CN216873497U

CN216873497U - Functional development board based on 5G module

Info

Publication number: CN216873497U
Application number: CN202121817529.4U
Authority: CN
Inventors: 黄娇龙
Original assignee: Beijing Huichen Sirui Technology Co ltd
Current assignee: Beijing Huichen Sirui Technology Co ltd
Priority date: 2021-08-05
Filing date: 2021-08-05
Publication date: 2022-07-01
Anticipated expiration: 2031-08-05

Abstract

The utility model relates to the technical field of development boards, and discloses a 5G module-based functional development board, which comprises a substrate body, a USIM module, a USB module, an RGQ module, a UART module, an IMAX module, an AP _ UART module, a PCIE module, a WIFI module and a PHY chip. This functional type development board based on 5G module through being provided with the structure that is provided with the protective housing in the outside of base plate body, can play the effect of keeping apart to the bottom of base plate body, prevents that ground moisture from causing the damage to the base plate body, through the structure that is provided with spread groove, connecting block, visor and arm-tie on the protective housing, can protect the development board.

Description

Functional development board based on 5G module

Technical Field

The utility model relates to the technical field of development boards, in particular to a functional development board based on a 5G module.

Background

The development board can enable designers to be familiar with the product quickly, save software and hardware development time to the maximum extent, and bring the product to the market as soon as possible. Especially for 5G modules, the technology is new, the functions are complete, and the functions are difficult, and most customers can evaluate on an evaluation board before formally starting the design.

Some functional development boards on the market are exposed outside, and have no protection effect on the development boards, so that the development boards are easily damaged.

We propose a 5G module based functional development board in order to solve the problems set forth above.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In view of the defects in the prior art in the background art, an object of the present invention is to provide a 5G module-based functional development board, so as to solve the problem that some 5G module-based functional development boards in the current market proposed in the background art are exposed outside, do not protect the development board, and are likely to cause damage to the development board.

(II) technical scheme

In order to achieve the purpose, the utility model is realized by the following technical scheme:

the utility model provides a functional type development board based on 5G module, includes substrate body, USIM module, USB module, RGQ module, UART module, IMAX module, AP _ UART module, PCIE module, WIFI module and PHY chip, substrate body's outside fixedly connected with protective housing, the spread groove has been seted up at the top of protective housing, the inside swing joint of spread groove has the connecting block, the top fixedly connected with visor of connecting block, the top fixedly connected with arm-tie of visor, the louvre has all been seted up to the both sides inner wall of protective housing, the inside fixedly connected with protection network of louvre.

Preferably, the bottom of the protective cover is in contact connection with the top of the protective shell, and the outer surface of the connecting block is in sliding connection with the inner surface of the connecting groove.

Preferably, the USIM module, the USB module, the RGQ module, the UART module, the IMAX module, the AP _ UART module, the PCIE module, the WIFI module, and the PHY chip are all electrically connected to the top of the substrate body.

Preferably, the two sides of the protective net are level with the two ends of the heat dissipation holes, and the protective net is made of iron wire materials.

Furthermore, the IMAX module is positioned in front of the UART module, and the UART module is positioned on the right side of the WIFI module.

Furthermore, the WIFI module is located the place ahead of PHY chip, the PCIE module is located the left side of base plate body.

(III) advantageous effects

Compared with the prior art, the utility model has the beneficial effects that: this functional type development board based on 5G module:

(1) through being provided with the structure that is provided with the protective housing in the outside of base plate body, can play the effect of keeping apart to the bottom of base plate body, prevent that ground moisture from causing the damage to the base plate body, through the structure that is provided with spread groove, connecting block, visor and arm-tie on the protective housing, can protect the development board.

(2) Through the structure that is provided with louvre and protection network on the protective housing, the heat dissipation of base plate body can be convenient for, improves the life of base plate body.

Drawings

FIG. 1 is a schematic diagram of an internal structure of a 5G module-based functional development board according to the present invention;

FIG. 2 is a schematic diagram of an internal structure of a protective cover of a functional development board based on a 5G module according to the present invention;

fig. 3 is a schematic perspective view of a connection plate of a functional development board based on a 5G module according to the present invention.

In the figure: 1. a protective shell; 2. a substrate body; 3. a USIM module; 4. a USB module; 5. an RG500Q module; 6. a UART module; 7. an IMAX module; 8. an AP _ UART module; 9. a PCIE module; 10. a WIFI module; 11. a PHY chip; 12. connecting grooves; 13. connecting blocks; 14. a protective cover; 15. pulling a plate; 16. heat dissipation holes; 17. and (4) a protective net.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a 5G module-based functional development board; the novel USB protective shell comprises a substrate body 2, a USIM module 3, a USB module 4, an RG500Q module 5, a UART module 6, an IMAX module 7, an AP _ UART module 8, a PCIE module 9, a WIFI module 10 and a PHY chip 11, wherein the outer part of the substrate body 2 is fixedly connected with a protective shell 1, the top of the protective shell 1 is provided with a connecting groove 12, the inner part of the connecting groove 12 is movably connected with a connecting block 13, the top of the connecting block 13 is fixedly connected with a protective cover 14, the top of the protective cover 14 is fixedly connected with a pulling plate 15, the inner walls of two sides of the protective shell 1 are respectively provided with heat dissipation holes 16, and the inner parts of the heat dissipation holes 16 are fixedly connected with a protective screen 17;

as a preferred technical scheme of the utility model: the bottom of the protective cover 14 is in contact connection with the top of the protective shell 1, and the outer surface of the connecting block 13 is in sliding connection with the inner surface of the connecting groove 12;

as a preferred technical scheme of the utility model: the USIM module 3, the USB module 4, the RG500Q module 5, the UART module 6, the IMAX module 7, the AP _ UART module 8, the PCIE module 9, the WIFI module 10 and the PHY chip 11 are electrically connected with the top of the substrate body 2;

as a preferred technical scheme of the utility model: the two sides of the protective net 17 are flush with the two ends of the heat dissipation holes 16, and the protective net 17 is made of iron wire materials;

as a preferred technical scheme of the utility model: the IMAX module 7 is positioned in front of the UART module 6, and the UART module 6 is positioned at the right side of the WIFI module 10;

as a preferred technical scheme of the utility model: the WIFI module 10 is located in front of the PHY chip 11, and the PCIE module 9 is located on the left side of the substrate body 2.

The working principle of the embodiment is as follows: when the 5G module-based functional development board is used, the substrate body 2 is placed inside the protective casing 1, then the connecting block 13 on the protective cover 14 is inserted into the connecting groove 12 to protect the internal components, and the heat dissipation holes 16 can facilitate the heat dissipation of the substrate body 2, which is the working process of the whole device, and the contents not described in detail in this specification are the prior art known to those skilled in the art.

Although the present invention has been described in detail with reference to the foregoing embodiments, it should be noted that, in the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, may be fixedly connected or detachably connected; or indirectly through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations; it will be apparent to those skilled in the art that modifications and equivalents may be made in the embodiments and/or portions thereof without departing from the spirit and scope of the present invention.

Claims

1. A functional development board based on a 5G module comprises a substrate body (2), a USIM module (3), a USB module (4), an RG500Q module (5), a UART module (6), an IMAX module (7), an AP _ UART module (8), a PCIE module (9), a WIFI module (10) and a PHY chip (11), it is characterized in that the outer part of the substrate body (2) is fixedly connected with a protective shell (1), the top of the protective shell (1) is provided with a connecting groove (12), the inside of the connecting groove (12) is movably connected with a connecting block (13), the top of the connecting block (13) is fixedly connected with a protective cover (14), the top of the protective cover (14) is fixedly connected with a pulling plate (15), heat dissipation holes (16) are formed in the inner walls of the two sides of the protective shell (1), and a protective net (17) is fixedly connected to the inner portions of the heat dissipation holes (16).

2. The 5G module-based functional development board as claimed in claim 1, wherein the bottom of the protective cover (14) is connected with the top of the protective shell (1) in a contact manner, and the outer surface of the connecting block (13) is connected with the inner surface of the connecting groove (12) in a sliding manner.

3. The functional development board based on the 5G module set according to claim 1, wherein the USIM module (3), the USB module (4), the RG500Q module (5), the UART module (6), the IMAX module (7), the AP _ UART module (8), the PCIE module (9), the WIFI module (10) and the PHY chip (11) are all electrically connected to the top of the substrate body (2).

4. The functional development board based on 5G module according to claim 1, characterized in that two sides of the protective net (17) are flush with two ends of the heat dissipation holes (16), and the protective net (17) is made of iron wire material.

5. The 5G module-based functional development board as claimed in claim 1, wherein the IMAX module (7) is located in front of the UART module (6), and the UART module (6) is located to the right of the WIFI module (10).

6. The 5G module-based functional development board according to claim 1, wherein the WIFI module (10) is located in front of the PHY chip (11), and the PCIE module (9) is located on the left side of the substrate body (2).