CN216897027U - Adopt ultrathin straight following formula panel light of mini-LED - Google Patents
Adopt ultrathin straight following formula panel light of mini-LED Download PDFInfo
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- CN216897027U CN216897027U CN202220120699.5U CN202220120699U CN216897027U CN 216897027 U CN216897027 U CN 216897027U CN 202220120699 U CN202220120699 U CN 202220120699U CN 216897027 U CN216897027 U CN 216897027U
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Abstract
The utility model discloses an ultrathin direct type panel lamp adopting a mini-LED, which comprises a face frame, a diffusion plate arranged in the face frame and a back plate arranged on the back surface of the face frame, wherein the back plate is positioned right above the diffusion plate, a quantum dot film and an optical drive integrated plate are sequentially arranged between the diffusion plate and the back plate from bottom to top, the optical drive integrated plate is provided with a mini-LED chip array and a driving component for driving the mini-LED chip in the mini-LED chip array to emit light, and the mini-LED chip in the mini-LED chip array faces the quantum dot film; the advantages are thin thickness of the whole lamp, uniform light output and high light efficiency.
Description
Technical Field
The utility model relates to a panel lamp, in particular to an ultrathin direct type panel lamp adopting a mini-LED.
Background
A panel lamp is a lighting fixture installed on a ceiling, which is generally used in offices, homes, and the like. The luminous panel light of current straight following formula of adoption usually adopts and directly falls luminous, and it installs a plurality of LED lamp strips in the base, and installation lens on the lamp pearl of every LED lamp strip, then the installation has the face frame of diffuser plate on the base, and the luminous panel light of this kind of straight following formula has following problem: 1) the distance between the LED lamp strip and the diffusion plate is large, so that the thickness of the whole lamp is thick; 2) the LED light bars are arranged at intervals, so that light is not uniform.
For solving the technical problem that current luminous panel light of straight following formula exists, luminous panel light of side has appeared on the market, it installs LED lamp strip around the rim, from up installing the diffuser plate down in proper order in the rim, the light guide plate, reflection paper, pearl cotton and backplate, the light that the lamp pearl of LED lamp strip sent jets out from the diffuser plate after light guide plate leaded light and reflection paper reflection, this luminous panel light of side is owing to be more even through the light guide plate leaded light, and LED lamp strip installs around the rim, make the thickness attenuation of whole lamp, but the luminous efficiency of the luminous panel light of straight following formula that has relatively current is lower.
Disclosure of Invention
The utility model aims to solve the technical problem of providing an ultrathin direct type panel lamp adopting a mini-LED, which has the advantages of thin thickness of the whole lamp, uniform light emission and high light efficiency.
The technical scheme adopted by the utility model for solving the technical problems is as follows: the ultrathin direct type panel lamp adopting the mini-LED comprises a face frame, a diffusion plate arranged in the face frame and a back plate arranged on the back face of the face frame, wherein the back plate is positioned right above the diffusion plate, and the ultrathin direct type panel lamp is characterized in that: the optical drive integrated plate is provided with a mini-LED chip array and a driving component used for driving a mini-LED chip in the mini-LED chip array to emit light, and the mini-LED chip in the mini-LED chip array faces the quantum dot film.
The integrated optical drive plate comprises a glass substrate, a circuit layer arranged on the front surface of the glass substrate, a mini-LED chip array arranged on the circuit layer and a driving element, wherein the driving element is positioned on the periphery of the mini-LED chip array. Here, the reason why the glass substrate is selected is as follows: on one hand, the glass substrate is lower in price compared with the aluminum substrate; on the other hand, after the mini-LED chip and the driving component are welded on the glass substrate, the glass substrate is not easy to warp and deform through reflow soldering, and the flatness is high, so that the light emission is more uniform. The layout of the circuit layer can be designed according to the array form of the mini-LED chip array, namely the arrangement of the mini-LED chips and the arrangement of the driving components. The driving components are arranged on the periphery of the mini-LED chip array, so that the driving components cannot block light emitted by the mini-LED chip and cannot generate shadows.
This ultra-thin straight following formula panel light still includes and encloses the silica gel isolation frame that establishes and form by four silica gel strips, the integrative horizontal extension in inboard of silica gel strip be provided with and be used for making the back of quantum dot membrane with mini-LED chip in the mini-LED chip array with drive components and parts contactless horizontal isolation strip, silica gel isolation frame's inner space quilt horizontal isolation strip divide into region and lower region, glass substrate's four peripheral edges by four horizontal isolation strip support, glass substrate restrict in last region in, the quantum dot membrane restrict in lower region in. In order to protect the mini-LED chip and the driving component from being stressed, the integrated optical drive plate and the quantum dot film are separated by a certain distance, the problem of the thickness of the whole lamp is considered, the distance separating the integrated optical drive plate and the quantum dot film is designed to be the minimum safety distance, the integrated optical drive plate and the quantum dot film are separated by the silica gel isolation frame, the minimum safety distance can be the minimum safety distance, and other reasonable structures can be adopted to enable the back of the quantum dot film to be not in contact with the mini-LED chip and the driving component in the mini-LED chip array.
And a heat-conducting silica gel pad used for guiding out heat generated by the mini-LED chip array and the driving component is arranged between the back surface of the glass substrate and the back plate.
The back plate is provided with a plurality of heat dissipation grooves for transferring heat on the heat conduction silica gel pad to the outside so as to accelerate heat dissipation.
The distance between two adjacent mini-LED chips in the mini-LED chip array is less than 5 mm. The interval between two adjacent mini-LED chips is small, so that light emitted by the adjacent mini-LED chips is partially overlapped, the light emitting is uniform, the arrangement number of the mini-LED chips is increased, the lighting effect is increased, the smaller the interval between the two adjacent mini-LED chips is, the better the interval is theoretically, and the interval between the two adjacent mini-LED chips is determined by considering factors of cost and the like, and the interval is set to be 3 mm.
The ultrathin direct type panel lamp adopting the mini-LED comprises a face frame, a diffusion plate arranged in the face frame and a back plate arranged on the back face of the face frame, wherein the back plate is positioned right above the diffusion plate, and the ultrathin direct type panel lamp is characterized in that: an optical drive integrated plate is arranged between the diffusion plate and the back plate, the optical drive integrated plate is provided with a mini-LED chip array and a driving component used for driving a mini-LED chip in the mini-LED chip array to emit light, the mini-LED chip in the mini-LED chip array faces the diffusion plate, and each mini-LED chip in the mini-LED chip array is provided with a fluorescent powder glue layer.
The integrated optical drive plate comprises a glass substrate, a circuit layer arranged on the front surface of the glass substrate, a mini-LED chip array arranged on the circuit layer and a driving element, wherein the driving element is positioned on the periphery of the mini-LED chip array. Here, the reason why the glass substrate is selected is as follows: on one hand, the glass substrate is lower in price compared with the aluminum substrate; on the other hand, after the mini-LED chip and the driving component are welded on the glass substrate, the glass substrate is not easy to warp and deform through reflow soldering, and the flatness is high, so that the light emitting is more uniform. The layout of the circuit layer can be designed according to the array form of the mini-LED chip array, namely the arrangement of the mini-LED chips and the arrangement of the driving components. The driving components are arranged on the periphery of the mini-LED chip array, so that the driving components cannot block light emitted by the mini-LED chip and cannot generate shadows.
This ultra-thin straight following formula panel light still includes to enclose the silica gel isolation frame that forms of establishing by four silica gel strips, the integrative horizontal extension in inboard of silica gel strip be provided with and be used for making the diffuser plate the back with mini-LED chip in the mini-LED chip array with the discontiguous horizontal isolation strip of drive components and parts, silica gel keep apart the inner space of frame quilt horizontal isolation strip divide into region and lower region, glass substrate's four peripheral edges by four horizontal isolation strip support, glass substrate limit in last region in, the diffuser plate limit in lower region in. In order to protect the mini-LED chip and the driving component from being stressed, the integrated optical drive plate and the diffusion plate are separated by a certain distance, the problem of the thickness of the whole lamp is considered, the distance separating the integrated optical drive plate and the diffusion plate is designed to be the minimum safe distance, the integrated optical drive plate and the diffusion plate are separated by the silica gel isolation frame, the minimum safe distance can be the minimum safe distance, and other reasonable structures can be adopted to ensure that the back surface of the diffusion plate is not contacted with the mini-LED chip and the driving component in the mini-LED chip array.
And a heat-conducting silica gel pad used for guiding out heat generated by the mini-LED chip array and the driving component is arranged between the back surface of the glass substrate and the back plate, and a plurality of heat dissipation grooves used for transferring the heat on the heat-conducting silica gel pad to the outside so as to accelerate heat dissipation are arranged on the back plate.
The distance between two adjacent mini-LED chips in the mini-LED chip array is less than 5 mm. The interval between two adjacent mini-LED chips is small, so that light emitted by the adjacent mini-LED chips is partially overlapped, the light emitting is uniform, the arrangement number of the mini-LED chips is increased, the lighting effect is increased, the smaller the interval between the two adjacent mini-LED chips is, the better the interval is theoretically, and the interval between the two adjacent mini-LED chips is determined by considering factors of cost and the like, and the interval is set to be 3 mm.
Compared with the prior art, the utility model has the advantages that:
1) the direct type light emitting is adopted, and the light source is a mini-LED chip array, so that the light efficiency is improved, and the light is emitted uniformly.
2) The quantum dot film generates green light and red light under the excitation of blue light emitted by the mini-LED chip, the green light and the red light are mixed with the blue light to generate high-quality white light, and the white light is emitted from the diffusion plate; the phosphor glue layer can convert blue light emitted by the mini-LED chip into white light, the white light is emitted from the diffusion plate, the CD-ROM integrated plate adopting the mini-LED chip is thin, and then the thicknesses of the diffusion plate, the quantum dot film or the phosphor glue layer, the CD-ROM integrated plate and the back plate are controlled, so that the thickness of the whole lamp is not more than 10mm, namely the thickness of the whole lamp is thinner.
Drawings
Fig. 1 is an exploded schematic view of an ultra-thin direct type panel lamp according to a first embodiment;
FIG. 2 is a schematic diagram of an integrated optical disc drive plate in an ultra-thin direct type panel lamp according to a first embodiment;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is an enlarged view of portion B of FIG. 1;
FIG. 5 is an exploded view of an ultra-thin direct-type panel lamp according to a second embodiment;
FIG. 6 is a schematic diagram of an integrated optical disc drive plate in an ultra-thin direct type panel lamp according to a second embodiment;
fig. 7 is an enlarged schematic view of portion C of fig. 6.
Detailed Description
The utility model is described in further detail below with reference to the accompanying examples.
The first embodiment is as follows:
the ultrathin direct type panel lamp adopting the mini-LED provided in this embodiment includes, as shown in fig. 1 to 4, a face frame 1, a diffusion plate 2, a quantum dot film 3, an integrated optical drive plate 4, a heat conductive silica gel pad 5, and a back plate 6 installed on the back surface of the face frame 1, where the diffusion plate 2, the quantum dot film 3, the integrated optical drive plate 4, and the heat conductive silica gel pad 5 are sequentially disposed in the face frame 1 from bottom to top, and the back plate 6 is located right above the diffusion plate 2, the integrated optical drive plate 4 is located between the diffusion plate 2 and the back plate 6, the integrated optical drive plate 4 has a mini-LED chip array 41 and a driving component 42 for driving the mini-LED chip 411 in the mini-LED chip array 41 to emit light, and the mini-LED chip 411 in the mini-LED chip array 41 faces the quantum dot film 3.
In this embodiment, the integrated optical drive board 4 is composed of a glass substrate 43, a circuit layer 44 disposed on the front surface of the glass substrate 43, a mini-LED chip array 41 disposed on the circuit layer 44, and a driving component 42, where the driving component 42 is located at the periphery of the mini-LED chip array 41. Here, the reason why the glass substrate 43 is selected is as follows: on the one hand, the glass substrate 43 is less expensive than the aluminum substrate; on the other hand, after the mini-LED chip 411 and the driving component 42 are welded on the glass substrate 43, the glass substrate 43 is not easy to warp and deform after reflow soldering, and the flatness is high, so that the light emission is more uniform. The layout of the circuit layer 44 can be designed according to the array form of the mini-LED chip array 41, i.e., the arrangement of the mini-LED chips 411 and the arrangement of the driving components 42. The driving component 42 is disposed at the periphery of the mini-LED chip array 41, so that the driving component 42 does not block the light emitted from the mini-LED chip 411 and does not generate a shadow.
In this embodiment, the ultra-thin direct type panel light further includes a silica gel isolation frame 7 formed by enclosing four silica gel strips 71, horizontal isolation strips 72 for making the back surface of the quantum dot film 3 not contact with the mini-LED chip 411 and the driving component 42 in the mini-LED chip array 41 are integrally and horizontally extended on the inner sides of the silica gel strips 71, an inner space of the silica gel isolation frame 7 is divided into an upper area (not shown in the figure) and a lower area (not shown in the figure) by the horizontal isolation strips 72, the peripheral edges of the glass substrate 43 are supported by the four horizontal isolation strips 72, the glass substrate 43 is limited in the upper area, and the quantum dot film 3 is limited in the lower area. In order to protect the mini-LED chip 411 and the driving component 42 from stress, the integrated optical drive plate 4 and the quantum dot film 3 are separated by a certain distance, meanwhile, the problem of the thickness of the whole lamp is considered, the distance separating the integrated optical drive plate 4 and the quantum dot film 3 is designed to be the minimum safe distance, the integrated optical drive plate 4 and the quantum dot film 3 are separated by the minimum safe distance through the silica gel isolation frame 7, of course, other reasonable structures can be adopted to enable the back of the quantum dot film 3 to be not in contact with the mini-LED chip 411 and the driving component 42 in the mini-LED chip array 41, and the silica gel isolation frame 7 is simple in structure and convenient to install.
In this embodiment, the thermal conductive silicone pad 5 is used to conduct heat generated by the mini-LED chip array 41 and the driving component 42, and the back plate 6 is provided with a plurality of heat dissipation grooves 61 for transferring the heat on the thermal conductive silicone pad 5 to the outside to accelerate heat dissipation.
In the present embodiment, the pitch between two adjacent mini-LED chips 411 in the mini-LED chip array 41 is less than 5 mm. The distance between two adjacent mini-LED chips 411 is small, so that light emitted by the adjacent mini-LED chips 411 is partially overlapped, the light is uniform, the number of the mini-LED chips 411 is increased, the lighting effect is also increased, theoretically, the smaller the distance between the two adjacent mini-LED chips 411 is, the better the distance is, and meanwhile, factors such as cost and the like are considered to specifically determine the distance between the two adjacent mini-LED chips 411, for example, the distance is set to be 3 mm.
The second embodiment:
as shown in fig. 5 to 7, the ultrathin direct type panel lamp using a mini-LED provided in this embodiment includes a face frame 1, a diffusion plate 2, an optical drive integrated plate 4, a heat conductive silica gel pad 5, and a back plate 6 installed on the back surface of the face frame 1, where the back plate 6 is located right above the diffusion plate 2, the optical drive integrated plate 4 is located between the diffusion plate 2 and the back plate 6, the optical drive integrated plate 4 has a mini-LED chip array 41 and a driving component 42 for driving the mini-LED chip 411 in the mini-LED chip array 41 to emit light, the mini-LED chip 411 in the mini-LED chip array 41 faces the diffusion plate 2, and a phosphor glue layer 8 is disposed on each mini-LED chip 411 in the mini-LED chip array 41.
In this embodiment, the integrated optical drive board 4 is composed of a glass substrate 43, a circuit layer 44 disposed on the front surface of the glass substrate 43, a mini-LED chip array 41 disposed on the circuit layer 44, and a driving component 42, where the driving component 42 is located at the periphery of the mini-LED chip array 41. Here, the reason why the glass substrate 43 is selected is as follows: on the one hand, the glass substrate 43 is less expensive than the aluminum substrate; on the other hand, after the mini-LED chip 411 and the driving component 42 are welded on the glass substrate 43, the glass substrate 43 is not easy to warp and deform after reflow soldering, and the flatness is high, so that the light emission is more uniform. The layout of the circuit layer 44 can be designed according to the array form of the mini-LED chip array 41, i.e., the arrangement of the mini-LED chips 411 and the arrangement of the driving components 42. The driving component 42 is disposed at the periphery of the mini-LED chip array 41, so that the driving component 42 does not block the light emitted from the mini-LED chip 411 and does not generate a shadow.
In this embodiment, the ultra-thin direct type panel light further includes a silica gel isolation frame 7 (refer to fig. 4) formed by enclosing four silica gel strips 71, horizontal isolation strips 72 for making the back surface of the diffusion plate 2 not contact with the mini-LED chip 411 and the driving component 42 in the mini-LED chip array 41 are integrally and horizontally extended on the inner sides of the silica gel strips 71, an inner space of the silica gel isolation frame 7 is divided into an upper area (not shown in the figure) and a lower area (not shown in the figure) by the horizontal isolation strips 72, the four edges of the glass substrate 43 are supported by the four horizontal isolation strips 72, the glass substrate 43 is limited in the upper area, and the diffusion plate 2 is limited in the lower area. In order to protect the mini-LED chip 411 and the driving component 42 from stress, the integrated optical drive board 4 is separated from the diffusion plate 2 by a certain distance, meanwhile, the problem of the thickness of the whole lamp is considered, the distance separating the integrated optical drive board 4 from the diffusion plate 2 is designed to be the minimum safe distance, the integrated optical drive board 4 and the diffusion plate 2 are separated by the silica gel isolation frame 7, the minimum safe distance can be the minimum safe distance, of course, other reasonable structures can be adopted to ensure that the back surface of the diffusion plate 2 is not in contact with the mini-LED chip 411 and the driving component 42 in the mini-LED chip array 41, and the silica gel isolation frame 7 is simple in structure and convenient to install.
In this embodiment, the thermal conductive silicone pad 5 is used to conduct heat generated by the mini-LED chip array 41 and the driving component 42, and the back plate 6 is provided with a plurality of heat dissipation grooves 61 for transferring the heat on the thermal conductive silicone pad 5 to the outside to accelerate heat dissipation.
In the present embodiment, the pitch between two adjacent mini-LED chips 411 in the mini-LED chip array 41 is less than 5 mm. The distance between two adjacent mini-LED chips 411 is small, so that light emitted by the adjacent mini-LED chips 411 is partially overlapped, the light is uniform, the number of the mini-LED chips 411 is increased, the lighting effect is also increased, theoretically, the smaller the distance between the two adjacent mini-LED chips 411 is, the better the distance is, and meanwhile, factors such as cost and the like are considered to specifically determine the distance between the two adjacent mini-LED chips 411, for example, the distance is set to be 3 mm.
The diffusion plate 2 can be made of conventional PC (polycarbonate) or PMMA (polymethyl methacrylate), and the thickness of the diffusion plate 2 is not more than 1 mm; the quantum dot film 3 adopts the prior art, and the thickness of the quantum dot film 3 is not more than 0.3 mm; the thickness of the glass substrate 43 is not more than 2 mm; the circuit layer 44 is attached to the glass substrate 43 by evaporation or pressing, the mini-LED chip 411 adopts the prior art, and the mini-LED chip 411 and the driving component 42 are welded on the circuit layer 44; the thickness of the silica gel strip 71 is not more than 4 mm; the thickness of the heat-conducting silica gel pad 5 is not more than 1 mm; the thickness of the back plate 6 is not more than 1.5mm, screw holes are formed in the periphery of the back plate 6, and the back plate 6 is mounted on the face frame 1 through the screw holes which are punched in by screws; the thickness of the fluorescent powder glue layer 8 is not more than 2mm, the fluorescent powder glue layer 8 is a glue layer formed by green fluorescent powder, red fluorescent powder and silica gel, the green fluorescent powder can be aluminate/LuAG/GA-YAG fluorescent powder, and the red fluorescent powder can be nitride fluorescent powder; the thickness of the face frame 1 is not more than 10mm, so that the thickness of the whole lamp is not more than 10 mm.
Claims (10)
1. The ultrathin direct type panel lamp adopting the mini-LED comprises a face frame, a diffusion plate arranged in the face frame and a back plate arranged on the back face of the face frame, wherein the back plate is positioned right above the diffusion plate, and the ultrathin direct type panel lamp is characterized in that: the optical drive integrated plate is provided with a mini-LED chip array and a driving component used for driving a mini-LED chip in the mini-LED chip array to emit light, and the mini-LED chip in the mini-LED chip array faces the quantum dot film.
2. The ultra-thin direct type panel lamp adopting the mini-LED as claimed in claim 1, wherein: the integrated optical drive plate comprises a glass substrate, a circuit layer arranged on the front surface of the glass substrate, a mini-LED chip array arranged on the circuit layer and a driving element, wherein the driving element is positioned on the periphery of the mini-LED chip array.
3. The ultra-thin direct type panel lamp adopting the mini-LED as claimed in claim 2, wherein: this ultra-thin straight following formula panel light still includes and encloses the silica gel isolation frame that establishes and form by four silica gel strips, the integrative horizontal extension in inboard of silica gel strip be provided with and be used for making the back of quantum dot membrane with mini-LED chip in the mini-LED chip array with drive components and parts contactless horizontal isolation strip, silica gel isolation frame's inner space quilt horizontal isolation strip divide into region and lower region, glass substrate's four peripheral edges by four horizontal isolation strip support, glass substrate restrict in last region in, the quantum dot membrane restrict in lower region in.
4. The ultra-thin direct type panel light adopting the mini-LED as claimed in claim 2 or 3, wherein: and a heat-conducting silica gel pad used for guiding out the heat generated by the mini-LED chip array and the driving component is arranged between the back surface of the glass substrate and the back plate.
5. The ultra-thin direct type panel lamp adopting mini-LED as claimed in claim 4, wherein: the back plate is provided with a plurality of heat dissipation grooves for transferring heat on the heat conduction silica gel pad to the outside so as to accelerate heat dissipation.
6. The ultra-thin direct type panel lamp using mini-LED according to any one of claims 1 to 3, wherein: the distance between two adjacent mini-LED chips in the mini-LED chip array is less than 5 mm.
7. An ultra-thin direct type panel lamp adopting mini-LEDs comprises a face frame, a diffusion plate arranged in the face frame, and a back plate arranged on the back surface of the face frame, wherein the back plate is positioned right above the diffusion plate, and the ultra-thin direct type panel lamp is characterized in that: an optical drive integrated plate is arranged between the diffusion plate and the back plate, the optical drive integrated plate is provided with a mini-LED chip array and a driving component used for driving a mini-LED chip in the mini-LED chip array to emit light, the mini-LED chip in the mini-LED chip array faces the diffusion plate, and a fluorescent powder glue layer is arranged on each mini-LED chip in the mini-LED chip array.
8. The ultra-thin direct type panel lamp adopting mini-LED as claimed in claim 7, wherein: the integrated optical drive plate comprises a glass substrate, a circuit layer arranged on the front surface of the glass substrate, a mini-LED chip array arranged on the circuit layer and a driving element, wherein the driving element is positioned on the periphery of the mini-LED chip array.
9. The ultra-thin direct type panel light adopting a mini-LED as claimed in claim 8, wherein: this ultra-thin straight following formula panel light still includes to enclose the silica gel isolation frame that establishes and form by four silica gel strips, the integrative horizontal extension of inboard of silica gel strip be provided with and be used for making the diffuser plate the back with mini-LED chip in the mini-LED chip array with drive components and parts contactless horizontal isolation strip, silica gel keep apart the inner space of frame quilt horizontal isolation strip divide into region and lower region, glass substrate's four peripheral edges by four horizontal isolation strip support, glass substrate restrict in last region in, the diffuser plate restrict in lower region in.
10. The ultra-thin direct type panel light adopting a mini-LED as claimed in claim 8 or 9, wherein: and a heat-conducting silica gel pad used for guiding out heat generated by the mini-LED chip array and the driving component is arranged between the back surface of the glass substrate and the back plate, and a plurality of heat dissipation grooves used for transferring the heat on the heat-conducting silica gel pad to the outside so as to accelerate heat dissipation are arranged on the back plate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220120699.5U CN216897027U (en) | 2022-01-17 | 2022-01-17 | Adopt ultrathin straight following formula panel light of mini-LED |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220120699.5U CN216897027U (en) | 2022-01-17 | 2022-01-17 | Adopt ultrathin straight following formula panel light of mini-LED |
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| CN216897027U true CN216897027U (en) | 2022-07-05 |
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| CN202220120699.5U Active CN216897027U (en) | 2022-01-17 | 2022-01-17 | Adopt ultrathin straight following formula panel light of mini-LED |
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| CN (1) | CN216897027U (en) |
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