CN216927551U - Special heat dissipation equipment for computer technology development hardware - Google Patents
Special heat dissipation equipment for computer technology development hardware Download PDFInfo
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- CN216927551U CN216927551U CN202220769561.8U CN202220769561U CN216927551U CN 216927551 U CN216927551 U CN 216927551U CN 202220769561 U CN202220769561 U CN 202220769561U CN 216927551 U CN216927551 U CN 216927551U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model relates to the technical field of computer heat dissipation, in particular to a special heat dissipation device for computer technology development hardware, which comprises a device shell, wherein a cooling box is arranged at the inner bottom end of the device shell, a semiconductor refrigeration sheet is arranged at the inner bottom end of the cooling box, a heat exchange tube is arranged in the cooling box, an air inlet and an air outlet of the heat exchange tube penetrate through the cooling box, a turbulence mechanism is also arranged in the cooling box, an induced draft fan is arranged at the top of the cooling box, outside air is introduced into the heat exchange tube through an air inlet cover by the induced draft fan, the air in the heat exchange tube is subjected to heat exchange and temperature reduction through cooling liquid in the cooling box, the air is converted into cold air which is then conveyed into a shunt tube through a telescopic air tube, the cold air is sprayed out through a plurality of spray heads to dissipate heat and reduce the temperature of the internal hardware, and the shunt tube can transversely reciprocate in the device shell through an arranged moving mechanism, the cold air diffusion area is increased, and the heat dissipation efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of computer heat dissipation, in particular to a special heat dissipation device for computer technology development hardware.
Background
Computer hardware refers to the general term for various physical devices in a computer system, including electronic, mechanical, and opto-electronic components, these physical devices form an organic whole to provide a material basis for the operation of computer software according to the requirements of system structure, in short, the functions of computer hardware are to input and store programs and data, and the executive program processes the data into a usable form, and from the appearance, the microcomputer is composed of a main case and external equipment, wherein the main case mainly comprises a CPU, a memory, a mainboard, a hard disk drive, an optical disk drive, various expansion cards, a connecting wire, a power supply and the like, the external equipment comprises a mouse, a keyboard and the like, the computer hardware can emit a large amount of heat in the running process, the computer hardware can be damaged due to overhigh temperature, therefore, the heat dissipation device special for the hardware needs to be developed by using the computer technology to perform heat dissipation processing on the computer hardware.
Most of existing computer hardware heat dissipation is conducted through air cooling heat dissipation fans, and when the room temperature is high, through the air cooling mode, the heat dissipation effect of the whole device can be greatly reduced, the heat dissipation effect is poor, and therefore a special heat dissipation device for computer technology development hardware is needed to improve the problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a special heat dissipation device for computer technology development hardware, so as to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme:
a cooling box is installed at the inner bottom end of the device shell, a semiconductor refrigerating sheet is installed at the inner bottom end of the cooling box, a heat exchange tube is arranged inside the cooling box, an air inlet and an air outlet of the heat exchange tube penetrate through the cooling box, a turbulence mechanism is further arranged inside the cooling box, an induced draft fan is installed at the top of the cooling box, an air outlet of the heat exchange tube is connected with an air inlet of the induced draft fan, a movable plate is arranged above the induced draft fan, a shunt tube is arranged at the top of the movable plate along the length direction, the shunt tube is fixedly installed on the movable plate through a clamp, a plurality of spray heads are arranged at the top of the shunt tube at equal intervals, the air outlet of the induced draft fan is connected with the shunt tube through a telescopic air pipe, and a moving mechanism for driving the movable plate to transversely reciprocate is arranged in the device shell, the device is characterized in that an air inlet cover is installed on the side wall of the device shell, a filter screen frame is detachably arranged in the air inlet cover, a filter screen is embedded in the filter screen frame, and the air inlet cover is connected with an air inlet of the heat exchange tube.
Preferably, the heat exchange tube is a copper tube with a serpentine shape and is filled with cooling liquid.
Preferably, vortex mechanism includes second motor, dwang and rotor blade, the second motor is installed on the lateral wall of cooler bin, the output of second motor runs through the lateral wall of cooler bin and is connected with the dwang, the dwang transversely sets up inside the cooler bin and is located between heat exchange tube and the semiconductor refrigeration piece, equidistant fixed cover is equipped with a plurality of rotor blade on the dwang.
Preferably, moving mechanism includes threaded rod, direction slide bar, first motor and support, the threaded rod transversely sets up the inside at the device casing, the both ends of threaded rod are rotated with the inner wall of device casing and are connected, threaded rod one end is extended to the outside of device casing and is connected with the output of first motor, first motor is installed on the support, support fixed mounting is on the lateral wall of device casing, both ends symmetry is provided with the direction slide bar around the threaded rod, the direction slide bar is on the inner wall of device casing with threaded rod parallel arrangement and both ends fixed connection.
Preferably, the center of the bottom of the moving plate is provided with a threaded sleeve, the threaded sleeve is in threaded sleeve connection with the threaded rod, sliding sleeves are arranged at the front end and the rear end of the bottom of the moving plate, and the sliding sleeves are respectively in sliding sleeve connection with the two guide sliding rods.
Preferably, the installation is led to the groove has been seted up at the top of air inlet cover, filter screen frame passes the installation and leads to the groove and install inside air inlet cover, the handle is installed at filter screen frame's top, filter screen frame's both sides all are provided with the fixture block, correspond the department with the position of fixture block on the inside wall of air inlet cover both sides and all be provided with the draw-in groove, pass through fixture block and draw-in groove joint between filter screen frame and the air inlet cover.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, external air is introduced into the heat exchange tube through the air inlet cover by the induced draft fan, the air in the heat exchange tube is subjected to heat exchange and temperature reduction through the cooling liquid in the cooling box, the air is changed into cold air, then the cold air is conveyed into the shunt tube through the telescopic air tube, the cold air is sprayed out through the plurality of spray heads to dissipate heat and reduce temperature of internal hardware, and the shunt tube can transversely reciprocate in the device shell through the arranged moving mechanism, so that the cold air diffusion area is increased, and the heat dissipation efficiency is improved.
2. According to the utility model, the heat exchange tube is a copper tube which is coiled into a snake shape, so that the contact area between the heat exchange tube and the cooling liquid is increased, the heat exchange efficiency is improved, the rotating rod is driven to rotate by the arranged second motor, the rotating blades are driven to rotate along with the rotating rod, the cooling liquid in the cooling box is stirred and flows, the uniformity of the integral temperature of the cooling liquid is improved, and the heat exchange effect is improved.
3. According to the air inlet hood, the filter screen frame is clamped with the air inlet hood through the clamping block and the clamping groove, the filter screen frame can be taken out conveniently through the handle, the filter screen is cleaned or replaced, the air circulation rate is improved, the filter screen frame can be rapidly installed conveniently through the clamping block and the clamping groove, and therefore the filter screen frame is high in installation and disassembly convenience and convenient to use.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a heat dissipation device dedicated for computer technology development hardware according to the present invention;
FIG. 2 is a schematic diagram of the internal structure of a cooling box of the heat dissipation device dedicated to computer technology development hardware according to the present invention;
FIG. 3 is a schematic diagram of a partial structure of a heat dissipation device dedicated for computer technology development hardware according to the present invention;
fig. 4 is a schematic structural diagram of an air intake hood and a filter screen frame of the heat dissipation device dedicated for computer technology development hardware according to the present invention.
In the figure: 1. a device housing; 2. a cooling tank; 3. an air intake hood; 301. installing a through groove; 302. a card slot; 4. an induced draft fan; 5. a telescopic air pipe; 6. moving the plate; 7. a moving mechanism; 701. a threaded rod; 702. a guide slide bar; 703. a first motor; 704. a support; 8. a heat exchange pipe; 9. a semiconductor refrigeration sheet; 10. a flow disturbing mechanism; 1001. a second motor; 1002. rotating the rod; 1003. a rotor blade; 11. a shunt tube; 12. A spray head; 13. clamping a hoop; 14. a threaded sleeve; 15. a sliding sleeve; 16. a filter screen frame; 1601. a clamping block; 17. a filter screen; 18. a handle.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Several embodiments of the utility model are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-4, the present invention provides a technical solution:
a heat dissipation device special for computer technology development hardware comprises a device shell 1, a cooling box 2 is installed at the inner bottom end of the device shell 1, cooling liquid is filled in the cooling box 2, a semiconductor refrigeration sheet 9 is installed at the inner bottom end of the cooling box 2, a heat exchange tube 8 is arranged inside the cooling box 2, an air inlet and an air outlet of the heat exchange tube 8 penetrate through the cooling box 2, a turbulence mechanism 10 is further arranged inside the cooling box 2, an induced draft fan 4 is installed at the top of the cooling box 2, the air outlet of the heat exchange tube 8 is connected with an air inlet of the induced draft fan 4, a movable plate 6 is arranged above the induced draft fan 4, a shunt tube 11 is arranged at the top of the movable plate 6 along the length direction, the shunt tube 11 is fixedly installed on the movable plate 6 through a hoop 13, a plurality of spray nozzles 12 are arranged at equal intervals at the top of the shunt tube 11, and an air outlet of the induced draft fan 4 is connected with the shunt tube 11 through a telescopic air tube 5, a moving mechanism 7 for driving a moving plate 6 to transversely reciprocate is arranged in the device shell 1, an air inlet cover 3 is arranged on the side wall of the device shell 1, a filter screen frame 16 is detachably arranged in the air inlet cover 3, a filter screen 17 is embedded and arranged in the filter screen frame 16, the air inlet cover 3 is connected with an air inlet of a heat exchange tube 8, the outside air is introduced into the heat exchange tube 8 through the air inlet hood 3 by the induced draft fan 4, the air in the heat exchange tube 8 is cooled by the heat exchange of the cooling liquid in the cooling box 2, the air is changed into cold air, then the cold air is conveyed into a shunt pipe 11 through a telescopic air pipe 5, the cold air is sprayed out through a plurality of spray heads 12, the hardware inside is cooled down in a heat dissipation manner, and the shunt tubes 11 can transversely move in the device shell 1 in a reciprocating manner through the arranged moving mechanism 7, so that the area of cold air diffusion is increased, and the heat dissipation efficiency is improved.
In this embodiment, referring to fig. 2, the heat exchange tube 8 is a copper tube that is coiled into a serpentine shape, so as to increase the contact area between the heat exchange tube 8 and the cooling liquid and improve the heat exchange efficiency.
In this embodiment, please refer to fig. 2, vortex mechanism 10 includes second motor 1001, dwang 1002 and rotor blade 1003, second motor 1001 installs on the lateral wall of cooler bin 2, the output of second motor 1001 runs through the lateral wall of cooler bin 2 and is connected with dwang 1002, dwang 1002 transversely sets up inside cooler bin 2 and is located between heat exchange tube 8 and the semiconductor refrigeration piece 9, equidistant cover is fixed and is equipped with a plurality of rotor blade 1003 on dwang 1002, second motor 1001 drive dwang 1002 through the setting rotates, drive rotor blade 1003 thereupon and rotate, stir the flow with the coolant liquid in the cooler bin 2, improve the homogeneity of coolant liquid bulk temperature, thereby improve the heat transfer effect.
In this embodiment, referring to fig. 1 and fig. 3, the moving mechanism 7 includes a threaded rod 701, a guiding sliding rod 702, a first motor 703 and a bracket 704, the threaded rod 701 is transversely disposed inside the device housing 1, two ends of the threaded rod 701 are rotatably connected to an inner wall of the device housing 1, one end of the threaded rod 701 extends to the outside of the device housing 1 and is connected to an output end of the first motor 703, the first motor 703 is mounted on the bracket 704, the bracket 704 is fixedly mounted on an outer side wall of the device housing 1, the front and rear ends of the threaded rod 701 are symmetrically provided with the guiding sliding rods 702, the guiding sliding rods 702 are disposed in parallel with the threaded rod 701 and two ends are fixedly connected to the inner wall of the device housing 1, a threaded sleeve 14 is mounted at a center of the bottom of the moving plate 6, the threaded sleeve 14 is threadedly sleeved on the threaded rod 701, sliding sleeves 15 are mounted at the front and rear ends of the bottom of the moving plate 6, the two sliding sleeves 15 are respectively slidably sleeved on the two guiding sliding rods 702, in practical application, the threaded rod 701 is driven to rotate by the first motor 703, so that the threaded sleeve 14 drives the moving plate 6 to move transversely on the threaded rod 701, and the moving plate 6 slides on the guide slide bar 702 through the sliding sleeve 15, so that the moving stability of the moving plate 6 is improved, the cold air diffusion area is increased, and the heat dissipation efficiency is improved.
In this embodiment, please refer to fig. 1 and fig. 4, the top of air inlet hood 3 has been seted up installation and has been led to groove 301, filter screen frame 16 passes installation and leads to groove 301 and install inside air inlet hood 3, handle 18 is installed at filter screen frame 16's top, filter screen frame 16's both sides all are provided with fixture block 1601, the position department of corresponding with fixture block 1601 all is provided with draw-in groove 302 on the inside wall of air inlet hood 3 both sides, connect through fixture block 1601 and draw-in groove 302 joint between filter screen frame 16 and the air inlet hood 3, in the time of practical application, be convenient for take out filter screen frame 16 through handle 18, clean or change filter screen 17, improve the air circulation rate, the quick installation of filter screen frame 16 is convenient for through fixture block 1601 and draw-in groove 302 that set up, make filter screen frame 16's installation and dismantlement convenience high, high in use.
The working principle of the utility model is as follows: when the cooling device is used, outside air is introduced into the heat exchange tube 8 through the air inlet cover 3 by the draught fan 4, the air in the heat exchange tube 8 is subjected to heat exchange and cooling through the cooling liquid in the cooling box 2 to change the air into cold air, the cooling liquid is continuously cooled and cooled by the semiconductor refrigerating sheet 9, the rotating rod 1002 is driven to rotate by the second motor 1001 and then drives the rotating blade 1003 to rotate, the cooling liquid in the cooling box 2 is stirred and flows, the uniformity of the overall temperature of the cooling liquid is improved, the heat exchange tube 8 is a coiled and snakelike copper tube, the contact area between the heat exchange tube 8 and the cooling liquid is improved, the heat exchange efficiency is improved, the cooling liquid is conveyed into the flow dividing tube 11 through the telescopic air tube 5, the cold air is sprayed out through the plurality of spray heads 12, the heat dissipation and cooling are carried out on the internal hardware, the movable plate 701 is driven to rotate by the first motor 703, so that the movable plate 701 is driven to transversely move on the threaded rod 701 by the threaded sleeve 14, and the moving plate 6 slides on the guide sliding rod 702 through the sliding sleeve 15, so that the moving stability of the moving plate 6 is improved, the shunt tube 11 can transversely reciprocate in the device shell 1, the cold air diffusion area is increased, and the heat dissipation efficiency is improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A special heat dissipation equipment for computer technology development hardware comprises a device shell (1), and is characterized in that: install cooler bin (2) in the inside bottom of device casing (1), semiconductor refrigeration piece (9) are installed to the inside bottom of cooler bin (2), the inside of cooler bin (2) is provided with heat exchange tube (8), cooler bin (2) is all run through to the air inlet and the gas outlet of heat exchange tube (8), still be provided with vortex mechanism (10) in cooler bin (2), draught fan (4) are installed at the top of cooler bin (2), the gas outlet of heat exchange tube (8) is connected with the air intake of draught fan (4), the top of draught fan (4) is provided with movable plate (6), the top of movable plate (6) is provided with shunt tubes (11) along length direction, shunt tubes (11) are through clamp (13) fixed mounting on movable plate (6), the top equidistant of shunt tubes (11) is provided with a plurality of shower nozzle (12), be connected through flexible trachea (5) between the air outlet of draught fan (4) and shunt tubes (11), be provided with drive movable plate (6) horizontal reciprocating motion's moving mechanism (7) in device casing (1), install suction hood (3) on the lateral wall of device casing (1), can dismantle in suction hood (3) and be provided with filter screen frame (16), filter screen (17) are installed to embedded in filter screen frame (16), suction hood (3) are connected with the air inlet of heat exchange tube (8).
2. The heat dissipation device dedicated to computer technology development hardware according to claim 1, wherein: the heat exchange tube (8) is a copper tube with a serpentine coil, and cooling liquid is filled in the cooling box (2).
3. The heat dissipation device dedicated to computer technology development hardware according to claim 1, wherein: vortex mechanism (10) include second motor (1001), dwang (1002) and rotating blade (1003), second motor (1001) is installed on the lateral wall of cooler bin (2), the output of second motor (1001) runs through the lateral wall of cooler bin (2) and is connected with dwang (1002), dwang (1002) transversely set up in cooler bin (2) inside and be located between heat exchange tube (8) and semiconductor refrigeration piece (9), equidistant fixed cover is equipped with a plurality of rotating blade (1003) on dwang (1002).
4. The heat dissipation device dedicated to computer technology development hardware according to claim 1, wherein: moving mechanism (7) include threaded rod (701), direction slide bar (702), first motor (703) and support (704), threaded rod (701) transversely sets up the inside at device casing (1), the both ends of threaded rod (701) are rotated with the inner wall of device casing (1) and are connected, threaded rod (701) one end extends to the outside of device casing (1) and is connected with the output of first motor (703), install on support (704) first motor (703), support (704) fixed mounting is on the lateral wall of device casing (1), both ends symmetry is provided with direction slide bar (702) around threaded rod (701), direction slide bar (702) and threaded rod (701) parallel arrangement and both ends fixed connection are on the inner wall of device casing (1).
5. The heat dissipation device dedicated to computer technology development hardware according to claim 4, wherein: the center department of movable plate (6) bottom installs thread bush (14), thread bush (14) screw thread cup joints on threaded rod (701), sliding sleeve (15) are all installed at both ends around movable plate (6) bottom, two sliding sleeve (15) slip cup joint respectively on two direction slide bars (702).
6. The heat dissipation device dedicated to computer technology development hardware according to claim 1, wherein: the installation has been seted up at the top of air inlet cover (3) and has been led to groove (301), filter screen frame (16) pass installation and lead to groove (301) and install inside air inlet cover (3), handle (18) are installed at the top of filter screen frame (16), the both sides of filter screen frame (16) all are provided with fixture block (1601), all be provided with draw-in groove (302) with the position department of corresponding of fixture block (1601) on the inside wall of air inlet cover (3) both sides, through fixture block (1601) and draw-in groove (302) joint between filter screen frame (16) and air inlet cover (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202220769561.8U CN216927551U (en) | 2022-04-03 | 2022-04-03 | Special heat dissipation equipment for computer technology development hardware |
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CN202220769561.8U CN216927551U (en) | 2022-04-03 | 2022-04-03 | Special heat dissipation equipment for computer technology development hardware |
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CN216927551U true CN216927551U (en) | 2022-07-08 |
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CN202220769561.8U Active CN216927551U (en) | 2022-04-03 | 2022-04-03 | Special heat dissipation equipment for computer technology development hardware |
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- 2022-04-03 CN CN202220769561.8U patent/CN216927551U/en active Active
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