CN216876785U - Temperature exchange device and temperature regulator - Google Patents

Abstract

The utility model provides a temperature exchange device and a temperature regulator, comprising: the temperature exchange layer is used for containing heat-conducting liquid; the heat exchange zone is arranged in an insulating way relative to the temperature exchange layer and is provided with a temperature changing unit; the alternating temperature unit, including semiconductor module, first heat exchange piece and second heat exchange piece, semiconductor module has at least one among cold compress mode and the hot compress mode, first heat exchange piece connect in semiconductor module is towards one side of user affected part, the second heat exchange piece connect in semiconductor module one side in user affected part dorsad, just the second heat exchange piece be used for with the temperature exchange layer carries out the heat exchange. The temperature exchange device is used for solving the problem that the refrigerating and heating efficiency is reduced due to the heat conducting medium, increasing the temperature rising and reducing speed and improving the temperature adjusting effect.

Description

Temperature exchange device and temperature regulator

Technical Field

The utility model relates to the field of medical or medical auxiliary equipment, in particular to a temperature exchange device and a temperature regulator.

Background

In daily affected part treatment, hot compress can expand local capillary vessel, accelerate blood circulation, and has effects of diminishing inflammation, relieving swelling, dispelling cold and dampness, relieving pain, and relieving fatigue. Cold compress can be used to lower the temperature of the tissue to achieve a thermoregulatory effect. Cooling reduces the amount of blood in the tissue and slows the metabolism of the tissue, thereby reducing bleeding and inflammation. In addition, cold compress has certain effect on spasm and muscle contracture, and can also raise pain threshold and reduce pain. The cold and hot compress pressurizing bag is used in cold and hot compress treatment as heat conducting agent for heat exchange with user's body and force applying medium for regulating the temperature of user's body.

At present, ordinary temperature regulation system mainly uses compressor or semiconductor refrigeration module to refrigerate and heat the heat conduction liquid, then uses the liquid pump to pack into the bag of parcel at the user affected part with the refrigerant liquid pressurization to the realization is to the temperature regulation of user affected part. However, the equipment needs refrigerating fluid as a heat-conducting medium, the refrigerating and heating efficiency is greatly reduced due to the addition of the heat-conducting medium, the temperature rising and cooling speed is slow, and the cold and hot compress curative effect is poor. Therefore, a temperature exchanging device and a temperature regulator are needed to improve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a temperature exchange device and a temperature regulator, wherein the temperature exchange device is used for solving the problem of reduction of refrigeration and heating efficiency caused by a heat-conducting medium, increasing the temperature rise and fall speed and improving the temperature regulation effect.

In a first aspect, the present invention provides a temperature exchanging apparatus, comprising: the temperature exchange layer is used for containing heat-conducting liquid; the heat exchange zone is arranged in an insulating way relative to the temperature exchange layer and is provided with a temperature change unit; the temperature change unit comprises a semiconductor module, a first heat exchange piece and a second heat exchange piece, wherein the semiconductor module is provided with at least one of a cold compress mode and a hot compress mode, the first heat exchange piece is connected to one side of the semiconductor module, which faces the affected part of the user, of the semiconductor module, the second heat exchange piece is connected to one side of the affected part of the user, back of the semiconductor module, and the second heat exchange piece is used for carrying out heat exchange on the temperature exchange layer.

The temperature regulator has the advantages that: in the hot compress mode, the semiconductor module absorbs the heat of the second heat exchange sheet and transfers the heat to the first heat exchange sheet, the second heat exchange sheet absorbs the heat of the temperature exchange layer, and the first heat exchange sheet transfers the heat to the affected part of the user, so that the affected part of the user is rapidly heated; the semiconductor module can also realize quick temperature rise of the affected part of the user by self-heating and directly transferring heat to the first heat exchange sheet; in a cold compress mode, the semiconductor module absorbs heat of the first heat exchange sheet, and the heat absorbed by the semiconductor module is transferred to the temperature exchange layer through the second heat exchange sheet embedded in the heat exchange area; the affected part of the user can be quickly heated and cooled; the problem of temperature exchange device temperature rise and fall speed slow is solved, be favorable to improving temperature regulation effect, improve temperature regulation appearance rate of utilization, a large amount of start-up time when having practiced thrift temperature regulation appearance and using helps alleviateing user's misery.

Optionally, the temperature exchange layer and the heat exchange area are provided with a liquid-electricity isolation layer therebetween, and one side of the second heat exchange piece, which is back to the affected part of the user, is embedded in the inner side of the liquid-electricity isolation layer. The beneficial effects are that: the temperature exchange layer and the heat exchange area are isolated by the liquid-electric isolation layer, so that electric leakage is avoided, and safety is improved; through with one side of the second heat exchange piece that is back to the user affected part inlay in the inboard of liquid electricity isolation layer for the second heat exchange piece is closer to temperature exchange layer is favorable to promoting heat exchange efficiency.

Optionally, the temperature varying unit further includes a temperature sensing module, the temperature sensing module is located between the first heat exchange fin and the second heat exchange fin, and the temperature sensing module is configured to detect the temperature of the temperature varying unit. The beneficial effects are that: the temperature sensing module is convenient for collecting the temperature information of the temperature changing unit, so that the first heat exchange piece is prevented from being too cold or too hot due to accidental damage of the semiconductor module, and the comfort and the safety in use are improved.

Optionally, the device further comprises a pouch for accommodating the temperature exchange layer and the heat exchange region, and the pouch is further configured to expand in the cold compress mode or the hot compress mode, and the surface of the first heat exchange fin facing the affected part of the user is coplanar with or protrudes from the outer surface of the pouch. The beneficial effects are that: is favorable for the affected part of the user to fully contact with the first heat exchange sheet, and promotes the cold compress or hot compress effect.

Optionally, the device still includes the bag, the bag is used for holding temperature exchange layer and heat exchange area, just the bag still is used for expanding under cold compress mode or the hot compress mode, the bag still includes pressurization layer and gas-liquid isolation layer, the gas-liquid isolation layer sets up the pressurization layer with between the temperature exchange layer the pressurization layer is used for inflating gas makes the bag expand. The beneficial effects are that: the pressurizing layer is filled with gas to expand the bag, so that the bag can be attached to the affected part of a user conveniently; the gas in the pressurizing layer and the heat-conducting liquid in the temperature exchange layer are isolated by the gas-liquid isolating layer, so that the heat-conducting liquid in the temperature exchange layer is prevented from directly contacting with air.

Optionally, the first heat exchange fin is made of a metal sheet, a ceramic sheet or a silicon sheet with high thermal conductivity. The beneficial effects are that: the heat conduction efficiency is increased, the temperature rising and falling speed of the first heat exchange piece is further increased, and energy is saved.

In a second aspect, the present invention provides a temperature regulator, comprising a connection pipe, a host and the temperature exchange device according to the first aspect, wherein the connection pipe is used for connecting the host and the temperature exchange device. The beneficial effects are that: the main machine is connected with the temperature exchange device through the connecting pipe, so that heat-conducting liquid can flow in the temperature exchange device and the main machine in a circulating mode, and continuous temperature adjustment is achieved.

Optionally, the temperature regulator further comprises a liquid pump, and the liquid pump is used for driving the heat-conducting liquid in the temperature exchange layer to flow in the cold compress mode or the hot compress mode; the liquid pump is also used for adjusting the flow speed of the heat-conducting liquid in the temperature exchange layer. The beneficial effects are that: the temperature rising or reducing speed of the temperature exchange layer can be adjusted by adjusting the flowing speed of the heat-conducting liquid in the temperature exchange layer, and the faster the flowing speed of the heat-conducting liquid is, the faster the temperature rising or reducing speed is; the slower the flow speed of the heat-conducting liquid is, the slower the temperature rising or reducing speed is. The flow speed of the heat-conducting liquid is adjusted by the liquid pump, so that the temperature rising and falling speed of the temperature exchange layer can be selected, and the discomfort of a user is reduced.

Optionally, a first fluid path and a second fluid path are arranged in the connecting pipe; one end of the first liquid path is communicated with one end of the liquid pump, and the other end of the first liquid path is communicated with a liquid outlet; one end of the second liquid path is provided with a heat exchange sheet, and the other end of the second liquid path is communicated with a liquid inlet; the liquid inlet and the liquid outlet are both communicated with the temperature exchange layer; the first heat exchange fin is used for contacting an affected part of a user; when the semiconductor module is in a cold compress mode, the cold end of the semiconductor module is connected with the first heat exchange sheet, and the hot end of the semiconductor module is connected with the second heat exchange sheet; the semiconductor module is used for transferring heat of an affected part of a user to heat conducting liquid in the temperature exchange layer; when the semiconductor module is in a hot compress mode, the hot end of the semiconductor module is connected with the first heat exchange sheet, and the cold end of the semiconductor module is connected with the second heat exchange sheet; the semiconductor module is used for transferring the heat of the heat-conducting liquid in the temperature exchange layer to the affected part of the user. The beneficial effects are that: in a cold compress mode, the liquid pump drives heat-conducting liquid in the box body to enter the temperature exchange layer through the first liquid path, the heat-conducting liquid in the temperature exchange layer flows into the heat exchange fins through the second liquid path, the heat exchange fan releases heat of the heat-conducting liquid in the heat exchange fins into air, and the heat-conducting liquid flows back to the box body to complete water path circulation, so that the temperature of the heat-conducting liquid in the temperature exchange layer is reduced, and the cold compress effect is favorably improved; when the hot compress mode, heat conduction liquid in the temperature exchange layer flows in the heat exchanger fin by the second liquid way, heat exchange fan blows the air to the heat exchanger fin, heat conduction liquid in the heat exchanger fin absorbs and gets into behind the heat in the air the box, heat conduction liquid in the liquid pump drive box gets into the temperature exchange layer through first liquid way and accomplishes water cycle, has promoted heat conduction liquid's in the temperature exchange layer temperature is favorable to promoting the hot compress effect.

It is worth mentioning that the semiconductor module can meet the requirements of temperature rise and temperature reduction, and the thermoelectric refrigerator can adjust the cold compress or hot compress mode by adjusting the direction of the loaded direct current, without adding another independent heating or cooling functional element in a given system.

Optionally, an air supply path is further arranged in the connecting pipe; one end of the gas supply path is communicated with a gas pump, the other end of the gas supply path is communicated with a vent, and the vent is communicated with the pressurizing layer; the air pump is used for adjusting the amount of air delivered to the pressurizing layer; the temperature adjusting device comprises a circuit interface and a power supply module, wherein the circuit interface is connected with the semiconductor module, a power supply circuit is arranged in the connecting pipe, and the power supply module is connected with the circuit interface through the power supply circuit. The beneficial effects are that: the gas is introduced into the gas supply circuit through the gas pump, the pressurizing layer drives the bag to expand, the pressure of the first heat exchange sheet which is attached to the affected part of a user is increased conveniently, the power supply module and the circuit interface are connected through the power supply circuit, the output power of the semiconductor module is controlled conveniently to reach the appropriate temperature, and the discomfort of the user is reduced.

Drawings

Fig. 1 is an overall structural view of a temperature regulator provided by the present invention;

FIG. 2 is a schematic cross-sectional view of the temperature varying unit shown in FIG. 1;

fig. 3 (a) is a schematic distribution diagram of a first temperature sensing module according to the present invention;

fig. 3 (b) is a schematic diagram of a second temperature sensing module distribution provided by the present invention;

FIG. 3 (c) is a schematic diagram of a third temperature sensing module distribution provided by the present invention;

FIG. 3 (d) is a schematic diagram illustrating a fourth temperature sensing module according to the present invention;

FIG. 4 is a top view of a pouch provided in accordance with the present invention;

fig. 5 is a schematic structural diagram of a cold and hot compress and pressurization host provided by the utility model.

Reference numbers in the figures:

1. a pouch; 101. a liquid-electric isolation layer; 102. a heat exchange zone; 103. a power supply cable; 104. a first heat exchange fin; 105. a semiconductor module; 106. a second heat exchange fin; 107. a temperature sensing module; 108. a temperature exchange layer; 109. a pressure layer; 110. a gas-liquid separation layer; 111. a circuit interface; 112. a liquid inlet; 113. a vent; 114. a liquid outlet; 115. a first pressurized zone; 116. a second pressurized zone;

2. a host; 201. a control module; 202. a liquid pump; 203. an air pump; 204. a power supply module; 205. a display module; 206. an input module; 207. a heat exchange fan; 208. a box body; 209. a heat exchanger fin;

3. a connecting pipe; 301. a first fluid path; 302. a second fluid path; 303. a gas supply path; 304. and a power supply circuit.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. As used herein, the word "comprising" and similar words are intended to mean that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.

Aiming at the problems in the prior art, the utility model provides a temperature exchange device and a temperature regulator.

Fig. 1 is an overall structural view of a temperature regulator provided in the present invention; fig. 2 is a schematic cross-sectional structure view of the temperature varying unit of fig. 1.

The present invention provides a temperature exchanging apparatus, referring to fig. 1 and 2, comprising: a temperature exchange layer 108 for containing a heat transfer liquid; a heat exchange zone 102, which is insulated from the temperature exchange layer 108, and the heat exchange zone 102 is provided with a temperature change unit; the temperature changing unit comprises a semiconductor module 105, a first heat exchange plate 104 and a second heat exchange plate 106, wherein the semiconductor module 105 has at least one of a cold compress mode and a hot compress mode, the first heat exchange plate 104 is connected to one side of the semiconductor module 105 facing to the affected part of a user, the second heat exchange plate 106 is connected to one side of the semiconductor module 105 facing to the affected part of the user, and the second heat exchange plate 106 is used for exchanging heat with the temperature exchange layer 108.

In some embodiments, a liquid-electric isolation layer 101 is disposed between the temperature exchange layer 108 and the heat exchange region 102, and a side of the second heat exchange fin 106 facing away from the affected part of the user is embedded in an inner side of the liquid-electric isolation layer 101.

In some embodiments, the apparatus further comprises a pouch 1 for accommodating the temperature exchange layer 108 and the heat exchange region 102, and the pouch 1 is further adapted to expand in the cold or hot compress mode, the pouch 1 further comprises a pressurization layer 109 and a gas-liquid separation layer 110, the gas-liquid separation layer 110 is disposed between the pressurization layer 109 and the temperature exchange layer 108, and the pressurization layer 109 is adapted to inflate the pouch 1 with gas.

In some embodiments of the present invention, the temperature exchange layer 108 is disposed in a hollow bag shape, the liquid-electric separation layer 101 is disposed in a sheet shape, the gas-liquid separation layer 110 is disposed in a sheet shape, the pressurizing layer 109 is disposed in a hollow bag shape, and the heat exchange region 102 is disposed in a sheet shape with a cavity therein. The power supply cable 103 and the temperature changing unit are both located inside the heat exchange region 102, the power supply cable 103 is distributed inside the heat exchange region 102 in a tree-like shape, the power supply cable 103 is electrically connected with the semiconductor module 105, the top side of the semiconductor module 105 is provided with a first heat exchange sheet 104, the first heat exchange sheet 104 is arranged in a rectangular shape, and in other embodiments, the first heat exchange sheet 104 can be in other shapes. When in use, the top end surface of the first heat exchange sheet 104 is in contact with the affected part of the user, the bottom side of the semiconductor module 105 is provided with a second heat exchange sheet 106, the second heat exchange sheet 106 is embedded into the liquid-electric isolation layer 101, and the second heat exchange sheet 106 is in direct contact with the temperature exchange layer 108.

In the hot compress mode, the power supply cable 103 supplies a first current to the semiconductor module 105 for supplying power, the semiconductor module 105 generates heat and guides the heat from the temperature exchange layer 108 to the first heat exchange fin 104, and the first heat exchange fin 104 is in direct contact with the affected part of the user for hot compress. In the cold compress mode, the power supply cable 103 provides a second current different from the first current direction to the semiconductor module 105 for supplying power, the semiconductor module 105 absorbs the heat of the first heat exchange fin 104, the first heat exchange fin 104 directly contacts with the affected part of the user for cold compress, the semiconductor module 105 guides the absorbed heat into the second heat exchange fin 106, and the heat of the second heat exchange fin 106 is conducted into the heat conducting liquid in the temperature exchange layer 108 due to the fact that the second heat exchange fin 106 directly contacts with the temperature exchange layer 108, and the heat is taken away through the heat conducting liquid.

In some embodiments, the power supply cable 103 may be arranged in a line, connecting a plurality of semiconductor modules 105 in series. In other embodiments, the semiconductor module 105 may be split into a cooling module and a heating module. It is worth noting that the power supply cable 103 supplies power to the cooling module and the heating module, respectively.

In some embodiments of the present invention, referring to fig. 2, the temperature changing unit further includes a temperature sensing module 107, the temperature sensing module 107 is located between the first heat exchange fin 104 and the second heat exchange fin 106, and the temperature sensing module 107 is configured to detect a temperature of the temperature changing unit.

In some embodiments of the present invention, referring to fig. 2, the apparatus further comprises a pouch 1 for accommodating the temperature exchange layer 108 and the heat exchange region 102, and the pouch 1 is further adapted to expand in the cold or hot compress mode, and the surface of the first heat exchange sheet 104 facing the affected part of the user is coplanar with or protruded from the outer surface of the pouch 1.

In some embodiments, the surface of the first heat exchange fin 104 facing the affected part of the user is disposed flush and coplanar with the outer surface of the pouch 1.

In other embodiments, the surface of the first heat exchange sheet 104 facing the affected part of the user is protruded higher than the outer surface of the pouch 1. In some embodiments of the present invention, referring to fig. 2, the bottom end of the second heat exchanging fin 106 is embedded inside the liquid-electric isolating layer 101.

In some embodiments, the second heat exchange fin 106 may be completely embedded inside the layer 101. In other embodiments, a portion of the second heat exchanging fin 106 may be embedded inside the liquid-electric isolating layer 101. In some embodiments, the bottom end of the second heat exchange fin 106 may directly contact the temperature exchange layer 108. In other embodiments, the bottom end of the second heat exchanging fin 106 may be separated from the isothermal layer 108 by a liquid-electric isolating layer 101.

It should be noted that, when the power supply cable 103, the semiconductor module 105 and the temperature sensing module 107 are all provided with a waterproof layer, a waterproof structure or a waterproof device, the liquid-electric isolation layer 101 may not be provided.

Fig. 3 (a) is a schematic distribution diagram of a first temperature sensing module according to the present invention; fig. 3 (b) is a schematic diagram of a second temperature sensing module distribution provided by the present invention; FIG. 3 (c) is a schematic diagram of a third temperature sensing module distribution provided by the present invention; fig. 3 (d) is a schematic distribution diagram of a fourth temperature sensing module provided by the present invention.

In some embodiments, the distribution of the temperature sensing modules 107 in the heat exchange region 102 may take various forms. As shown in fig. 3 (a), in one embodiment, the temperature sensing modules 107 are uniformly distributed in the heat exchange area 102, and can detect the temperature in the pouch 1 comprehensively.

As shown in fig. 3 (b), in another embodiment, the temperature sensing modules 107 are distributed at a central position within the heat exchange area 102. Is beneficial to accurately controlling the temperature of the central position of the bag 1.

In yet another embodiment, as shown in fig. 3 (c), the temperature sensing modules 107 are distributed at the edge positions in the heat exchange area 102, which is beneficial to timely find out that the pocket 1 is not tightly fitted to the affected part of the user, and ensure the temperature regulation effect.

In yet another embodiment, as shown in fig. 3 (d), the temperature sensing modules 107 are distributed on one side of the heat exchange area 102 for local thermal conditioning. That is to say, in the use scene that the affected part of the user is exposed and the user wears clothes around the affected part, the side of the heat exchange region 102 with the temperature sensing module 107 is attached to the affected part of the user, and the temperature change speed of the affected part of the user and the temperature change speed of the clothes following the first heat exchange plate 104 are different, so that abnormal error reporting in the use process can be reduced, and the use experience is improved.

It is noted that, in one embodiment, the first heat exchanging fin 104 is made of a metal sheet, a ceramic sheet or a silicon sheet with high thermal conductivity.

In some embodiments, the first heat exchange fins 104 may be arranged in any shape, such as a circle, an ellipse, a rounded polygon, or an irregular shape. The first heat exchange fins 104 may be distributed in an array shape or a ring shape at one side of the heat exchange region 102, and the first heat exchange fins 104 may be concentrated at one side of the heat exchange region 102 or uniformly distributed at one side of the heat exchange region 102.

Fig. 4 is a top view of a pouch provided by the present invention.

In some embodiments of the present invention, referring to fig. 4, a circuit interface 111, a liquid inlet 112, a gas vent 113 and a liquid outlet 114 are disposed on one side of the pouch 1. The circuit interface 111 is electrically connected to the power supply cable 103, and the semiconductor module 105 and the temperature sensing module 107 are both electrically connected to the power supply cable 103.

In some embodiments, the circuit interface 111, the inlet 112, the vent 113 and the outlet 114 may be disposed on one side of the pouch 1, or the circuit interface 111, the inlet 112, the vent 113 and the outlet 114 may be disposed on multiple sides of the pouch 1. The water, electricity and gas can be separated from the bag 1, and medical accidents caused by leakage can be reduced.

Fig. 5 is a schematic structural diagram of a host according to the present invention.

The utility model provides a temperature regulator, which comprises a connecting pipe 3, a host machine 2 and the temperature exchange device in any one of the embodiments, wherein the connecting pipe 3 is used for connecting the host machine 2 with the temperature exchange device, and the temperature exchange device is shown in figure 5.

The temperature regulator further comprises a liquid pump 202, wherein the liquid pump 202 is used for driving the heat-conducting liquid in the temperature exchange layer 108 to flow in the cold compress mode or the hot compress mode; the liquid pump 202 is also used to adjust the flow rate of the thermally conductive liquid within the temperature exchange layer 108.

In some embodiments, the liquid pump 202 may also be configured as an oil pump or a water pump, the tank 208 is configured to store cooling oil or cooling liquid, the air pump 203 may also be configured as an air valve externally connected to a static air pipe, the control module 201 includes a controller or a control chip, the input module 206 includes an input device or an input interface, and the input device includes an input keyboard, a touch pad, or an input button. The display module 205 includes a display or a touch screen, and the heat exchanging fin 209 may be fixedly connected or detachably connected to the heat exchanging fan 207.

It should be noted that the control information input by the input module 206 to the control module 201 includes a temperature setting value, a constant temperature timing time and a pressurizing strength, which are respectively used for controlling the temperature of the semiconductor module 105, the operating time of the semiconductor module 105 and the pressurizing strength of the air pump 203. The input module 206 and the control module 201 are arranged to facilitate selection of a suitable temperature, a suitable temperature adjustment time and a suitable pressure of the sachet 1 against the affected part of the user.

In some embodiments of the present invention, referring to fig. 4 and 5, a first fluid path 301 and a second fluid path 302 are disposed in the connection tube 3 and are in fluid communication with the temperature exchange device; one end of the first fluid path 301 is communicated with one end of the fluid pump 202, and the other end of the first fluid path 301 is communicated with the fluid outlet 114. One end of the second liquid path 302 is provided with a heat exchange plate 209, and the other end of the second liquid path 302 is communicated with a liquid inlet 112. The liquid inlet 112 and the liquid outlet 114 are both communicated with the temperature exchange layer 108; the first heat exchange fin 104 is for contacting a lesion of a user; when the semiconductor module 105 is in a cold compress mode, the cold end of the semiconductor module 105 is connected with the first heat exchange fin 104, and the hot end of the semiconductor module 105 is connected with the second heat exchange fin 106; the semiconductor module 105 is used for transferring heat of the affected part of the user to the heat conducting liquid in the temperature exchange layer 108; when the semiconductor module 105 is in the hot compress mode, the hot end of the semiconductor module 105 is connected with the first heat exchange fin 104, and the cold end of the semiconductor module 105 is connected with the second heat exchange fin 106; the semiconductor module 105 is used for transferring heat of the heat conducting liquid in the temperature exchange layer 108 to the affected part of the user.

An air supply path 303 is also arranged in the connecting pipe 3; one end of the air supply path 303 is communicated with an air pump 203, the other end of the air supply path 303 is communicated with an air port 113, and the air port 113 is communicated with the pressurization layer 109; the air pump 203 is used for adjusting the amount of air delivered to the pressurizing layer 109; the temperature adjusting device comprises a circuit interface 111 connected with the semiconductor module 105 and a power supply module, a power supply circuit 304 is arranged in the connecting pipe 3, and the power supply module 204 is connected with the circuit interface 111 through the power supply circuit 304.

In some embodiments, referring to fig. 2 and 5, the air supply path 303 is used for the air pump 203 to fill the air port 113 with air, and the air supply path 303 is also used for the air pump 203 to suck air out of the air port 113. The air supply path 303 is arranged to facilitate adjustment of the air pressure of the pressurizing layer 109, so that the comfort level during use is improved.

The following further explains the working method flow of the temperature regulator provided by the utility model with reference to specific use scenes:

firstly, the host 2 is powered by an external power supply, and the temperature, the temperature regulation time and the pressure of the bag 1 on the affected part of the user are set by the input module 206; the bag 1 is wrapped on the outer side of the affected part of the user, so that the first heat exchange sheet 104 contacts the affected part of the user, and the display module 205 can display the current output power of the air pump 203, the temperature set by the input module 206, and the remaining time of temperature adjustment in real time. The control module 201 obtains the temperature values of all the temperature sensing modules 107 through a continuous or a certain interval period, and obtains an average temperature value and a standard deviation of the temperature values through averaging. When the average temperature value reaches the preset temperature, the control module 201 controls the power supply module 204 to reduce the output power to the semiconductor module 105, which has the following beneficial effects: is favorable for improving the comfort of the use process. When temperature value standard deviation of temperature sensing module 107 surpassed preset threshold value, control module 201 control display module 205 shows that information reminds the user to correctly wear bag 1, makes the heat exchange area laminating user affected part, and its beneficial effect lies in: the user can be reminded to reduce the gap between the heat exchange area 102 and the affected part of the user, so as to avoid the interference of the temperature adjusting effect by the external air. The control module 201 controls the air pump 203 to inject air into the pressurizing layer 109 to maintain the pressure of the pouch 1 against the affected part of the user.

It is noted that the control module 201 is configured to receive a control temperature inputted by a user and process the temperature of the surface of the pouch obtained by the temperature sensor in the pouch, and then control the output power of the power supply module 204 for supplying power to the semiconductor module, and the first heat exchange fin 104 is configured to contact the affected part of the user. The semiconductor module 105 has a cold side and a hot side in operation, heat from the cold side being transferred to the hot side by the semiconductor module 105, the cold and hot sides of the semiconductor module 105 being interchangeable by changing the electrodes of the semiconductor module 105, i.e. controlling the direction of current to the semiconductor module 105. The working mode of the temperature regulator comprises a cold compress mode and a hot compress mode, and the cold compress mode and the hot compress mode are respectively elaborated in detail as follows:

when entering the cold compress mode, the cold end of the semiconductor module 105 is connected with the first heat exchange fin 104, and the hot end of the semiconductor module 105 is connected with the second heat exchange fin 106; the semiconductor module 105 is used for transferring heat from the affected part of the user to the heat conducting liquid in the temperature exchange layer 108. Meanwhile, the control module 201 controls the liquid pump 202 to inject the heat-conducting liquid in the box 208 into the temperature exchange layer 108 in the bag 1 through the first liquid path 301, the heat-conducting liquid takes the heat of the second heat exchange fin 106 out of the bag, the heat-conducting liquid flows into the heat exchange fin 209 through the second liquid path 302, the heat in the heat-conducting liquid is released into the air through the heat exchange fan 207, and finally the heat-conducting liquid returns to the box 208 to complete the water path circulation, so that the continuous and stable heat dissipation is realized.

When entering the hot compress mode, the hot end of the semiconductor module 105 is connected with the first heat exchange sheet 104, and the cold end of the semiconductor module 105 is connected with the second heat exchange sheet 106; the semiconductor module 105 is used for transferring heat of the heat conducting liquid in the temperature exchange layer 108 to the affected part of the user. Meanwhile, the heat-conducting liquid flows into the heat exchange fins 209 through the second liquid path 302, heat in the air is conducted into the heat-conducting liquid through the heat exchange fan 207, the heat-conducting liquid flows into the box body 208, the control module 201 controls the liquid pump 202 to inject the heat-conducting liquid in the box body 208 into the temperature exchange layer 108 in the bag 1 through the first liquid path 301, the heat-conducting liquid in the temperature exchange layer 108 flows out of the bag through the second liquid path 302 after transferring heat to the second heat exchange fins 106, water path circulation is completed, and continuous and stable heating is achieved.

It should be noted that the semiconductor module can be a thermoelectric cooling chip or a thermoelectric Cooler (TEC), and the TEC is a device that produces cold by utilizing the Thermo-electric effect of a semiconductor, and is also called a thermoelectric Cooler, which is an electronic element based on semiconductor materials and can be used as a small heat pump. By applying a low dc voltage across the thermoelectric cooler, heat flows from one side of the thermoelectric cooler to the other. In addition, the thermoelectric refrigerator is used as a heat pump to transfer heat from one point to another point when the thermoelectric refrigerator works, and is not used for a common heat absorption process or a magic process for dissipating heat. After power is applied, one side of the thermoelectric cooler cools while the other side heats up. The heat of the cooled surface is transferred to the hot end, which completely conforms to the thermodynamic process. The thermoelectric cooler can adjust the cooling or heating mode by adjusting the direction of the applied direct current.

In some embodiments, the semiconductor module 105 may autonomously generate heat and transfer the heat to the first heat exchange fin 104, thereby achieving rapid warming for hot compress on the affected part of the user.

In one embodiment, an air valve is provided at one side of the pressurizing layer 109, and the pressurizing layer 109 can be connected to the atmospheric pressure through the air valve to discharge part or all of the air in the pressurizing layer 109, so that the pouch 1 can be removed from the outer side of the affected part of the user after the temperature adjustment is finished.

It should be noted that, in one embodiment, the temperature regulator can control the cold compress mode and the hot compress mode to be performed alternately according to the instruction input by the input module 206, so as to achieve diversified temperature regulation of the affected part of the user.

Although the embodiments of the present invention have been described in detail hereinabove, it is apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it is to be understood that such modifications and variations are within the scope and spirit of the present invention as set forth in the following claims. Moreover, the utility model as described herein is capable of other embodiments and of being practiced or of being carried out in various ways.

Claims (10)

1. A temperature exchanging device, comprising:

a temperature exchange layer (108) for containing a heat transfer fluid;

the heat exchange zone (102) is arranged in an insulating mode relative to the temperature exchange layer (108), and the heat exchange zone (102) is provided with a temperature changing unit;

the temperature change unit comprises a semiconductor module (105), a first heat exchange plate (104) and a second heat exchange plate (106), wherein the semiconductor module (105) is provided with at least one of a cold compress mode and a hot compress mode, the first heat exchange plate (104) is connected to one side of the semiconductor module (105) facing to a user affected part, the second heat exchange plate (106) is connected to one side of the semiconductor module (105) facing away from the user affected part, and the second heat exchange plate (106) is used for carrying out heat exchange on a temperature exchange layer (108).

2. The temperature exchanger arrangement according to claim 1, wherein a liquid-electric isolation layer (101) is arranged between the temperature exchange layer (108) and the heat exchange region (102), and a side of the second heat exchange fin (106) facing away from the affected part of the user is embedded inside the liquid-electric isolation layer (101).

3. The temperature exchange device according to claim 1, wherein the temperature changing unit further comprises a temperature sensing module (107), the temperature sensing module (107) is located between the first heat exchange fin (104) and the second heat exchange fin (106), and the temperature sensing module (107) is used for detecting the temperature of the temperature changing unit.

4. The temperature exchange device according to claim 1, further comprising a pouch (1) for accommodating the temperature exchange layer (108) and the heat exchange zone (102), and the pouch (1) is further adapted to expand in the cold or hot compress mode, the surface of the first heat exchange fin (104) facing the affected part of the user being coplanar with or protruding from the outer surface of the pouch (1).

5. The temperature exchange device according to claim 1, further comprising a pouch (1) for accommodating the temperature exchange layer (108) and the heat exchange zone (102), and the pouch (1) is further adapted to expand in the cold or hot compress mode, the pouch (1) further comprising a pressurization layer (109) and a gas-liquid separation layer (110), the gas-liquid separation layer (110) being disposed between the pressurization layer (109) and the temperature exchange layer (108), the pressurization layer (109) being adapted to inflate a gas to expand the pouch (1).

6. The temperature exchange device according to any one of claims 1 to 5, characterized in that the first heat exchange fins (104) are made of a sheet of metal, ceramic or silicone with high thermal conductivity.

7. Thermostat, characterized in that it comprises a connection pipe (3), a main unit (2) and a temperature exchange device according to any one of claims 1-6, the connection pipe (3) being intended to connect the main unit (2) with the temperature exchange device.

8. The temperature conditioner according to claim 7, further comprising a liquid pump (202), wherein the liquid pump (202) is used for driving the heat conducting liquid in the temperature exchange layer (108) to flow in the cold compress mode or the hot compress mode; the liquid pump (202) is also used for adjusting the flow speed of the heat-conducting liquid in the temperature exchange layer (108).

9. Thermostat according to claim 8, characterized in that a first fluid path (301) and a second fluid path (302) are provided in the connecting tube (3) in fluid communication with the temperature exchanging device; one end of the first liquid path (301) is communicated with one end of the liquid pump (202), and the other end of the first liquid path (301) is communicated with a liquid outlet (114); one end of the second liquid path (302) is provided with a heat exchange fin (209), and the other end of the second liquid path (302) is communicated with a liquid inlet (112); the liquid inlet (112) and the liquid outlet (114) are both communicated with the temperature exchange layer (108);

the first heat exchange fin (104) is for contacting a user's affected part; when the semiconductor module (105) is in a cold compress mode, the cold end of the semiconductor module (105) is connected with the first heat exchange fin (104), and the hot end of the semiconductor module (105) is connected with the second heat exchange fin (106); the semiconductor module (105) is used for transferring heat of a wounded part of a user to heat conducting liquid in the temperature exchange layer (108);

when the semiconductor module (105) is in a hot compress mode, the hot end of the semiconductor module (105) is connected with the first heat exchange plate (104), and the cold end of the semiconductor module (105) is connected with the second heat exchange plate (106); the semiconductor module (105) is used for transferring heat of the heat conducting liquid in the temperature exchange layer (108) to the affected part of the user.

10. The temperature regulator according to claim 7, wherein a gas supply path (303) is further provided in the connecting tube (3); one end of the air supply path (303) is communicated with an air pump (203), the other end of the air supply path (303) is communicated with an air port (113), and the air port (113) is communicated with the pressurization layer (109); the air pump (203) is used for adjusting the amount of air delivered to the pressurizing layer (109);

the temperature adjusting device comprises a circuit interface (111) connected with the semiconductor module (105) and a power supply module, a power supply circuit (304) is arranged in the connecting pipe (3), and the power supply module (204) is connected with the circuit interface (111) through the power supply circuit (304).

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