CN216902861U

CN216902861U - Assembling device for overturning device of wafer transmission system

Info

Publication number: CN216902861U
Application number: CN202220234499.2U
Authority: CN
Inventors: 张贤龙; 川辺哲也; 刘恩龙; 乐佳浩; 马刚; 曹洁
Original assignee: Shanghai Guangchuan Technology Co ltd
Current assignee: Shanghai Guangchuan Technology Co ltd
Priority date: 2022-01-28
Filing date: 2022-01-28
Publication date: 2022-07-05
Anticipated expiration: 2032-01-28

Abstract

The utility model discloses an assembling device of a turnover device for a wafer transmission system, which comprises: the bearing base is provided with a first positioning unit, and the wafer simulation disc is fixed in the first positioning unit; the outer side of the wafer simulation disc is provided with a turnover assembly, and the axis of the turnover assembly is superposed with one diameter of the wafer simulation disc; the motor base is provided with a motor, and an output shaft of the motor is fixedly connected with the overturning assembly; and the shaft axis of the motor output shaft and the shaft axis of the turnover assembly are coincided with one diameter of the wafer simulation disc. The utility model greatly improves the assembly efficiency of the wafer turnover device and promotes the further development of the wafer transmission field.

Description

Assembling device for overturning device of wafer transmission system

Technical Field

The utility model belongs to the field of wafer transmission, and particularly relates to an assembling device of a turnover device for a wafer transmission system.

Background

In the field of semiconductors, automatic wafer overturning equipment needs to be assembled in the production process, and the wafer can be overturned after the assembly. During the assembly process of the wafer turnover device, the superposition of the axis lines of the turnover assembly and the motor output shaft is especially required to be ensured; when the output shaft of the motor drives the turnover assembly to turn over, if the axial leads of the motor and the turnover assembly are not coincident, the turnover assembly can drive the wafer to swing to a larger extent in the wafer turning process, so that the wafer cannot be accurately placed at a specified position.

Therefore, in the process of installing the wafer turnover device, the position of the output shaft of the motor or the motor needs to be accurately positioned, and the position of the axis of the turnover assembly needs to be accurately positioned, so that the axes of the motor and the axis of the turnover assembly coincide. At present, the wafer overturning device is mainly assembled through a measuring tool by an assembling person and is adjusted through multiple tests to determine the final installation position, so that the installation process of the wafer overturning device is complicated, and the assembly efficiency is low.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving, at least to some extent, one of the problems in the related art. Therefore, the utility model aims to provide an assembling device for a turnover device of a wafer transmission system, which greatly improves the assembling efficiency of the wafer turnover device and promotes the further development of the wafer transmission field.

In order to achieve the purpose, the utility model provides the following technical scheme: an assembly device for a turnover device of a wafer transfer system, comprising:

the bearing base is provided with a first positioning unit, and the wafer simulation disc is fixed in the first positioning unit; the outer side of the wafer simulation disc is provided with a turnover assembly, and the axis of the turnover assembly is superposed with one diameter of the wafer simulation disc;

the motor base is provided with a motor, and an output shaft of the motor is fixedly connected with the overturning assembly; and the shaft axis of the motor output shaft and the shaft axis of the turnover assembly are coincided with one diameter of the wafer simulation disc.

Further, the device also comprises a fixed block, wherein a hollow cavity is arranged inside the fixed block; the fixed block is fixed in the bearing base through a first positioning unit, and when the motor output shaft extends into the hollow cavity, the motor output shaft does not contact with the inner wall of the fixed block in the rotating process.

Further, the first positioning unit is located on the upper surface of the bearing base; the first positioning unit comprises a first positioning groove and a first positioning pin, the first positioning pin is uniformly distributed on the periphery of the first positioning groove, and the center lines of the first positioning groove and the first positioning pin in the extension direction of the motor output shaft coincide with each other.

Further, the bearing base and the motor base are fixed in the bottom plate, and the motor base is fixedly connected with the bottom plate through a second positioning pin.

Furthermore, a left fixing piece and a right fixing piece are arranged on two sides of the bearing base, and a central connecting line of the left fixing piece and the right fixing piece is perpendicular to the axis of the turnover assembly.

Compared with the prior art, the technical scheme provided by the utility model has the following advantages: the wafer simulation disc and the fixing block are installed on the basis of the same first positioning unit, and the axis of the turnover assembly can be coincident with the axis of the output shaft of the motor in the installation mode, so that the wafer simulation disc and the fixing block are also the purpose of the application. In the overturning process of the wafer overturning device assembled in the mode, the overturning component connected to the tail end of the motor output shaft and the wafer cannot swing, so that the overturning accuracy is ensured; meanwhile, the assembling device is simple in structure, the assembling efficiency of the wafer overturning device is greatly improved, and the further development of the field of wafer transmission is promoted.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

In the drawings:

FIG. 1 is a schematic view of a fixed block fixed on a bearing base through a first positioning unit;

FIG. 2 is a schematic view of a wafer simulation disk of the present invention fixed to a carrier base by a first positioning unit;

FIG. 3 is a schematic diagram of the positions of a fixed block and a wafer simulation disk in a load-bearing base according to the present invention;

reference numerals: 1. a load-bearing base; 11. a fixed block; 12. simulating a disc by using a wafer; 13. a first positioning unit; 131. a first positioning pin; 132. a first positioning groove; 14. a left securing member; 15. a right fixed member; 16. a turnover assembly; 2. a motor base; 21. an output shaft of the motor; 22. a second positioning pin; 23. a motor; 3. a base plate.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it is to be understood that the orientations and positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "lateral", "vertical", "horizontal", "top", "bottom", "inner", "outer", "leading", "trailing", and the like are configured and operated in specific orientations based on the orientations and positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate that the device or element referred to must have a specific orientation, and thus, are not to be construed as limiting the present invention.

It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are merely for convenience in describing the present technical solution and are not to be construed as indicating or implying any relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the utility model. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

Referring to fig. 1-3, the present invention provides an assembling apparatus for a flipping apparatus of a wafer transfer system, comprising: the device comprises a bearing base 1, a motor base 2, a wafer simulation disc 12 and a fixed block 11; wherein:

the bearing base 1 is provided with a first positioning unit 13, and the wafer simulation disc 12 is fixed in the first positioning unit 13; the outer side of the wafer simulation disc 12 is provided with a turnover component 16, and the axis line of the turnover component 16 is superposed with one diameter of the wafer simulation disc 12; the first positioning unit 13 is positioned on the upper surface of the bearing base 1; the first positioning unit 13 includes a first positioning groove 132 and a first positioning pin 131, the first positioning pin 131 is uniformly distributed on the periphery of the first positioning groove 132, and the first positioning groove 132 coincides with the center line of the first positioning pin 131 in the extending direction of the motor output shaft 21.

The motor base 2 is provided with a motor 23, and a motor output shaft 21 is fixedly connected with the overturning assembly 16; the shaft axis of the motor output shaft 21 and the shaft axis of the turnover assembly 16 are superposed with one diameter of the wafer simulation disc 12;

the fixing block 11, the inside of the fixing block 11 includes the cavity chamber; the fixed block 11 is fixed in the bearing base 1 through the first positioning unit 13, and when the motor output shaft 21 extends into the hollow cavity, the motor output shaft 21 is not contacted with the inner wall of the fixed block 11 in the rotating process.

As an example, the wafer simulation disk 12 and the fixing block 11 are not located in the loading base 1 at the same time, but are separately installed when the flipping unit 16 and the motor are positioned.

As another embodiment, in the present application, a through hole matched with the fixing block 11 is formed in the center of the wafer simulation disk 12, and the fixing block 11 does not need to be disassembled after positioning the motor, and the wafer simulation disk 12 can be directly positioned and installed through the first positioning groove 132 on the periphery of the fixing block 11, as shown in fig. 3.

The first positioning pin 131 may include a plurality of first positioning holes, and may be provided in a complete groove shape. Similarly, the second positioning pin 22 may include a plurality of second positioning holes, and may be configured in a complete groove shape.

The utility model provides an assembling device for a turnover device of a wafer transmission system, which has the following assembling principle:

firstly, fixing a fixed block 11 in a bearing base 1 through a first positioning unit 13, wherein the fixed block 11 internally comprises a hollow cavity;

then the motor output shaft 21 extends into the hollow cavity, and the position of the motor 23 is adjusted to ensure that the motor output shaft 21 is not contacted with the inner wall of the fixed block 11 in the rotating process; fixing the adjusted motor 23 in the motor base 2;

then, the fixing block 11 in the first positioning unit 13 is disassembled, and the wafer simulation disc 12 is fixed in the bearing base 1 through the first positioning unit 13; wherein, the shaft axis of the motor output shaft 21 is superposed with one diameter of the wafer simulation disc 12;

and finally, installing a turnover component 16 on the outer side of the wafer simulation disc 12, wherein the motor output shaft 21 is fixedly connected with the turnover component 16, and the shaft axis of the motor output shaft 21 and the shaft axis of the turnover component 16 are superposed with one diameter of the wafer simulation disc 12.

In the installation process of the wafer overturning device, if the shaft axes of the motor output shaft 21 and the overturning component 16 are not on the same line, the overturning process can deviate, so that the wafer cannot be placed at a specified position. The flip assembly 16 herein refers to an assembly for holding a wafer during the wafer flipping process; the axial lead of the turnover assembly 16 refers to the central line of the turnover assembly 16 which keeps motionless in the turnover process, and the axial lead of the turnover assembly 16 is coincident with one diameter of the wafer clamped by the turnover assembly; this diameter can be considered as the axis of the wafer during flipping.

This application is earlier through first positioning unit 13 and fixed block 11 definite motor position, contains cavity chamber in the fixed block 11 for fix a position motor output shaft 21. The motor output shaft 21 is fixedly connected with the motor, and the positioning process of the motor output shaft 21 is the positioning process of the motor 23. The fixed block 11 is fixed by taking the first positioning unit 13 as a reference, the motor output shaft 21 is fixed by taking the hollow cavity of the fixed block 11 as a reference, and the motor 23 can be regarded as being fixed by taking the first positioning unit 13 as a reference in the whole fixing process; in the process, the up-down, left-right positions of the motor 23 in the motor base 2 can be adjusted until the motor output shaft 21 is not contacted with the inner wall of the fixed block 11 in the rotating process, namely the axial lead of the motor output shaft 21 is superposed with the axial lead of the hollow cavity; the axis line of the hollow chamber can be regarded as the central line of the hollow chamber in the extension direction of the motor shaft. After the motor 23 is fixed in position, the screw connected with the motor is screwed down to fix the motor in the motor base 2.

After the motor is fixed, the fixing block 11 is removed, the wafer simulation disc 12 is continuously installed by taking the first positioning unit 13 as a reference, and the overturning component 16 is installed by taking the wafer simulation disc 12 as a reference. In the overturning process of the wafer overturning device assembled in the way, the overturning component 16 connected to the tail end of the motor output shaft 21 and the wafer cannot swing, so that the overturning accuracy is ensured; meanwhile, the assembling device is simple in structure, the assembling efficiency of the wafer overturning device is greatly improved, and the further development of the field of wafer transmission is promoted.

In order to form the final wafer overturning device, the bearing base 1 and the wafer simulation disc 12 are finally disassembled to form the overturning device integrating the motor 23, the motor output shaft 21 and the overturning assembly 16. The wafer simulation disk 12 is used to position the flip assembly 16, and is the same size as the wafer to simulate the wafer. After the wafer simulation disc 12 is removed, the wafer to be turned is placed at the position of the original wafer simulation disc 12, and the motor drives the wafer to be turned through the motor output shaft 21 and the turning assembly 16.

As a specific embodiment, the first positioning unit 13 is located on the upper surface of the carrying base 1; the first positioning unit 13 is disposed on the upper surface of the carrying base 1 to facilitate the removal and replacement of the subsequent fixing block 11 and the wafer simulation disk 12. The positioning hole in the fixing block 11 may be disposed at a side of the fixing block 11 to avoid the hollow chamber.

Specifically, the first positioning unit 13 includes a first positioning groove 132 and a first positioning pin 131, the first positioning pin 131 is uniformly distributed on the periphery of the first positioning groove 132, and the first positioning groove 132 coincides with the center line of the first positioning pin 131 in the extending direction of the motor output shaft 21. The extending direction of the motor output shaft 21 here refers to the direction in which the axis of the motor output shaft 21 is located. In view of the difference in shape between the fixing block 11 and the wafer simulation disk 12, the first positioning groove 132 is designed to fix the fixing block 11, and the fixing block 11 is embedded into the first positioning groove 132 during assembly; the surface of the wafer simulation disk 12 may be provided with positioning holes matching with the first positioning grooves 132, and the positioning holes on the surface of the wafer simulation disk 12 are matched with the first positioning pins 131 during assembly. Because the center lines of the first positioning groove 132 and the first positioning pin 131 in the extending direction of the motor output shaft 21 are overlapped, the shaft axis of the motor output shaft 21, namely the shaft axis of the cavity in the fixed block 11 and the shaft axis of the turnover assembly 16, can be ensured to be overlapped with one diameter of the wafer simulation disc 12 by reasonably setting the depth of the first positioning groove 132, the height of the fixed block 11 and the thickness of the wafer simulation disc 12.

In order to accurately determine the distance between the motor 23 and the turnover assembly 16, in the application, the bearing base 1 and the motor base 2 are fixed in the bottom plate 3, and the motor base 2 is fixedly connected with the bottom plate 3 through the second positioning pin 22; when the motor base 2 is installed, the second positioning pin 22 is used for fixing, so that the distance between the motor 23 and the overturning assembly 16 is ensured to be constant.

This application can specifically adopt the amesdial to measure motor output shaft 21's circle and beat to through the position of adjustment motor 23 in motor base 2, ensure that the circle beat error is less than and set for the threshold value. The inner diameter of the hollow cavity can be slightly larger than that of the cylindrical cavity of the motor output shaft 21, and the rotation process of the motor output shaft 21 is observed to ensure that the hollow cavity is not contacted with the inner wall of the fixed block 11 in the rotation process.

After the wafer simulation disc 12 is fixed, the overturning assembly 16 needs to be installed on the outer side of the wafer simulation disc, before the overturning assembly 16 is installed, the left fixing piece 14 and the right fixing piece 15 can be installed on two sides of the bearing base 1, and the central connecting line of the left fixing piece 14 and the right fixing piece 15 is perpendicular to the axial lead of the overturning assembly 16; through the arrangement of the left fixing piece 14 and the right fixing piece 15, the position of the axis of the overturning assembly 16 relative to the wafer simulation disc 12 can be ensured, and the axis of the motor output shaft 21 and the axis of the overturning assembly 16 are ensured to be coincident with one diameter of the wafer simulation disc 12.

In the present application, the axis of the output shaft 21 of the motor coincides with the axis of the turnover assembly 16, and is a horizontal line parallel to the surface of the chassis. If the axes of the turnover assembly 16 and the motor output shaft 21 are coincident and have a certain included angle with the horizontal direction, the wafer will swing up and down in the turnover process. Only when the axis lines of the turnover assembly 16 and the motor output shaft 21 are ensured to be the same horizontal line, the wafer cannot be deviated up, down, left and right when the motor drives the turnover assembly 16 to turn over the wafer.

It is to be understood that the foregoing examples, while indicating the preferred embodiments of the utility model, are given by way of illustration and description, and are not to be construed as limiting the scope of the utility model; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims

1. An assembly device for a turnover device of a wafer transport system, comprising:

2. The assembly apparatus of claim 1, further comprising a fixing block, wherein the fixing block comprises a hollow chamber therein; the fixed block is fixed in the bearing base through a first positioning unit, and when the motor output shaft extends into the hollow cavity, the motor output shaft does not contact with the inner wall of the fixed block in the rotating process.

3. The assembling device for the turnover device of the wafer transmission system as recited in claim 1, wherein the first positioning unit is located on the upper surface of the carrying base; the first positioning unit comprises a first positioning groove and a first positioning pin, the first positioning pin is uniformly distributed on the periphery of the first positioning groove, and the center lines of the first positioning groove and the first positioning pin in the extension direction of the motor output shaft coincide with each other.

4. The assembly apparatus of claim 1, wherein the carrier base and the motor base are fixed in a base plate, and the motor base and the base plate are fixedly connected by a second positioning pin.

5. The assembling device of claim 1, wherein a left fixing member and a right fixing member are disposed on two sides of the supporting base, and a central connecting line of the left fixing member and the right fixing member is perpendicular to an axial line of the flipping module.