CN216781409U - Wafer polishing mechanism - Google Patents
Wafer polishing mechanism Download PDFInfo
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- CN216781409U CN216781409U CN202220116873.9U CN202220116873U CN216781409U CN 216781409 U CN216781409 U CN 216781409U CN 202220116873 U CN202220116873 U CN 202220116873U CN 216781409 U CN216781409 U CN 216781409U
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- polishing
- lead screw
- driving assembly
- axis servo
- screw driving
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Abstract
The embodiment of the utility model discloses a wafer polishing mechanism which comprises a base, a polishing motor, a pressing cylinder, a first XZ-axis servo lead screw driving assembly and a second XZ-axis servo lead screw driving assembly, wherein the polishing motor and the pressing cylinder are coaxially arranged on the base in an opposite vertical mode, a lower clamping plate is arranged on an output shaft of the polishing motor, a pressing shaft is arranged on a piston rod of the pressing cylinder, an upper clamping plate is correspondingly arranged at the bottom end of the pressing shaft, the polishing mechanism further comprises a first XZ-axis servo lead screw driving assembly and a second XZ-axis servo lead screw driving assembly, polishing assemblies are respectively arranged on the first XZ-axis servo lead screw driving assembly and the second XZ-axis servo lead screw driving assembly, each polishing assembly comprises a polishing motor, the polishing motor is vertically arranged, a polishing roller is arranged on the output shaft of the polishing motor, and a polishing plane, an upper polishing inclined plane and a lower polishing inclined plane are respectively used for polishing upper and lower chamfers. The utility model has simple structure and high polishing efficiency and can accurately polish the edge of the wafer.
Description
Technical Field
The utility model relates to the technical field of wafer polishing, in particular to a wafer polishing mechanism.
Background
In the chip production process, polishing is required after the wafer is cut. Conventional polishing is inefficient due to the high hardness of the wafer. Therefore, the conventional wafer is placed on the chuck of the motor, and the high-speed rotation of the motor drives the wafer to rotate at a high speed, so that the polishing efficiency is improved.
However, the existing polishing mechanism for chamfering the edge of the wafer has a complex structure and low polishing efficiency.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the embodiments of the present invention is to provide a wafer polishing mechanism to improve polishing efficiency.
In order to solve the above technical problems, an embodiment of the present invention provides a wafer polishing mechanism, which includes a base, a polishing motor, and a pressing cylinder, wherein the polishing motor and the pressing cylinder are vertically disposed on the base in a coaxial opposite direction, an output shaft of the polishing motor is provided with a lower chuck plate, a piston rod of the pressing cylinder is provided with a pressing shaft, a bottom end of the pressing shaft is correspondingly provided with an upper chuck plate, polishing mechanism still includes the servo lead screw drive assembly of first XZ axle, the servo lead screw drive assembly of second XZ axle, the servo lead screw drive assembly of first XZ axle, the servo lead screw drive assembly correspondence of second XZ axle is located on the base, the servo lead screw drive assembly of first XZ axle, all be equipped with the subassembly of polishing on the servo lead screw drive assembly of second XZ axle, the subassembly of polishing includes grinding motor, the vertical setting of grinding motor, be equipped with the grinding roller on grinding motor's the output shaft, the correspondence of grinding roller periphery is equipped with the plane of polishing and is used for polishing the upper and lower chamfer respectively and polish the inclined plane with polish the inclined plane down.
Furthermore, the upper polishing inclined plane and the lower polishing inclined plane are correspondingly arranged on the upper side and the lower side of the polishing plane.
Further, the polishing assembly further comprises an alignment cylinder which is coaxially and oppositely arranged with the polishing motor, an alignment shaft is arranged on a piston rod of the alignment cylinder, the front end of the alignment shaft is conical, and an alignment groove matched with the alignment shaft is formed in the front end of the polishing roller.
Furthermore, an ultrasonic vibrator is arranged on the pressing shaft.
The utility model has the beneficial effects that: the utility model has simple structure and high polishing efficiency and can accurately polish the edge of the wafer.
Drawings
Fig. 1 is a perspective view of an angle 1 of a wafer polishing mechanism according to an embodiment of the present invention.
Fig. 2 is a perspective view of an angle 2 of the wafer polishing mechanism according to the embodiment of the present invention.
Fig. 3 is a perspective view of an angle 3 of the wafer polishing mechanism according to the embodiment of the present invention.
FIG. 4 is a perspective view of an angle of a grinding roller according to an embodiment of the present invention.
Figure 5 is a perspective view of another angle of a grinding roller in accordance with an embodiment of the present invention.
Fig. 6 is a perspective view of the aligning cylinder according to the embodiment of the present invention.
Description of the reference numerals
The grinding machine comprises a base 1, a polishing motor 11, a pressing cylinder 12, a pressing shaft 13, a lower chuck 14, an upper chuck 15, a first XZ-axis servo screw rod driving assembly 21, a second XZ-axis servo screw rod driving assembly 22, a grinding motor 31, a grinding roller 32, a grinding plane 33, an upper grinding inclined plane 34, a lower grinding inclined plane 35, an alignment groove 36, an alignment cylinder 37 and an alignment shaft 38.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other without conflict, and the present invention is further described in detail with reference to the drawings and specific embodiments.
If directional indications (such as up, down, left, right, front, and rear … …) are provided in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the movement, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only used for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
Referring to fig. 1 to 6, a wafer polishing mechanism according to an embodiment of the present invention includes a base, a polishing motor, a pressing cylinder, a first XZ-axis servo screw driving assembly, and a second XZ-axis servo screw driving assembly.
The polishing motor and the compressing cylinder are coaxially and vertically arranged on the base in opposite directions, a lower chuck plate is arranged on an output shaft of the polishing motor, a compressing shaft is arranged on a piston rod of the compressing cylinder, and an upper chuck plate is correspondingly arranged at the bottom end of the compressing shaft.
The first XZ axis servo lead screw driving assembly and the second XZ axis servo lead screw driving assembly are correspondingly arranged on the base, and the first XZ axis servo lead screw driving assembly and the second XZ axis servo lead screw driving assembly are respectively provided with a polishing assembly. The two groups of polishing components are respectively and correspondingly arranged on the left side and the right side of the lower chuck plate. The polishing assembly comprises a polishing motor, the polishing motor is vertically arranged, a polishing roller is arranged on an output shaft of the polishing motor, and the periphery of the polishing roller is correspondingly provided with a polishing plane and an upper polishing inclined plane and a lower polishing inclined plane which are respectively used for polishing upper and lower chamfers. When the polishing device is specifically implemented, the polishing plane, the upper polishing inclined plane and the lower polishing inclined plane can be realized by adopting the detachable polishing sleeve, and the polishing device is convenient to replace.
As an implementation mode, the upper polishing inclined plane and the lower polishing inclined plane are correspondingly arranged on the upper side and the lower side of the polishing plane, and the polishing plane, the upper polishing inclined plane and the lower polishing inclined plane form a polishing surface with a trapezoidal section.
As an implementation mode, the polishing assembly further comprises an alignment cylinder coaxially arranged opposite to the polishing motor, an alignment shaft is arranged on a piston rod of the alignment cylinder through a bearing, the front end of the alignment shaft is conical, and an alignment groove matched with the alignment shaft is formed in the front end of the polishing roller. The output shaft of the grinding motor fixes one end of the grinding roller, and the alignment shaft props against the other end of the grinding roller, so that the stability of the grinding roller during polishing and grinding is improved.
As an implementation mode, the pressing shaft is provided with the ultrasonic vibrator, and the ultrasonic vibrator further improves the polishing efficiency.
The working principle of the utility model is as follows: positioning the wafer to be polished after being placed on the lower chuck, and driving the upper chuck to compress the wafer after the positioning is finished; the alignment shaft is driven to extend to prop against the grinding roller; the polishing motor and the grinding motor work to drive the two groups of grinding assemblies to preset positions, so that the corresponding grinding surfaces (grinding planes, upper grinding inclined surfaces or lower grinding inclined surfaces) grind the wafer.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A wafer polishing mechanism comprises a base, a polishing motor and a pressing cylinder, wherein the polishing motor and the pressing cylinder are coaxially and oppositely vertically arranged on the base, a lower chuck plate is arranged on an output shaft of the polishing motor, a pressing shaft is arranged on a piston rod of the pressing cylinder, an upper chuck plate is correspondingly arranged at the bottom end of the pressing shaft, the polishing mechanism is characterized by further comprising a first XZ-axis servo lead screw driving assembly and a second XZ-axis servo lead screw driving assembly, the first XZ-axis servo lead screw driving assembly and the second XZ-axis servo lead screw driving assembly are correspondingly arranged on the base, the first XZ-axis servo lead screw driving assembly and the second XZ-axis servo lead screw driving assembly are respectively provided with a polishing assembly, the polishing assembly comprises a polishing motor, the polishing motor is vertically arranged, a polishing roller is arranged on an output shaft of the polishing motor, and the periphery of the polishing roller is correspondingly provided with a polishing plane and an upper polishing inclined plane and a lower polishing inclined plane which are respectively used for polishing upper and lower chamfers.
2. The wafer polishing mechanism as recited in claim 1, wherein the upper bevel and the lower bevel are disposed on upper and lower sides of the polishing surface.
3. The wafer polishing mechanism as recited in claim 1, wherein the polishing assembly further comprises an alignment cylinder disposed coaxially opposite the polishing motor, a piston rod of the alignment cylinder is provided with an alignment shaft, a front end of the alignment shaft is tapered, and a front end of the polishing roller is provided with an alignment groove matching the alignment shaft.
4. The wafer polishing mechanism as recited in claim 1, wherein the hold down shaft is provided with an ultrasonic transducer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220116873.9U CN216781409U (en) | 2022-01-17 | 2022-01-17 | Wafer polishing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220116873.9U CN216781409U (en) | 2022-01-17 | 2022-01-17 | Wafer polishing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216781409U true CN216781409U (en) | 2022-06-21 |
Family
ID=82013989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220116873.9U Active CN216781409U (en) | 2022-01-17 | 2022-01-17 | Wafer polishing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216781409U (en) |
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2022
- 2022-01-17 CN CN202220116873.9U patent/CN216781409U/en active Active
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