CN216819797U - Five-string side-wiring large cell half-piece assembly - Google Patents

Abstract

The application discloses five other big battery half piece subassemblies of walking of cluster, belong to photovoltaic module technical field, a walk line length for shortening among the big battery pack, thereby reduce the wiring degree of difficulty and use the line cost, including the wiring board, silicon chip unit and pencil, the main part of wiring board is transparent backplate, be provided with outline and interior frame on the transparent backplate, outline and interior frame are located same one side of transparent backplate, constitute the bank wire casing between outline and the interior frame, the voltage opposite direction of adjacent silicon chip unit, the other string of walking line that all connects at the both ends of every silicon chip unit carries out electric connection with same one side of adjacent silicon chip unit. The utility model shortens the distance of the butt joint ends of the series connection by changing the arrangement mode of the silicon wafer units, and reduces the length of the wire harness required by the series connection; through design a plurality of winding displacement grooves and card wire casing on giving the wiring board, including shorter pencil demand, improved wiring efficiency, improved the precision of pencil installation simultaneously and the stability after the installation.

Description

Five-string side-wiring large cell half-piece assembly

Technical Field

The application relates to the technical field of photovoltaic modules, in particular to a five-string side-routing large-cell half-cell module.

Background

At present, due to the limitation of manufacturing technology, the solar cell panel cannot be made too large, and a plurality of photoelectric conversion panels need to be integrated to obtain a larger solar cell panel.

The existing large battery pack has the following defects: for example, a wiring harness integrating a plurality of photoelectric conversion panels needs to pass through the boards, so that the installation is complex, the positioning difficulty is high, and the material consumption of the wiring harness is high, which greatly increases the production cost of a large battery assembly. In order to solve the problems, a novel large cell half-piece assembly with five strings of side-routing wires is provided.

Disclosure of Invention

The purpose of this application lies in, shortens the line length of walking among the big battery pack to reduce the wiring degree of difficulty and use the line cost.

In order to achieve the above purpose, the technical scheme adopted by the application is as follows: the five-string side-wiring large cell half-piece assembly comprises a wiring board, silicon wafer units and wiring harnesses, wherein the main body part of the wiring board is a transparent back plate, an outer frame and an inner frame are arranged on the transparent back plate, the outer frame and the inner frame are positioned on the same side of the transparent back plate, a row of wiring grooves are formed between the outer frame and the inner frame, the wiring grooves are convenient to position and install, a plurality of wiring grooves are formed in the inner frame, limiting clamping teeth are arranged on the inner wall of each wiring groove of the inner frame, the number of the silicon wafer units is several, the voltage directions of the adjacent silicon wafer units are opposite, the length of the wiring harnesses required by series connection is greatly reduced, the two ends of each silicon wafer unit are connected with the wiring harnesses, each wiring harness comprises a side-wiring string line, the side-wiring string lines are suitable for being embedded into the wiring grooves, and the side-wiring string lines electrically connect the same side of the adjacent silicon wafer units, and one side of the silicon wafer unit is connected with the bypass string at most once, and the bypass string is clamped in the wire clamping groove by the limiting clamping teeth, so that the stability of the wire harness connecting end is improved.

Preferably, the wire harness further comprises an incoming line end and an outgoing line end, the two outermost silicon wafer units are respectively connected with the incoming line end and the outgoing line end and used for being connected with an external circuit, and the incoming line end and the outgoing line end are both connected to one side, far away from the side connected with the bypass string line, of the silicon wafer unit.

Preferably, the outer frame is provided with a wire inlet groove at a position close to the lead-in end, and the lead-in end passes through the wire inlet groove and extends out of the wiring board.

Preferably, the outer frame is provided with an outlet slot at a position close to the outlet end, and the outlet end passes through the outlet slot and extends out of the wiring board.

As an optimization, transparent backplate is made by the organic glass material, guarantees the light transmissivity, outline and interior frame are made by aluminum alloy material, ensure that battery board subassembly's edge possesses sufficient structural strength.

Compared with the prior art, the beneficial effect of this application lies in:

(1) by changing the arrangement mode of the silicon wafer units, the distance of the serially connected butt ends is shortened as much as possible, the length of a wiring harness required by serial connection is greatly reduced, and the use cost of the wiring harness is reduced;

(2) through design a plurality of winding displacement grooves and card wire casing on giving the wiring board, including shorter pencil demand, greatly reduced the location and the installation degree of difficulty of wiring, improved wiring efficiency, improved the precision of pencil installation and the stability after the installation simultaneously.

Drawings

Fig. 1 is a schematic view of an assembly structure of the five-string side-wiring large cell half-wafer assembly;

fig. 2 is a partial enlarged view of the five-string side-wiring large-cell half-wafer assembly at the position a in fig. 1;

fig. 3 is a partial enlarged view of the five string side-routing large cell half wafer assembly at B of fig. 1;

fig. 4 is a schematic perspective view of the wiring board of the five-string side-wiring large cell half-chip assembly;

fig. 5 is a partial enlarged view of the five-string side-wiring large-cell half-wafer assembly at the position C in fig. 4;

fig. 6 is a partial enlarged view of the five string side-routing large cell half wafer assembly at D of fig. 4;

fig. 7 is a schematic diagram of the wiring and current routing of the silicon wafer unit of the five-string side-routing large cell half-wafer assembly.

In the figure: 1. a wiring board; 101. a wire arrangement groove; 102. a transparent back plate; 103. an outer frame; 104. an inner frame; 105. a wire inlet groove; 106. an outlet groove; 107. limiting latch teeth; 108. a wire clamping groove; 2. a silicon wafer unit; 3. a wire harness; 301. a lead-in terminal; 302. an outlet terminal; 303. and bypassing the serial line.

Detailed Description

The present application is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.

In the description of the present application, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., it indicates that the orientation and positional relationship shown in the drawings are based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be construed as limiting the specific scope of protection of the present application.

It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

The terms "comprises," "comprising," and "having," and any variations thereof, in the description and claims of this application, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

As shown in fig. 1-7, the five-string side-wiring large cell half-module comprises a wiring board 1, a silicon chip unit 2 and a wiring harness 3, wherein the main part of the wiring board 1 is a transparent back plate 102, the transparent back plate 102 is made of organic glass material to ensure good light transmission, an outer frame 103 and an inner frame 104 are arranged on the transparent back plate 102, the outer frame 103 and the inner frame 104 are made of aluminum alloy material to ensure that the frame of the cell module has enough structural strength, the outer frame 103 and the inner frame 104 are positioned on the same side of the transparent back plate 102, a wiring groove 101 is formed between the outer frame 103 and the inner frame 104 to facilitate the positioning and installation of the wiring harness 3, and the wiring harness 3 is more stable after installation, a plurality of wiring grooves 108 are arranged on the inner frame 104, the inner frame 104 is provided with a limiting latch 107 on the inner wall of the wiring groove 108 to more stably fix the wiring harness 3 in the wiring groove 108, the quantity of the silicon wafer units 2 is a plurality of, and the voltage directions of the adjacent silicon wafer units 2 are opposite, so that the wiring distance is greatly shortened when the silicon wafer units 2 are connected in series in a tail-in connection mode, the two ends of each silicon wafer unit 2 are connected with the wiring harnesses 3, each wiring harness 3 comprises the bypass serial lines 303, the bypass serial lines 303 are suitable for being embedded into the wiring grooves 101, the bypass serial lines 303 electrically connect the same sides of the adjacent silicon wafer units 2, and one side of each silicon wafer unit 2 is connected with the bypass serial lines 303 at most once, so that the silicon wafer units 2 are connected without passing through the silicon wafer units 2, the wiring difficulty is reduced, the required wiring harnesses 3 are shorter in length, the wiring cost is effectively reduced, the bypass serial lines 303 are clamped in the clamping grooves 108 by the limiting clamping teeth 107, and the stability of connecting ends can be effectively guaranteed.

The wiring harness 3 further comprises a leading-in wire end 301 and a leading-out wire end 302, and is used for transmitting electric energy generated by solar electricity, the two silicon chip units 2 on the outermost side are respectively connected with the leading-in wire end 301 and the leading-out wire end 302, the leading-in wire end 301 and the leading-out wire end 302 are both connected to one side, far away from the side connected with the side walking serial wire 303, of the silicon chip units 2, wiring continuity of a circuit is guaranteed, the outer frame 103 is provided with a wire inlet groove 105 at a position close to the leading-in wire end 301, the leading-in wire end 301 penetrates through the wire inlet groove 105 and extends out of the wiring board 1, the outer frame 103 is provided with a wire outlet groove 106 at a position close to the leading-out wire end 302, the leading-out wire end 302 penetrates through the wire outlet groove 106 and extends out of the wiring board 1, and connection with an external power consumption circuit is facilitated.

The assembly steps of the five-string side-wiring large-cell half-chip assembly are as follows: the whole assembly process is carried out in a dust-free workshop no matter through manual or automatic equipment, firstly, the outer frame 103 and the inner frame 104 are fixed on the same side of the transparent backboard 102 through solidification, the uniform gap between the outer frame 103 and the inner frame 104 is ensured in the assembly process, the gap is the wiring groove 101 required in the following wiring, then, the silicon wafer units 2 are sequentially and uniformly fixed on the transparent backboard 102 positioned on the inner side of the inner frame 104 according to the sequence of positive and negative, then, enough number of side-walking string wires 303 are taken to connect the same sides of the adjacent photovoltaic power supplies and are sequentially connected with the silicon wafer units 2 in series, the connected side-walking string wires 303 are embedded into the wiring groove 101 and the wire clamping groove 108, and finally, the leading-in end 301 and the leading-out end 302 are connected on the corresponding sides of the two silicon wafer units 2 of which one side can not be connected with the side-walking string wires 303, the assembly of the whole battery assembly can be completed.

The foregoing has described the general principles, essential features, and advantages of the application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, which are merely illustrative of the principles of the application, but that various changes and modifications may be made without departing from the spirit and scope of the application, and these changes and modifications are intended to be within the scope of the application as claimed. The scope of protection claimed by this application is defined by the following claims and their equivalents.

Claims (5)

1. The utility model provides a five cluster side walk line big battery half piece subassemblies which characterized in that: comprises a wiring board, a silicon chip unit and a wiring harness, wherein the main body part of the wiring board is a transparent backboard, an outer frame and an inner frame are arranged on the transparent backboard, the outer frame and the inner frame are positioned at the same side of the transparent backboard, a trunking is formed between the outer frame and the inner frame, a plurality of wire clamping grooves are formed in the inner frame, limiting clamping teeth are arranged on the inner wall of each wire clamping groove of the inner frame, a plurality of silicon wafer units are arranged, the voltage directions of the adjacent silicon chip units are opposite, two ends of each silicon chip unit are connected with wire harnesses, the wiring harness comprises a bypass serial line which is suitable for being embedded into the wiring groove and electrically connects the same sides of the adjacent silicon chip units, and one side of the silicon chip unit is connected with a side-walking string line at most once, and the side-walking string line is clamped in the wire clamping groove by the limiting clamping teeth.

2. The five-string side-routing large-cell half-wafer assembly of claim 1, wherein: the wiring harness further comprises a leading-in end and leading-out end, the two silicon wafer units on the outermost side are respectively connected with the leading-in end and the leading-out end, and the leading-in end and the leading-out end are both connected to the side, far away from the silicon wafer units, connected with the side-walking string wires.

3. The five-string side-routing large-cell half-wafer assembly of claim 2, wherein: and a wire inlet groove is formed in the position, close to the lead-in wire end, of the outer frame, and the lead-in wire end penetrates through the wire inlet groove and extends out of the wiring board.

4. The five-string side-routing large-cell half-wafer assembly of claim 2, wherein: an outlet groove is formed in the position, close to the outlet line end, of the outer frame, and the outlet line end penetrates through the outlet groove and extends out of the wiring board.

5. The five-string side-routing large-cell half-wafer assembly of claim 1, wherein: the transparent back plate is made of an organic glass material, and the outer frame and the inner frame are made of an aluminum alloy material.

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