CN216900793U

CN216900793U - Test box for semiconductor test

Info

Publication number: CN216900793U
Application number: CN202123368706.8U
Authority: CN
Inventors: 徐凤琴; 王春伟
Original assignee: Shanghai Hengduo Instrument Technology Co ltd
Current assignee: Shanghai Hengduo Instrument Technology Co ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2022-07-05
Anticipated expiration: 2031-12-29

Abstract

The utility model provides a test box for semiconductor testing, which belongs to the technical field of semiconductor testing devices and mainly aims at the problem that the existing device is inconvenient to use, and provides the following technical scheme, wherein the test box for semiconductor testing comprises a box body and a box door, the box door is hinged on the box body, a moving plate and a heating assembly are respectively arranged in the box body in a penetrating manner, a clamping assembly is arranged in the moving plate in a penetrating manner, the clamping assembly comprises a double-end screw and two groups of sliding blocks, the sliding blocks are arranged in a penetrating manner in a sliding groove, the sliding groove is formed in the moving plate, the double-end screw is positioned between the two groups of sliding blocks, both ends of the double-end screw are sleeved with screw sleeves, connecting rods are arranged on the screw sleeves, the tail ends of the connecting rods are connected with the sliding blocks, and fixed plates are arranged on the sliding blocks; through the arrangement of the moving plate and the clamping assembly, workers can quickly and accurately fix the semiconductor material, so that the device is more convenient to use; through the arrangement of the heating wires, the motor, the fan, the through holes and the heat conducting plate, the test effect of the device is better.

Description

Test box for semiconductor test

Technical Field

The utility model relates to the technical field of semiconductor test devices, in particular to a test box for semiconductor test.

Background

The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, semiconductor products and materials are generally applied to electronic and electrical equipment, the temperature of the equipment is generally increased in the using process, and in order to ensure the quality of the semiconductor products, the semiconductor products need to be subjected to high-temperature test before being put into use, so that a semiconductor test box is needed.

As in application No.: CN202020028385.3 discloses a high temperature test device suitable for different semiconductor products, the device is provided with subassembly such as heater, controller, the board that generates heat, heat conduction post and holding tank, the heater passes through the heat conduction post and conveys heat energy to the board that generates heat, will await measuring simultaneously in the semiconductor product puts into the holding tank for await measuring the semiconductor product and arrange the board below that generates heat in, make the device can carry out high temperature test to the semiconductor product fast, and can more the controller adjust different temperatures, it is the semiconductor product to satisfy the difference.

Through the above-mentioned patent of analysis and prior art, the board structure of placing in traditional test box is fixed, can't take out it, when making the staff put into the proof box with the semiconductor product, need stretch into the box with the hand, thereby make the staff sight sheltered from by the box, lead to the staff can't be accurate place the semiconductor product in place, and the semiconductor directly places in the holding tank, it is spacing not to it, make the staff can't be quick convenient fix semiconductor material, it is not convenient enough to make the proof box use.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a test box for a semiconductor test, which aims to solve the problem that the existing device is not convenient enough to use.

The utility model relates to a test box for semiconductor test, which is realized by the following specific technical means:

the utility model provides a test box is used in semiconductor test, includes box and chamber door, the chamber door articulates on the box, wear to be equipped with movable plate and heating element in the box respectively, wear to be equipped with the centre gripping subassembly in the movable plate, the centre gripping subassembly includes double-end screw and two sets of sliding blocks, the sliding block is worn to establish in the spout, the spout is seted up on the movable plate, double-end screw is located two sets of between the sliding block, the double-end screw both ends all overlap and are equipped with the swivel nut, be provided with the connecting rod on the swivel nut, the connecting rod terminal with the sliding block is connected, be provided with the fixed plate on the sliding block.

The above technical solution further comprises: the heating assembly comprises a plurality of groups of fixing frames and a plurality of groups of heating wires, the fixing frames are arranged in the box body in a penetrating mode, the fixing frames are respectively provided with a fixing sleeve and the heating wires, and the fixing sleeve is arranged outside the heating wires.

The above technical solution further comprises: the box is internally provided with a fan in a penetrating manner, the fan is positioned on one side of one group of heating wires and is connected with a motor rotating shaft, and the motor is arranged on the side face of the box.

The above technical solution further comprises: the movable plate both sides all are provided with the stopper, the stopper is worn to establish at the spacing inslot, the spacing inslot is seted up in the box.

The above technical solution further comprises: the movable plate is internally provided with a locking assembly in a penetrating manner, the locking assembly comprises a compression spring and a locking pin, the compression spring is connected with one end of the locking pin, the other end of the locking pin penetrates out of the movable plate and penetrates through the box body, and a handle is arranged on the locking pin.

The above technical solution further comprises: the fixed plate with the sliding block corner is provided with the strengthening rib, be provided with the heat-conducting plate on the fixed plate, the fixed plate with all seted up the through-hole on the heat-conducting plate.

The above technical solution further comprises: the box door is conveniently provided with a handle and a transparent plate.

Compared with the prior art, the utility model has the following beneficial effects:

1. the box door is opened, the movable plate is pulled out of the box body, the clamping assembly is moved out of the box body, a worker can conveniently and accurately vertically place a semiconductor product between two sets of fixing plates, the double-threaded screw is rotated, the two sets of screws move on the double-threaded screw, the sliding block is pulled through the connecting rod to move, the distance between the two sets of fixing plates is changed, the semiconductor product is clamped and fixed by the distance, the semiconductor material can be quickly and accurately fixed by the worker through the arrangement of the movable plate and the clamping assembly, and the device is more convenient to use.

2. Through the heater strip heat production, the starter motor drives the fan and rotates, and the heat that makes the heater strip produce is full of inside the box to the through-hole blocks semiconductor product with the reducible fixed plate of heat-conducting plate, avoids appearing the different condition of each part of semiconductor product being heated, through the setting of heater strip, motor, fan, through-hole and heat-conducting plate, makes the semiconductor product be heated more evenly, makes the experimental effect of device better.

Drawings

FIG. 1 is a schematic diagram of a test chamber for testing a semiconductor device according to the present invention.

FIG. 2 is an exploded view of a test chamber for testing a semiconductor device according to the present invention.

Fig. 3 is an enlarged schematic view of the area a in fig. 2.

Fig. 4 is an enlarged schematic view of the region B in fig. 2.

FIG. 5 is a schematic view of a clamping assembly in a test chamber for testing a semiconductor according to the present invention.

FIG. 6 is a schematic diagram of a box in a test chamber for testing a semiconductor according to the present invention.

In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. a box body; 2. a box door; 3. a motor; 4. a handle; 5. a transparent plate; 6. moving the plate; 7. a chute; 8. a slider; 9. a limiting block; 10. a fan; 11. heating wires; 12. fixing a sleeve; 13. a fixed mount; 14. a compression spring; 15. a handle; 16. a locking pin; 17. a double-ended screw; 18. a threaded sleeve; 19. a connecting rod; 20. a fixing plate; 21. a through hole; 22. a heat conducting plate; 23. reinforcing ribs; 24. a limiting groove.

Detailed Description

The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example (b):

as shown in figures 1 to 6:

the utility model provides a test box for semiconductor test, which comprises a box body 1 and a box door 2, wherein a moving plate 6 and a heating component are arranged in the box body 1 in a penetrating manner, a clamping component arranged in the moving plate 6 comprises a double-thread screw 17 and two groups of sliding blocks 8, the sliding blocks 8 are arranged in sliding grooves 7 on the moving plate 6 in a penetrating manner, the double-thread screw 17 is positioned between the two groups of sliding blocks 8, both ends of the double-thread screw 17 are sleeved with screw sleeves 18, the tail ends of connecting rods 19 arranged on the screw sleeves 18 are connected with the sliding blocks 8, fixing plates 20 are arranged on the sliding blocks 8, when a semiconductor product is placed, the moving plate 6 is drawn out of the box body 1, so that the clamping component is moved out of the box body 1, a worker can conveniently vertically place the semiconductor product between the two groups of fixing plates 20, then rotate the double-thread screw 17, the thread directions of both ends of the double-thread screw 17 are opposite, under the action of threads, the two groups of screw sleeves 18 move oppositely on the double-thread screw 17, change the angle of connection between connecting rod 19 and the sliding block 8 to pulling sliding block 8 removes in spout 7, changes the distance between two sets of fixed plates 20, presss from both sides the semiconductor product through fixed plate 20 and tightly fixes, need not the staff and stretches into the hand and place the semiconductor product in box 1, can fix the semiconductor product on movable plate 6 through rotatory double-end screw 17, makes the device use more convenient, and it is fixed more firm.

Referring to fig. 2, the heating assembly includes a plurality of fixing frames 13 and a plurality of heating wires 11, the fixing frames 13 are inserted into the box 1, fixing sleeves 12 and the heating wires 11 are respectively disposed on the fixing frames 13, the fixing sleeves 12 are sleeved outside the heating wires 11, the heating wires 11 can be firmly mounted on the fixing frames 13 through the fixing sleeves 12, and the heating wires 11 can rapidly raise the temperature in the box 1 to heat the semiconductor product.

Referring to fig. 1 and 2, a fan 10 is arranged in the box body 1 in a penetrating manner, the fan 10 is located on one side of a group of heating wires 11, the fan 10 is connected with a rotating shaft of the motor 3, the motor 3 is arranged on the side surface of the box body 1, the motor 3 is started to drive the fan 10 to rotate, heat generated by the heating wires 11 is diffused through the fan 10, the heat is filled in the box body 1, the using effect of the device is better, and the situation that the heating wires 11 only locally heat the semiconductor product is avoided.

Referring to fig. 2 and 6, both sides of the moving plate 6 are provided with a limiting block 9, the limiting block 9 is arranged in a limiting groove 24 in the box body 1 in a penetrating manner, when the moving plate 6 is pulled out, the limiting block 9 moves in the limiting groove 24, and the limiting block 9 and the limiting groove 24 can prevent the moving plate 6 from being completely pulled out of the box body 1, so that the device is damaged.

Referring to fig. 3 and 5, the locking assembly penetrating through the moving plate 6 includes a compression spring 14 and a locking pin 16, the compression spring 14 is connected to one end of the locking pin 16, the other end of the locking pin 16 penetrates through the moving plate 6 and penetrates through the box body 1, a handle 15 is arranged on the locking pin 16, under the action of the compression spring 14, the locking pin 16 is inserted into the box body 1 to fix the moving plate 6, so that the moving plate 6 is prevented from sliding out of the box body 1 after the box door 2 is opened, and when the moving plate 6 needs to be pulled out, the handle 15 is pulled along the direction of the locking pin 16 to withdraw the locking pin 16 out of the box body 1, so that the locking of the moving plate 6 can be released, and the moving plate 6 can be quickly pulled out of the box body 1 by a worker, so that the device is more convenient to use.

Referring to fig. 3 and 5, the fixing plate 20 and the sliding block 8 are provided with reinforcing ribs 23 at corners, the fixing plate 20 is provided with a heat conducting plate 22, the fixing plate 20 and the heat conducting plate 22 are provided with through holes 21, the reinforcing ribs 23 can increase the connection strength between the fixing plate 20 and the sliding block 8, the through holes 21 and the heat conducting plate 22 can reduce the influence of the fixing plate 20 on heat transfer, so that the semiconductor product is heated more uniformly, and the test result is more accurate.

Referring to fig. 2, a handle 4 and a transparent plate 5 are conveniently arranged above the box door 2, the transparent plate 5 enables a worker to observe the conditions in the box body 1 at any time, the test is conveniently recorded, and the handle 4 enables the worker to conveniently open the box door 2.

The specific use mode and function of the embodiment are as follows: when placing the semiconductor product, open chamber door 2, take movable plate 6 out outside box 1, vertically put between two sets of fixed plates 20 with the semiconductor product, rotatory double-threaded screw 17 again, the screw thread at double-threaded screw 17 both ends is revolved to opposite, under the effect of screw thread, two sets of swivel nuts 18 are on double-threaded screw 17 and are moved in opposite directions, change the angle of connection between connecting rod 19 and the sliding block 8, thereby pulling sliding block 8 removes in spout 7, change the distance between two sets of fixed plates 20, press from both sides the semiconductor product through fixed plate 20 and press from both sides fixedly, it can to withdraw box 1 with movable plate 6 again, it is more convenient to make the device use. When testing, through the temperature in the promotion box 1 that heater strip 11 can be quick to the semiconductor product is located between two sets of adjacent heater strips 11, makes the device heating effect better, drives fan 10 through motor 3 and rotates, and through the heat diffusion that fan 10 produced heater strip 11, inside messenger's heat was full of box 1, carries out high temperature test to the semiconductor product, makes the device result of use better.

Claims

1. A test chamber for semiconductor test is characterized in that: including box (1) and chamber door (2), chamber door (2) articulate on box (1), wear to be equipped with movable plate (6) and heating element in box (1) respectively, wear to be equipped with the centre gripping subassembly in movable plate (6), the centre gripping subassembly includes double-end screw (17) and two sets of sliding block (8), sliding block (8) are worn to establish in spout (7), spout (7) are seted up on movable plate (6), double-end screw (17) are located two sets of between sliding block (8), double-end screw (17) both ends are all overlapped and are equipped with swivel nut (18), be provided with connecting rod (19) on swivel nut (18), connecting rod (19) terminal with sliding block (8) are connected, be provided with fixed plate (20) on sliding block (8).

2. A test chamber for testing a semiconductor according to claim 1, wherein: heating element includes multiunit mount (13) and multiunit heater strip (11), mount (13) wear to establish in box (1), be provided with fixed cover (12) on mount (13) respectively with heater strip (11), fixed cover (12) cover is established outside heater strip (11).

3. A test chamber for testing a semiconductor according to claim 2, wherein: wear to be equipped with fan (10) in box (1), fan (10) are located one of them a set of heater strip (11) one side, fan (10) are connected with motor (3) pivot, motor (3) set up box (1) side.

4. A test chamber for testing a semiconductor according to claim 1, wherein: moving plate (6) both sides all are provided with stopper (9), stopper (9) are worn to establish in spacing groove (24), spacing groove (24) are seted up in box (1).

5. A test chamber for testing a semiconductor according to claim 1, wherein: wear to be equipped with locking Assembly in movable plate (6), locking Assembly includes compression spring (14) and fitting pin (16), compression spring (14) with fitting pin (16) one end is connected, fitting pin (16) other end is worn out movable plate (6) is worn to establish in box (1), be provided with handle (15) on fitting pin (16).

6. A test chamber for testing a semiconductor according to claim 1, wherein: fixed plate (20) with sliding block (8) corner is provided with strengthening rib (23), be provided with heat-conducting plate (22) on fixed plate (20), fixed plate (20) with through-hole (21) have all been seted up on heat-conducting plate (22).

7. A test chamber for testing a semiconductor according to claim 1, wherein: a handle (4) and a transparent plate (5) are arranged above the box door (2).