CN216927356U - Laser projection equipment - Google Patents

Abstract

The application discloses laser projection equipment dispels the heat to the camera through liquid cooling system, sets up the heat conduction lug to liquid cooling system's first cold head, and the heat conduction lug is outstanding in first cold head and with the light valve butt, is located the inlet on the first cold head top cap and faces the heat conduction lug, still sets up a plurality of column structures in the heat conduction lug. The cooling liquid impacts the columnar structure under the action of gravity, the heat dissipation efficiency of the light valve is improved, meanwhile, the liquid cooling heat dissipation system dissipates heat of the light source, and the light source and the heat dissipation system of the optical machine form circulation. The application provides a laser projection equipment can promote laser projection equipment's radiating efficiency to realize the miniaturization of product volume.

Description

Laser projection equipment

Technical Field

The application relates to the technical field of laser projection display, in particular to laser projection equipment.

Background

The laser projection equipment adopts a high-power laser to convert electric energy into light energy, and the generated laser beam is projected onto a screen through an optical system to form a projection picture.

In laser projection devices, lasers are used as heat source components, and the optical power and the thermal power are increasing, and some precision optoelectronic devices, such as light valves, need to be irradiated by high-energy light beams even if heat is dissipated, otherwise the performance of the optoelectronic devices is deteriorated. The DMD device is a light valve used under a DLP projection framework, and is directly irradiated by laser beams, and the service life and reliability of equipment can be guaranteed only if the temperature is controlled below a certain value. The heat of the DMD is mainly generated by light irradiation, and the heat generated by the operation of the DMD is small, so as to increase the heat to be dissipated at the DMD along with the increase of the laser generated by the laser.

At present, two forms of air cooling and liquid cooling exist in the industry for DMD heat dissipation. The air cooling heat transfer can be regulated and controlled, the material selection space is large, but the efficiency is low, the large space is occupied, and the cost of high air quantity and high noise is needed. Liquid cooling has high heat transfer efficiency, but the cost is high and the improvement of the heat transfer efficiency of some conventional means is limited.

There is a need for a solution that can compromise heat dissipation efficiency and product size miniaturization.

Disclosure of Invention

The application provides a laser projection equipment can promote laser projection equipment's radiating efficiency to realize the miniaturization of product volume.

The application provides a laser projection device: the liquid cooling heat dissipation system comprises an optical machine and a liquid cooling heat dissipation system, wherein the optical machine comprises a light valve which is positioned in an optical machine shell; the liquid cooling heat dissipation system at least comprises a first cold head, and the first cold head is connected to the back surface of the light valve;

the first cold head comprises a top cover, a bottom plate, a liquid inlet and a heat conduction lug, the heat conduction lug protrudes out of the bottom plate and is abutted against the back surface of the light valve, the liquid inlet is arranged on the top cover, and the liquid inlet faces the heat conduction lug;

still include a plurality of columnar structure in the heat conduction convex block of first cold head, the columnar structure to the top cap extends.

Further, the heat conduction bump penetrates through the bottom plate.

Further, the top end of the columnar structure is located between the top cover and the bottom plate.

Further, it is characterized in that the cross section of the columnar structure is circular.

Further, it is characterized in that the interval of the columnar structures is not smaller than the cross-sectional diameter of the columnar structures.

Further, first cold head still includes the liquid outlet, the liquid outlet set up in the top cap.

Further, the liquid cooling heat dissipation system further comprises a second cold head and a cold row, wherein the first cold head and the second cold head are connected to the cold row, and the second cold head is arranged on one side face of the laser light source shell.

The laser device further comprises a laser light source, wherein a red laser component is mounted on one side surface of the laser light source shell, and the second cold head is attached to the back surface of the red laser component;

and a blue laser component and a green laser component are arranged on the other side surface which is vertical to the mounting side surface of the red laser component.

Further, the liquid inlet of the second cold head is connected with the liquid outlet of the first cold head, and the liquid outlet of the second cold head and the liquid inlet of the first cold head are both connected to the cold row.

Further, the second cold head is a combination of the cold head and the pump.

The laser projection equipment of above-mentioned one or more embodiments dispels the heat to the light valve through liquid cooling system, specifically sets up the heat conduction lug with the light valve back butt at first cold head, makes the inlet of first cold head towards the heat conduction lug, and the heat conduction lug is inside still to set up a plurality of columnar structure, and the heat transfer of light valve is to the heat conduction lug. The cooling liquid impacts the columnar structure in the heat conducting convex block under the action of gravity, and the heat transferred by the light valve is quickly taken away. The heat dissipation system is small in size and beneficial to miniaturization of the whole machine while the heat dissipation efficiency of the laser projection equipment is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1A is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present disclosure;

FIG. 1B is a schematic diagram illustrating an optical path principle of a laser projection apparatus according to an embodiment of the present disclosure;

fig. 1C is a schematic diagram of an ultra-short focus projection apparatus according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a light source structure of the laser projection apparatus shown in FIG. 1A according to an embodiment of the present disclosure;

FIG. 3A is a schematic diagram of the liquid cooling heat dissipation structure of FIG. 1A according to an embodiment of the present disclosure;

FIG. 3B is an exploded view of the DMD module of FIG. 3A;

FIG. 4A is a schematic diagram of a liquid cooling system according to an embodiment of the present disclosure;

FIG. 4B is an exploded view of FIG. 4A of the present application;

FIG. 5 is a cross-sectional view of the first coldhead of FIG. 4A;

FIG. 6 is a cross-sectional view of a pillar structure

FIG. 7 is a diagram illustrating the flow of liquid in the liquid-cooled heat dissipation system according to an embodiment of the present invention;

description of reference numerals:

10-a laser projection device;

100-light source, 102-light source housing, 110-red laser assembly, 120-blue laser assembly, 130-green laser assembly;

200-optical machine, 210-DMD digital micromirror array; 300-a lens; 400-a circuit board;

501-a fan, 601-a cold row, 602-a first cold head, 603-a second cold head, 604-a pipeline, 6021-a first cold head liquid inlet and 6022-a first cold head liquid outlet; 6031-second cold head liquid inlet, 6032-second cold head liquid outlet;

701-first cold head top cover, 702-first cold head bottom plate, 703-heat conduction bump, 704-columnar structure.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

First, the structure and operation of the laser projection apparatus of the present embodiment will be described with reference to the example of the laser projection apparatus shown in fig. 1A.

The laser projection apparatus 10 includes a whole casing (not shown), and further includes a light source 100, an optical engine 200, and a lens 300, which are assembled in the whole casing according to optical functional parts, and the optical parts are sequentially connected along a light beam propagation direction, and each optical part has a corresponding casing to wrap the optical part, so as to support the optical part and enable each optical part to meet a certain sealing or airtight requirement. The optical engine 200 and the lens 300 are connected and disposed along a first direction of the whole machine, for example, the first direction may be a width direction of the whole machine, or the first direction is opposite to a viewing direction of a user according to a use mode. The light source 100 is disposed in a space enclosed by the optical engine 200, the lens 300 and a part of the whole casing. In this example, the light source 100 is a pure three-color laser light source that emits red, blue, and green laser light. The light source 100, the optical engine 200 and the lens 300 are arranged in an "L" shape, wherein the optical engine 200 and the lens 300 are arranged along a long side direction of the "L" shape, and the light source 100 is arranged along a short side direction of the "L" shape.

Referring to fig. 1A, the light source 100 has a light outlet, which is a surface where the light outlet is located, and the light source 100 provides an illumination beam for the optical engine 200 through connection. The optical machine 200 has a light inlet and a light outlet according to the design of the internal illumination light path of the optical machine, wherein the light inlet of the optical machine 200 is connected to the light outlet of the light source 100, and the light outlet of the optical machine 200 is connected to the lens 300. The light inlet and the light outlet of the optical machine 200 are usually located on different sides of the optical machine in a vertical relationship, where the vertical is a vertical in a spatial position relationship, and the different sides may be different sides of the housing of the rectangular solid light or different sides of the irregular three-dimensional structure.

Fig. 1B shows a schematic diagram of an optical path of a laser projection apparatus, as shown in fig. 1B, the optical projection apparatus is divided into a light source 100, an optical engine 200, and a lens 300 according to optical functional parts. The light source 100 includes a red laser, a blue laser, a green laser, and a plurality of optical lenses for homogenizing and converging the laser beam. The light beam emitted from the light source 100 is incident to the optical engine 200, the optical engine 200 further includes a plurality of lens groups, the TIR or RTIR prism is used to form an illumination light path, the light beam is incident to the light valve, which is a key core device, and the light valve modulates the light beam and then enters the lens group of the lens 300 for imaging. Depending on the projection architecture, the light valve may comprise a wide variety, such as LCOS, LCD or DMD, in this example a DLP architecture is applied, the light valve being a DMD chip. The laser projection device mentioned in this example may be an ultra-short-focus laser projection device. In the ultra-short-focus projection apparatus, the lens 300 is an ultra-short-focus projection lens, and generally includes a refractive lens group and a reflective lens group, so as to image the light beam reflected by the DMD. As shown in fig. 1C, the ultra-short focus projection lens corrects and amplifies the imaging light beam, and then the imaging light beam is reflected and then enters the projection medium, such as a projection screen for imaging, so that an image with a preset size can be projected without a fixed distance from the projection medium like a long focus projection device, and the projection device can be closer to the projection medium, thereby improving the use experience. The ultra-short focus projection device may achieve a smaller throw ratio, such as less than 0.3, in this example, the throw ratio may be 0.24.

And, referring to fig. 1A, a plurality of circuit boards 400 are disposed in a space enclosed by the optical device 200, the lens 300 and another part of the whole casing, the plurality of circuit boards 400 include a power board, a TV board, a control board, a display board, etc., the plurality of circuit boards 400 may be laid flat and stacked, or a part of the plurality of circuit boards 400 may be disposed along the bottom surface of the whole casing and a part of the plurality of circuit boards 400 may be disposed vertically along the side surface of the whole casing.

And, in the laser projection apparatus 10, a plurality of structures such as an acoustic device, a fan, and the like are also provided.

Laser projection equipment adopts three-colour laser light source in this example, produces three primary colors light by the laser instrument, no longer uses wavelength conversion parts such as fluorescence wheel to produce fluorescence, has also left out corresponding drive and radiating part, and the light path has also been simplified for the structure volume of whole light source reduces greatly, thereby the light source, ray apparatus and camera lens can be "L" type and arrange, and the light path structure is more regular, compact. Meanwhile, the reduction of the volume of the light source also provides space for the arrangement of a heat dissipation system.

In a laser projection apparatus, a light source is a main heat generating source, and a high-density energy beam of a laser irradiated on the surface of an optical lens also generates heat. The DMD chip has an area of a fraction of an inch, but is required to withstand the beam energy required for the entire projected image, and the heat generation is very high. On the one hand, the laser has the operating temperature who sets for, forms stable light output, compromises life and performance, and simultaneously, equipment inside contains a plurality of precision optical lens, and especially ultrashort burnt camera lens contains a plurality of lenses, if the inside high temperature of whole equipment, the heat gathering can cause the camera lens to take place "the temperature and float" the phenomenon, and imaging quality can seriously descend. And components such as circuit board devices and the like are driven by electric signals, certain heat is generated, and each electronic device also has a set working temperature. Therefore, good heat dissipation and temperature control are very important guarantees for proper operation of the laser projection device.

The laser projection equipment comprises a light source, an optical machine, a lens and a plurality of circuit boards, and further comprises a heat dissipation system which is used for dissipating heat of the optical engine part and the circuit board part, so that normal operation of the equipment is guaranteed. In the laser projection apparatus of the present example, the heat dissipation system includes a liquid cooling circulation system and an air cooling heat dissipation system.

The laser projection device structure mainly comprises two heat dissipation systems. The liquid cooling heat dissipation system mainly dissipates heat of one group of lasers and the optical machine of the light source, and the air cooling heat dissipation system mainly dissipates heat of the other two groups of lasers, the lens and the circuit board of the light source. Compared with an air cooling heat dissipation system, the liquid cooling circulation system is flexible, the volume of the cold head and the cold row is smaller than that of the traditional heat dissipation fin, and the selection of the shape and the structure position of the liquid cooling circulation system is more diversified. Because the cold head and the cold row are communicated through the pipeline and are a circulating system all the time, the cold row can be arranged close to the cold head and also can have other relative position relations, and the space of the laser projection equipment determines the cold row.

The light source 100 serves as a main heat source of the laser projection apparatus, and the structure of the three-color laser light source will be described with reference to the drawings, wherein fig. 2 is a schematic structural diagram of the light source 100 in fig. 1A.

As shown in fig. 2, the light source 100 includes a light source housing 102, and a red laser assembly 110, a blue laser assembly 120, and a green laser assembly 130 mounted on different sides of the light source housing 102 to emit red laser light, blue laser light, and green laser light, respectively. The blue laser assembly 120 and the green laser assembly 130 are mounted on the same side surface in parallel, and are both perpendicular to the red laser assembly 110 in a spatial position, that is, the side surface of the light source housing where the blue laser assembly 120 and the green laser assembly 130 are located is perpendicular to the side surface of the light source housing where the red laser assembly 130 is located, and both the two side surfaces are perpendicular to the bottom surface of the light source housing 102 or the bottom surface of the whole housing. The mounting positions of the blue laser and the green laser are not limited to this, and the positions may be switched.

Referring to fig. 2, the laser assemblies of any color output rectangular spots, and are vertically mounted on the side surface of the light source housing 102 along the long side direction of the respective rectangular spots.

Fig. 3A is a schematic diagram of a liquid cooling heat dissipation structure shown in fig. 1B in an embodiment of the present application. Specifically, as shown in fig. 3A, a liquid cooling circulation system including a second cold head 603 and a cold row 601 is disposed on one side of the light source housing, wherein the side is mounted with the red laser assembly 110. And a fan 501 is arranged to cool the first cold row 601 by air cooling. The fan is located between the second cold head and the cold row and is a suction fan relative to the first cold row. On the other side of the light source housing, which is perpendicular to the aforementioned side, the blue laser module 120 and the green laser module 130 are mounted.

The red laser component 110 is connected with the second cold head 603, and heat dissipation is performed in a liquid cooling mode, wherein the heating area of the second cold head 603 is larger than the heat conduction area of the back of the red laser component, so that heat conduction can be accelerated. In the liquid cooling circulation system, the second cold head 603 takes away the heat of the heat source component and returns to the cold row 601, the cold row 601 is cooled, and the cooled coolant, for example, water which is commonly used, returns to the cold head again, and then circulates to conduct the heat to the heat source. In the liquid cooling circulation system, still include the pump for the coolant liquid that drives in the liquid cooling circulation system keeps flowing, in this example, sets up pump and cold head integration, does benefit to the reduction part volume. That is, the second cold head 603 serves as both a cold head and a pump. And, in the liquid cooling circulation system of the laser projection apparatus of this example, further include a liquid replenishing device (not shown) for replenishing liquid to the liquid cooling circulation system, so that the liquid pressure in the whole liquid cooling circulation system is greater than the external pressure of the system, and thus external air does not enter the circulation system due to volatilization of the cooling liquid or poor sealing of the pipe joint, causing internal noise of the circulation system, or even causing damage to the device due to cavitation.

And, in this example, the DMD digital micromirror array chip 210, the light valve core device in the optical engine 200, also employs liquid cooling for heat dissipation, the DMD chip being mounted on the side of the housing of the optical engine 200. As shown in the figure, the cold head 602 is installed on one side of the housing of the optical machine 200 for contacting and heat exchanging with the back heat-conducting bump of the DMD chip, and the cold head 602 is also connected to the cold head 603 through a pipe in the liquid cooling circulation system formed by the cold row 601. The cold head 603 will be referred to as the second cold head and the cold head 602 will be referred to as the first cold head hereinafter.

The second cold head 603 has a cooling liquid inlet 6031 and a cooling liquid outlet 6032. The first cold head 602 corresponding to the DMD chip also has a cooling liquid inlet 6021 and a cooling liquid outlet 6022. The back surface of the DMD chip abuts against the first cold head 603.

That is, the red laser assembly 110 and the DMD chip both use a liquid cooling heat dissipation method. Specifically, as shown in fig. 7, when the heat dissipation requirement of the DMD chip is higher than that of the laser assembly, the DMD chip is preferentially dissipated, that is, the coolant with lower temperature flows from the cold row 601 into the coolant inlet 6031 of the first cold head 603 through the pipe 604, the coolant flows through the first cold head 603 to carry away the heat generated by the DMD chip and flows out from the coolant outlet 6032, the second cold head 603 is communicated with the first cold head 602, specifically, the coolant flowing out from the coolant outlet 6032 flows into the coolant inlet 6021 of the second cold head 602, the coolant flows through the second cold head 602 to carry away the heat generated by the red laser assembly, flows out from the coolant outlet 6022, and flows back to the cold row 601 through the pipe 6022 to be cooled again.

In another embodiment, the DMD chip has a lower heat dissipation requirement than the laser device, and preferentially dissipates heat to the red laser device, and at this time, the coolant first takes away heat from the red laser device through the second cold head from the cold row, then takes away heat from the DMD chip through the first cold head by flowing through the pipeline, and finally flows back to the cold row for cooling. In this embodiment, the thermal power of the red laser component is 60W, the heat source area is 14 cm, the operating temperature is not higher than 52 ℃, the thermal power of the DMD chip is 40W, the heat source area is 2.5 cm, and the operating temperature is not higher than 50 ℃, and thus, the heat flow density of the DMD chip is higher than that of the red laser and the temperature requirement is lower than that of the red laser, so that the temperature of the cooling liquid after heat exchange with the DMD chip is increased but still lower than that of the red laser, and therefore, heat exchange with the red laser can still be performed by using the temperature difference.

As shown in fig. 3B, the first cold head 602 covers the DMD chip, is connected to the DMD chip by a screw, and is specifically in contact with the heat-conducting bump on the back surface of the DMD chip, and the heat-conducting bump on the back surface of the DMD chip is smaller because the DMD chip is smaller in size.

In order to improve the heat exchange efficiency of the cold head and rapidly guide out the heat concentrated in a small area range, a heat conduction bump is arranged in the first cold head, as shown in fig. 4A and 4B. First cold head includes top cap 701, bottom plate 702 and heat conduction lug 703, coolant liquid inlet 6021 and coolant liquid outlet 6022 of first cold head all set up in top cap 701, top cap 701 encloses synthetic cavity with bottom plate 702, the top cap welds with the bottom, heat conduction lug 703 runs through bottom plate 702 and DMD back butt, heat conduction lug bottom matches with DMD chip back heat conduction area, the area of being heated of first cold head 602 equals the area of being heated at the DMD chip back promptly, the heat that the DMD chip produced can transmit the heat conduction lug.

The cooling liquid is filled in the first cold head 602, namely the cavity and the heat conduction bump, and no air exists inside, so that the circulation of the cooling liquid is facilitated, and the noise is not easy to generate. The size direct influence of first cold head top cap 701 encloses the volume that closes the cavity with bottom plate 702, and is too little when the top cap, encloses synthetic cavity small, receives under the unchangeable circumstances of pump control at the coolant liquid velocity of flow, and the coolant liquid is short of flowing through the time in the cavity, can accomplish heat exchange and discharge fast, but little cavity can lead to being located its inside coolant liquid volume few, causes the inside coolant liquid temperature rise of cavity big, is unfavorable for the heat dissipation of follow-up red laser instrument subassembly. When the top cap is too big, it is bulky to enclose synthetic cavity, and the coolant liquid volume in the cavity is many, and the temperature rise is little, does benefit to red laser instrument subassembly's heat dissipation, but can lead to the coolant liquid to flow through for a long time in the cavity inside, causes heat exchange and discharge rate to reduce. In this embodiment, the area of the top cover is not smaller than the area of the DMD chip and not larger than the area of the top surface of the illumination housing.

The coolant liquid inlet 6021 of first cold head faces the heat conduction bump 703, and the coolant liquid directly falls into the heat conduction bump 703 after flowing into from liquid inlet 6021, and the position of coolant liquid outlet 6022 is not specifically limited, and can be in the coplanar with the coolant liquid inlet, also can be in its side around, but with the thickness that the coolant liquid outlet set up first cold head in the side of first cold head can increase, be unfavorable for the reduction of laser projection equipment volume, consequently, in this embodiment, set up coolant liquid outlet and coolant liquid inlet in the coplanar.

Specifically, as shown in fig. 5, the heat conduction bump 703 includes a plurality of pillar structures 704 spaced apart from each other, extending from the bottom of the heat conduction bump toward the top cover, and not contacting the top cover 701 and the water inlet 6021. Compared with the structure without the columnar structure in the heat conduction convex block, the heat dissipation area of the heat conduction convex block is increased, particularly the surface area part of the columnar structure, so that the heat dissipation efficiency is improved.

The columnar structure and the heat conduction block are made of metal materials, the copper alloy or the aluminum alloy with high heat conductivity coefficient can be used, the columnar structure and the heat conduction lug can be formed by welding or formed by cutting and can also be integrally formed by die casting, the integral forming by die casting is adopted in the embodiment, the forming process is rapid, the cost is low, and the reliability is high.

The columnar structures are not limited to be cylindrical, and can also be conical, the columnar structures can be uniformly arranged or irregularly arranged, the arrangement mode can be sequential arrangement or cross arrangement, and the interval between the columnar structures is 0.5 to 1.5 times of the diameter of the bottom surface of the columnar structures.

In the present embodiment, as shown in fig. 6, in particular, the column-shaped structures 704 are cylinders uniformly arranged in 4 rows and 3 columns, the distance between each row is 0.5 to 1.5 times the diameter of the bottom surface of the cylinder, and the distance between each column is 0.5 to 1 times the diameter of the bottom surface of the cylinder. The DMD cavity does not need to be designed with a fine microstructure to increase the heat dissipation area, and the generated heat is mainly conducted and transferred by the columnar structure.

The columnar structure 704 extends from the bottom of the heat conducting bump 703 to the top cover 701, the top end of the columnar structure 704 is positioned between the top cover and the bottom plate, the length of the columnar structure 704, which is higher than the bottom plate, is 0.5 to 1 times of the diameter of the columnar structure, namely, a part of the columnar structure extends into the cavity, and the top surface of the columnar structure is higher than the bottom plate, so that the increase of the surface area of the columnar structure is facilitated on one hand, and the heat dissipation area is increased; on the other hand, the transverse disturbance among the cooling liquid in the cavity can be increased, and the heat dissipation rate is accelerated.

The back is flowed into from the coolant liquid inlet 6021 of first cold head to the coolant liquid, and the coolant liquid forms the impact to columnar structure 704 top surface under the effect of gravity, takes away the heat of transferring by DMD chip 210 fast, and the coolant liquid strikes the cooling liquid level that the columnar structure does not extend to cavity part simultaneously, takes away the heat that the DMD chip transmitted liquid, and the coolant liquid passes through the inside cavity of first cold head again, moves to the first cold head of coolant liquid outlet 6022 outflow, carries away the heat of DMD chip.

The coolant entering from the coolant inlet 6021 of the first cold head, under the action of gravity, the gravitational potential energy is converted into kinetic energy, the flow velocity of the coolant is increased, the impact velocity on the top of the columnar structure 704 is increased, and the thermal conductivity is increased. Meanwhile, the cooling liquid flows downwards along the wall surface of the columnar structure, impacts the cooling liquid surface of the columnar structure, which does not extend to the cavity part, and the cooling liquids in different directions collide with each other, so that the disturbance of the cooling liquid can be enhanced, the thermal resistance in the heat transfer process is reduced, the heat transfer coefficient is improved, the convection heat exchange strength is enhanced, and the rapid cooling of the DMD chip is realized.

The efficiency of the heat exchange of the first cold head that has set up columnar structure in the heat conduction lug is higher, can be fast with the quick derivation of the comparatively concentrated heat of small area scope, does benefit to DMD chip operating temperature's stability, reduces the temperature rise speed, simultaneously, compare in the condition that coolant liquid inlet and liquid outlet all are located first cold head side, the radiating dentate structure of its inside design's reinforcing can influence the liquid flow rate, increase liquid resistance, it is limited to promote the heat transfer efficiency of DMD chip. And the liquid inlet and the liquid outlet through with first cold head set up in the top cap to set up the heat of heat conduction lug transmission DMD, utilize gravity to promote the heat transfer efficiency to DMD. And make it and red laser instrument share a set of liquid cooling system, to liquid cooling system, need not increase too much subassembly, can realize red laser instrument and the promotion of DMD radiating efficiency. And compare with the water inlet and the delivery port of first cold head all set up in the side before, the radiating efficiency of DMD chip promotes, and cooling system's volume reduces to compromise the reduction of heat dissipation demand and equipment volume.

It should be noted that the fan 501 may also be disposed between the whole casing and the cold row, in which case the fan is a blowing fan relative to the cold row.

In a laser projection apparatus, the heat dissipation requirement of the light source 100 is the most strict, and is the portion of the whole apparatus where the operating temperature is relatively low. Specifically, the operating temperature of the red laser assembly is lower than the operating temperatures of the blue laser assembly and the green laser assembly, which is determined by the light emission principle of the red laser. The blue laser and the green laser are generated by using a gallium arsenide light emitting material, and the red laser is generated by using a gallium nitride light emitting material. The red laser has low light emission efficiency and high heat generation. The temperature requirements of the red laser luminescent material are also more severe. Therefore, when the light source component composed of the three-color laser is radiated, different radiating structures are required to be arranged according to the temperature requirements of different laser assemblies, the laser of each color can be ensured to work in a better state, the service life of the laser assemblies is prolonged, and the light emitting efficiency is more stable.

The air cooling heat dissipation mode can control the temperature difference between the hot end and the cold end of the heat source to be about 4-5 ℃, and the temperature difference control of the liquid cooling heat dissipation can be more accurate and smaller in range, such as 2-3 ℃. The red laser component with the lower working temperature threshold value adopts a liquid cooling heat dissipation mode, the blue laser component with the relatively higher working temperature threshold value and the red laser component adopt an air cooling heat dissipation mode, the red laser component can be cooled by lower heat dissipation cost under the condition of meeting the requirement of the working temperature of the red laser, and the requirement on the rotating speed of the fan can be reduced by meeting the requirement on the smaller temperature difference. The liquid cooling heat dissipation method has a higher component cost than the air cooling heat dissipation method.

Therefore, in the laser projection device in the example, the mode of liquid cooling and air cooling mixed heat dissipation is adopted for the heat dissipation of the light source, so that the working temperature control of different laser assemblies can be met, and the laser projection device is economical and reasonable.

Above-mentioned laser projection equipment in one or more embodiments, the ray apparatus and the red laser instrument of light source share one set of liquid cooling system, set up heat conduction lug through the first cold head to liquid cooling system, utilize the action of gravity of coolant liquid to realize the rapid cooling to the ray apparatus, and then promoted laser projection equipment's radiating efficiency. Meanwhile, the heat dissipation system is small in size, the complexity of the liquid cooling circulation system is not increased, and the miniaturization of the whole structure is facilitated.

In above-mentioned a plurality of embodiments, liquid cooling system and phase transition heat pipe system set up in the space that light source, ray apparatus, camera lens three enclose, cooperate with projection system's optical function part, and the overall arrangement is compact, and space utilization is high, when realizing high-efficient heat dissipation, can also realize the miniaturization of structure.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A laser projection device is characterized in that the device comprises an optical machine and a liquid cooling heat dissipation system,

the optical machine comprises a light valve, and the light valve is positioned in the optical machine shell;

the liquid cooling heat dissipation system at least comprises a first cold head, and the first cold head is connected to the back surface of the light valve;

the first cold head comprises a top cover, a bottom plate and a heat conduction lug, the heat conduction lug protrudes out of the bottom plate and is abutted against the back surface of the light valve, and a liquid inlet is formed in the top cover and faces towards the heat conduction lug;

still include a plurality of columnar structure in the heat conduction convex block of first cold head, the columnar structure to the top cap extends.

2. The laser projection device of claim 1, wherein the thermally conductive bump extends through the base plate.

3. The laser projection device of claim 2, wherein a top end of the columnar structure is located between the top cover and the base plate.

4. A laser projection device as claimed in claim 3, wherein the cross-section of the columnar structure is circular.

5. The laser projection device of claim 4, wherein the columnar structures are spaced apart by no less than a cross-sectional diameter of the columnar structures.

6. The laser projection device of claim 1, wherein the first cold head further comprises a liquid outlet, the liquid outlet being disposed in the top cover.

7. The laser projection device of claim 1, wherein the liquid-cooled heat dissipation system further comprises a second cold head and a cold bar, and the first cold head and the second cold head are both connected to the cold bar.

8. The laser projection device of claim 7, further comprising a laser source, wherein a red laser component is mounted on one side surface of the laser source housing, and the second cold head is mounted on the back surface of the red laser component;

and a blue laser component and a green laser component are arranged on the other side surface which is vertical to the mounting side surface of the red laser component.

9. The laser projection device of claim 8, wherein the liquid inlet of the second cold head is connected to the liquid outlet of the first cold head, and the liquid outlet of the second cold head and the liquid inlet of the first cold head are both connected to the cold row.

10. A laser projection device as claimed in claim 9, wherein the second cold head is a combination of a cold head and a pump.

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