CN216902888U

CN216902888U - High-performance IGBT module shell structure

Info

Publication number: CN216902888U
Application number: CN202123302882.1U
Authority: CN
Inventors: 周晟
Original assignee: Kunshan Xinda Accurate Component Co ltd
Current assignee: Kunshan Xinda Accurate Component Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-07-05
Anticipated expiration: 2031-12-24

Abstract

The utility model discloses a high-performance IGBT module shell structure, which comprises a shell, wherein a plurality of groups of contact pins are arranged at the outer edge of the top surface of the shell, and the high-performance IGBT module shell structure is characterized in that: the middle part of the shell is provided with a cavity, the bottom of each group of contact pins is provided with a bending connecting piece, the bending connecting pieces are vertically connected with the contact pins, the outer ends of the bending connecting pieces are embedded in the shell, the inner ends of the bending connecting pieces are inserted into the cavity, and the bending connecting pieces are vertically connected with the inner wall corresponding to the cavity; the inner wall of the cavity is provided with a plurality of groups of supporting plates at intervals, the distance between two groups of bending connecting pieces is smaller than the width of the supporting plates, each group of supporting plates is arranged below two adjacent groups of bending connecting pieces, and two sides of the bottom of each group of bending connecting pieces are respectively abutted to the top surfaces of the two adjacent groups of supporting plates. The utility model improves the firmness and stability of installation and prolongs the service life.

Description

High-performance IGBT module shell structure

Technical Field

The utility model relates to an IGBT module, in particular to a high-performance IGBT module shell structure.

Background

The IGBT and the insulated gate bipolar transistor are composite fully-controlled voltage-driven power semiconductor devices composed of BJTs (bipolar transistors) and MOS (insulated gate field effect transistors), and have the advantages of both high input impedance of the MOSFET and low conduction voltage drop of GTR.

The IGBT modules are generally mounted inside a case and then assembled using the case. After the IGBT module is installed in the casing, need utilize connecting wire and casing contact pin above the connecting piece to be connected, however, among the prior art, the connecting piece directly exposes, in routing connection, it is not hard up easily, after the routing in addition, connecting piece and junction between them are not hard up easily, and the pulling force is not enough during subsequent use, influences subsequent use's stability and life.

Disclosure of Invention

The utility model aims to provide a high-performance IGBT module shell structure, which ensures the firmness and stability of subsequent routing connection, improves the drawing force and prolongs the service life.

In order to achieve the purpose, the utility model adopts the technical scheme that: a high-performance IGBT module shell structure comprises a shell, wherein a plurality of groups of contact pins are arranged at the outer edge of the top surface of the shell, the bottoms of the contact pins are pre-buried in the shell, the shell is of a hollow structure, a cavity is arranged in the middle of the shell, and two ends of the cavity are respectively communicated with the top surface and the bottom surface of the shell; the bottom of each group of the contact pins is provided with a bending connecting piece, the bending connecting piece is vertically connected with the contact pins, the outer ends of the bending connecting pieces are pre-embedded in the shell, the inner ends of the bending connecting pieces are inserted in the cavities, and the bending connecting pieces are vertically connected with the inner walls corresponding to the cavities;

the inner wall of the cavity is provided with a plurality of groups of supporting plates at intervals, the distance between the two groups of bending connecting pieces is smaller than the width of the supporting plates, each group of supporting plates is arranged below the two adjacent groups of bending connecting pieces, and two sides of the bottom of each group of bending connecting pieces are respectively abutted against the top surfaces of the two adjacent groups of supporting plates.

In the above technical scheme, the housing and the supporting plate are made of plastic, and the contact pin and the bending connecting piece are made of metal.

In the technical scheme, the top of each group of the supporting plate is provided with a convex plate extending upwards, the convex plates are arranged between two adjacent groups of the bending connecting pieces, the outer side surfaces of the convex plates are connected with the inner wall of the cavity, and the side walls of the convex plates are in contact with the side walls of the two adjacent groups of the bending connecting pieces.

In the above technical scheme, the height of the convex plate is smaller than that of the bending connecting piece.

In the technical scheme, the two sides of the convex plate are respectively provided with a clamping groove, the bottom of each clamping groove is flush with the top surface of the supporting plate, the two sides of the bending connecting piece are respectively provided with a clamping plate, and each group of clamping plates are respectively clamped in the clamping grooves of the adjacent convex plates.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

1. according to the utility model, the plurality of groups of supporting plates are arranged on the inner wall of the cavity, the bottom of the bending connecting piece is directly abutted against the supporting plates, so that the bottom of the bending connecting piece is supported, and the supporting force of the bending connecting piece is increased, therefore, the looseness can be prevented when the bending connecting piece is subsequently connected with an IGBT module in a routing manner, the drawing force of a connecting part is increased, the firmness and stability of installation and use are improved, and the service life is prolonged;

2. according to the utility model, the convex plate is arranged on the supporting plate and is positioned between the adjacent bending connecting pieces, so that the bending connecting pieces can be clamped, and the clamping groove and the clamping plate are arranged, so that the bending connecting pieces can be wrapped, the firmness of the bending connecting pieces is increased, and the firmness of subsequent routing and the increase of drawing force are ensured.

Drawings

FIG. 1 is a schematic structural diagram according to a first embodiment of the present invention;

FIG. 2 is a schematic perspective view of a top portion of the first embodiment of the present invention;

FIG. 3 is a schematic perspective view of a bottom portion of an embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a connection portion between a bent connection member and a supporting plate according to an embodiment of the present invention.

Wherein: 1. a housing; 2. inserting a pin; 3. a cavity; 4. bending the connecting piece; 5. a support plate; 6. a convex plate; 7. a card slot; 8. provided is a clamping plate.

Detailed Description

The utility model is further described with reference to the following figures and examples:

the first embodiment is as follows: referring to fig. 1-4, a high-performance IGBT module casing structure includes a casing 1, a plurality of groups of contact pins 2 are arranged at an outer edge of a top surface of the casing, bottoms of the contact pins are pre-buried in the casing, the casing is of a hollow structure, a cavity 3 is arranged in a middle of the casing, and two ends of the cavity are respectively communicated with the top surface and a bottom surface of the casing; the bottom of each group of the contact pins is provided with a bending connecting piece 4, the bending connecting pieces are vertically connected with the contact pins, the outer ends of the bending connecting pieces are pre-embedded in the shell, the inner ends of the bending connecting pieces are inserted in the cavities, and the bending connecting pieces are vertically connected with the inner walls corresponding to the cavities;

the inner wall of the cavity is provided with a plurality of groups of supporting plates 5 at intervals, the distance between two groups of bending connecting pieces is smaller than the width of the supporting plates, each group of supporting plates is arranged below two adjacent groups of bending connecting pieces, and two sides of the bottom of each group of bending connecting pieces are respectively abutted against the top surfaces of the two adjacent groups of supporting plates.

In this embodiment, through the setting of layer board, can give the support with the bottom of the connecting piece of bending, increase its support performance, at the installation of IGBT module like this, when utilizing the connecting wire and the connecting piece routing connection of bending, prevent that the connecting piece department of bending is not hard up and warp, simultaneously, after the installation is accomplished, guarantee its drawing force, guarantee subsequent life.

The shell and the supporting plate are made of plastics, and the contact pin and the bending connecting piece are made of metal.

When the plastic shell is manufactured, the contact pin and the bending connecting piece are placed into the mold, then the shell is subjected to injection molding, and the contact pin and the bending connecting piece are embedded into the plastic shell in a pre-buried mode.

Referring to fig. 1-4, the top of each group of the supporting plates is provided with a convex plate 6 extending upwards, the convex plates are arranged between two adjacent groups of the bending connecting pieces, the outer side surfaces of the convex plates are connected with the inner walls of the cavities, and the side walls of the convex plates are in contact with the side walls of the two adjacent groups of the bending connecting pieces.

The height of the convex plate is smaller than that of the bending connecting piece.

Through the arrangement of the convex plate, the side part of the bent connecting piece can be propped against, the bent connecting piece is prevented from bending and deforming towards two sides, and the firmness of installation and use of the bent connecting piece is improved.

Referring to fig. 4, two sides of the protruding plate are respectively provided with a clamping groove 7, the bottom of each clamping groove is flush with the top surface of the supporting plate, two sides of the bending connecting piece are respectively provided with a clamping plate 8, and each group of clamping plates are respectively clamped in the clamping grooves of the adjacent protruding plates.

Cardboard and draw-in groove's setting further increases the area of contact between connecting piece and casing, the flange of bending, increases its intensity, prevents that it from appearing not hard up on the casing, guarantees the fastness and the stability of the connecting piece of bending in routing connection and the use, increase of service life reduces the maintenance rate.

Claims

1. The utility model provides a high performance IGBT module shell structure, includes the casing, the top surface outer fringe department of casing is equipped with the multiunit contact pin, the bottom of contact pin pre-bury in inside the casing, its characterized in that: the shell is of a hollow structure, a cavity is arranged in the middle of the shell, and two ends of the cavity are respectively communicated with the top surface and the bottom surface of the shell; the bottom of each group of the contact pins is provided with a bending connecting piece, the bending connecting piece is vertically connected with the contact pins, the outer ends of the bending connecting pieces are pre-embedded in the shell, the inner ends of the bending connecting pieces are inserted in the cavities, and the bending connecting pieces are vertically connected with the inner walls corresponding to the cavities;

the inner wall of the cavity is provided with a plurality of groups of supporting plates at intervals, the distance between two groups of bending connecting pieces is smaller than the width of the supporting plates, each group of supporting plates is arranged below two adjacent groups of bending connecting pieces, and two sides of the bottom of each group of bending connecting pieces are respectively abutted to the top surfaces of the two adjacent groups of supporting plates.

2. The high performance IGBT module housing structure of claim 1, characterized in that: the shell and the supporting plate are made of plastics, and the contact pin and the bending connecting piece are made of metal.

3. The high performance IGBT module housing structure of claim 1, wherein: the top of every group layer board is equipped with the flange that extends up, the flange sets up in adjacent two sets of bend between the connecting piece, the lateral surface of flange with the inner wall of cavity links to each other, the lateral wall of flange and adjacent two sets of the lateral wall of connecting piece of bending contacts.

4. The high performance IGBT module housing structure of claim 3, wherein: the height of the convex plate is smaller than that of the bending connecting piece.

5. The high performance IGBT module housing structure of claim 4, wherein: the two sides of the convex plate are respectively provided with a clamping groove, the bottom of each clamping groove is flush with the top surface of the support plate, two sides of the bending connecting piece are respectively provided with a clamping plate, and each group of clamping plates are respectively clamped in the clamping grooves of the adjacent convex plates.