connected with the negative pole electricity of multiunit film core 16 respectively, and a plurality of equal fixedly connected with negative pole keysets 20 of branch negative plate 171.

The plurality of groups of film cores 16 are respectively in one-to-one correspondence with the plurality of sub-negative plates 171, and the negative electrode of each group of film cores 16 is electrically connected with the corresponding sub-negative plate 171. Specifically, the negative electrode of each group of film cores 16 is in contact with its corresponding divided negative plate 171 or electrically connected by a wire. Each group of the film cores 16 may include a plurality of the film cores 16, and preferably, each group of the film cores 16 may include 6 film cores 16. The number of the groups of the film cores 16 may be two or more, and is not limited thereto.

The divided negative electrode plate 171 and the negative electrode interposer 20 may be of an integral structure, or the divided negative electrode plate 171 and the negative electrode interposer 20 may be welded together.

The negative electrode adapter plates 20 of two adjacent sub-negative electrode plates 171 are electrically connected through a current sensor, that is, the sub-negative electrode plates 171 are sequentially connected in series, and the current sensor can acquire current information between the two adjacent sub-negative electrode plates 171.

In another embodiment, at least one wall of the housing 13 is a heat sink plate 19 and the heat sink plate 19 is provided with heat dissipation channels therein. Alternatively, the heat dissipation plate 19 is disposed on the outer side of at least one wall of the housing 13, and the heat dissipation channel is disposed inside the heat dissipation plate 19, so that the heat dissipation plate 19 is attached to the wall of the housing 13 to dissipate heat. Alternatively, the bottom wall of the housing 13 is a heat sink 19, and a heat dissipation passage is provided inside the heat sink 19. The fluid flows through the heat dissipation channel to take away the heat of the thin film capacitor assembly 1.

Based on the thin film capacitor bank 1 provided in the above embodiment, the present invention further provides a controller structure, which includes any one of the thin film capacitor banks 1 in the above embodiments. Since the controller structure employs the thin film capacitor assembly 1 in the above embodiment, please refer to the above embodiment for the beneficial effect of the controller structure.

In one embodiment, the controller structure further includes a case 5 and a power module 3. The thin film capacitor group 1 is arranged in the box body 5. The thin film capacitor bank 1 is fixed in the box 5, and specifically, the thin film capacitor bank 1 may be fixed in the box 5 by means of clamping or screwing.

The box 5 is provided with a positive input terminal 51, a negative input terminal 52, and at least one set of three-phase connection terminals. The positive input terminal 51 and the negative input terminal 52 are electrically connected to the positive and negative electrodes of the power supply, respectively. The positive input end 51 on the box 5 is electrically connected with the positive input pin 11 of the thin film capacitor bank 1, so that the positive input pin 11 of the thin film capacitor bank 1 is electrically connected with the positive electrode of the power supply through the positive input end 51 on the box 5. The negative input terminal 52 on the box 5 is electrically connected with the negative input pin 12 of the thin-film capacitor bank 1, so that the negative input pin 12 of the thin-film capacitor bank 1 is electrically connected with the negative electrode of the power supply through the negative input terminal 52 on the box 5.

Each set of three-phase connection terminals includes a U connection terminal 53, a V connection terminal 54, and a W connection terminal 55.

The power module 3 is also arranged in the box body 5, the power module 3 is fixed in the box body 5, and specifically, the power module 3 can be fixed in the box body 5 through clamping or a screw. The power module 3 includes a plurality of positive pins 31, a plurality of negative pins 32, and at least one set of three-phase terminals.

The plurality of positive pins 31 correspond to the plurality of negative pins 32, respectively. The positive pins 31 are electrically connected to the positive output pins 14 of the thin film capacitor assembly 1, specifically, the positive pins 31 of the power module 3 may be in contact with the positive output pins 14 of the thin film capacitor assembly 1, or the positive pins 31 of the power module 3 may be electrically connected to the positive output pins 14 of the thin film capacitor assembly 1 through wires. The negative pins 32 are electrically connected to the negative output pins 15 of the thin film capacitor assembly 1, specifically, the negative pins 32 of the power module 3 may be in contact with the negative output pins 15 of the thin film capacitor assembly 1, or the negative pins 32 of the power module 3 may be electrically connected to the negative output pins 15 of the thin film capacitor assembly 1 through wires.

Each group of three-phase terminals comprises a U terminal, a V terminal and a W terminal, and any group of three-phase connecting terminals on the box body 5 is electrically connected with at least one group of three-phase terminals of the power module 3. Specifically, the U terminal, the V terminal, and the W terminal of the group of three-phase terminals are electrically connected to the U connection terminal 53, the V connection terminal 54, and the W connection terminal 55 of the group of three-phase connection terminals, respectively, that is, the U terminal of the three-phase terminal is electrically connected to the U connection terminal 53 of the three-phase connection terminal, the V terminal of the three-phase terminal is electrically connected to the V connection terminal 54 of the three-phase connection terminal, and the W terminal of the three-phase terminal is electrically connected to the W connection terminal 55 of the three-phase connection terminal.

In the above embodiment, the power module 3 is electrically connected to the thin film capacitor bank 1 through the positive pins 31 and the negative pins 32, and the power module 3 is electrically connected to the three-phase connection terminals on the box 5 through at least one set of three-phase terminals, so that the ac output of the thin film capacitor bank 1 is realized.

The controller structure has higher integration level, reduces the die sinking cost of the case and the wire holder compared with a plurality of mutually independent controllers, and reduces the research and development resource investment. According to market differentiation requirements, flexible matching can be performed.

Further, the controller structure further comprises a control board 2, and a communication output end of the control board 2 is connected with a communication input end of the power module 3. Thus, the control board 2 can adjust the operating state of the power module 3.

Optionally, the power module 3 and the box 5 are electrically connected through the adapter assembly 4, that is, the three-phase terminals of the power module 3 and the three-phase connection terminals on the box 5 are electrically connected through the adapter assembly 4.

The adaptor assembly 4 includes an insulated wire holder 41, and the insulated wire holder 41 is used to fix the lead. Specifically, a lead member is used to achieve electrical connection between the two components, and the lead member is fixed to the insulated wire holder 41.

The adapter assembly 4 further includes a plurality of first guides 43, a plurality of second guides 46, and a manifold guide 42. The first conductive connectors 43, the second conductive connectors 46 and the main conductive connector 42 are all fixedly connected to the insulated wire holder 41. The plurality of first and second conductive members 43 and 46 are overlapped with the main conductive member 42, thereby achieving electrical connection between the plurality of first conductive members 43 and the plurality of second conductive members 46.

The first conductive members 43 are electrically connected to the positive pins 31 and the negative pins 32 of the power module 3, respectively. Specifically, the positive pin 31 of one power module 3 is electrically connected to one first conductive member 43, and the positive pin 31 and the first conductive member 43 may be directly contacted or electrically connected through a wire. The negative pin 32 of one power module 3 is electrically connected to one first conductive member 43, and the negative pin 32 and the first conductive member 43 may be directly contacted or electrically connected through a wire. Thereby achieving that the plurality of positive pins 31 and the plurality of negative pins 32 of the power module 3 are electrically connected with the main conductor 42 through the first conductor 43.

The plurality of second lead members 46 are electrically connected to the three-phase connection terminals on the case 5, respectively. Specifically, any one of the U terminals of the three-phase connection terminals on the box body 5 is electrically connected to one of the second lead pieces 46, and the U terminal and the second lead piece 46 may be directly contacted or electrically connected through a wire. Any V terminal of the three-phase connection terminals on the box body 5 is electrically connected with one second lead 46, and the V terminal and the second lead 46 can be directly contacted or electrically connected through a lead. Any one of the W terminals of the three-phase connection terminals on the case 5 is electrically connected to one of the second lead members 46, and the W terminal and the second lead member 46 may be directly contacted or electrically connected by a wire. Therefore, all the U terminals, the V terminals and the W terminals on the box body 5 are electrically connected with the main guide connecting piece 42 through the second guide connecting piece 46, and finally, the three-phase terminals of the power module 3 are electrically connected with the three-phase connecting terminals on the box body 5. In this manner, the provision of the adapter assembly 4 may further reduce the size of the controller structure.

It should be noted that, when the number of sets of the three-phase connection terminals on the box 5 is smaller than the number of sets of the three-phase terminals of the power module 3, any one set of the three-phase connection terminals on the box 5 may be electrically connected to any one set of the three-phase terminals of the power module 3, or any one set of the three-phase connection terminals on the box 5 may be electrically connected to any one set of the three-phase terminals of the power module 3, which is not limited herein.

The adaptor assembly 4 may further include two dc connectors 45, the two dc connectors 45 are fixedly connected to the insulating connector base 41, and the two dc connectors 45 are used to electrically connect the positive input terminal 51 and the negative input terminal 52 on the box 5 to the positive input pin 11 and the negative input pin 12 of the thin film capacitor bank 1, respectively.

Specifically, the two dc conductive members 45, the first conductive members 43, the second conductive members 46 and the bus conductive member 42 may be fixedly connected to the insulated wire holder 41 by screws. The dc conductive member 45, the first conductive member 43, the second conductive member 46 and the main conductive member 42 may be made of copper or other conductive materials.

Further, the controller structure further includes a current sampling plate 44, the first conducting connectors 43 all penetrate through the current sampling plate 44, and the current sampling plate 44 is used for collecting current information in the first conducting connectors 43. The communication output of the current sampling board 44 is connected to the communication input of the control board 2.

As shown in fig. 5 and 6, in the third embodiment of the present invention, a set of three-phase connection terminals is disposed on the box 5, the number of the power modules 3 is one, and the power modules 3 include two sets of three-phase terminals, in this case, the set of three-phase connection terminals on the box 5 may be electrically connected to any one set of three-phase terminals of the power modules 3, or the set of three-phase connection terminals on the box 5 may be electrically connected to both sets of three-phase terminals of the power modules 3.

In the third embodiment, the connection manner between the thin film capacitor assembly 1 and the power module 3 is the same as that of the above embodiment, and as shown in fig. 6, the adapting assembly 4 may be completely the same as that of the adapting assembly 4 of the above embodiment.

As shown in fig. 7 and 9, in a fourth embodiment of the present invention, the power module 3 includes a plurality of sub-power modules. Alternatively, the power module 3 includes a first sub-power module and a second sub-power module, that is, the power module 3 includes two sub-power modules. It should be noted that the plurality of sub-power modules are independent of each other, the plurality of sub-power modules are relatively fixed, and each sub-power module can implement the function of the power module in the prior art.

In the fourth embodiment, each of the plurality of sub-power modules includes a plurality of positive pins 31 and a plurality of negative pins 32, and the plurality of positive pins 31 of the power module 3 are electrically connected to the plurality of positive output pins 14 of the thin film capacitor bank 1, respectively. The negative pins 32 are electrically connected to the negative output pins 15 of the thin film capacitor bank 1, respectively.

In the fourth embodiment, two sets of three-phase connection terminals are disposed on the box 5, the power module 3 includes two sub-power modules, each sub-power module is provided with a set of three-phase terminals, and at this time, the two sets of three-phase connection terminals on the box 5 are electrically connected to the three-phase terminals of the two sub-power modules respectively.

In the fourth embodiment, the power module 3 and the box 5 are also electrically connected through the adapter assembly 4, and the main conductive member 42 of the adapter assembly 4 is specifically a laminated busbar 47. Other structures of the adapter assembly 4 are the same as the adapter assembly 4 of the previous embodiment, and are not described herein again.

As shown in fig. 8, in a fifth embodiment provided by the present invention, the power module 3 includes a plurality of sub-power modules. Alternatively, the power module 3 includes a first sub-power module and a second sub-power module, that is, the power module includes two sub-power modules.

In the fifth embodiment, each of the plurality of sub-power modules includes a plurality of positive pins 31 and a plurality of negative pins 32, and the plurality of positive pins 31 of the power module 3 are electrically connected to the plurality of positive output pins 14 of the thin film capacitor bank 1, respectively. The negative pins 32 are electrically connected to the negative output pins 15 of the thin film capacitor bank 1, respectively.

In the fifth embodiment, two sets of three-phase connection terminals are disposed on the box 5, the power module 3 includes two sub-power modules, each sub-power module is provided with a set of three-phase terminals, and at this time, the two sets of three-phase connection terminals on the box 5 are electrically connected to the three-phase terminals of the two sub-power modules respectively.

In the fifth embodiment, the power module 3 and the box 5 are also electrically connected through the adapter assembly 4, and the main conductive member 42 of the adapter assembly 4 is specifically a laminated busbar 47. The other structures of the adapter assembly 4 are the same as the adapter assembly 4 of the previous embodiment, and are not described herein again.

Further, in the fifth embodiment, the thin film capacitor bank 1 is the thin film capacitor bank 1 described in the second embodiment. The plurality of film cores 16 of the thin film capacitor bank 1 are divided into a plurality of groups of film cores 16. The negative plate 17 comprises a plurality of sub-negative plates 171, the sub-negative plates 171 are respectively electrically connected with the negative electrodes of the plurality of groups of film cores 16, and the sub-negative plates 171 are fixedly connected with the negative electrode adapter plate 20. The plurality of groups of film cores 16 are respectively in one-to-one correspondence with the plurality of sub-negative plates 171, and the negative electrode of each group of film cores 16 is electrically connected with the corresponding sub-negative plate 171. Specifically, the negative electrode of each group of film cores 16 is in contact with its corresponding divided negative plate 171 or electrically connected by a wire. .

The negative electrode adapter plates 20 of two adjacent sub-negative electrode plates 171 are electrically connected through a current sensor, that is, the sub-negative electrode plates 171 are sequentially connected in series, and the current sensor can acquire current information between the two adjacent sub-negative electrode plates 171. The communication output end of the current collector is connected with the communication input end of the control panel 2 so as to carry out more accurate monitoring control on the generator and the motor.

Any of the controller configurations described above may be a motor controller and/or a generator controller, and in particular may be a dual module single motor controller, a dual motor controller, and a motor controller plus a generator controller.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims (14)

1. A thin film capacitor bank, comprising:

a housing (13) and a film core (16) disposed within the housing (13);

a positive plate (18) and a negative plate (17), both the positive plate (18) and the negative plate (17) being disposed within the can (13), the positive plate (18) being electrically connected to the positive electrode of the film core (16), the negative plate (17) being electrically connected to the negative electrode of the film core (16);

the positive input pin (11) is fixedly connected with the positive plate (18) and is partially exposed out of the shell (13), and the negative input pin (12) is fixedly connected with the negative plate (17) and is partially exposed out of the shell (13);

the positive output pins (14) are fixedly connected with the positive plate (18) and are partially exposed out of the shell (13), and the negative output pins (15) are fixedly connected with the negative plate (17) and are partially exposed out of the shell (13).

2. A thin film capacitor bank as claimed in claim 1, wherein a plurality of said thin film cores (16) are divided into a plurality of groups of thin film cores (16);

the negative plate (17) comprises a plurality of sub-negative plates (171), the sub-negative plates (171) are respectively electrically connected with the negative electrodes of the multiple groups of film cores (16), the sub-negative plates (171) are fixedly connected with negative electrode adapter plates (20), and the negative electrode adapter plates (20) of the two adjacent sub-negative plates (171) are electrically connected through a current sensor.

3. The thin-film capacitor bank as claimed in claim 1, characterized in that at least one wall of the housing (13) is a heat sink plate (19) and the heat sink plate (19) is provided with heat dissipation channels on its inside; or a heat dissipation plate (19) is arranged on the outer side of at least one wall of the shell (13), and a heat dissipation channel is arranged in the heat dissipation plate (19); or the bottom wall of the shell (13) is a heat dissipation plate (19), and a heat dissipation channel is arranged in the heat dissipation plate (19).

4. A controller structure, characterized in that it comprises a thin film capacitor bank (1) according to any one of claims 1-3.

5. The controller structure of claim 4, further comprising:

the power supply comprises a box body (5), wherein a positive electrode input end (51), a negative electrode input end (52) and at least one group of three-phase connecting terminals are arranged on the box body (5), and each three-phase connecting terminal comprises a U connecting terminal (53), a V connecting terminal (54) and a W connecting terminal (55); the thin-film capacitor bank (1) is arranged in the box body (5), the positive input end (51) is electrically connected with the positive input pin (11) of the thin-film capacitor bank (1), and the negative input end (52) is electrically connected with the negative input pin (12) of the thin-film capacitor bank (1);

the power module (3) is arranged in the box body (5), the power module (3) comprises a plurality of positive pins (31) and a plurality of negative pins (32) which respectively correspond to the positive pins (31), the positive pins (31) are respectively and electrically connected with the positive output pins (14) of the thin film capacitor bank (1), and the negative pins (32) are respectively and electrically connected with the negative output pins (15) of the thin film capacitor bank (1); the power module (3) comprises at least one group of three-phase terminals, each three-phase terminal comprises a U terminal, a V terminal and a W terminal, and any group of three-phase connecting terminals on the box body (5) are electrically connected with at least one group of three-phase terminals of the power module (3).

6. A controller arrangement according to claim 5, characterized in that the electrical connection between the power module (3) and the three-phase connection terminals of the box (5) is achieved by means of a switching assembly (4).

7. A control arrangement according to claim 6, characterised in that the adapter assembly (4) comprises an insulated wire holder (41), the insulated wire holder (41) being used to secure a lead.

8. A control arrangement according to claim 7, characterised in that the changeover component (4) further comprises a plurality of first guides (43), a plurality of second guides (46) and a bus guide (42), the plurality of first guides (43), the plurality of second guides (46) and the bus guide (42) all being fixedly connected to the insulating connection base (41), and the plurality of first guides (43) and the plurality of second guides (46) all overlapping the bus guide (42);

the first guide connecting pieces (43) are electrically connected with the positive pins (31) and the negative pins (32) of the power module (3) respectively, and the second guide connecting pieces (46) are electrically connected with the three-phase connecting terminals on the box body (5) respectively.

9. The controller structure according to claim 7, wherein the adapter module (4) further comprises two direct current conductors (45) fixedly connected to the insulated wire holder (41), and the two direct current conductors (45) are used for electrically connecting a positive input terminal (51) and a negative input terminal (52) on the box body (5) with the positive input pin (11) and the negative input pin (12) of the thin film capacitor bank (1), respectively.

10. A controller arrangement according to claim 5, further comprising a control board (2), a communication output of the control board (2) being connected with a communication input of the power module (3).

11. The controller structure according to claim 10, characterized in that the power module (3) and the box body (5) are electrically connected through a switching assembly (4), the switching assembly (4) comprises an insulating wire holder (41), two direct current guides (45), a plurality of first guides (43), a plurality of second guides (46) and a main guide (42), the two direct current guides (45), the plurality of first guides (43), the plurality of second guides (46) and the main guide (42) are fixedly connected with the insulating wire holder (41), and the plurality of first guides (43) and the plurality of second guides (46) are overlapped with the main guide (42);

the two direct current guide connecting pieces (45) are used for enabling a positive electrode input end (51) and a negative electrode input end (52) on the box body (5) to be electrically connected with a positive input pin (11) and a negative input pin (12) of the thin film capacitor bank (1) respectively; the first guide connectors (43) are respectively and electrically connected with the positive pins (31) and the negative pins (32) of the power module (3), and the second guide connectors (46) are respectively and electrically connected with the three-phase connecting terminals on the box body (5);

the controller structure also comprises a current sampling plate (44), and a plurality of first guide connectors (43) penetrate through the current sampling plate (44); the communication output end of the current sampling plate (44) is connected with the communication input end of the control plate (2).

12. A control arrangement according to claim 8 or 11, characterized in that the bus bar (42) is a laminated busbar (47).

13. A controller structure according to claim 5, characterized in that a set of three-phase connection terminals is provided on said box (5), the number of said power modules (3) is one and said power modules (3) comprise two sets of three-phase terminals; the three-phase connecting terminal is connected with an arbitrary set of three-phase terminal, or the three-phase connecting terminal is connected with two sets of three-phase terminals.

14. A controller arrangement according to claim 5, characterized in that the power module (3) comprises a plurality of sub-power modules; or the power module (3) comprises a first power splitting module and a second power splitting module.

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