CN216792684U - Chip assembly, imaging box and imaging device - Google Patents

Abstract

The application provides a chip assembly, an imaging box and imaging equipment, and relates to the technical field of printing and imaging. The chip assembly includes: a substrate; the memory unit is configured on the substrate; the contact element is arranged on the substrate and electrically connected with the storage unit, and the contact element comprises at least two conductive pieces; the conductive pieces in at least one preset area of the contact piece are arranged in parallel in pairs, and the distance ratio of the length of the conductive pieces in the direction parallel to the substrate to the outermost conductive piece in the preset area is larger than 3. Set two liang of parallels to the electrically conductive piece in the region of presetting with the contact, be favorable to the contact of electrically conductive piece and printer, secondly set the distance ratio of the electrically conductive piece of length along the direction that is on a parallel with the base plate and the electrically conductive piece in the region of presetting the outside to be greater than 3 to when having the condition that the installation is not in place for messenger's chip subassembly and printer, can guarantee that the electrical contact performance of chip subassembly and printer is good.

Description

Chip assembly, imaging box and imaging device

Technical Field

The application relates to the technical field of printing and imaging, in particular to a chip assembly, an imaging box and imaging equipment.

Background

The printer is provided with replaceable printing consumables such as toner cartridges, ink cartridges and the like. A chip is generally provided in a printing consumable, and the chip can store information related to the consumable, such as consumable amount information, color information, production date, and the like. Therefore, the stability of the electrical connection of the chip in the printing consumables and the image forming apparatus is very important.

The existing printing consumables cause poor contact or incapability of contacting at the contact point of a chip and a printer due to the defect of a connection mode.

SUMMERY OF THE UTILITY MODEL

The application aims to provide a chip assembly, an imaging box and imaging equipment, and aims to solve the technical problem of poor contact of the existing chip and a contact point of a printer.

In order to achieve the purpose, the following technical scheme is adopted in the application:

in a first aspect, the present application provides a chip assembly comprising: a substrate; a memory cell disposed on the substrate; a contact disposed on the substrate, the contact being electrically connected to the memory cell and including at least two conductive members; the conductive pieces in at least one preset area of the contact piece are arranged in parallel in pairs, and the distance ratio of the length of the conductive pieces in the direction parallel to the substrate to the outermost conductive pieces in the preset area is greater than 3.

In the process of realizing, the conductive pieces in the preset area of the contact piece are arranged to be parallel in pairs, so that the contact between the conductive pieces and the printer is facilitated, and then the distance ratio of the length of the conductive pieces in the direction parallel to the substrate to the conductive pieces on the outermost side in the preset area is set to be larger than 3, so that when the chip assembly and the printer are not installed in place, the good electrical contact performance of the chip assembly and the printer can be ensured.

In some embodiments, the substrate comprises one or more of a flexible substrate, a strip substrate.

In the implementation process, the substrates are set to be of various types so as to meet the requirements of different printers and improve the adaptability of the chip assembly.

In some embodiments, the chip assembly further comprises: the battery module is arranged on the substrate, and the battery module and the storage unit are both configured on the same side of the substrate.

In the process of realizing the method, the battery module is arranged on the substrate to meet the electric energy requirement of the chip assembly and ensure the normal work of the storage unit.

In some embodiments, the memory cell is configured as a side of the substrate facing away from the contact.

In the process of the implementation, the storage unit is arranged on one side of the substrate, which is away from the contact piece, so that the chip assembly can play a role in protecting the storage unit to a certain extent in the use process, and the service life of the storage unit is prolonged.

In some embodiments, at least a portion of the conductive member is configured in the predetermined region.

In the implementation process, the length of the conductive piece is set to be longer than that of the preset area, so that the contact piece is conveniently contacted with a printer, and the good electrical contact performance between the chip assembly and the printer is ensured.

In some embodiments, a ratio of a length of the conductive member in a direction parallel to the substrate to a distance of the conductive member on the outermost side in the predetermined region is greater than or equal to 5.

In a second aspect, the present application provides an imaging cartridge comprising: an imaging body; and a chip assembly as claimed in any one of the preceding claims, wherein the imaging body is configured to receive at least a portion of the chip assembly.

The imaging cartridge provided in the second aspect of the present application includes the chip assembly according to any one of the technical solutions of the first aspect, so that all technical effects of any one of the embodiments described above are achieved, and details are not repeated herein.

In some embodiments, the surface formed between the two outermost conductive members of the chip assembly and the surface of the imaging body form an included angle smaller than 90 °.

In the process of the realization, the chip assembly is obliquely arranged relative to the surface of the imaging body, so that the chip assembly can be better contacted with the printer in the use process of the imaging box, and the electrical contact performance with the printer is improved.

In some embodiments, the structure of at least a portion of the chip assembly is affixed to the surface of the imaging body by an adhesive.

In a third aspect, the present application also provides an imaging apparatus comprising an imaging cartridge as defined in any one of the above.

The imaging device provided by the embodiment of the third aspect of the present application includes the imaging cartridge according to any one of the technical solutions of the second aspect, so that all technical effects of any one of the embodiments described above are achieved, and details are not repeated here.

Compared with the prior art, the beneficial effect of this application scheme is: set two liang of parallels of electrically conductive piece in the predetermined region with the contact, be favorable to electrically conductive piece and printer's contact, secondly set electrically conductive piece to be greater than 3 along the length of the direction of being on a parallel with the base plate with the distance ratio of the electrically conductive piece of the outside in the predetermined region to when making chip subassembly and printer have the condition of not in place of installation, can guarantee that the electric contact performance of chip subassembly and printer is good.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for a user of ordinary skill in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a chip assembly disclosed in an embodiment of the present application.

Fig. 2 is another schematic structural diagram of a chip assembly disclosed in an embodiment of the present application.

Fig. 3 is a schematic front side structure diagram of a chip assembly disclosed in an embodiment of the present application.

Fig. 4 is a schematic structural diagram of an imaging cartridge disclosed in an embodiment of the present application.

Fig. 5 is a schematic structural diagram of another imaging cartridge disclosed in the embodiments of the present application.

Fig. 6 is another view angle structure diagram of fig. 5.

Reference numerals

10. A chip assembly; 101. a substrate; 102. a storage unit; 103. a contact member; 1031. a conductive member; 104. a battery module; 105. a capacitor; 106. a metal contact; 20. an imaging device; 201. an imaging body; 2011. and (4) mounting the groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a user of ordinary skill in the art based on the embodiments in the present application without any creative effort belong to the protection scope of the present application.

In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only used for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case to a user of ordinary skill in the art.

Examples

With the development of semiconductor technology, more and more printer manufacturers will store data in a storage medium (usually called a chip) in order to record the usage of printer consumables (such as a powder cartridge, a toner cartridge, etc.). The storage medium is usually fixed on a powder box or a toner cartridge, and is in electric signal connection with an electric contact point of a printer through an electric contact surface to realize data communication.

The inventor finds that, in the design process, because the printer and the chip are physically connected, the position of the electric contact surface is fixed relative to the printing consumable (a powder box or a toner cartridge), however, after the printing consumable is installed on the powder box, the printing consumable may be installed in place, so that the contact point of the printer and the chip on the printing consumable cannot be contacted, normal printing cannot be performed, and the contact position of the chip is small, so that the contact point cannot be contacted.

In view of the above, as shown in fig. 1, fig. 1 is a schematic structural diagram of a chip assembly 10 disclosed in the embodiment of the present application; in a first aspect, the present application provides a chip assembly 10 comprising: the image forming apparatus comprises a substrate 101, a storage unit 102 and a contact 103, wherein the storage unit 102 and the contact 103 are arranged on the substrate 101, the storage unit 102 is used for storing data of the use condition of the image forming box, and the contact 103 is used for being connected with an electric signal of the image forming device 20 to realize data communication.

Specifically, the memory cell 102 is disposed on the substrate 101; the contact 103 is disposed on the substrate 101, the contact 103 is electrically connected to the memory cell 102, and the contact 103 includes at least two conductive members 1031; the conductive members 1031 in at least one preset region of the contact member 103 are arranged in parallel, and a distance ratio between a length of the conductive member 1031 in a direction parallel to the substrate 101 and the outermost conductive member 1031 in the preset region is greater than 3.

Illustratively, the predetermined region is a part of the structure of the contact 103, at least a part of the conductive member 1031 is configured in the predetermined region and is used for connecting with the electrical signal of the imaging device 20, and the conductive member 1031 extending out of the predetermined region can avoid the phenomenon that the imaging device 20 is in poor contact or cannot contact with the chip assembly 10 when the imaging cartridge is not mounted in place to a certain extent.

It should be noted that, the length of the conductive component 1031 along the direction parallel to the substrate 101 may be understood that, when the chip assembly 10 is in a strip shape, the length of the conductive component 1031 along the direction parallel to the substrate 101 is the actual length of the conductive component 1031; when the chip assembly 10 is made of a flexible material, that is, the chip assembly 10 is completely attached to the imaging box, and the distribution of the chip assembly 10 may be regular or irregular, at this time, the length of the conductive member 1031 along the direction parallel to the substrate 101 is the length of the conductive member 1031 after being straightened.

In the implementation process, the conductive members 1031 in the preset region of the contact member 103 are arranged to be parallel to each other, which is beneficial to the contact between the conductive members 1031 and the printer, and then the distance ratio between the length of the conductive members 1031 in the direction parallel to the substrate 101 and the outermost conductive members 1031 in the preset region is set to be greater than 3, so that when the chip component 10 and the printer are not installed in place, the good electrical contact performance between the chip component 10 and the printer can be ensured.

As shown in fig. 1-2, the substrate 101 includes one or more of a flexible substrate 101 and a long substrate 101.

For example, the flexible substrate 101 is made of a flexible material, and the flexible substrate 101 is completely attached to the imaging box, and the fixing manner may be that an adhesive is attached, or that the flexible substrate is attached to the imaging box by plugging, or of course, a part of the flexible substrate may be attached by using the adhesive, and another part of the flexible substrate may be attached by plugging; the long-strip substrate 101 is made of hard materials, and when the surface of the imaging box is uneven, the partial structure of the long-strip substrate 101 is attached to the imaging box, so that the long-strip substrate 101 is fixed to the imaging box, and the fixing mode of the long-strip substrate 101 is similar to the fixing mode of the flexible substrate 101 to the imaging box, which is not repeated herein.

In the implementation process, the substrate 101 is provided in multiple types to meet the requirements of different printers, so that the adaptability of the chip assembly 10 is improved.

As further shown in fig. 1-2, the chip assembly 10 further includes: a battery module 104, wherein the battery module 104 is disposed on the substrate 101, and both the battery module 104 and the storage unit 102 are disposed on the same side of the substrate 101; of course, the chip assembly 10 further includes a capacitor 105, and the capacitor 105, the battery module 104 and the storage unit 102 are disposed on the same side of the substrate 101.

In the implementation process, the battery module 104 is disposed on the substrate 101 to meet the power requirement of the chip assembly 10, so as to ensure the normal operation of the storage unit 102.

As shown in fig. 3, fig. 3 is a schematic front-side structure view of a chip assembly 10 disclosed in an embodiment of the present application, and the memory unit 102 is configured on a side of the substrate 101 facing away from the contact 103.

In the implementation process, the memory unit 102 is arranged on the side of the substrate 101 away from the contact 103, so that the chip assembly 10 can protect the memory unit 102 to some extent during the use process, so as to prolong the service life of the memory unit 102.

As shown in fig. 4, fig. 4 is a schematic structural diagram of an imaging cartridge disclosed in an embodiment of the present application, and a structure of at least a portion of the conductive component 1031 is configured in the preset region.

In the above implementation process, the length of the conductive member 1031 is set to be longer than that of the preset region, so as to facilitate the contact between the contact member 103 and the printer, and ensure good electrical contact performance between the chip assembly 10 and the printer.

In a preferred embodiment, a ratio of a length of the conductive component 1031 in a direction parallel to the substrate 101 to a distance of the conductive component 1031 on the outermost side in the predetermined region is greater than or equal to 5.

For example, the conductive members 1031 may be rectangular conductive strips, irregular shapes or regular shapes, where the regular shapes may be circles or squares with equal areas and sizes connected in series to form the conductive members 1031; the irregular shape may be a series of different shapes, forming the conductive member 1031, etc.

As shown in fig. 4-6, in a second aspect, the present application provides an imaging cartridge comprising: an imaging body 201 and the chip assembly 10, wherein the imaging body 201 is used for accommodating at least a part of the structure of the chip assembly 10.

Illustratively, the surface of the imaging body 201 is provided with a mounting groove 2011, the mounting groove 2011 corresponds to a contact point of the imaging device 20, and a structure of at least a part of the chip component 10 is configured in the mounting groove 2011, wherein the mounting groove 2011 may form a snap-fit connection with the chip component 10, or may form a connection with the chip component 10 by means of an adhesive.

It is understood that the shape and size of the imaging cartridges are not fixed, and the imaging cartridges with different sizes can be arranged according to the type of the imaging device 20, most commonly, the imaging cartridges are flat and low-height shallow boxes, so that printing materials such as carbon powder can be contained in the imaging cartridges, and according to the type of the imaging device 20, the imaging cartridges can also be polyester carbon powder with low melting point or physical carbon powder with lower price.

The imaging cartridge provided in the second aspect of the present application includes the chip assembly 10 according to any one of the first aspect of the present disclosure, so that all technical effects of any one of the above embodiments are achieved, and details are not repeated herein.

As shown in fig. 6, the surface formed between the two outermost conductive members 1031 of the chip assembly 10 and the surface of the imaging body 201 form an angle smaller than 90 °.

For example, the inclination angle of the chip assembly 10 is not particularly limited, and may be greater than 0 ° and smaller than 90 °, and the smaller the inclination angle is, the larger the area of the contact surface (contact 103) of the chip assembly 10 with respect to the contact point of the imaging device 20 is, i.e., the better the electrical contact performance is.

In the implementation process, by arranging the chip assembly 10 to be obliquely arranged relative to the surface of the imaging body 201, the chip assembly 10 can be better contacted with the printer during the use process of the imaging box, so that the electrical contact performance with the printer is improved.

In some embodiments, the structure of at least a portion of the chip assembly 10 is adhered to the surface of the imaging body 201 by an adhesive; for example, the placement position of the adhesive may be the installation groove 2011 of the imaging body 201, or may be located outside the installation groove 2011 of the imaging body 201, or of course, the adhesive may be disposed at both positions.

In a third aspect, the present application also provides an imaging device 20 comprising an imaging cartridge; illustratively, the image forming apparatus 20 includes a printer, a copier, a facsimile machine, a multifunction machine, etc., wherein the image forming apparatus 20 may further include a photosensitive device including a photosensitive drum, a charging roller, a cleaning member, etc., and the image forming cartridge is detachably mounted on the photosensitive device.

The imaging device 20 provided in the embodiment of the third aspect of the present application includes the imaging cartridge according to any one of the technical solutions of the second aspect, so that all technical effects of any one of the embodiments described above are achieved, and details are not repeated here.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A chip assembly, comprising:

a substrate;

a memory cell disposed on the substrate;

a contact disposed on the substrate, the contact being electrically connected to the memory cell and including at least two conductive members;

the conductive pieces in at least one preset area of the contact piece are arranged in parallel in pairs, and the distance ratio of the length of the conductive pieces in the direction parallel to the substrate to the outermost conductive pieces in the preset area is greater than 3.

2. The chip assembly according to claim 1, wherein the substrate comprises one or more of a flexible substrate, a strip substrate.

3. The chip assembly according to claim 1, further comprising:

the battery module is arranged on the substrate, and the battery module and the storage unit are both configured on the same side of the substrate.

4. The chip assembly according to claim 1, wherein the storage unit is configured as a side of the substrate facing away from the contact.

5. The chip assembly according to claim 1, wherein at least a portion of the conductive member is structured to be disposed in the predetermined region.

6. The chip assembly according to claim 1, wherein a ratio of a length of the conductive member in a direction parallel to the substrate to a distance of the conductive member on an outermost side in the predetermined region is 5 or more.

7. An imaging cartridge, comprising:

an imaging body; and

the chip assembly of any one of claims 1 to 6, wherein the imaging body is for receiving a structure of at least a portion of the chip assembly.

8. The imaging cartridge according to claim 7, wherein a surface formed between the two outermost conductive members of the chip assembly forms an angle of less than 90 ° with a surface of the imaging body.

9. An imaging cartridge according to claim 7, wherein at least a portion of the chip assembly is configured to be adhered to the surface of the imaging body by an adhesive.

10. An image forming apparatus, characterized by comprising the image forming cartridge according to any one of claims 7 to 9.

Images