CN216928201U - Sleeve structure - Google Patents

Sleeve structure Download PDF

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Publication number
CN216928201U
CN216928201U CN202220506671.5U CN202220506671U CN216928201U CN 216928201 U CN216928201 U CN 216928201U CN 202220506671 U CN202220506671 U CN 202220506671U CN 216928201 U CN216928201 U CN 216928201U
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China
Prior art keywords
sleeve
conductor
layer
silica gel
epoxy
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CN202220506671.5U
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Chinese (zh)
Inventor
蔡军伟
刘江华
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Anhui Xiangdeng Electric Co ltd
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Anhui Xiangdeng Electric Co ltd
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Priority to CN202220506671.5U priority Critical patent/CN216928201U/en
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Abstract

The utility model relates to a bushing structure comprising: arranging epoxy sleeves on two sides of the equipment wall; a silica gel sleeve is connected and arranged in the epoxy sleeve; arranging the conductor in the silica gel sleeve, wherein one end of the conductor is connected to the metal conductor arranged in the epoxy sleeve; an inner semi-conducting layer is arranged between the conductor and the silica gel sleeve; the casing structure has the advantages of good adhesion effect, low price and simple manufacturing process, and simultaneously has the casing structure with the cleanliness requirement on the inner wall of the casing structure not so high, and the production mode of the casing structure also has the environmental protection property.

Description

Sleeve structure
Technical Field
The embodiment of the utility model relates to a sleeve structure, in particular to a novel sleeve structure.
Background
The bushing structure is applied to the connection between the switch cabinets in the power distribution system, along with the development of social economy, the investment of construction engineering is increased, and the market demands of the switch cabinets and the unit cabinets in the power distribution system are more and more. In the prior art, the unit cabinets are connected through cables, jumper wires or shielded buses, the space between the cabinets is large, the floor area of a power distribution system is large, the investment is increased, the cabinets are connected on a construction site, the requirements on construction environment, construction capacity and the like are high, and the construction difficulty and uncertainty factors are increased. And the cabinet combining action is finished in a factory, the construction is standardized, the electrical performance is stable, and the requirements of the bushing for the cabinet combining of the unit cabinets are increased gradually in the process.
The inner wall of the existing sleeve structure is sprayed with the conductive paint which is used as an inner semi-conductive layer (a conductor shielding layer), so that the requirements on the related performances of the conductive paint, such as conductivity, the adhesion effect with a silica gel product and the like, are high, and the price of the conductive paint meeting the requirements is generally high; besides the high price, the spraying operation difficulty of the conductive paint is high, the working hours are high, the spraying position is the inner wall of the product, the adhesion of the conductive paint is not uniform, the inspection of the thickness and the uniformity of the coating is complicated, the shielding capability of the conductor is reduced easily when the thickness and the uniformity of the coating are not uniform, the balance of an electric field near the conductor cannot be completely ensured, the partial discharge phenomenon of the insulating layer is avoided, and the line safety is damaged easily;
in addition, the cleanliness requirement on the inner wall of the sleeve structure before spraying the conductive paint is high, if the inner wall has impurity residues, electric field distortion and partial discharge are easy to generate under the condition of electrified operation, and the overall insulation performance of the product is influenced after long-term operation; meanwhile, the paint spraying process is easy to cause pollution, and certain harm is caused to the environment and personal safety.
SUMMERY OF THE UTILITY MODEL
An object of an embodiment of the present invention is to provide a sleeve structure which has a good adhesion effect, is inexpensive, has a simple manufacturing process, requires less high cleanliness for the inner wall of the sleeve structure, and is environmentally friendly in the manner of production of the sleeve structure.
In order to achieve the above object, an embodiment of the present invention designs a casing structure including:
an equipment wall;
the epoxy sleeve is arranged on two sides of the equipment wall;
the silica gel sleeve is connected and arranged in the epoxy sleeve;
the conductor is arranged in the silica gel sleeve, and one end of the conductor is connected to the metal conductor arranged in the epoxy sleeve;
an inner semi-conducting layer is arranged between the conductor and the silica gel sleeve.
Further, the inner semi-conducting layer is wrapped on the inner side of the through hole of the silica gel sleeve through injection molding and secondary forming.
Furthermore, a metal connecting piece for connecting a switch cabinet circuit is fixed at one end of the epoxy sleeve.
Further, the epoxy sleeves are arranged on two sides of the equipment wall.
Further, the insulating layer is fixed outside the inner semi-conducting layer in an injection molding mode, the outer semi-conducting layer is fixed outside the insulating layer after injection molding, the grounding ring is fixed above the outer semi-conducting layer, and a plurality of grounding holes are fixed on the outer side of the grounding ring along the outer edge of the grounding ring.
Further, the grounding hole is arranged in an ear hole shape.
Further, the material of the inner semi-conducting layer is conductive silicon rubber.
Further, the insulating layer is made of insulating silicon rubber.
Further, the material of the outer semi-conductive layer is conductive silicone rubber.
Further, the thickness of the inner semiconductive layer is 0.5mm to 1 mm.
Compared with the prior art, the inner semi-conducting layer in the sleeve structure is subjected to injection molding by using conductive silica gel and then subjected to secondary molding with an insulating rubber material, so that the quality, size, performance and the like of the injection-molded inner semi-conducting layer (conductor shielding layer) are controllable, the conductor shielding effect is ensured, and the performance is stable; the inner semi-conducting layer is made of silica gel, the adhesion effect with main insulation (insulating silica gel) is excellent, and the elastic characteristic of the silica gel product can ensure that the three layers of the conductor, the inner semi-conducting layer and the main insulation layer are co-extruded, so that the gap in size is reduced, the three layers are completely and tightly contacted, the problem of local electric field distortion caused by the gap formed due to the fact that the size is not consistent is solved, and the internal electric field is balanced; the silica gel inner semi-conducting layer in the sleeve structure has high forming yield and efficiency, a plurality of mold cavities are formed, the number of the mold cavities is compared with that of the mold cavities sprayed with the conductive paint, the working time is greatly reduced, and the performance is stable and reliable.
The sleeve structure has the advantages of good adhesion effect, low price and simple manufacturing process, and simultaneously has the sleeve structure with the cleanliness requirement on the inner wall of the sleeve structure not so high, and meanwhile, the production mode of the sleeve structure also has the environmental protection property.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic left-side view of the inner semiconductive layer in the bushing structure of the utility model;
fig. 3 is a schematic view of the structure in the direction a-a of fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solutions claimed in the claims of the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a bushing structure, as shown in fig. 1, 2, and 3, including:
arranging epoxy sleeves 2 on two sides of the equipment wall 1; the epoxy sleeve 2 is mainly used for connecting cables, mainly for connecting cables on both sides of the equipment wall 1.
A silica gel sleeve 3 is connected and arranged in the epoxy sleeve 2; the silicone sleeve 3 is mainly used for conducting electricity and insulating the conductor 4.
A conductor 4 is arranged in the silica gel sleeve 3, and one end of the conductor 4 is connected to a metal conductor 5 arranged in the epoxy sleeve 2;
an inner semiconducting layer 6 is arranged between the conductor 4 and the silica gel jacket 3. The inner semi-conducting layer 6 is used for ensuring the effect of conductor shielding and has stable performance; the inner semi-conducting layer 6 and the silica gel sleeve 3 have excellent adhesion effect, and the inner semi-conducting layer 6 and the silica gel sleeve 3 reduce the size gap and ensure complete and close contact of the three.
The inner semi-conducting layer 6 in the sleeve structure is arranged between the conductor 4 and the silica gel sleeve 3, and the inner semi-conducting layer 6 ensures the effect of conductor shielding and has stable performance; the inner semi-conducting layer 6 and the silica gel sleeve 3 have excellent adhesion effect, the inner semi-conducting layer 6 and the silica gel sleeve 3 reduce gaps in size, complete and tight contact of the inner semi-conducting layer 6 and the silica gel sleeve 3 is ensured, the problem of local electric field distortion caused by the gap formed due to size ineffectiveness is solved, and an internal electric field is balanced; the silica gel inner semi-conducting layer in the sleeve structure has high forming yield and efficiency, a plurality of mold cavities are formed, the silica gel inner semi-conducting layer is compared with the sprayed conductive paint, the working hours are greatly reduced, and the performance is stable and reliable.
The sleeve structure has the advantages of good adhesion effect, low price and simple manufacturing process, and simultaneously has the sleeve structure with the cleanliness requirement on the inner wall of the sleeve structure not so high. The conductive paint solves the technical problems that the conductive paint in the prior art is high in price, high in operation difficulty of spraying the conductive paint, high in working time, uneven in adhesion, complex in detection of coating thickness and uniformity, incapable of avoiding a partial discharge phenomenon to an insulating layer, easy to harm line safety, high in cleanliness requirement on the inner wall of a sleeve structure before spraying the conductive paint, easy to pollute in a paint spraying process, and capable of causing certain damage to environment and personal safety.
In order to achieve the above technical effects, as shown in fig. 1, 2 and 3, the inner semi-conductive layer 6 is wrapped inside the through hole 7 of the silicone sleeve 3 by injection molding and secondary molding. Interior semi-conducting layer 6 can guarantee the performance of being followed between interior semi-conducting layer 6 and the silica gel sleeve pipe 3 through the post forming parcel of moulding plastics at silica gel sleeve pipe 3, the local discharge phenomenon of avoiding the insulating layer has been guaranteed, the adhesion of the conductive paint among the prior art has been solved inhomogeneous, and coating thickness and homogeneity inspection are more loaded down with trivial details, can't avoid the local discharge phenomenon to the insulating layer, the cleanliness requirement to the inner wall of bushing structure before easily endangering line safety and the conductive paint of spraying is higher, it also easily produces the pollution to spray paint the in-process, cause technical problem such as certain injury to environment and personal safety.
In order to achieve the above technical effects, as shown in fig. 1, 2, and 3, a metal connector for connecting a switch cabinet line is fixed to one end of the epoxy bushing 2.
In order to achieve the above technical effects, as shown in fig. 1, 2, and 3, epoxy sleeves 2 are disposed on both sides of the apparatus wall 1.
In order to achieve the above-mentioned technical effects, as shown in fig. 1, 2 and 3, an insulating layer 8 is fixed by injection molding on the outside of an inner semiconductive layer 6, an outer semiconductive layer 9 is fixed by injection molding on the outside of the insulating layer 8, a ground ring 10 is fixed on the outer semiconductive layer 9, and a plurality of ground holes 11 are fixed on the outside of the ground ring 10 along the outer edge of the ground ring 10.
In order to achieve the above technical effects, as shown in fig. 1, 2, and 3, the ground hole 11 is provided in an ear hole shape.
In order to achieve the above technical effects, as shown in fig. 1, 2, and 3, the material of the inner semiconductive layer 6 is conductive silicone rubber.
In order to achieve the above technical effects, as shown in fig. 1, 2, and 3, the material of the insulating layer 8 is insulating silicone rubber.
In order to achieve the above technical effects, as shown in fig. 1, 2, and 3, the material of the outer semiconductive layer 9 is conductive silicone rubber.
In order to achieve the above-described technical effects, the inner semiconductive layer 6 has a thickness of 0.5mm to 1mm as shown in fig. 1, 2, and 3.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the utility model, and that various changes in form and details may be made therein without departing from the spirit and scope of the utility model in practice.

Claims (10)

1. A sleeve structure, comprising:
an equipment wall;
the epoxy sleeve is arranged on two sides of the equipment wall;
the silica gel sleeve is connected and arranged in the epoxy sleeve;
the conductor is arranged in the silica gel sleeve, and one end of the conductor is connected to the metal conductor arranged in the epoxy sleeve;
an inner semi-conducting layer is arranged between the conductor and the silica gel sleeve.
2. The bushing structure of claim 1 wherein said inner semiconductive layer is wrapped inside said through hole of said silicone bushing by injection overmolding.
3. The bushing structure of claim 1 wherein a metal connector for connecting to a switchgear circuit is secured to one end of said epoxy bushing.
4. A jacket structure according to claim 3, characterized in that said epoxy jacket is arranged on both sides of the wall of the device.
5. The pipe in pipe according to claim 1, wherein an insulating layer is injection-molded and fixed outside the inner semiconductive layer, an outer semiconductive layer is injection-molded and fixed outside the insulating layer, a ground ring is fixed above the outer semiconductive layer, and a plurality of ground holes are fixed outside the ground ring along an outer edge of the ground ring.
6. A tubular casing structure as claimed in claim 5, characterized in that the grounding hole is provided in the form of an ear hole.
7. The bushing structure of claim 2 wherein said inner semiconducting layer is made of conductive silicone rubber.
8. The bushing structure of claim 5 wherein said insulating layer is made of an insulating silicone rubber.
9. The bushing structure of claim 5, wherein the material of the outer semiconducting layer is conductive silicone rubber.
10. A jacket structure according to claim 7, characterized in that the thickness of the inner semiconducting layer is 0.5-1 mm.
CN202220506671.5U 2022-03-09 2022-03-09 Sleeve structure Active CN216928201U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220506671.5U CN216928201U (en) 2022-03-09 2022-03-09 Sleeve structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220506671.5U CN216928201U (en) 2022-03-09 2022-03-09 Sleeve structure

Publications (1)

Publication Number Publication Date
CN216928201U true CN216928201U (en) 2022-07-08

Family

ID=82224280

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220506671.5U Active CN216928201U (en) 2022-03-09 2022-03-09 Sleeve structure

Country Status (1)

Country Link
CN (1) CN216928201U (en)

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