CN216852908U - Heat exchange system - Google Patents

Abstract

The application discloses heat exchange system, which comprises a compressor, heat exchanger and throttle subassembly, the heat exchanger includes the microchannel heat exchanger, the microchannel heat exchanger includes first collector and second collector, first collector includes the import pipe, the microchannel heat exchanger includes a plurality of heat exchange tubes, the heat exchange tube is the microchannel flat pipe, still include automatically controlled subassembly, automatically controlled subassembly includes frequency conversion controller and radiating piece, the orthographic projection of radiating piece on the first plane coincides with the orthographic projection of partial first flat pipe group on the first plane, the orthographic projection of at least partial radiating piece on the first plane does not coincide with the orthographic projection of first flat pipe zone territory on the first plane. This application heat transfer system can improve the radiating effect of radiating piece on the inverter controller, is favorable to promoting system's performance.

Description

Heat exchange system

Technical Field

The application relates to the technical field of air conditioners, in particular to a heat exchange system.

Background

The existing air conditioning system comprises a compressor, a heat exchange component, a throttling component and a controller component. The variable frequency controller in the controller component is used for carrying out logic control on an air conditioning system, the general variable frequency controller is transversely or vertically arranged in a machine case of an air conditioning unit and is close to a condenser in the heat exchange component, the temperature of the variable frequency controller is controlled, the reliability and the safety of the variable frequency controller are critical, and a heat dissipation piece is usually connected to the variable frequency controller to carry out heat dissipation treatment on the variable frequency controller.

In the prior art, the inlet position of the high-temperature refrigerant of the condenser is close to the heat dissipation part of the frequency conversion controller, and air firstly passes through the inlet area of the high-temperature condenser and then blows over the heat dissipation part of the frequency conversion controller, so that the heat dissipation effect of the heat dissipation part is poor.

SUMMERY OF THE UTILITY MODEL

In view of above-mentioned problem, the application provides a heat transfer system, can improve the radiating effect of radiating piece on the variable frequency controller, is favorable to promoting system's performance.

The application provides a heat exchange system, which comprises a compressor, a heat exchanger and a throttling assembly, wherein the heat exchanger comprises a first collecting pipe and a second collecting pipe, the first collecting pipe comprises an inlet pipe, the heat exchanger comprises a plurality of heat exchange pipes, the heat exchange pipes are arranged at intervals in the length direction of the first collecting pipe, the heat exchange pipes are directly or indirectly connected with the second collecting pipe, and the micro-channel flat pipes are communicated with the first collecting pipe and the second collecting pipe;

the heat exchanger comprises fins, at least part of the fins are arranged between the two heat exchange tubes, the two heat exchange tubes are adjacently arranged in the length direction of the first header, and the fins are directly or indirectly connected with the heat exchange tubes;

the heat exchange tubes comprise at least two heat exchange tube sets, namely a first heat exchange tube set and a second heat exchange tube set, and each heat exchange tube set comprises at least two heat exchange tubes; the heat exchange system also comprises a refrigerant, the refrigerant exchanges heat in the heat exchanger, when the heat exchanger works, the refrigerant enters the heat exchanger through the inlet pipe, flows through the first header pipe, enters the heat exchange pipe of the first heat exchange pipe set, enters the heat exchange pipe of the second heat exchange pipe set through the second header pipe, flows to the first header pipe, and in the same heat exchange pipe set, the flowing directions of the refrigerant during the work are the same;

the cooling device is characterized by further comprising an electric control assembly, wherein the electric control assembly comprises a variable frequency controller and a radiating piece, the radiating piece is used for cooling the variable frequency controller, and the variable frequency controller is directly or indirectly connected with the radiating piece;

the heat exchanger comprises a first heat exchange tube group, a first heat exchange tube region, a heat sink and a second heat exchange tube region, wherein the first heat exchange tube group is arranged in the heat exchanger region, the heat sink is arranged in the heat exchanger region, the heat exchanger region is arranged in the heat exchanger region, the heat sink is arranged in the heat exchanger region, and the heat sink is arranged in the heat exchanger region.

In the technical scheme of this application embodiment, through deviating from in first heat exchange tube region at least part of radiating piece, it is regional to deviate the high temperature high pressure refrigerant heat transfer that the heat exchanger import came to increased the radiating heat transfer difference in temperature of variable frequency controller, strengthened the radiating effect of radiating piece, can effectively reduce variable frequency controller temperature, do not trigger the logical upper limit of system, help promoting compressor frequency under the high temperature operating mode, and then be favorable to promoting the refrigerating capacity index of air conditioner under the high temperature operating mode.

In some embodiments, the heat exchanger includes a microchannel heat exchanger, the heat exchange tube of the microchannel heat exchanger includes microchannel flat tubes, the microchannel flat tubes include a first flat tube group and a second flat tube group, the microchannel heat exchanger region including the first flat tube group and fins connected to flat tubes of the first flat tube group is a first flat tube region, an orthographic projection of the heat dissipation member on the first plane coincides with an orthographic projection of a part of the microchannel heat exchanger on the first plane, and an orthographic projection of at least a part of the heat dissipation member on the first plane does not coincide with an orthographic projection of the first flat tube region on the first plane.

In some embodiments, when the microchannel heat exchanger is in operation, air flows across the surface of the microchannel heat exchanger to exchange heat with the microchannel heat exchanger, and at least a portion of the air flows sequentially through the microchannel heat exchanger and the heat sink. The heat exchange air after exchanging heat with the micro-channel heat exchanger passes through the surface of the heat dissipation part to exchange heat with the heat dissipation part, and the heat on the surface of the heat dissipation part is taken away.

In some embodiments, the first flat tube group is located below the second flat tube group in the gravity direction, the refrigerant flows through the first flat tube group and the second flat tube group in sequence, the first flat tube group comprises n micro-channel flat tubes, the second flat tube group comprises m micro-channel flat tubes, and n > m. The inlet pipe is arranged below the micro-channel heat exchanger, so that heat dissipation of the heat dissipation piece is facilitated.

In some embodiments, the heat exchange system comprises a tank body, and the minimum vertical distance from the first flat tube region to the bottom of the tank body in the gravity direction is smaller than the minimum vertical distance from the heat radiating element to the bottom of the tank body. That is, the heat dissipation member is located above the first flat tube region, and is arranged closer to the outlet tube of the microchannel heat exchanger relative to the inlet tube of the microchannel heat exchanger.

In some embodiments, the microchannel heat exchanger comprises a kth flat tube group, K >2, the kth flat tube group being located above the first flat tube group in the direction of gravity, an orthographic projection of a portion of the heat sink on the first plane coinciding with an orthographic projection of the kth flat tube group on the first plane, and/or a portion of the air flowing sequentially through the kth flat tube group and the heat sink. Thereby reducing the temperature of the air flowing over the heat sink.

In some embodiments, the microchannel heat exchanger includes a kth flat tube group, K >2, the second header includes an outlet tube, the kth flat tube group is communicated with the outlet tube through the second header, the microchannel heat exchanger region where the kth flat tube group and a fin located between two microchannel flat tubes of the kth flat tube group are located is defined as a kth flat tube region, and an orthographic projection of the heat dissipation element on the first plane coincides with an orthographic projection of a part of the kth flat tube region on the first plane. Because the flat tub of district of K is the outlet pipe region, after the heat exchange with the air, the refrigerant is lower in the temperature of outlet pipe department, and the air flows through in proper order the flat tub of district of K with the radiating piece to be favorable to having increased the radiating heat transfer difference in temperature of variable frequency controller, strengthened the radiating effect of radiating piece.

In some embodiments, an orthographic projection of the second manifold on the first plane is closer to an orthographic projection of the heat sink on the first plane than an orthographic projection of the first manifold on the first plane. Thereby making the heat sink closer to the outlet tube of the microchannel heat exchanger, the heat dissipation effect of the heat sink can be improved.

In some embodiments, the microchannel heat exchanger includes a kth flat tube group, where K >2, the first header includes an outlet tube, the kth flat tube group is communicated with the outlet tube through the first header, the microchannel heat exchanger region where the kth flat tube group and a fin located between two microchannel flat tubes of the kth flat tube group are located is defined as a kth flat tube region, and an orthographic projection of the heat dissipation element on the first plane coincides with an orthographic projection of a part of the kth flat tube region on the first plane. Because the K-th flat tube region is the region where the outlet tube is located, after heat exchange with air is carried out, the temperature of the refrigerant at the outlet tube is lower, and the air sequentially flows through the K-th flat tube region and the heat dissipation piece, so that the heat transfer temperature difference of heat dissipation of the frequency conversion controller is increased, and the heat dissipation effect of the heat dissipation piece is enhanced.

In some embodiments, an orthographic projection of the first manifold on the first plane is closer to an orthographic projection of the heat sink on the first plane than an orthographic projection of the second manifold on the first plane. Therefore, the heat dissipation piece is closer to the outlet pipe of the micro-channel heat exchanger and is close to the low-temperature refrigerant heat exchange area connected with the outlet pipe of the heat exchange pipe, the temperature of the heat dissipation piece can be further reduced, and the heat dissipation effect of the heat dissipation piece is improved.

In some embodiments, K flat tube groups are arranged in sequence along the length direction of the first header, and the K flat tube group is located above the K-1 flat tube group in the gravity direction, and the K flat tube group is located above the first flat tube group. With the import pipe setting in the lower extreme, the outlet pipe setting is in the highest place to need not to change the position of radiating piece, can set up the region that the radiating piece corresponds at the outlet pipe, reduced the transformation degree of difficulty, saved and reformed transform the time.

The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.

Drawings

Various additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Moreover, like reference numerals are used to refer to like elements throughout. In the drawings:

FIG. 1 is a schematic diagram of a heat exchange system according to an embodiment provided herein;

FIG. 2 is a schematic assembly view of a microchannel heat exchanger and heat sink of an embodiment provided herein;

FIG. 3 is a schematic view of another angled microchannel heat exchanger and heat sink assembly of an embodiment provided herein;

FIG. 4 is a schematic diagram of a circuit of a refrigerant in a microchannel heat exchanger according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of another circuit of a refrigerant in a microchannel heat exchanger according to an embodiment of the present disclosure;

FIG. 6 is a top view of a microchannel heat exchanger and heat sink in an assembled state according to embodiments provided herein;

fig. 7 is a schematic view showing an assembled state of a microchannel heat exchanger in the prior art.

In the drawings, the drawings are not necessarily drawn to scale.

The reference numbers in the detailed description are as follows:

1-microchannel heat exchanger, 2-first header, 3-second header, 4-microchannel flat tube, 5-inlet tube, 6-outlet tube, 7-variable frequency controller, 8-heat dissipation piece, 9-first plane, 10-compressor, 11-first heat exchanger, 12-second heat exchanger and 13-throttling component.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are merely used to more clearly illustrate the technical solutions of the present application, and therefore are only examples, and the protection scope of the present application is not limited thereby.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the technical terms "first", "second", and the like are used only for distinguishing different objects, and are not to be construed as indicating or implying relative importance or implicitly indicating the number, specific order, or primary-secondary relationship of the technical features indicated. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

In the description of the embodiments of the present application, the term "and/or" is only one kind of association relationship describing an associated object, and means that three relationships may exist, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

In the description of the embodiments of the present application, the term "plurality" refers to two or more (including two), and similarly, "plural sets" refers to two or more (including two), and "plural pieces" refers to two or more (including two).

In the description of the embodiments of the present application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the directions or positional relationships indicated in the drawings, and are only for convenience of description of the embodiments of the present application and for simplicity of description, but do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the embodiments of the present application.

In the description of the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are used in a broad sense, and for example, may be fixedly connected, detachably connected, or integrated; mechanical connection or electrical connection is also possible; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The air conditioning system generally comprises basic components such as a condenser, an evaporator, a compressor, a throttling assembly and the like, wherein the basic components are sequentially connected through a pipeline to form a closed system, and a refrigerant circularly flows in the closed system and changes state, so that heat exchange is carried out between the refrigerant and the outside, and the refrigerating effect is achieved.

Among the basic components included in an air conditioning system, the condenser and the evaporator are basic heat exchange components, and the structures thereof are basically the same and are collectively called as a heat exchanger.

The inverter air-conditioning system is also internally provided with an inverter controller 7 for carrying out logic control on the air-conditioning system, the inverter controller 7 is usually arranged close to a condenser in a refrigeration system component, and a heat dissipation piece 8 is connected to the inverter controller 7 for carrying out heat dissipation treatment on the inverter controller 7.

Generally speaking, the condenser adopts a form that air enters from the upper part and liquid exits from the lower part, the inlet position of the high-temperature refrigerant is close to the heat dissipation part 8 on the frequency conversion controller 7, and air firstly passes through the inlet area of the high-temperature condenser and then blows through the heat dissipation part 8 of the frequency conversion controller 7, so that the heat dissipation temperature difference of the heat dissipation part 8 is small, and the heat dissipation effect is poor. The temperature parameter of the variable frequency controller 7 is an important parameter in the control logic of the air conditioning system, and under outdoor high ambient temperature, the heat dissipation of the heat dissipation part 8 on the variable frequency controller 7 is limited, so that the frequency of the compressor 10 of the whole system cannot be increased or reduced after the temperature of the variable frequency controller 7 in the variable frequency control logic reaches the upper limit of the control parameter, and the performance of the system is affected.

Therefore, the inventor of the present application proposes that at least part of the heat dissipation member 8 deviates from the first flat tube region close to the refrigerant inlet, so as to improve the heat dissipation effect of the heat dissipation member 8 on the frequency conversion controller 7, and to facilitate the improvement of the system performance.

The application provides a heat exchange system, including compressor 10, microchannel heat exchanger 1 and throttle subassembly 13.

In some embodiments, as shown in fig. 1, a heat exchange system includes a compressor 10, a first heat exchanger 11, a second heat exchanger 12, and a throttling assembly 13, where the compressor 10 includes a first opening and a second opening, the first heat exchanger 12 includes a first opening and a second opening, the throttling assembly 13 includes a first opening and a second opening, the first opening of the first heat exchanger 11 communicates with the first opening of the compressor 10, the second opening of the first heat exchanger 11 communicates with the first opening of the throttling assembly 13, the second opening of the throttling assembly 13 communicates with the first opening of the second heat exchanger 12, the second opening of the second heat exchanger 12 communicates with the second opening of the compressor 10, the heat exchange system is filled with a refrigerant during a cooling condition, the first heat exchanger 11 is an outdoor heat exchanger as a condenser, the second heat exchanger 12 is an indoor heat exchanger as an evaporator, and the first heat exchanger 11 and/or the second heat exchanger 12 may be the microchannel heat exchanger 1 provided by the present application.

Referring to fig. 2 to 6, the microchannel heat exchanger 1 includes a first header 2 and a second header 3, the first header 2 and the second header 3 being substantially parallel and spaced apart by a predetermined distance, the first header 2 including an inlet pipe 5, and the inlet pipe 5 may have various forms and sizes.

The micro-channel heat exchanger 1 further comprises a plurality of heat exchange tubes, the heat exchange tubes are micro-channel flat tubes 4, the micro-channel flat tubes 4 are arranged in the length direction of the first collecting tube 2 at intervals, one ends of the micro-channel flat tubes 4 are directly or indirectly connected with the first collecting tube 2, the other ends of the micro-channel flat tubes 4 are directly or indirectly connected with the second collecting tube 3, in some embodiments, a plurality of flat tube slots are formed in the first collecting tube 2, flat tube slots corresponding to the number and the positions of the flat tube slots in the first collecting tube 2 are formed in the second collecting tube 3, and two ends of the micro-channel flat tubes 4 are inserted into the flat tube slots to communicate the first collecting tube 2 and the second collecting tube 3.

The micro-channel heat exchanger 1 further comprises fins, at least part of the fins are arranged between the two micro-channel flat tubes 4, the two micro-channel flat tubes 4 are adjacently arranged in the length direction of the first collecting pipe 2, and the fins are directly or indirectly connected with the micro-channel flat tubes 4.

The micro-channel flat tube 4 comprises at least two flat tube groups, namely a first flat tube group and a second flat tube group, thereby dividing the loop of the refrigerant into two loops to increase the flow velocity of the refrigerant and improve the heat exchange performance of the microchannel heat exchanger 1, each flat tube group comprises at least two microchannel flat tubes 4, the refrigerant exchanges heat in the microchannel heat exchanger 1, a plurality of clapboards are arranged in the first collecting tube 2 and the second collecting tube 3 to divide the interior of the first collecting tube 2 and the second collecting tube 3 into a plurality of independent cavities, i.e., the microchannel heat exchanger 1 is used as a condenser, a gaseous refrigerant enters the microchannel heat exchanger 1 through the inlet pipe 5, passes through the first header 2, enters the micro-channel flat tubes 4 of the first flat tube group, enters the micro-channel flat tubes 4 of the second flat tube group through the second collecting tube 3, flows to the first collecting tube 2, and in one flat tube group, the flowing direction of the refrigerant is the same when the refrigerant works. Therefore, the refrigerant loop of the micro-channel heat exchanger 1 is divided into two loops, the refrigerant flow is lengthened, the heat exchange is sufficient, the flow speed is accelerated, and the heat exchange performance is improved. The heat exchange performance of the micro-channel heat exchanger 1 as a condenser is improved.

The heat exchange system further comprises an electric control assembly, the electric control assembly comprises a variable frequency controller 7 and a radiating piece 8, the variable frequency controller 7 is used for carrying out logic control on the air conditioning system, the radiating piece 8 is used for cooling the variable frequency controller 7, and the variable frequency controller 7 and the radiating piece 8 are directly or indirectly connected.

Taking the example shown in fig. 2, the X-axis direction defining the three-dimensional coordinate system points to the right, the Y-axis direction points to the upper side, and the Z-axis direction points to the outside of the XY-plane.

In some embodiments, the micro-channel flat tubes 4 are in a shape of a long strip, an L shape, or more, for facilitating understanding of the concept of the present application, the micro-channel flat tubes 4 discussed below all use the long strip-shaped micro-channel flat tubes 4, the length direction of the micro-channel flat tubes 4 is the X-axis direction, the height direction thereof is the Y-axis direction, and the width direction thereof is the Z-axis direction. When the conception of the invention is applied to the micro-channel flat tubes 4 with other shapes, the technical effect to be achieved by the application can be achieved by making adaptive changes without creative mental labor.

Referring to fig. 2, the present application defines a plane perpendicular to the width direction of the microchannel flat tubes 4 as a first plane 9, the first plane 9 is parallel to the XY plane, a region of the microchannel heat exchanger 1 where the first flat tube group and the fins located between the two microchannel flat tubes 4 of the first flat tube group are located is a first flat tube region, an orthographic projection of the heat sink 8 on the first plane 9 coincides with an orthographic projection of a part of the microchannel heat exchanger 1 on the first plane 9, that is, the projection of the heat sink 8 is completely covered by the projection of the microchannel heat exchanger 1, air blown over the heat sink 8 first blows over the surface of the microchannel heat exchanger 1, but unlike the prior art, an orthographic projection of at least a part of the heat sink 8 on the first plane 9 coincides with an orthographic projection of the first flat tube region on the first plane 9, that is, the heat sink 8 is not completely located behind the airflow direction of the first flat tube region, this is also because being equipped with import pipe 5 on the first flat tube region, when microchannel heat exchanger 1 that this application provided used as the condenser, from the entering of import pipe 5 for high temperature steam, the temperature that leads to first flat tube region is higher, can heat the regional air of first flat tube of flowing through to the heat dissipation difference that leads to radiating piece 8 is little, and the radiating effect is poor.

This application is through deviating from in first flat tub of region at least part of heat dissipation piece 8 to increased the radiating heat transfer difference in temperature of variable frequency controller 7, strengthened the radiating effect of heat dissipation piece 8, can effectively reduce 7 temperature of variable frequency controller and not trigger the logical upper limit of system, effectively promote compressor 10 frequencies under the high temperature operating mode, and then promote the refrigerating capacity index of air conditioner under the high temperature operating mode.

According to some embodiments of the application, optionally, when the microchannel heat exchanger 1 works, air flows through the surface of the microchannel heat exchanger 1 to exchange heat with the microchannel heat exchanger 1, at least part of the air flows through the microchannel heat exchanger 1 and the heat dissipation member 8 in sequence, and heat exchange air after exchanging heat with the microchannel heat exchanger 1 passes through the surface of the heat dissipation member 8 to exchange heat with the heat dissipation member 8, so that heat on the surface of the heat dissipation member 8 is taken away.

For reducing the temperature of this heat transfer air, can move the position of radiating piece 8, avoid the import regional setting of microchannel heat exchanger 1 with radiating piece 8, perhaps change the position with import pipe 5 of microchannel heat exchanger 1 to with the regional skew radiating piece 8 of first flat pipe, also can play the same effect, after considering comprehensively that installation space and transformation complexity are in, this application is preferred to be adopted the technical scheme with import pipe 5 change position of microchannel heat exchanger 1.

According to some embodiments of the present application, optionally, the inlet pipe 5 is disposed below the microchannel heat exchanger 1, that is, in the Y-axis direction, the first flat pipe group is located below the second flat pipe group, the refrigerant flows through the first flat pipe group and the second flat pipe group in sequence, the first flat pipe group includes n microchannel flat pipes 4, the second flat pipe group includes m microchannel flat pipes 4, and n > m. The density of the micro-channel flat tubes 4 in the first flat tube group is higher than that of the second flat tube group, because the micro-channel heat exchanger 1 works as a condenser, the temperature of the refrigerant at the inlet tube 5 is higher, along with the heat exchange of the refrigerant and the outside air, the temperature of the refrigerant is gradually reduced, the temperature of the refrigerant at the outlet tube 6 of the heat exchanger is lowest, because the temperature difference of the heat exchange at the inlet of the heat exchanger is larger, the heat exchange performance requirement is higher, and the micro-channel flat tubes 4 in the region are correspondingly increased.

According to some embodiments of the present application, optionally, the heat exchange system comprises a box for housing the microchannel heat exchanger 1, in the direction of gravity (Y-axis direction), the minimum vertical distance from the first flat tube region to the bottom of the box is smaller than the minimum vertical distance from the heat sink 8 to the bottom of the box, i.e. the heat sink 8 is located above the first flat tube region, and the heat sink 8 is located closer to the outlet tube 6 of the microchannel heat exchanger 1 than to the inlet tube 5 of the microchannel heat exchanger 1.

According to some embodiments of the present application, optionally, the circuit inside the microchannel heat exchanger 1 is divided into a plurality of circuits, in particular, the microchannel heat exchanger 1 comprises a kth flat tube group, K >2, in the direction of gravity, the kth flat tube group being located above the first flat tube group, the kth flat tube group being closer to the outlet tube 6 of the microchannel heat exchanger 1, or the outlet tube 6 of the microchannel heat exchanger 1 is arranged on the first header 2 or the second header 3 at a location corresponding to the kth flat tube group, an orthographic projection of a part of the heat sink 8 on the first plane 9 coincides with an orthographic projection of the kth flat tube group on the first plane 9, at least a part of the heat sink 8 is arranged closer to the outlet tube 6 of the microchannel heat exchanger 1, and/or a part of the air flows through the kth flat tube group and the heat sink in sequence, thereby reducing the temperature of the air flowing through the heat sink.

Referring to fig. 4, when K is an even number, the outlet pipe 6 and the inlet pipe 5 are on the first header 2; referring to fig. 5, when K is an odd number, the outlet pipe 6 is on the second header 3, so that the microchannel heat exchanger 1 can be conveniently selected according to a specific application, and installation is easier and more convenient.

According to some embodiments of the present application, optionally, when K is an odd number, the second header 3 includes an outlet pipe 6, the kth flat pipe group is communicated with the outlet pipe 6 via the second header 3, a region of the microchannel heat exchanger 1 where the kth flat pipe group and the fin located between two microchannel flat pipes 4 of the kth flat pipe group are located is defined as a kth flat pipe region, an orthographic projection of the heat sink 8 on the first plane 9 coincides with an orthographic projection of a part of the kth flat pipe region on the first plane 9, so that the radiator element 8 falls completely within the kth flat tube region, which, because of the outlet tube 6, after having undergone heat exchange with air, the refrigerant is at a lower temperature at the outlet pipe 6, the air flows through the kth flat pipe region and the radiator element 8 in sequence, thereby increasing the heat transfer temperature difference of the frequency conversion controller 7 and strengthening the heat dissipation effect of the heat dissipation piece 8.

According to some embodiments of the present application, optionally, the orthographic projection of the second header 3 on the first plane 9 is closer to the orthographic projection of the heat dissipation member 8 on the first plane 9 than the orthographic projection of the first header 2 on the first plane 9, so that the heat dissipation member 8 is closer to the outlet pipe 6 of the microchannel heat exchanger 1, the heat dissipation effect of the heat dissipation member 8 can be improved.

According to some embodiments of the present application, optionally, when K is an even number, the first header 2 includes an outlet pipe 6, the kth flat pipe group is communicated with the outlet pipe 6 through the first header 2, a region of the microchannel heat exchanger 1 where the kth flat pipe group and the fin located between two microchannel flat pipes 4 of the kth flat pipe group are located is defined as a kth flat pipe region, an orthographic projection of the heat sink 8 on the first plane 9 coincides with an orthographic projection of a part of the kth flat pipe region on the first plane 9, so that the radiator element 8 falls completely within the kth flat tube region, which, because of the outlet tube 6, after having undergone heat exchange with air, the refrigerant is at a lower temperature at the outlet pipe 6, the air flows through the kth flat pipe region and the radiator element 8 in sequence, thereby increasing the heat transfer temperature difference of the frequency conversion controller 7 and strengthening the heat dissipation effect of the heat dissipation piece 8.

According to some embodiments of the present application, optionally, the orthographic projection of the first header 2 on the first plane 9 is closer to the orthographic projection of the heat dissipation member 8 on the first plane 9 than the orthographic projection of the second header 3 on the first plane 9, so that the heat dissipation member 8 is closer to the outlet pipe 6 of the microchannel heat exchanger 1, the heat dissipation effect of the heat dissipation member 8 can be improved.

According to some embodiments of the present application, optionally, K flat tube groups are sequentially arranged along the length direction of the first header 2 and/or the second header 3, in the gravity direction, the K flat tube group is located above the K-1 flat tube group, the K flat tube group is located above the first flat tube group, the inlet tube 5 is arranged at the lowest position, and the outlet tube 6 is arranged at the highest position, so that the heat dissipation member 8 can be arranged in the region corresponding to the outlet tube 6 without changing the position of the heat dissipation member 8, the modification difficulty is reduced, and the modification time is saved.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present disclosure, and the present disclosure should be construed as being covered by the claims and the specification. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.

Claims (11)

1. A heat exchange system, which is characterized by comprising a compressor, a heat exchanger and a throttling assembly, wherein the heat exchanger comprises a first collecting pipe and a second collecting pipe, the first collecting pipe comprises an inlet pipe, the heat exchanger comprises a plurality of heat exchange pipes, the heat exchange pipes are arranged at intervals in the length direction of the first collecting pipe, the heat exchange pipes are directly or indirectly connected with the second collecting pipe, and microchannel flat pipes are communicated with the first collecting pipe and the second collecting pipe;

the heat exchanger comprises fins, at least part of the fins are arranged between the two heat exchange tubes, the two heat exchange tubes are adjacently arranged in the length direction of the first header, and the fins are directly or indirectly connected with the heat exchange tubes;

the heat exchange tubes comprise at least two heat exchange tube sets, namely a first heat exchange tube set and a second heat exchange tube set, and each heat exchange tube set comprises at least two heat exchange tubes; the heat exchange system also comprises a refrigerant, the refrigerant exchanges heat in the heat exchanger, when the heat exchanger works, the refrigerant enters the heat exchanger through the inlet pipe, flows through the first header pipe, enters the heat exchange pipe of the first heat exchange pipe set, enters the heat exchange pipe of the second heat exchange pipe set through the second header pipe, flows to the first header pipe, and in the same heat exchange pipe set, the flowing directions of the refrigerant during the work are the same;

the cooling device is characterized by further comprising an electric control assembly, wherein the electric control assembly comprises a variable frequency controller and a radiating piece, the radiating piece is used for cooling the variable frequency controller, and the variable frequency controller is directly or indirectly connected with the radiating piece;

the heat exchanger comprises a first heat exchange tube group, a first heat exchange tube region, a heat sink and a second heat exchange tube region, wherein the first heat exchange tube group is arranged in the heat exchanger region, the heat sink is arranged in the heat exchanger region, the heat exchanger region is arranged in the heat exchanger region, the heat sink is arranged in the heat exchanger region, and the heat sink is arranged in the heat exchanger region.

2. The heat exchange system of claim 1, wherein the heat exchanger comprises a microchannel heat exchanger, the heat exchange tubes of the microchannel heat exchanger comprise the microchannel flat tubes, the microchannel flat tubes comprise a first flat tube bank and a second flat tube bank, the microchannel heat exchanger region comprising the first flat tube bank and the fins connected to the flat tubes of the first flat tube bank is a first flat tube region, an orthographic projection of the heat sink on the first plane coincides with an orthographic projection of a portion of the microchannel heat exchanger on the first plane, and an orthographic projection of at least a portion of the heat sink on the first plane does not coincide with an orthographic projection of the first flat tube region on the first plane.

3. The heat exchange system of claim 2, wherein in operation of the microchannel heat exchanger, air flows across the surface of the microchannel heat exchanger to exchange heat with the microchannel heat exchanger, at least a portion of the air flowing sequentially through the microchannel heat exchanger and the heat sink.

4. The heat exchange system of claim 2 or 3 wherein the first flat tube bank is positioned below the second flat tube bank in the direction of gravity, the refrigerant flowing through the first flat tube bank and the second flat tube bank in sequence, the first flat tube bank comprising n of the microchannel flat tubes, the second flat tube bank comprising m of the microchannel flat tubes, n > m.

5. A heat exchange system according to claim 2 including a housing, the first flat tube region being spaced gravitationally from the bottom of the housing by a minimum vertical distance that is less than the minimum vertical distance of the heat sink from the bottom of the housing.

6. The heat exchange system of claim 2 or 3 wherein the microchannel heat exchanger comprises a Kth flat tube bank, K >2, the Kth flat tube bank being located above the first flat tube bank in the direction of gravity, an orthographic projection of a portion of the heat sink on the first plane coinciding with an orthographic projection of the Kth flat tube bank on the first plane, and/or a portion of the air flowing sequentially through the Kth flat tube bank and the heat sink.

7. The heat exchange system according to claim 2 or 3, wherein the microchannel heat exchanger comprises a K-th flat tube group, K >2, the second header comprises an outlet tube, the K-th flat tube group is communicated with the outlet tube through the second header, the microchannel heat exchanger region where the K-th flat tube group and a fin between two microchannel flat tubes of the K-th flat tube group are located is defined as a K-th flat tube region, and an orthographic projection of the heat dissipation element on the first plane is coincident with an orthographic projection of part of the K-th flat tube region on the first plane.

8. The heat exchange system of claim 7 wherein an orthographic projection of the second header on the first plane is closer to an orthographic projection of the heat sink on the first plane than an orthographic projection of the first header on the first plane.

9. The heat exchange system of claim 2 or 3, wherein the microchannel heat exchanger comprises a K-th flat tube group, K >2, the first header comprises an outlet tube, the K-th flat tube group is communicated with the outlet tube through the first header, the microchannel heat exchanger region where the K-th flat tube group and a fin positioned between two microchannel flat tubes of the K-th flat tube group are located is defined as a K-th flat tube region, and an orthographic projection of the heat sink on the first plane coincides with an orthographic projection of part of the K-th flat tube region on the first plane.

10. The heat exchange system of claim 9 wherein an orthographic projection of the first header on the first plane is closer to an orthographic projection of the heat sink on the first plane than an orthographic projection of the second header on the first plane.

11. The heat exchange system of claim 9 wherein K flat tube banks are arranged sequentially along the length of the first header, the K flat tube bank being positioned above the K-1 flat tube bank and the K flat tube bank being positioned above the first flat tube bank in the direction of gravity.

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