CN216852577U

CN216852577U - SMT paster packaging hardware

Info

Publication number: CN216852577U
Application number: CN202122700732.XU
Authority: CN
Inventors: 王天祥
Original assignee: Kunshan Huasu Express Electronics Co ltd
Current assignee: Kunshan Huasu Express Electronics Co ltd
Priority date: 2021-11-05
Filing date: 2021-11-05
Publication date: 2022-06-28
Anticipated expiration: 2031-11-05

Abstract

The utility model discloses an SMT paster packaging device, wherein one end of a threaded rod is fixedly connected with an ejector block, the bottom of a fixed plate is positioned at two sides of an internal thread groove and is provided with a groove, a fixed shaft is fixedly connected inside the groove, the outer side of the fixed shaft is movably sleeved with a fixed column, the inner side of the fixed column is positioned above the ejector block and is fixedly connected with a limiting block, one end of the outer side of the fixed column is fixedly connected with a clamping block, one end of the threaded rod, far away from the ejector block, is fixedly connected with a rotating handle, the clamping block fixed at the outer side of the fixed column is abutted against the inside of an elongated slot through the abutting of the ejector block, so that the fixed plate is fixed at the top of a placing table, the same operation is carried out, the other three fixed plates are fixed at the top of the placing table according to the shapes of circuit boards, the fixed plates can be placed at different positions according to the shapes of the circuit boards, and can clamp and fix the circuit boards with different shapes, the practicality of the device is stronger.

Description

SMT paster packaging hardware

Technical Field

The utility model relates to the technical field of electronic components, in particular to an SMT chip packaging device.

Background

SMT is a surface mount technology (surface mount technology), which is the most popular technology and process in the electronic assembly industry at present, and is a circuit connection technology in which surface mount components (SMC/SMD, or chip components in chinese) without pins or short leads are mounted on the surface of a printed circuit board or other substrates, and are soldered and assembled by means of reflow soldering or dip soldering.

SMT paster is less, when welding it, and if the circuit board is fixed unstable, leads to the paster dislocation easily, and current fixed mode can't be fixed not equidimension and the circuit board of different shapes, for this reason, provides an SMT paster packaging hardware.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to an SMT chip packaging apparatus, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: an SMT chip packaging device comprises a fixing plate, wherein a dismounting structure is arranged on one side of the fixing plate;

the dismouting structure includes internal thread groove, through-hole and threaded rod, the bottom of fixed plate is seted up to the internal thread groove, the bottom in internal thread groove is seted up to the through-hole, the threaded rod activity runs through in the inside of through-hole, the threaded rod passes through threaded connection in the inside of internal thread groove, the one end fixedly connected with kicking block of threaded rod, the both sides that the bottom of fixed plate is located internal thread groove all are seted up flutedly, the inside fixedly connected with fixed axle of recess, the fixed column has been cup jointed in the outside activity of fixed axle, the inboard top fixedly connected with stopper that is located the kicking block of fixed column, the outside one end fixedly connected with fixture block of fixed column, the first expanding spring of one end fixedly connected with of stopper is kept away from to the inboard of fixed column, the threaded rod is kept away from the rotatory handle of one end fixedly connected with of kicking block.

Preferably, a push rod is movably inserted into one side of the fixing plate, a push block is fixedly connected to one end of the push rod, and a second telescopic spring is movably sleeved between the push block and the fixing plate on the outer side of the push rod.

Preferably, the push rod is provided with a threaded section at the outer side of the end far away from the push block, the threaded section is connected with a fixed block through a threaded hole, and the fixed block is provided with a limit plate at the end far away from the push rod.

Preferably, one end of the fixing plate is provided with a deep groove, and the deep groove is matched with the fixing block.

Preferably, a placing table is installed below the fixing plate, a plurality of deep holes are formed in the top of the placing table, and elongated slots are formed in the plurality of deep holes.

Preferably, the deep hole is matched with the fixing column, the long groove is matched with the clamping block, and the fixing plate is mounted at the top of the placing table through the fixing column.

Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the top block is abutted to the outer side of the limiting block, the fixing column is pushed to be opened towards two sides, so that the clamping block fixed to the outer side of the fixing column is abutted to the inner part of the long groove, the fixing plate is fixed to the top of the placing table, the other three fixing plates are fixed to the top of the placing table according to the shape of the circuit board, the fixing plates can be placed at different positions according to the shape of the circuit board, the circuit boards in different shapes can be clamped and fixed, the surface mounting operation is more convenient, and the practicability of the device is stronger.

Drawings

FIG. 1 is a schematic top view of the present invention;

FIG. 2 is a schematic cross-sectional view of the female screw groove of the present invention;

FIG. 3 is a schematic bottom view of the present invention;

FIG. 4 is a schematic view of a deep hole configuration of the present invention;

fig. 5 is a schematic structural view of a fixing plate according to the present invention.

In the figure: 1. a fixing plate; 2. a disassembly and assembly structure; 21. an internal thread groove; 22. a through hole; 23. a threaded rod; 24. a top block; 25. a groove; 26. a fixed shaft; 27. fixing a column; 28. a limiting block; 29. a clamping block; 210. a first extension spring; 211. rotating the handle; 3. a push rod; 4. pushing a block; 5. a second extension spring; 6. a fixed block; 7. a threaded segment; 8. a limiting plate; 9. deep grooves; 10. a placing table; 11. deep holes; 12. and a long groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1-5, the present invention provides a technical solution: an SMT chip packaging device comprises a fixing plate 1, wherein a dismounting structure 2 is arranged on one side of the fixing plate 1;

the dismounting structure 2 comprises an inner thread groove 21, a through hole 22 and a threaded rod 23, wherein the inner thread groove 21 is arranged at the bottom of the fixing plate 1, the through hole 22 is arranged at the bottom of the inner thread groove 21, the threaded rod 23 movably penetrates through the through hole 22, the threaded rod 23 is connected with the inside of the inner thread groove 21 through threads, one end of the threaded rod 23 is fixedly connected with a top block 24, the threaded rod 23 rotates inside the inner thread groove 21 to drive the top block 24 to move upwards, the bottom of the fixing plate 1 is positioned at two sides of the inner thread groove 21 and is respectively provided with a groove 25, the inside of the groove 25 is fixedly connected with a fixed shaft 26, the outer side of the fixed shaft 26 is movably sleeved with a fixed column 27, the inner side of the fixed column 27 is positioned above the top block 24 and is fixedly connected with a limit block 28, one end of the outer side of the fixed column 27 is fixedly connected with a clamping block 29 which is abutted against the outer side of the limit block 28 through the top block 24 to push the fixed column 27 to open towards two sides, the fixture block 29 fixed on the outer side of the fixed column 27 is abutted against the inside of the long groove 12, so that the fixed plate 1 is fixed on the top of the placing table 10, the same operation is performed, the other three fixed plates 1 are fixed on the top of the placing table 10 according to the shapes of the circuit boards, the fixed plates 1 can be placed at different positions according to the shapes of the circuit boards, the circuit boards in different shapes can be clamped and fixed, the surface mounting operation is more convenient, the practicability of the device is higher, the first expansion spring 210 is fixedly connected to one end, far away from the limiting block 28, of the inner side of the fixed column 27, the rotary handle 211 is fixedly connected to one end, far away from the top block 24, of the threaded rod 23, the top block 24 is separated from the limiting block 28 through manual rotation of the rotary handle 211, and the limiting block 28 is driven to reset under the action of the first expansion spring 210;

A push rod 3 is movably inserted into one side of the fixed plate 1, one end of the push rod 3 is fixedly connected with a push block 4, a second telescopic spring 5 is movably sleeved between the push block 4 and the fixed plate 1 at the outer side of the push rod 3, and the push block 4 is abutted against the outer end of the circuit board under the action of the second telescopic spring 5 to fix the circuit board;

the placing table 10 is installed below the fixing plate 1, the top of the placing table 10 is provided with a plurality of deep holes 11, long grooves 12 are formed in the deep holes 11, the deep holes 11 are matched with fixing columns 27, the long grooves 12 are matched with fixture blocks 29, the fixing columns 27 are inserted into the deep holes 11 by aligning the fixing columns 27 with the deep holes 11 to be placed, the fixing columns 27 are abutted to the bottoms of the long grooves 12, and the fixing plate 1 is installed at the top of the placing table 10 through the fixing columns 27.

The one end outside that push rod 3 kept away from ejector pad 4 is equipped with screw thread section 7, screw thread section 7 is connected with fixed block 6 through the screw hole, the one end fixedly connected with limiting plate 8 of push rod 3 is kept away from to fixed block 6, deep trouth 9 has been seted up to the one end of fixed plate 1, deep trouth 9 matches mutually with fixed block 6, through manual pulling ejector pad 4, place the circuit board in the inside of fixed block 6, loosen ejector pad 4, make ejector pad 4 contradict in the outer end of circuit board under the effect of second expanding spring 5.

In the working principle or the structural principle, when in use, the fixing plate 1 is placed at different positions according to the shape of the circuit board, the fixing column 27 is aligned with the deep hole 11 of the position to be placed, the fixing column 27 is inserted into the deep hole 11, so that the fixing column 27 is abutted against the bottom of the long groove 12, the handle 211 is rotated by manual rotation, the threaded rod 23 is rotated inside the inner threaded groove 21, so that the ejector block 24 is driven to move upwards, the ejector block 24 is abutted against the outer side of the limiting block 28, so that the fixing column 27 is pushed to open towards two sides, the clamping block 29 fixed on the outer side of the fixing column 27 is abutted against the inside of the long groove 12, so that the fixing plate 1 is fixed on the top of the placing table 10, the other three fixing plates 1 are fixed on the top of the placing table 10 according to the shape of the circuit board, and the fixing plates 1 are placed at different positions according to the shape of the circuit board, can carry out the centre gripping to the circuit board of different shapes fixedly, make the paster operation more convenient, the practicality of device is stronger, through manual pulling ejector pad 4, place the circuit board in the inside of fixed block 6, loosen ejector pad 4, make ejector pad 4 contradict in the outer end of circuit board under second expanding spring 5's effect, fix the circuit board, and is simple and convenient, easy operation, when needs are dismantled, through manual rotatory handle 211, make ejector pad 24 break away from stopper 28, drive stopper 28 and reset under first expanding spring 210's effect, can extract fixed column 27 from the inside of deep hole 11, thereby make fixed plate 1 break away from and place platform 10.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An SMT paster packaging hardware, includes fixed plate (1), its characterized in that: a dismounting structure (2) is arranged on one side of the fixing plate (1);

the disassembly and assembly structure (2) comprises an inner thread groove (21), a through hole (22) and a threaded rod (23), the inner thread groove (21) is arranged at the bottom of the fixing plate (1), the through hole (22) is arranged at the bottom of the inner thread groove (21), the threaded rod (23) movably penetrates through the through hole (22), the threaded rod (23) is connected with the inner part of the inner thread groove (21) through threads, one end of the threaded rod (23) is fixedly connected with a top block (24), grooves (25) are respectively formed in the two sides of the bottom of the fixing plate (1) which are positioned on the inner thread groove (21), a fixing shaft (26) is fixedly connected with the inner part of each groove (25), a fixing column (27) is movably sleeved on the outer side of the fixing shaft (26), a limiting block (28) is fixedly connected to the inner side of the fixing column (27) which is positioned above the top block (24), and a clamping block (29) is fixedly connected to one end of the outer side of the fixing column (27), one end of the inner side of the fixed column (27), which is far away from the limiting block (28), is fixedly connected with a first telescopic spring (210), and one end of the threaded rod (23), which is far away from the top block (24), is fixedly connected with a rotating handle (211).

2. An SMT chip packaging device according to claim 1, wherein: one side activity of fixed plate (1) has inserted push rod (3), the one end fixedly connected with ejector pad (4) of push rod (3), the outside of push rod (3) is located the activity and has cup jointed second expanding spring (5) between ejector pad (4) and fixed plate (1).

3. An SMT chip package device according to claim 2, wherein: the push rod (3) keep away from the one end outside of ejector pad (4) and be equipped with screw thread section (7), screw thread section (7) are connected with fixed block (6) through the screw hole, the one end fixedly connected with limiting plate (8) of push rod (3) are kept away from in fixed block (6).

4. An SMT chip packaging device according to claim 3, wherein: a deep groove (9) is formed in one end of the fixing plate (1), and the deep groove (9) is matched with the fixing block (6).

5. An SMT chip packaging device according to claim 1, wherein: a placing table (10) is installed below the fixing plate (1), a plurality of deep holes (11) are formed in the top of the placing table (10), and long grooves (12) are formed in the deep holes (11).

6. An SMT chip packaging device according to claim 5, wherein: the deep hole (11) is matched with the fixing column (27), the long groove (12) is matched with the clamping block (29), and the fixing plate (1) is installed at the top of the placing table (10) through the fixing column (27).