CN216902878U

CN216902878U - Clamp for processing semiconductor chip

Info

Publication number: CN216902878U
Application number: CN202122226605.0U
Authority: CN
Inventors: 吴雪燕
Original assignee: Shenzhen Fuyunda Machinery Co ltd
Current assignee: Shenzhen Fuyunda Machinery Co ltd
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2022-07-05
Anticipated expiration: 2031-09-14

Abstract

The utility model relates to the technical field of semiconductor chips and discloses a clamp for processing a semiconductor chip, which comprises a bottom plate, wherein a spring cylinder is fixedly installed at the top of the bottom plate, a first spring is fixedly installed inside the spring cylinder, a connecting plate is fixedly installed at one end of the first spring, a connecting block is fixedly installed at one side of the connecting plate, a connecting shaft is fixedly installed inside the connecting block, a push rod is fixedly installed on the outer wall of the connecting shaft, a connecting rod is fixedly installed on the outer wall of the connecting shaft, and a bolt is fixedly installed inside the connecting rod. This anchor clamps for semiconductor chip processing can stabilize the product centre gripping, and the effectual general anchor clamps for semiconductor chip processing that have avoided leads to the product to influence the problem appearance of processing effect with the skew because of the unstable product of centre gripping is not hard up, has reduced the spoilage of product, has improved the yield of product, has improved the efficiency of product processing to further improvement the practicality of device.

Description

Clamp for processing semiconductor chip

Technical Field

The utility model relates to the technical field of semiconductor chips, in particular to a clamp for processing a semiconductor chip.

Background

A semiconductor chip: in order to meet the requirements of mass production, the electrical properties of semiconductors must be predictable and stable, so that the purity of dopants and the quality of semiconductor lattice structures must be strictly required, common quality problems including dislocations, twin planes or stacking faults of crystal lattices affect the characteristics of semiconductor materials, and for a semiconductor device, the defective crystal defects of the material crystal lattice are usually the main cause of the element performance.

The traditional clamp for processing the semiconductor chip used in the current market can not clamp the product firmly, the problem that the processing effect is influenced by the deviation of the product during processing due to the fact that the product is not clamped firmly and loosened can often occur, the damage rate of the product is high, and the yield of the product is low.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides a clamp for processing a semiconductor chip, which has the advantages of firm clamping and the like and solves the problem that the common clamp for processing the semiconductor chip is weak in clamping.

(II) technical scheme

In order to achieve the purpose of clamping and fastening, the utility model provides the following technical scheme: a clamp for processing a semiconductor chip comprises a bottom plate, wherein a spring cylinder is fixedly installed at the top of the bottom plate, a first spring is fixedly installed inside the spring cylinder, a connecting plate is fixedly installed at one end of the first spring, a connecting block is fixedly installed on one side of the connecting plate, a connecting shaft is fixedly installed inside the connecting block, a push rod is fixedly installed on the outer wall of the connecting shaft, a connecting rod is fixedly installed on the outer wall of the connecting shaft, a bolt is fixedly installed inside the connecting rod, a clamping block is movably installed on the outer wall of the bolt, a sliding block is fixedly installed at the bottom of the clamping block, and a sliding rail is fixedly installed at the top of the bottom plate;

preferably, a movable groove is formed in the bottom plate, a second spring is fixedly mounted in the movable groove, and a limiting block is fixedly mounted at the top end of the second spring, so that the product can be conveniently mounted.

Preferably, the inside movable mounting of second spring has the sleeve, telescopic inside movable mounting has the telescopic link, the top and the stopper fixed connection of telescopic link have reduced the wearing and tearing of second spring, the effectual life who prolongs the second spring.

Preferably, the number of connecting rods is two, and two connecting rods use the push rod as horizontal central line and set up as symmetry axis symmetry for the device can be convenient for the centre gripping.

Preferably, the number of clamp splice is two, and two clamp splices use the push rod to set up as symmetry axis symmetry, can carry out fine centre gripping to the device for the device centre gripping is firm.

Preferably, the quantity of slider is two, the bottom and the slide rail swing joint of two sliders, and the size of slider is identical with the inside size of slide rail, can carry out fine spacing to the clamp splice, prevents the clamp splice skew.

Preferably, the number of the movable grooves is two, and the two movable grooves are arranged in parallel by taking the horizontal central line of the bottom plate as a parallel line, so that the use size of the device is convenient to adjust.

(III) advantageous effects

Compared with the prior art, the utility model provides a clamp for processing a semiconductor chip, which has the following beneficial effects:

1. this anchor clamps are used in semiconductor chip processing, through the bottom plate, the spring case, first spring, the connecting plate, the connecting block, the connecting axle, the push rod, the connecting rod, the bolt, the clamp splice, mutually supporting of slider and slide rail is used, can make the device stabilize the product centre gripping, the effectual anchor clamps for general semiconductor chip processing of having avoided lead to the product to influence the problem appearance of processing effect with the skew in man-hour because of the unstable product of centre gripping is not hard up, the spoilage of product has been reduced, the yield of product has been improved, the efficiency of product processing has been improved, thereby further the practicality of device has been improved.

2. This anchor clamps are used in semiconductor chip processing, through the bottom plate, the spring case, first spring, the connecting plate, the connecting block, the connecting axle, the push rod, the connecting rod, the bolt, the clamp splice, mutually supporting of slider and slide rail is used, can make the product size of adjusting, avoided general anchor clamps for semiconductor chip processing to lead to the relatively poor problem of device work efficiency to appear because of the centre gripping size is single, make the device can be applicable to not unidimensional product, the device application scope has been enlarged, thereby further improvement the suitability of device.

3. This anchor clamps are used in semiconductor chip processing through mutually supporting of clamp splice, slider, slide rail, movable groove, second spring, stopper, sleeve and telescopic link, can be so that the product can be convenient for install, has promoted the installation of work and the efficiency of dismantling, has reduceed staff's working strength, has improved the efficiency of product processing, has improved the efficiency that the product was changed, is convenient for change the product.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is an enlarged view taken at A of FIG. 1 in accordance with the present invention;

fig. 4 is a front view of the present invention.

In the figure: 1. a base plate; 2. a spring case; 3. a first spring; 4. a connecting plate; 5. connecting blocks; 6. a connecting shaft; 7. a push rod; 8. a connecting rod; 9. a bolt; 10. a clamping block; 11. a slider; 12. a slide rail; 13. a movable groove; 14. a second spring; 15. a limiting block; 16. a sleeve; 17. a telescopic rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, a clamp for processing a semiconductor chip comprises a base plate 1, a spring cylinder 2 is fixedly installed at the top of the base plate 1, a first spring 3 is fixedly installed inside the spring cylinder 2, a connecting plate 4 is fixedly installed at one end of the first spring 3, a connecting block 5 is fixedly installed at one side of the connecting plate 4, a connecting shaft 6 is fixedly installed inside the connecting block 5, a push rod 7 is fixedly installed on the outer wall of the connecting shaft 6, a connecting rod 8 is fixedly installed on the outer wall of the connecting shaft 6, a bolt 9 is fixedly installed inside the connecting rod 8, a clamping block 10 is movably installed on the outer wall of the bolt 9, a sliding block 11 is fixedly installed at the bottom of the clamping block 10, a sliding rail 12 is fixedly installed at the top of the base plate 1, and a clamp for processing a semiconductor chip is formed by the base plate 1, the spring cylinder 2, the first spring 3, the connecting plate 4, the connecting block 5, the connecting shaft 6, the push rod 7, The connecting rod 8, the bolt 9, the clamping block 10, the sliding block 11 and the sliding rail 12 are mutually matched for use, so that the device can firmly clamp a product, the problem that the processing effect is influenced by the offset of the product in processing due to the loose product which is not firmly clamped by a general clamp for processing a semiconductor chip is effectively solved, the damage rate of the product is reduced, the yield of the product is improved, and the product processing efficiency is improved, so that the practicability of the device is further improved, the movable groove 13 is formed in the bottom plate 1, the second spring 14 is fixedly arranged in the movable groove 13, the limiting block 15 is fixedly arranged at the top end of the second spring 14, so that the product can be conveniently installed, the sleeve 16 is movably arranged in the second spring 14, the telescopic rod 17 is movably arranged in the sleeve 16, the top end of the telescopic rod 17 is fixedly connected with the limiting block 15, and the abrasion of the second spring 14 is reduced, the service life of the second spring 14 is effectively prolonged, the product can be conveniently installed through the mutual matching use of the clamping block 10, the sliding block 11, the sliding rail 12, the movable groove 13, the second spring 14, the limiting block 15, the sleeve 16 and the telescopic rod 17, the working strength of workers is reduced, the product processing efficiency is improved, the product replacement is convenient, the number of the connecting rods 8 is two, the two connecting rods 8 are symmetrically arranged by taking the push rod 7 as a horizontal central line as a symmetrical axis, the device can be conveniently clamped, and the size of the product can be adjusted through the mutual matching use of the bottom plate 1, the spring cylinder 2, the first spring 3, the connecting plate 4, the connecting blocks 5, the connecting shaft 6, the push rod 7, the connecting rods 8, the bolts 9, the clamping block 10, the sliding block 11 and the sliding rail 12, the problem that the work efficiency of a common clamp for processing the semiconductor chip is poor due to single clamping size is solved, the clamp is suitable for products with different sizes, the application range of the clamp is expanded, the applicability of the clamp is further improved, the number of the clamping blocks 10 is two, the two clamping blocks 10 are symmetrically arranged by taking the push rod 7 as a symmetry axis, the clamp can be well clamped on the clamp, the clamp is stable, the number of the sliding blocks 11 is two, the bottoms of the two sliding blocks 11 are movably connected with the sliding rail 12, the size of the sliding blocks 11 is identical with the inner size of the sliding rail 12, the clamping blocks 10 can be well limited, the deviation of the clamping blocks 10 is prevented, the number of the movable grooves 13 is two, the two movable grooves 13 are arranged in parallel and parallel in parallel mode by taking the horizontal central line of the bottom plate 1, and the use size of the clamp is convenient to adjust.

When using, place the product at stopper 15, press stopper 15, make second spring 14 stretch out and draw back the inside of going into movable groove 13, promote the product, make the product contact push rod 7, push rod 7 receives the extrusion, drive connecting block 5 backshifting, make first spring 3 at the inside activity of spring holder 2, thereby drive the 8 motions of connecting rod of 6 outer walls of connecting axle, the slider 11 that drives clamp splice 10 bottom slides in the inside of slide rail 12, carry out the centre gripping to the product, when the bottom of product leaves the top of stopper 15, the elasticity of second spring 14 pops out movable groove 13's inside and one side swing joint of product with stopper 15, carry on spacingly and fixed to the product.

In conclusion, the clamp for processing the semiconductor chip can firmly clamp the product, effectively avoids the problem that the processing effect is influenced by the deviation of the product in processing caused by loose products which are not firmly clamped by a common clamp for processing the semiconductor chip, reduces the damage rate of the product, improves the yield of the product, improves the processing efficiency of the product, further improves the practicability of the device, can adjust the size of the product, avoids the problem that the working efficiency of the device is poorer because the clamping size of the common clamp for processing the semiconductor chip is single, can be suitable for products with different sizes, expands the application range of the device, further improves the applicability of the device, can facilitate the installation of the product, improves the installation and disassembly efficiency of the work, and reduces the working strength of workers, the efficiency of product processing has been improved, the efficiency of product change has been improved, is convenient for change the product.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a anchor clamps are used in semiconductor chip processing, includes bottom plate (1), its characterized in that: the top fixed mounting of bottom plate (1) has spring case (2), the inside fixed mounting of spring case (2) has first spring (3), the one end fixed mounting of first spring (3) has connecting plate (4), one side fixed mounting of connecting plate (4) has connecting block (5), the inside fixed mounting of connecting block (5) has connecting axle (6), the outer wall fixed mounting of connecting axle (6) has push rod (7), the outer wall fixed mounting of connecting axle (6) has connecting rod (8), the inside fixed mounting of connecting rod (8) has bolt (9), the outer wall movable mounting of bolt (9) has clamp splice (10), the bottom fixed mounting of clamp splice (10) has slider (11), the top fixed mounting of bottom plate (1) has slide rail (12).

2. The jig for processing a semiconductor chip according to claim 1, wherein: the movable groove (13) is formed in the bottom plate (1), the second spring (14) is fixedly mounted inside the movable groove (13), and the limiting block (15) is fixedly mounted at the top end of the second spring (14).

3. The jig for processing a semiconductor chip according to claim 2, wherein: the inside movable mounting of second spring (14) has sleeve (16), the inside movable mounting of sleeve (16) has telescopic link (17), the top and stopper (15) fixed connection of telescopic link (17).

4. The jig for processing a semiconductor chip according to claim 1, wherein: the number of the connecting rods (8) is two, and the two connecting rods (8) are symmetrically arranged by taking the push rod (7) as a horizontal center line.

5. The jig for processing a semiconductor chip according to claim 1, wherein: the number of the clamping blocks (10) is two, and the two clamping blocks (10) are symmetrically arranged by taking the push rod (7) as a symmetry axis.

6. The jig for processing a semiconductor chip as recited in claim 1, wherein: the number of the sliding blocks (11) is two, the bottoms of the two sliding blocks (11) are movably connected with the sliding rail (12), and the size of each sliding block (11) is matched with the inner size of the corresponding sliding rail (12).

7. The jig for processing a semiconductor chip as recited in claim 2, wherein: the number of the movable grooves (13) is two, and the two movable grooves (13) are arranged in parallel by taking the horizontal central line of the bottom plate (1) as a parallel line.