CN216851964U - 3DS measuring head measuring signal processing system - Google Patents

Abstract

3DS measuring head measuring signal processing system. The gear measurement center is a multi-axis linkage high-precision measuring instrument which is provided with a high-precision measuring head. The utility model comprises an X-axis control system, a Y-axis control system and a Z-axis control system; the X-axis control system, the Y-axis control system and the Z-axis control system respectively comprise a PSD interface circuit, an amplifying circuit, a PSD processing chip, an A/D converter, a main controller, a signal output circuit, a laser diode driving chip and a laser emission interface circuit; the utility model is used for 3DS gauge head measurement signal handles.

Description

3DS Probe Measurement Signal Processing System

technical field

The utility model relates to a 3DS probe measurement signal processing system.

Background technique

The gear measuring center is a high-precision measuring instrument with multi-axis linkage, and the instrument is equipped with a high-precision probe. When the instrument is working normally, the three-dimensional probe measures the small displacements in three directions and converts the measured values into voltage signals. The converted voltage signals are collected by the data acquisition card and transmitted to the main control computer, and finally displayed on the display. The parameters and curves of various gears or tools are displayed.

SUMMARY OF THE INVENTION

The purpose of the utility model is to provide a 3DS probe measurement signal processing system.

The above purpose is achieved through the following technical solutions:

A 3DS probe measurement signal processing system, which consists of an X-axis control system, a Y-axis control system and a Z-axis control system;

The X-axis control system, the Y-axis control system and the Z-axis control system all include a PSD interface circuit, an amplifier circuit, a PSD processing chip, an A/D converter, a main controller, a signal output circuit, Laser diode driver chip and laser emission interface circuit;

The PSD interface circuit is electrically connected to the amplifying circuit, the amplifying circuit is electrically connected to the PSD processing chip, the PSD processing chip is electrically connected to the A/D converter, and the The A/D converter is electrically connected with the main controller, and the main controller is electrically connected with the signal output circuit through the CAN bus.

In the 3DS probe measurement signal processing system, the main controller is also electrically connected with the laser diode drive chip, and the laser diode drive chip is electrically connected with the laser emission interface circuit.

The 3DS probe measurement signal processing system, the X-axis control system, the Y-axis control system and the A/D converters of the Z-axis control system are all electrically connected to the voltage reference chip.

In the 3DS probe measurement signal processing system, the voltage reference chip circuit is also electrically connected with the power supply interface circuit, and the power supply interface circuit is respectively connected with +12V, -12V, +5V to ensure power supply.

Beneficial effects:

1. The utility model converts the tiny displacement signals in three directions into electrical signals, so that the displacement in each direction is proportional to the output voltage signal, and the output voltage signal is converted into a digital signal by the A/D converter of 16bit. .

2. The PSD sensor interface circuit of the present utility model is connected with the PSD sensor, the PSD sensor is responsible for the collection of the micro-displacement signal, and the collected micro-displacement is sent to the signal processing board for comprehensive signal processing. Each processed voltage signal is input to the A/D converter and converted into a digital signal for output through the CAN bus.

2. The power supply interface circuit of the utility model is respectively connected with +12V, -12V and +5V to ensure power supply.

Description of drawings:

Accompanying drawing 1 is the principle diagram of the present utility model;

Accompanying drawing 2 is PSD signal processing chip circuit diagram;

Accompanying drawing 3 is the circuit diagram of amplifying circuit;

Accompanying drawing 4 is the circuit diagram of laser diode driver chip;

Accompanying drawing 5 is PSD sensor interface circuit diagram;

Accompanying drawing 6 is the signal output interface circuit diagram;

7 is a circuit diagram of a power supply reference chip;

Accompanying drawing 8 is the circuit diagram of the power indicator light;

Accompanying drawing 9 is the power interface circuit diagram;

Accompanying drawing 10 is the laser transmitter interface circuit diagram;

Figure 11 is a circuit diagram of the main controller.

Detailed ways:

Example 1:

A 3DS probe measurement signal processing system, which consists of an X-axis control system, a Y-axis control system and a Z-axis control system;

The X-axis control system, the Y-axis control system and the Z-axis control system all include a PSD interface circuit, an amplifier circuit, a PSD processing chip, an A/D converter, a main controller, a signal output circuit, Laser diode driver chip and laser emission interface circuit;

The PSD interface circuit is electrically connected to the amplifying circuit, the amplifying circuit is electrically connected to the PSD processing chip, the PSD processing chip is electrically connected to the A/D converter, and the The A/D converter is electrically connected with the main controller, the main controller is electrically connected with the signal output circuit through the CAN bus, and the signal output interface outputs three data signals through the CAN bus.

Example 2:

According to the 3DS probe measurement signal processing system according to Embodiment 1, the main controller is further electrically connected to the laser diode driver chip, and the laser diode driver chip is electrically connected to the laser emission interface circuit .

The driving of the laser diode adopts the combination of MOS tube and operational amplifier to realize 50mA constant current source driving. For the signal processing of the PSD sensor, the weak current signal is first converted into a voltage signal, and then the voltage signal is digitized and sampled, and the output digital signal is a small displacement signal. After the signal is processed, the digital displacement signal is output at the output interface.

Example 3:

According to the 3DS probe measurement signal processing system according to Embodiment 1 or 2, the A/D converters of the X-axis control system, the Y-axis control system and the Z-axis control system are all connected to the voltage reference Chips are electrically connected.

Example 4:

According to the 3DS probe measurement signal processing system according to Embodiment 1, 2 or 3, the voltage reference chip circuit is further electrically connected to the power interface circuit, and the power interface circuit is connected to +12V and -12V respectively. , +5V connected to ensure power supply.

The process of converting the tiny displacement measured by the gear measuring instrument into a voltage signal, and then sampling it into a digital signal through the A/D converter, and finally outputting it to the subsequent processing equipment through the CAN bus. The main processing chip adopts STM32F103 of STMicroelectronics, the PSD signal processing chip is OPA2228, and the voltage amplifying chip is AD8676. The laser emission interface can be connected to three laser transmitters at the same time, and the PSD interface can be connected to three PSD sensors at the same time. The LED lights behind the driver board represent three different power supply voltages, namely red (+12V), green (-12V), and blue (+5V). In addition, the driver board also has the advantages of stable operation and low power consumption.

Claims (4)

1. A3 DS measuring head measuring signal processing system is characterized in that: the device comprises an X-axis control system, a Y-axis control system and a Z-axis control system;

the X-axis control system, the Y-axis control system and the Z-axis control system respectively comprise a PSD interface circuit, an amplifying circuit, a PSD processing chip, an A/D converter, a main controller, a signal output circuit, a laser diode driving chip and a laser emission interface circuit;

the PSD interface circuit is electrically connected with the amplifying circuit, the amplifying circuit is electrically connected with the PSD processing chip, the PSD processing chip is electrically connected with the A/D converter, the A/D converter is electrically connected with the main controller, and the main controller is electrically connected with the signal output circuit through a CAN bus.

2. The 3DS measuring head measuring signal processing system according to claim 1, wherein the main controller is further electrically connected with the laser diode driving chip, and the laser diode driving chip is electrically connected with the laser emission interface circuit.

3. The 3DS measuring head measuring signal processing system according to claim 2, wherein the A/D converters of the X-axis control system, the Y-axis control system and the Z-axis control system are all electrically connected with a voltage reference chip.

4. The 3DS measuring head measuring signal processing system according to claim 3, wherein the voltage reference chip circuit is further electrically connected with a power interface circuit, and the power interface circuit is respectively connected with +12V, -12V and +5V to ensure power supply.

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