CN216901687U - Double-frequency electronic tag - Google Patents

Double-frequency electronic tag Download PDF

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Publication number
CN216901687U
CN216901687U CN202123434751.9U CN202123434751U CN216901687U CN 216901687 U CN216901687 U CN 216901687U CN 202123434751 U CN202123434751 U CN 202123434751U CN 216901687 U CN216901687 U CN 216901687U
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China
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layer
antenna
frequency
chip
dual
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CN202123434751.9U
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Chinese (zh)
Inventor
林鸿伟
林加良
张琼勇
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Xiamen Innov Electronics Tech Co ltd
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Xiamen Innov Electronics Tech Co ltd
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Priority to CN202123434751.9U priority Critical patent/CN216901687U/en
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Abstract

The utility model provides a dual-frequency electronic tag, which comprises a chip antenna layer, an anti-metal layer and a release paper layer, wherein the chip antenna layer comprises a dual-frequency chip, a high-frequency antenna and an ultrahigh-frequency antenna, the high-frequency antenna and the ultrahigh-frequency antenna are respectively and electrically connected with the dual-frequency chip, and the high-frequency antenna is arranged at one side of the chip antenna layer; the metal-resistant layer comprises a wave-absorbing layer and a foam layer, the wave-absorbing layer is arranged below the high-frequency antenna, the dual-frequency chip is positioned outside an upper area corresponding to the wave-absorbing layer, the foam layer is arranged below the wave-absorbing layer, and the high-frequency antenna, the dual-frequency chip and the ultrahigh-frequency antenna are all positioned in an area right above the foam layer; the dual-frequency electronic tag is characterized in that the release paper layer is arranged below the chip antenna layer and the anti-metal layer, and the chip antenna layer, the wave absorbing layer, the foam layer and the release paper layer are bonded through the adhesive.

Description

Double-frequency electronic tag
Technical Field
The utility model relates to the field of radio frequency electronic tags, in particular to a dual-frequency electronic tag.
Background
Electronic tags, also known as radio frequency tags, are commonly used for merchandise anti-counterfeiting traceability, information marking, asset management, vehicle management, and the like. The dual-frequency electronic tag has the advantages that the dual-frequency electronic tag has the high-frequency antenna and the ultrahigh-frequency antenna simultaneously, so that the dual-frequency electronic tag can be identified in two frequency bands, has a large identification range, can meet the requirements of users who are convenient in the general market, can meet the requirements of industrialized full-life-cycle asset management, and can be widely applied to fields of luxury goods anti-counterfeiting tracking, logistics, liquor anti-counterfeiting traceability, aviation luggage, IT asset management and the like. When the dual-frequency electronic tag is used, the dual-frequency electronic tag is often attached to a metal surface, so that in order to ensure the signal transmission performance of the electronic tag, the tag must be designed to be metal-resistant. The mode that wave-absorbing materials are laid between the attaching surface and the high-frequency antenna is needed in the high-frequency antenna anti-metal design, but the wave-absorbing materials laid between the ultrahigh-frequency antenna and the attaching surface can affect the transmission of ultrahigh-frequency antenna signals.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the dual-frequency electronic tag can ensure the transmission performance of the ultrahigh frequency antenna and simultaneously realize metal resistance.
In order to solve the technical problems, the utility model adopts the technical scheme that:
a dual-frequency electronic tag comprises a chip antenna layer, an anti-metal layer and a release paper layer, wherein the chip antenna layer comprises a dual-frequency chip, a high-frequency antenna and an ultrahigh-frequency antenna, the high-frequency antenna and the ultrahigh-frequency antenna are respectively and electrically connected with the dual-frequency chip, and the high-frequency antenna is arranged at one side of the chip antenna layer;
the metal-resistant layer comprises a wave-absorbing layer and a foam layer, the wave-absorbing layer is arranged below the high-frequency antenna, the dual-frequency chip is positioned outside an upper area corresponding to the wave-absorbing layer, the foam layer is arranged below the wave-absorbing layer, and the high-frequency antenna, the dual-frequency chip and the ultrahigh-frequency antenna are positioned in an area right above the foam layer;
the release paper layer is arranged below the chip antenna layer and the anti-metal layer, and the chip antenna layer, the wave absorbing layer, the foam layer and the release paper layer are bonded through an adhesive.
Further, a surface material layer is arranged above the chip antenna layer, and the surface material layer is bonded with the chip antenna layer through an adhesive.
Furthermore, the surface material layer is far away from one end of the wave-absorbing layer extends towards the outer side and is bent to be arranged between the foam layer and the release paper layer and is located outside the area under the wave-absorbing layer.
Furthermore, the high-frequency antenna with the dual-frequency chip is electrically connected through an extension wire, the extension wire extends towards one side far away from the high-frequency antenna and is bent to be arranged between the foam layer and the release paper layer.
Furthermore, one end, far away from the high-frequency antenna, of the ultrahigh-frequency antenna extends towards the outer side and is bent to be arranged between the foam layer and the release paper layer, and the edge of the ultrahigh-frequency antenna is vertically aligned with the edge of the other end of the ultrahigh-frequency antenna.
The utility model has the beneficial effects that: the ultrahigh frequency antenna is arranged at a position, close to the side edge, of the tag, the wave absorbing layer made of wave absorbing materials is arranged on the area below the high frequency antenna independently, the chip is arranged in an area outside the wave absorbing layer, the ultrahigh frequency antenna can be arranged on two sides of the dual-frequency chip outside the wave absorbing layer, then the ultrahigh frequency antenna is correspondingly paved with foam to realize metal resistance of the ultrahigh frequency antenna, the corresponding metal resistant layer is paved in a specific structure in a partitioning manner, the transmission performance of the ultrahigh frequency antenna can be ensured, the metal resistance of the dual-frequency antenna is realized simultaneously, and the tag has reliable performance.
Drawings
Fig. 1 is a schematic front layout structure diagram of a dual-frequency electronic tag according to a first embodiment of the present invention;
fig. 2 is a schematic diagram of a hierarchical structure of a dual-frequency electronic tag according to a first embodiment of the present invention.
Description of reference numerals:
1. a face material layer; 2. a chip antenna layer; 21. a dual-frequency chip; 22. a high-frequency antenna; 23. an ultra-high frequency antenna; 24. extending the lead; 3. a metal-resistant layer; 31. a wave-absorbing layer; 32. soaking a cotton layer; 4. and (5) a release paper layer.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 and 2, a dual-frequency electronic tag includes a chip antenna layer, a metal-resistant layer and a release paper layer, where the chip antenna layer includes a dual-frequency chip, a high-frequency antenna and an ultra-high frequency antenna, the high-frequency antenna and the ultra-high frequency antenna are respectively electrically connected to the dual-frequency chip, and the high-frequency antenna is disposed at one side of the chip antenna layer;
the metal-resistant layer comprises a wave-absorbing layer and a foam layer, the wave-absorbing layer is arranged below the high-frequency antenna, the dual-frequency chip is positioned outside an upper area corresponding to the wave-absorbing layer, the foam layer is arranged below the wave-absorbing layer, and the high-frequency antenna, the dual-frequency chip and the ultrahigh-frequency antenna are all positioned in an area right above the foam layer;
the release paper layer is arranged below the chip antenna layer and the anti-metal layer, and the chip antenna layer, the wave absorbing layer, the foam layer and the release paper layer are bonded through an adhesive.
As can be seen from the above description, the beneficial effects of the present invention are: the ultrahigh frequency antenna is arranged at a position, close to the side edge, of the tag, the wave absorbing layer made of wave absorbing materials is arranged on the area below the high frequency antenna independently, the chip is arranged in an area outside the wave absorbing layer, the ultrahigh frequency antenna can be arranged on two sides of the dual-frequency chip outside the wave absorbing layer, then the ultrahigh frequency antenna is correspondingly paved with foam to realize metal resistance of the ultrahigh frequency antenna, the corresponding metal resistant layer is paved in a specific structure in a partitioning manner, the transmission performance of the ultrahigh frequency antenna can be ensured, the metal resistance of the dual-frequency antenna is realized simultaneously, and the tag has reliable performance.
Further, a surface material layer is arranged above the chip antenna layer, and the surface material layer is bonded with the chip antenna layer through an adhesive.
According to the description, the surface material layer is arranged above the chip antenna layer and on the surface of the label, so that the chip and the antenna below can be protected, and meanwhile, personalized printing can be carried out on the surface material layer.
Furthermore, the surface material layer is far away from one end of the wave-absorbing layer extends towards the outer side and is bent to be arranged between the foam layer and the release paper layer and is located outside the area under the wave-absorbing layer.
According to the description, the surface material layer is prolonged and bent to the position below the foam layer, so that the antenna can be protected, and meanwhile, the integral unevenness of the label lower than the wave absorbing layer can be improved.
Furthermore, the high-frequency antenna with the dual-frequency chip is electrically connected through an extension wire, the extension wire extends towards one side far away from the high-frequency antenna and is bent to be arranged between the foam layer and the release paper layer.
It can be known from the above description, be connected high frequency antenna and dual-frenquency chip through the extension wire, and extend the extension wire to bubble cotton and from between the type paper, tear when the label uses and paste the label on the object surface from type paper, the extension wire is then pasted on the object surface through the glue film of bottommost face, when dismantling the label from the object surface, the extension wire then easy fracture adhesion remains on the object surface of being pasted, the high frequency antenna and the dual-frenquency chip disconnection of label, produce the vestige of being destroyed, thereby make the label have anti-tear function, improve the antifalsification ability of label.
Furthermore, one end, far away from the high-frequency antenna, of the ultrahigh-frequency antenna extends towards the outer side and is bent to be arranged between the foam layer and the release paper layer, and the edge of the ultrahigh-frequency antenna is vertically aligned with the edge of the other end of the ultrahigh-frequency antenna.
It can be known from the above description, buckle the one end extension of hyperfrequency antenna to the bubble cotton and leave between the type paper, when label attached use back tear label, hyperfrequency antenna also probably is torn to because the area of hyperfrequency antenna is great, not only can leave more obvious vestige, be difficult to recover moreover, make the label have the function of preventing tearing well, thereby improve the antifalsification ability of label.
The dual-frequency electronic tag can be applied to anti-counterfeiting traceability and asset management, is particularly suitable for metal surfaces and valuables, can keep good legibility even if the tag is attached to the metal surface by arranging the anti-metal layer, and can be torn by bending and extending the antenna to be arranged at a position close to the attachment surface, so that the tag has high anti-detachment and anti-counterfeiting performance, and the anti-counterfeiting traceability of the valuables is ensured.
Referring to fig. 1 and fig. 2, a first embodiment of the present invention is:
a dual-frequency electronic tag comprises a surface material layer 1, a chip antenna layer 2, an anti-metal layer 3 and a release paper layer 4. The chip antenna layer 2 comprises a double-frequency chip 21, a high-frequency antenna 22 and an ultrahigh-frequency antenna 23, wherein the high-frequency antenna 22 is a coil-shaped antenna, and the ultrahigh-frequency antenna 23 is a limit dipole antenna.
As shown in fig. 1, the high-frequency antenna 22 is electrically connected to the dual-frequency chip 21 through the extension wire 24, and the uhf antenna 23 is electrically connected to the dual-frequency chip 21. The dual-frequency chip 21 is arranged at a position close to the middle of the chip antenna layer 2, the high-frequency antenna 22 is arranged at a position close to one side of the chip antenna layer 2, and the dipoles of the ultrahigh-frequency antenna 23 are respectively positioned in an area between the high-frequency antenna 22 and the dual-frequency chip 21 and an area on one side of the dual-frequency chip 21 far away from the high-frequency antenna 22.
As shown in fig. 1 and 2, the metal-resistant layer 3 includes a wave-absorbing layer 31 and a foam layer 32. The wave absorbing layer 31 is arranged under the high-frequency antenna 22, the area of the wave absorbing layer 31 is larger than the area enclosed by the edge of the high-frequency antenna 22, and wave absorbing materials with the same width as the label can be paved between the position of the edge of the high-frequency antenna 22 close to the middle part of the label and the edge to form the wave absorbing layer 31. The dual-frequency chip 21 is preferably spaced apart from the corresponding region above the absorbing layer 31. The foam layer 32 is the same as the label in size and is laid below the wave-absorbing layer 31.
The extension wire 24 between the high-frequency antenna 22 and the dual-frequency chip 21 extends towards the direction of the label far away from the high-frequency antenna 22 and is bent and arranged below the foam layer 32, and the dipole at the end, far away from the high-frequency antenna 22, of the ultrahigh-frequency antenna 23 extends in the same direction as the extension wire 24 and is bent to the position below the foam layer 32 and can be extended to be as long as the foam layer 32.
In this embodiment, one side of the label-attached article is used as the lower side, the face material layer 1 is disposed on the uppermost side of the label, one end of the face material layer 1, which is far away from the high-frequency antenna 22, is extended outwards and bent to the lower sides of the extension wire 24 and the ultrahigh-frequency antenna 23, which are located below the foam layer 32, and the bending length is smaller than the transverse length of the extension wire 24, which is bent to the lower layer, so that at least the extension wire 24 can be exposed. The label is provided with a release paper layer 4 at the lowest part, and the surface material layer 1, the chip antenna layer 2, the wave absorbing layer 31, the foam layer 32 and the release paper layer 4 are adhered together through an adhesive.
The working principle of the dual-frequency electronic tag of the embodiment is as follows:
the wave absorbing layer 31 below the high-frequency antenna 22 absorbs or greatly weakens the electromagnetic wave energy from the surface adhered to the metal on the lower surface of the high-frequency antenna 22, so that the interference of the metal on the signal transmission of the high-frequency antenna 22 is reduced, the signal transmission of the ultrahigh-frequency antenna 23 is not influenced, and the metal resistance of the high-frequency antenna 22 is realized. The ultrahigh frequency antenna 23 shields the interference in the ultrahigh frequency range of the metal bonding surface through the foam partition, and realizes ultrahigh frequency metal resistance.
When the label is used, the release paper layer 4 at the lowest part is torn off and attached to the surface of an article. When the label is detached, the extension wire 24 and the ultrahigh frequency antenna 23 are torn, the connection between the high frequency antenna 22 and the dual-frequency chip 21 is disconnected, the ultrahigh frequency antenna 23 is not operated any more, the ultrahigh frequency antenna 23 is partially damaged, the signal transmission performance is reduced, and therefore the label generates unrecoverable detaching marks and plays a role in preventing detachment.
In summary, according to the dual-frequency electronic tag provided by the utility model, the anti-metal material is laid in different regions, so that the transmission performance of the ultrahigh frequency antenna can be ensured, and the anti-metal of the dual-frequency antenna can be realized, so that the tag has reliable performance; bend the extension wire with hyperfrequency antenna and connection high frequency antenna and dual-frenquency chip to pasting the face, when the label was pulled down, extension wire and hyperfrequency antenna can be torn, and the unable normal work of label just produces and tears the vestige, make the label can have higher anti-fake performance of preventing tearing open, guarantee the anti-fake of valuables and trace to the source.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.

Claims (5)

1. A dual-frequency electronic tag is characterized by comprising a chip antenna layer, an anti-metal layer and a release paper layer, wherein the chip antenna layer comprises a dual-frequency chip, a high-frequency antenna and an ultrahigh-frequency antenna, the high-frequency antenna and the ultrahigh-frequency antenna are respectively and electrically connected with the dual-frequency chip, and the high-frequency antenna is arranged at one side of the chip antenna layer;
the metal-resistant layer comprises a wave-absorbing layer and a foam layer, the wave-absorbing layer is arranged below the high-frequency antenna, the dual-frequency chip is positioned outside an upper area corresponding to the wave-absorbing layer, the foam layer is arranged below the wave-absorbing layer, and the high-frequency antenna, the dual-frequency chip and the ultrahigh-frequency antenna are all positioned in an area right above the foam layer;
the release paper layer is arranged below the chip antenna layer and the anti-metal layer, and the chip antenna layer, the wave absorbing layer, the foam layer and the release paper layer are bonded through an adhesive.
2. The dual-band electronic tag of claim 1, wherein a surface material layer is disposed above the chip antenna layer, and the surface material layer is bonded to the chip antenna layer by an adhesive.
3. The dual-frequency electronic tag according to claim 2, wherein one end of the surface material layer, which is far away from the wave-absorbing layer, extends towards the outside and is bent between the foam layer and the release paper layer and is located outside the area right below the wave-absorbing layer.
4. The dual-band electronic tag according to any one of claims 1-3, wherein the high-frequency antenna is electrically connected to the dual-band chip through an extension wire, and the extension wire extends towards a side away from the high-frequency antenna and is bent between the foam layer and the release paper layer.
5. The dual-band electronic tag according to claim 4, wherein one end of the UHF antenna away from the HF antenna extends outwards and is bent between the foam layer and the release paper layer, and the edge of the UHF antenna is vertically aligned with the edge of the other end of the UHF antenna.
CN202123434751.9U 2021-12-31 2021-12-31 Double-frequency electronic tag Active CN216901687U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123434751.9U CN216901687U (en) 2021-12-31 2021-12-31 Double-frequency electronic tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123434751.9U CN216901687U (en) 2021-12-31 2021-12-31 Double-frequency electronic tag

Publications (1)

Publication Number Publication Date
CN216901687U true CN216901687U (en) 2022-07-05

Family

ID=82210983

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123434751.9U Active CN216901687U (en) 2021-12-31 2021-12-31 Double-frequency electronic tag

Country Status (1)

Country Link
CN (1) CN216901687U (en)

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