CN216905753U

CN216905753U - Heat dissipation structure for data center

Info

Publication number: CN216905753U
Application number: CN202123381928.3U
Authority: CN
Inventors: 王坤
Original assignee: Guangzhou Yizi Internet Technology Co ltd
Current assignee: Guangzhou Yizi Internet Technology Co ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2022-07-05
Anticipated expiration: 2031-12-29

Abstract

The utility model relates to the technical field of cabinet heat dissipation, in particular to a heat dissipation structure for a data center, which comprises a cabinet and a water tank, wherein supporting legs are fixedly arranged between the bottom of the cabinet and the outer wall of the top of the water tank, a cabinet door is arranged on the outer wall of one side of the cabinet, a heat dissipation assembly is arranged on the outer wall of a vertical pipe, an air cooling mechanism is arranged on the outer wall of the top of the water tank, and a disturbance mechanism is arranged on the inner wall of the water tank. The pipe chase that sets up can increase with the area of contact of U type intubate to promote the radiating effect to the rack.

Description

Heat dissipation structure for data center

Technical Field

The utility model relates to the technical field of cabinet heat dissipation, in particular to a heat dissipation structure for a data center.

Background

The data center machine room is a large space for providing operation for the server, but the temperature in the space is higher due to strong performance of equipment, high concentration and large heat productivity, and the performance of the server is reduced due to long-term operation, so that the machine room of the data center needs to be cooled.

The heat dissipation measures in the prior art have the following problems:

(1) the existing cabinet is a smooth plane, the contact area with the external environment is small, and the heat exchange area is limited during heat dissipation;

(2) the existing heat dissipation measures mostly adopt air conditioners for cooling, the mode lacks pertinence, the layout can not be carried out according to the size and the type of an on-site cabinet, and the heat dissipation effect on the cabinet is not favorably improved.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a heat dissipation structure for a data center, so as to solve the problems in the background art.

The technical scheme of the utility model is as follows: the utility model provides a heat radiation structure for data center, includes rack and water tank, fixed mounting has the supporting legs between the bottom of rack and the top outer wall of water tank, one side outer wall of rack is provided with the cabinet door, the top outer wall fixed mounting of water tank has the water pump, the top outer wall of water pump has cup jointed the standpipe, the back flow has been cup jointed on the top of standpipe, the one end of back flow is cup jointed in the top outer wall of water tank, the outer wall of standpipe is provided with radiator unit, the mounting groove has been seted up to the bottom outer wall of water tank, and the inner wall fixed mounting of mounting groove has the semiconductor refrigeration piece, the top outer wall of water tank is provided with forced air cooling mechanism, and the inner wall of water tank sets up disturbance mechanism.

Preferably, the heat dissipation assembly comprises a U-shaped insertion pipe, the outer wall of the vertical pipe is provided with a connection pipe, the U-shaped insertion pipe is sleeved at one end of the connection pipe, and the outer wall of the vertical pipe is fixedly provided with a circuit breaking valve through a bolt.

Preferably, the heat dissipation assembly further comprises pipe slots formed in the outer walls of the two sides of the cabinet.

Preferably, the air cooling mechanism comprises an air pipe fixedly installed on the outer wall of one side of the water tank, the air outlet of the air pipe is aligned to the heat dissipation end of the semiconductor refrigeration sheet, a fan is fixedly installed on the outer wall of the top of the air pipe, a shunting box is sleeved at the air inlet end of the fan, and an air inlet part is sleeved on the outer wall of one side of the shunting box.

Preferably, the air inlet part comprises a flow dividing pipe sleeved on the outer wall of one side of the flow dividing box, the air inlet box is sleeved at one end of the flow dividing pipe, and the air inlet pipe is sleeved at one end of the air inlet box.

Preferably, the disturbance mechanism includes the pivot of rotating and connecting in the box inner wall of admitting air, the outer wall fixed mounting of pivot has the drive plate, the drive plate sets up in the inner wall of the box of admitting air, the outer wall bottom fixed mounting of pivot has the puddler, the puddler sets up in the inner wall of water tank.

The utility model provides a heat dissipation structure for a data center by improving, compared with the prior art, the heat dissipation structure has the following improvements and advantages:

one is as follows: according to the utility model, different numbers of U-shaped insertion pipes can be inserted according to requirements, the open valves at different positions are controlled, and then the water pump is started to convey water into the U-shaped insertion pipes through the vertical pipe, so that water in the water tank finally flows back to the inner wall of the water tank after passing through the vertical pipe and the U-shaped insertion pipes, the heat of the cabinet is taken away through the circular flow of the water, the heat dissipation of the cabinet is realized, the arrangement can be adjusted in a targeted manner according to the condition of the cabinet, and the contact area between the arranged pipe grooves and the U-shaped insertion pipes can be increased, so that the heat dissipation effect on the cabinet is improved;

the second step is as follows: when the fan is started, the flow pipe is used for exhausting air, at the moment, air flow enters the inner wall of the air inlet box from one end of the air inlet pipe, the driving plate is driven to rotate under the action of the air flow, the driving plate drives the rotating shaft to rotate at the moment, the stirring rod is further driven to rotate and stir water in the water tank, the effect of stirring the water in the water tank is achieved, the temperature of the water in the water tank is kept uniformly hot, therefore, low-temperature water which is continuous enters the inner walls of the U-shaped insertion pipe and the vertical pipe, and the heat dissipation speed of the whole cabinet is increased.

Drawings

The utility model is further explained below with reference to the figures and examples:

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a perspective view of another aspect of the present invention;

FIG. 3 is a perspective view of the present invention with the cabinet concealed;

FIG. 4 is a perspective view of a portion of the cabinet of the present invention;

FIG. 5 is a perspective view of a U-shaped cannula portion of the present invention;

fig. 6 is a schematic sectional view showing a portion of the intake box according to the present invention.

Description of reference numerals:

1. a cabinet; 2. a water tank; 3. a cabinet door; 4. a U-shaped cannula; 5. a water pump; 6. a vertical tube; 7. a circuit breaking valve; 8. supporting legs; 9. a pipe groove; 10. an air duct; 11. a fan; 12. a shunt box; 13. a shunt tube; 14. an air intake box; 15. an air inlet pipe; 16. a semiconductor refrigeration sheet; 17. a rotating shaft; 18. a drive plate; 19. a stirring rod.

Detailed Description

The present invention is described in detail below, and technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The utility model provides a heat dissipation structure for a data center through improvement, and the technical scheme of the utility model is as follows:

as shown in fig. 1-6, a heat radiation structure for data center, including rack 1 and water tank 2, fixed mounting has supporting legs 8 between the bottom of rack 1 and the top outer wall of water tank 2, one side outer wall of rack 1 is provided with cabinet door 3, top outer wall fixed mounting of water tank 2 has water pump 5, standpipe 6 has been cup jointed to water pump 5's top outer wall, the back flow has been cup jointed on standpipe 6's top, the one end of back flow is cup jointed in water tank 2's top outer wall, standpipe 6's outer wall is provided with radiator unit, the mounting groove has been seted up to water tank 2's bottom outer wall, the inner wall fixed mounting of mounting groove has semiconductor refrigeration piece 16, water tank 2's top outer wall is provided with forced air cooling mechanism, and water tank 2's inner wall sets up disturbance mechanism.

Further, radiator unit includes U type intubate 4, and the outer wall of standpipe 6 is provided with the takeover, and U type intubate 4 cup joints in the one end of takeover, and there is open circuit valve 7 in the outer wall of standpipe 6 through bolt fixed mounting, through the open circuit valve 7 of controlling different positions department, then start water pump 5 with water through standpipe 6 carry to U type intubate 4 in.

Further, radiator unit is still including seting up in the tube seat 9 of 1 both sides outer wall of rack, and the tube seat 9 of setting can increase the area of contact with U type intubate 4 to promote the radiating effect to rack 1.

Further, the air cooling mechanism comprises an air pipe 10 fixedly installed on the outer wall of one side of the water tank 2, an air outlet of the air pipe 10 is aligned to a heat dissipation end of the semiconductor refrigeration sheet 16, a fan 11 is fixedly installed on the outer wall of the top of the air pipe 10, a shunting box 12 is sleeved on an air inlet end of the fan 11, and an air inlet part is sleeved on the outer wall of one side of the shunting box 12.

Further, the air inlet part comprises a flow dividing pipe 13 sleeved on the outer wall of one side of the flow dividing box 12, an air inlet box 14 is sleeved at one end of the flow dividing pipe 13, an air inlet pipe 15 is sleeved at one end of the air inlet box 14, the fan 11 is started when the water pump 5 works, and when the fan 11 is started, the heat dissipation end of the semiconductor refrigeration piece 16 is dissipated through the air pipe 10, so that the semiconductor refrigeration piece 16 is prevented from being damaged when working for a long time.

Further, disturbance mechanism is including rotating the pivot 17 of connecting in the box 14 inner wall of admitting air, the outer wall fixed mounting of pivot 17 has drive plate 18, drive plate 18 sets up in the inner wall of the box 14 of admitting air, the outer wall bottom fixed mounting of pivot 17 has puddler 19, puddler 19 sets up in the inner wall of water tank 2, shunt 13 bleeds when fan 11 starts, the air current enters into the inner wall of the box 14 of admitting air from the one end of intake pipe 15 this moment, effect through the air current drives drive plate 18 and rotates, drive plate 18 drives pivot 17 and rotates this moment, and then drive puddler 19 and rotate the stirring, the realization is to the effect of water stirring in the water tank 2, make the temperature in the water tank 2 keep even heat, thereby make the low-temperature water that is continuous enter into in the inner wall of U type intubate 4 and standpipe 6.

The working principle is as follows: when the cooling water circulation cooling device is used, different numbers of U-shaped insertion pipes 4 can be selectively inserted according to requirements, the circuit breaking valves 7 at different positions are controlled, then the water pump 5 is started to convey water into the U-shaped insertion pipes 4 through the vertical pipes 6, so that the water in the water tank 2 finally flows back to the inner wall of the water tank 2 after passing through the vertical pipes 6 and the U-shaped insertion pipes 4, the heat of the cabinet 1 is taken away through the circulation flow of the water, the heat dissipation of the cabinet 1 is realized, the contact area between the arranged pipe grooves 9 and the U-shaped insertion pipes 4 can be increased, the heat dissipation effect on the cabinet 1 is improved, the semiconductor chilling plates 16 arranged at the bottom of the water tank 2 can cool the water in the water tank 2, the temperature of the cooling water is always kept in a low temperature state, the fan 11 is started when the water pump 5 works, the heat dissipation end of the semiconductor chilling plates 16 is dissipated through the air pipe 10 when the fan 11 is started, and the damage of the semiconductor chilling plates 16 due to long-time work is avoided, flow tube 13 is bled when fan 11 starts, the air current enters into the inner wall of box 14 that admits air from the one end of intake pipe 15 this moment, effect through the air current drives drive plate 18 and rotates, drive plate 18 drives pivot 17 and rotates this moment, and then drive puddler 19 and rotate the stirring, the realization is to the effect of water stirring in water tank 2, make the temperature in water tank 2 keep even heat, thereby make low temperature water that is continuous enter into the inner wall of U type intubate 4 and standpipe 6, promote the radiating rate of whole rack 1.

Claims

1. A heat radiation structure for a data center, characterized in that: including rack (1) and water tank (2), fixed mounting has supporting legs (8) between the bottom of rack (1) and the top outer wall of water tank (2), one side outer wall of rack (1) is provided with cabinet door (3), the top outer wall fixed mounting of water tank (2) has water pump (5), standpipe (6) have been cup jointed to the top outer wall of water pump (5), the back flow has been cup jointed on the top of standpipe (6), the one end of back flow is cup jointed in the top outer wall of water tank (2), the outer wall of standpipe (6) is provided with radiator unit, the mounting groove has been seted up to the bottom outer wall of water tank (2), and the inner wall fixed mounting of mounting groove has semiconductor refrigeration piece (16), the top outer wall of water tank (2) is provided with forced air cooling mechanism, and the inner wall of water tank (2) sets up disturbance mechanism.

2. The heat dissipation structure for a data center according to claim 1, wherein: the heat dissipation assembly comprises a U-shaped insertion pipe (4), the outer wall of the vertical pipe (6) is provided with a connection pipe, the U-shaped insertion pipe (4) is connected to one end of the connection pipe in a sleeved mode, and a circuit breaking valve (7) is fixedly mounted on the outer wall of the vertical pipe (6) through bolts.

3. The heat dissipation structure for a data center according to claim 2, wherein: the heat dissipation assembly further comprises pipe grooves (9) formed in the outer walls of the two sides of the cabinet (1).

4. The heat dissipation structure for a data center according to claim 1, wherein: air-cooled mechanism is including air hose (10) of fixed mounting in water tank (2) one side outer wall, the heat dissipation end of semiconductor refrigeration piece (16) is aimed at to the air outlet of air hose (10), the top outer wall fixed mounting of air hose (10) has fan (11), the inlet end cover of fan (11) has connect shunting box (12), the part of admitting air has been cup jointed to one side outer wall of shunting box (12).

5. The heat dissipation structure for a data center according to claim 4, wherein: the air inlet component comprises a shunt pipe (13) sleeved on the outer wall of one side of the shunt box (12), an air inlet box (14) is sleeved at one end of the shunt pipe (13), and an air inlet pipe (15) is sleeved at one end of the air inlet box (14).

6. The heat dissipation structure for a data center according to claim 5, wherein: disturbance mechanism is including rotating pivot (17) of connecting in box (14) inner wall of admitting air, the outer wall fixed mounting of pivot (17) has drive plate (18), drive plate (18) set up in the inner wall of box (14) of admitting air, the outer wall bottom fixed mounting of pivot (17) has puddler (19), puddler (19) set up in the inner wall of water tank (2).