CN216868397U

CN216868397U - LED illumination packaging structure with good heat dissipation effect

Info

Publication number: CN216868397U
Application number: CN202220077897.8U
Authority: CN
Inventors: 夏拥军; 汤建锋
Original assignee: JIANGSU YAMING LIGHTING CO Ltd
Current assignee: JIANGSU YAMING LIGHTING CO Ltd
Priority date: 2022-01-13
Filing date: 2022-01-13
Publication date: 2022-07-01
Anticipated expiration: 2032-01-13

Abstract

The utility model discloses an LED lighting packaging structure with a good heat dissipation effect, which comprises a conduction pillar, wherein the top of the conduction pillar is fixedly connected with a solder pillar, the top of the solder pillar is fixedly provided with a light-emitting chip, the outer surface of one side of the conduction pillar is fixedly connected with a connecting disc, the top of the connecting disc is provided with a mounting groove, the inside of the mounting groove is fixedly provided with a transparent cover, one side of the bottom of the connecting disc is fixedly provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a heat dissipation base, the top surface of the heat dissipation base is provided with a groove, the inner bottom surface of the groove is fixedly provided with a heat dissipation fan, and the outer surface walls of two sides of the heat dissipation base are respectively provided with a plurality of heat dissipation holes. The utility model solves the problem that the internal temperature of the LED illumination packaging structure is difficult to reduce again because the existing LED illumination packaging structure only depends on conduction for heat dissipation.

Description

LED illumination packaging structure with good heat dissipation effect

Technical Field

The utility model relates to the technical field of LED lighting packaging, in particular to an LED lighting packaging structure with a good heat dissipation effect.

Background

LED (semiconductor light emitting diode) encapsulation is the encapsulation of luminous chip, compares the integrated circuit encapsulation and has great difference, and LED's encapsulation not only requires to protect the wick, but also can the printing opacity, and generally speaking, the function of encapsulation lies in providing the sufficient protection of chip, prevents that the chip from exposing for a long time in the air or mechanical damage and losing efficacy to improve the stability of chip, good encapsulation can let LED possess better luminous efficiency and radiating environment, and then promote LED's life-span.

However, in the current social life, when the conventional LED lighting package structure provides better light emitting efficiency and heat dissipation environment for the LED, the design is often performed on heat dissipation conduction, however, the internal temperature of the LED lighting package structure is difficult to reduce again only by conduction, so we need an LED lighting package structure with good heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides the LED lighting packaging structure with good heat dissipation effect, and solves the problem that the internal temperature of the LED lighting packaging structure is difficult to reduce because the existing LED lighting packaging structure only relies on conduction for heat dissipation.

In order to achieve the purpose, the utility model is realized by the following technical scheme: the utility model provides a LED illumination packaging structure that radiating effect is good, includes the biography guide pillar, the top fixedly connected with solder post of biography guide pillar, the top of solder post has set firmly luminous chip, the outer fixed surface in one side of biography guide pillar is connected with the connection pad, the mounting groove has been seted up at the top of connection pad, the inside fixed mounting of mounting groove has the translucent cover, bottom one side of connection pad has set firmly heat dissipation mechanism.

Preferably, the heat dissipation mechanism comprises a heat dissipation base, a groove is formed in the top surface of the heat dissipation base, a heat dissipation fan is fixedly mounted on the inner bottom surface of the groove, and a plurality of heat dissipation holes are formed in the outer surface walls of the two sides of the heat dissipation base.

Preferably, the equal fixedly connected with connecting block in bottom surface both sides of connection pad, two the spacing groove has all been seted up to one side exterior wall of connecting block, logical groove, two have all been seted up to the both sides exterior wall of heat dissipation base the equal sliding connection in inside that leads to the groove has the limiting plate, and the one end of limiting plate slides and runs through to the inside of recess.

Preferably, the inside surface wall in the both sides that lead to the groove has all seted up the spout, two equal sliding connection in inside of spout has the slider, and one end of slider and one side outward appearance wall fixed connection of limiting plate.

Preferably, the limiting plate is kept away from the one end fixedly connected with fixed plate of heat dissipation base, the fixed plate is close to a side outward appearance wall fixedly connected with a plurality of reset spring of heat dissipation base, and reset spring's one end and a side outward appearance wall fixed connection of heat dissipation base.

Preferably, a silica gel layer is fixedly arranged at the top of the solder column, and fluorescent powder is filled between the silica gel layer and the light-emitting chip.

Advantageous effects

The utility model provides an LED lighting packaging structure with a good heat dissipation effect. Compared with the prior art, the method has the following beneficial effects:

(1) this LED illumination packaging structure that radiating effect is good, when LED lamps and lanterns normal use, the translucent cover can prevent that external debris from contacting with luminous chip, protect luminous chip, make LED illumination packaging structure possess the function to luminous chip protection, when LED lamps and lanterns are when producing the heat, can outwards transmit the heat that produces to heat dissipation mechanism through the conduction post, radiator fan in the heat dissipation mechanism starts this moment, can cool down to the surface of conduction post, radiator fan is when cooling down to the conduction post, can also exchange with the outside air through the louvre, make the radiating effect better, it only relies on the conduction to dispel the heat to have solved current LED illumination packaging structure, the problem that LED illumination packaging structure's inside temperature is difficult to reduce again.

(2) This LED illumination packaging structure that radiating effect is good, when needs carry out the dismouting to heat dissipation mechanism and LED lamps and lanterns and change, can be through fixed plate pulling limiting plate, reset spring is tensile this moment, make the limiting plate break away from the spacing groove, the connecting block can break away from heat dissipation mechanism's recess, after the recess of heat dissipation mechanism is put into to new connecting block, loosen the fixed plate, reset spring resets, and drive the limiting plate motion, the slider can prevent that the limiting plate from taking place the skew when being driven by reset spring with the cooperation of spout, make the limiting plate can insert into the spacing groove again, accomplish the fixing to the connecting block, the dismouting of heat dissipation mechanism and LED lamps and lanterns is changed has been made things convenient for.

Drawings

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

fig. 3 is an enlarged view of a portion of a structure in fig. 1.

In the figure: 1-conducting post, 2-heat dissipation mechanism, 3-connecting block, 11-solder post, 12-light emitting chip, 13-connecting disc, 14-transparent cover, 15-fluorescent powder, 16-silica gel layer, 21-heat dissipation base, 22-heat dissipation fan, 23-heat dissipation hole, 31-limiting groove, 32-through groove, 33-limiting plate, 34-fixing plate, 35-reset spring, 131-mounting groove, 211-groove, 321-sliding groove and 322-sliding block.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an LED lighting packaging structure with good heat dissipation effect comprises a conduction post 1, the conduction post 1 can transfer heat, a solder post 11 is fixedly connected to the top of the conduction post 1, a light-emitting chip 12 is fixedly arranged on the top of the solder post 11, a connecting disc 13 is fixedly connected to the outer surface of one side of the conduction post 1, a mounting groove 131 is formed in the top of the connecting disc 13, a transparent cover 14 is fixedly mounted inside the mounting groove 131, the transparent cover 14 can provide a protection effect for the light-emitting chip 12 while not affecting LED lighting, a heat dissipation mechanism 2 is fixedly arranged on one side of the bottom of the connecting disc 13, the heat dissipation mechanism 2 can enhance the heat dissipation effect of the LED lighting packaging structure, the heat dissipation mechanism 2 comprises a heat dissipation base 21, a groove 211 is formed in the top surface of the heat dissipation base 21, a heat dissipation fan 22 is fixedly mounted on the bottom surface of the groove 211, and the heat dissipation fan 22 can cool the surface of the conduction post 1, the outer surface walls of the two sides of the heat dissipation base 21 are respectively provided with a plurality of heat dissipation holes 23, and the heat dissipation holes 23 facilitate the exchange between the outside air and the air inside the heat dissipation mechanism 2.

The two sides of the bottom surface of the connecting disc 13 are both fixedly connected with the connecting blocks 3, one side outer surface wall of each of the two connecting blocks 3 is provided with a limiting groove 31, two side outer surface walls of the heat dissipation base 21 are both provided with through grooves 32, the insides of the two through grooves 32 are both slidably connected with limiting plates 33, one end of each limiting plate 33 slidably penetrates into the inside of the corresponding groove 211, the size of each limiting plate 33 is matched with that of each through groove 32, two side inner surface walls of each through groove 32 are both provided with sliding grooves 321, the insides of the two sliding grooves 321 are both slidably connected with sliding blocks 322, one end of each sliding block 322 is fixedly connected with one side outer surface wall of each limiting plate 33, the size of each sliding block 322 is matched with that of each sliding groove 321, one end of each limiting plate 33 far away from the heat dissipation base 21 is fixedly connected with a fixing plate 34, one side outer surface wall of each fixing plate 34 close to the heat dissipation base 21 is fixedly connected with a plurality of reset springs 35, and one end of each reset spring 35 is fixedly connected with one side outer surface wall of the heat dissipation base 21, the elastic coefficient of the return spring 35 is determined according to actual conditions, the return spring 35 can be replaced, and the limiting plate 33 can be prevented from being deviated when driven by the return spring 35 through the matching of the sliding block 322 and the sliding groove 321.

The top of the solder column 11 is fixedly provided with a silica gel layer 16, fluorescent powder 15 is filled between the silica gel layer 16 and the light emitting chip 12, the silica gel layer 16 and the fluorescent powder 15 can improve the illumination effect of the light emitting chip 12, and the contents not described in detail in the present specification belong to the prior art known by those skilled in the art.

During the use, when LED lamps and lanterns normally use, translucent cover 14 can prevent that external debris from contacting with luminescent chip 12, protect luminescent chip 12, make LED illumination packaging structure possess the function to luminescent chip 12 protection, when LED lamps and lanterns are producing heat, can outwards transmit the heat that produces to heat dissipation mechanism 2 through biography guide pillar 1, radiator fan 22 in the heat dissipation mechanism 2 starts this moment, can cool down to the surface of guide pillar 1, radiator fan 22 is when cooling down to guide pillar 1, can also exchange with the outside air through louvre 23, make the radiating effect better, solved current LED illumination packaging structure and only relied on the conduction to dispel the heat, LED illumination packaging structure's inside temperature is difficult to the problem that reduces again.

When needs carry out the dismouting change to heat dissipation mechanism 2 and LED lamps and lanterns, can stimulate limiting plate 33 through fixed plate 34, reset spring 35 is tensile this moment, make limiting plate 33 break away from limiting groove 31, connecting block 3 can break away from in heat dissipation mechanism 2's the recess 211, after new connecting block 3 put into heat dissipation mechanism 2's recess 211, loosen fixed plate 34, reset spring 35 resets, and drive the motion of limiting plate 33, slider 322 can prevent that limiting plate 33 from taking place the skew when being driven by reset spring 35 with the cooperation of spout 321, make limiting plate 33 can insert into limiting groove 31 again, accomplish the fixed to connecting block 3, the dismouting change of heat dissipation mechanism 2 and LED lamps and lanterns has been made things convenient for.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a LED illumination packaging structure that radiating effect is good, includes and passes guide pillar (1), its characterized in that: the light-emitting diode is characterized in that a solder column (11) is fixedly connected to the top of the guide column (1), a light-emitting chip (12) is fixedly arranged on the top of the solder column (11), a connecting disc (13) is fixedly connected to the outer surface of one side of the guide column (1), a mounting groove (131) is formed in the top of the connecting disc (13), a transparent cover (14) is fixedly arranged inside the mounting groove (131), and a heat dissipation mechanism (2) is fixedly arranged on one side of the bottom of the connecting disc (13).

2. The LED lighting package structure with good heat dissipation effect according to claim 1, wherein: the heat dissipation mechanism (2) comprises a heat dissipation base (21), a groove (211) is formed in the top surface of the heat dissipation base (21), a heat dissipation fan (22) is fixedly mounted on the bottom surface of the inner portion of the groove (211), and a plurality of heat dissipation holes (23) are formed in the outer surface walls of the two sides of the heat dissipation base (21).

3. The LED lighting package structure with good heat dissipation effect according to claim 2, wherein: the equal fixedly connected with connecting block (3) in bottom surface both sides of connection pad (13), two spacing groove (31) have all been seted up to the outside surface wall in one side of connecting block (3), logical groove (32), two have all been seted up to the outside surface wall in both sides of heat dissipation base (21) the equal sliding connection in inside that leads to groove (32) has limiting plate (33), and the one end of limiting plate (33) slides and runs through to the inside of recess (211).

4. The LED lighting package structure with good heat dissipation effect according to claim 3, wherein: spout (321) have all been seted up, two to the interior table wall in both sides that lead to groove (32 the equal sliding connection in inside of spout (321) has slider (322), and the outward appearance wall fixed connection of one side of the one end of slider (322) and limiting plate (33).

5. The LED lighting package structure with good heat dissipation effect according to claim 3, wherein: the one end fixedly connected with fixed plate (34) of heat dissipation base (21) is kept away from to limiting plate (33), fixed plate (34) are close to one side outward appearance wall fixedly connected with a plurality of reset spring (35) of heat dissipation base (21), and one end of reset spring (35) and one side outward appearance wall fixed connection of heat dissipation base (21).

6. The LED lighting package structure with good heat dissipation effect according to claim 1, wherein: the top of the solder column (11) is fixedly provided with a silica gel layer (16), and fluorescent powder (15) is filled between the silica gel layer (16) and the light-emitting chip (12).