CN216870483U - Gas analyzer - Google Patents

Abstract

The utility model discloses a gas analyzer, relates to the field of gas detection, and solves the problems of low space utilization rate and low detection precision of the conventional device, and the key points of the technical scheme are as follows: the utility model provides a gas analyzer, contains thermos cup and heat preservation cup cover, be provided with sensor module in the heat preservation cup cover, the heat preservation cup cover cooperatees with the thermos cup and forms the enclosure space. The purpose of improving the space utilization rate and the detection precision of the device is achieved.

Description

Gas analyzer

Technical Field

The utility model relates to the field of gas detection, in particular to a gas analyzer.

Background

In the field of gas detection, the existing gas analyzer mainly has the following defects. Firstly, the mixed design of circuit gas circuit can lead to the problem that the chaotic space utilization of circuit is low. Secondly, the sensor module is closer to the circuit module, the circuit module continuously generates heat and needs heat dissipation, the sensor module and the gas to be detected need to be placed in an environment with relatively constant temperature, and the heat dissipation of the circuit module influences the detection precision of the sensor module.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a gas analyzer, which achieves the purposes of improving the space utilization rate and the detection precision.

The technical purpose of the utility model is realized by the following technical scheme: a gas analyzer is characterized in that: contain thermos cup and heat preservation cup cover, be provided with sensor module in the heat preservation cup cover, the heat preservation cup cover cooperatees with the thermos cup and forms the enclosure space.

The sensor module is arranged in the closed heat-insulating space, so that the sensor module and the gas to be detected can be in a relatively constant environment, and the detection result is more accurate.

Further, the heat insulation cup comprises a heat insulation plate and a support plate, and the heat insulation cup cover is arranged above the heat insulation plate; the supporting plate is arranged below the heat insulation plate; a circuit module mounting bracket is arranged below the supporting plate; the circuit module mounting bracket is provided with a circuit module.

Keep apart circuit module installing support through the heat insulating board with the thermos cup cover, can play the heat that the isolation circuit module sent on the one hand, on the other hand sets up thermos cup and circuit module installing support from top to bottom through the backup pad, plays and practices thrift the space, increases space utilization's effect.

A support column is further arranged below the support plate; the number of the struts is more than or equal to three.

The purpose of the support column is to replace a circuit module mounting bracket to support the device, so that the center of gravity of the whole device is more stable.

And a mounting seat is arranged below the support.

The pillar sets up on the mount pad, through the pillar of changing different length, can change the distance of backup pad and mount pad, and then changes the space that circuit module installing support occupy, conveniently changes the circuit module of different specifications.

Further, the supporting plate and the heat insulation plate are provided with corresponding mounting holes and through holes.

The mounting hole is used for mounting the heat-preservation cup cover, the bracket and the supporting plate; the through hole is mainly used for passing through the cable and the air channel pipeline. Through the arrangement, the space can be further saved, and the line pipelines are arranged, so that the whole device is cleaner and tidier.

Further be provided with sensor module mounting bracket in the thermos cup cover, the sensor module sets up on sensor module mounting bracket.

The sensor module mounting frame can be used for mounting the sensor module and can also be used for mounting other auxiliary equipment, such as a heating device.

Furthermore, the inner wall of the vacuum cup is bonded with heat insulation cotton.

The main function of the heat insulation cotton is added to enhance the heat insulation performance of the vacuum cup. The bonding position of the heat insulation cotton can also be arranged on the outer wall.

Furthermore, a polytetrafluoroethylene heat insulation sheet is attached to the bottom surface of the heat-preservation cup cover.

The heat insulation performance can be further enhanced through the heat insulation sheet, and the purpose of better isolating the heat of the circuit module is achieved.

The sensor modules and circuit modules referred to in the present invention are prior art in the field.

Through adopting above-mentioned technical scheme, reach at least one kind of beneficial effect:

1. the sensor module is independently arranged in the vacuum cup, so that the sensor module and the gas to be detected are in relatively constant environment, and the monitoring precision is improved.

2. The sensor module and the circuit module are arranged up and down, so that the space of the device can be saved, and the device is cleaner and tidier.

Drawings

FIG. 1 is an exploded view of an embodiment

In the figure: 1. a vacuum cup; 2. a vacuum cup cover; 3. a sensor module; 4. a sensor module mounting bracket; 5. a heat insulation plate; 6. a support plate; 7. a circuit module mounting bracket; 8. a circuit module; 9. a pillar; 10. and (7) mounting a seat.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly or indirectly connected to the other element, and the "connection" does not limit the fixed connection or the movable connection, and the specific connection mode should be determined according to the specific technical problem to be solved.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Example (b):

the structure of the utility model comprises a support plate (6), a heat insulation plate (5), a heat preservation cup (1), a heat preservation cup cover (2), a sensor module (3), a sensor module mounting rack (4), a support column (9), a circuit module (8), a circuit module mounting bracket (7) and a mounting seat (10).

The supporting plate (6) is used for separating the upper partition from the lower partition, and layering of the sensor module (3) and the circuit module (8) is achieved.

The heat insulation board (5) is positioned on the upper part of the support board (6) and is used for isolating heat between the circuit module (8) and the sensor module (3).

The upper space formed by the vacuum cup (1) and the vacuum cup cover (2) enables the temperature of the sensor module (3) to be constant.

The sensor module mounting frame (4) is used for mounting the upper-layer space sensor module (3) and accessories thereof; a heating module may be installed when it is desired to heat the gas to be detected.

The support (9) is used for supporting the lower layer space.

The circuit module mounting bracket (7) is used for mounting the circuit modules (8) in the lower layer of space in a centralized manner.

Mounting holes and through holes are formed in the corresponding positions of the supporting plate (6) and the heat insulation plate (5), the mounting holes are used for mounting the heat insulation cup cover (2), and the circuit module mounting bracket (7) and the bracket; the through hole is used for installing an air channel pipeline and a cable.

The heat-insulating cup cover (2) installed on the heat-insulating plate (5) is a base body of an upper space, a sensor module installing frame (4) is pre-installed in the heat-insulating cup cover, and the sensor module (3) is installed on the sensor module installing frame (4).

The heat preservation cup (1) is sleeved with the heat preservation cup cover (2) to provide a closed heat preservation environment for the sensor module (3).

The heat insulation effect of the vacuum cup (1) is further improved by pasting heat insulation cotton on the inner wall or the outer wall of the vacuum cup (1), and the heat insulation effect is further enhanced by pasting a polytetrafluoroethylene heat insulation sheet at the bottom of the vacuum cup cover (2).

Circuit module (8) are fixed in the below of backup pad (6) through circuit module installing support (7), and its required installation space size cooperates through pillar (9) length, and pillar (9) are longer, and then backup pad (6) below is the space that circuit module installing support (7) provided is big more, can satisfy different specification circuit module's (8) installation demand. Meanwhile, as the mounting holes are reserved on the supporting plate (6), if a new device is provided, the device can be mounted through the reserved hole positions, and the mounting space is saved.

The whole device is arranged on a mounting seat (10) through a support column (9). The entire device can be further stabilized by the mounting (10).

The sensor module (3) and the circuit module (8) mentioned in the embodiment are common in the prior art. The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.

Claims (8)

1. A gas analyzer is characterized in that: contain thermos cup (1) and heat preservation cup cover (2), be provided with sensor module (3) in heat preservation cup cover (2), heat preservation cup cover (2) cooperatees with thermos cup (1) and forms the enclosure space.

2. A gas analyzer in accordance with claim 1, wherein: comprises a heat insulation plate (5) and a support plate (6), wherein the heat insulation cup cover (2) is arranged above the heat insulation plate (5); the supporting plate (6) is arranged below the heat insulation plate (5); a circuit module mounting bracket (7) is arranged below the supporting plate (6); the circuit module mounting bracket (7) is provided with a circuit module (8).

3. A gas analyzer in accordance with claim 2, wherein: a support post (9) is arranged below the support plate (6).

4. A gas analyzer in accordance with claim 3, wherein: and a mounting seat (10) is arranged below the strut (9).

5. A gas analyzer in accordance with claim 2, wherein: and the supporting plate (6) and the heat insulation plate (5) are provided with corresponding mounting holes and through holes.

6. A gas analyzer in accordance with claim 1, wherein: a sensor module mounting frame (4) is arranged in the heat-preservation cup cover (2), and the sensor module (3) is arranged on the sensor module mounting frame (4).

7. A gas analyzer in accordance with claim 1, wherein: the inner wall of the vacuum cup (1) is bonded with heat insulation cotton.

8. A gas analyzer in accordance with claim 1, wherein: the bottom surface of the heat-preservation cup cover (2) is attached with a polytetrafluoroethylene heat insulation sheet.

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