CN216770797U

CN216770797U - Infrared temperature measuring device of non-contact bus connector department

Info

Publication number: CN216770797U
Application number: CN202122657958.6U
Authority: CN
Inventors: 杨立海; 李楚良; 周明睿; 朱智军
Original assignee: Acrel Co Ltd; Jiangsu Acrel Electrical Manufacturing Co Ltd
Current assignee: Acrel Co Ltd; Jiangsu Acrel Electrical Manufacturing Co Ltd
Priority date: 2021-11-02
Filing date: 2021-11-02
Publication date: 2022-06-17
Anticipated expiration: 2031-11-02

Abstract

The utility model relates to an infrared temperature measuring device at a non-contact bus connector, which comprises a collector (1), a temperature measuring module (2) and two buses (3), wherein the collector (1) is connected with the temperature measuring module (2) through the two buses (3), and the temperature measuring module (2) comprises an infrared temperature measuring probe (21) used for collecting temperature data at the bus connector. Compared with the prior art, the utility model has the advantages of accurate temperature measurement, convenient operation and the like.

Description

Infrared temperature measuring device of non-contact bus connector department

Technical Field

The utility model relates to a temperature measuring device, in particular to an infrared temperature measuring device at a non-contact bus connector.

Background

With the rapid development of the economy of China, the electricity consumption in China is increasing day by day. In recent years, bus ducts instead of cables have become a main development trend of power supply guidelines in China. In the practical application scene of the bus, the bus temperature rise is too high to cause safety problems often due to overlarge bus load, too thin bus design and insufficient wiring at the bus duct connection position. Therefore, many occasions using the bus require accurate temperature measurement on the bus joint, so that the problem is early warned and solved.

Traditional bus duct connector temperature measurement mode divide into two kinds, and the first kind is the manual hand-held temperature measurement instrument, measures outside casing temperature, and this mode both consumed the manpower, and the temperature data that obtains is very inaccurate again. The second is inside the probe gos deep into the bus duct, through probe and bus duct contact, gets electricity and temperature measurement simultaneously, and this mode causes the safety problem easily because the probe has the contact with the generating line.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provide an infrared temperature measuring device at a non-contact bus connector.

The purpose of the utility model can be realized by the following technical scheme:

according to one aspect of the utility model, the infrared temperature measuring device at the non-contact bus connector comprises a collector, a temperature measuring module and two buses, wherein the collector is connected with the temperature measuring module through the two buses, and the temperature measuring module comprises an infrared temperature measuring probe for collecting temperature data at the bus connector.

As a preferable technical scheme, a plurality of temperature measuring modules are arranged and distributed in a matrix manner in the temperature measuring area of the bus connector,

as a preferred technical scheme, the temperature measuring modules are respectively connected with the collector.

As an optimized technical scheme, the collector comprises a first MCU, a dot matrix liquid crystal display, an RS485 communication circuit, a key input circuit and a first two-bus interface, wherein the first MCU is respectively connected with the dot matrix liquid crystal display, the RS485 communication circuit and the key input circuit.

As a preferable technical scheme, the RS485 communication circuit is connected with a user terminal.

As a preferred technical solution, the collector further includes a first ferroelectric memory and a first ferroelectric memory 16 respectively connected to the first MCU.

As a preferred technical scheme, the collector further comprises a temperature measuring module automatic addressing and fault positioning circuit which is built in the first MCU.

As a preferred technical solution, the temperature measuring module further includes a second MCU, an indicator light, an external NTC, a second ferroelectric memory, and a second bus interface, and the second MCU is connected to the infrared temperature measuring probe, the indicator light, the external NTC, the second ferroelectric memory, and the second bus interface, respectively.

As a preferred technical scheme, the temperature measuring module further comprises a temperature and humidity sensor connected with the second MCU.

As a preferred technical scheme, one collector is connected with 160 temperature measurement modules at most.

Compared with the prior art, the utility model has the following advantages:

1) the temperature measurement is accurate, the operation is convenient, the collector supplies power and communicates with the temperature measurement module through the two buses, the temperature measurement module realizes accurate temperature measurement on the bus wiring position by collecting data of the infrared temperature measurement probe, and the terminal can be connected with the collector through RS485 to read temperature data in real time, so that the operation convenience is greatly improved;

2) matrix temperature measurement: measuring the area temperature of 16X4 areas at the bus duct connector in a large range, and realizing accurate temperature measurement in the range of-10 ℃ to 150 ℃;

3) measuring the temperature and humidity of the environment: the internal ambient temperature of the measuring module and the internal ambient temperature of the bus duct and the internal humidity of the bus duct are measured to ensure the safety of the bus duct.

4) Automatic addressing of modules: the collector can carry out one-key automatic addressing on the temperature measurement module and has a fault positioning function.

5) Communication: data acquisition can be carried out on the collector through the RS485 interface, and a Modbus protocol can be supported.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural diagram of a collector of the present invention;

FIG. 3 is a schematic structural diagram of a temperature measurement module according to the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the scope of protection of the present invention.

As shown in fig. 1-3, an infrared temperature measuring device at a non-contact bus connector comprises a collector 1, a temperature measuring module 2 and two buses 3, wherein the collector 1 is connected with the temperature measuring module 2 through the two buses 3, and the temperature measuring module 2 comprises an infrared temperature measuring probe 21 for collecting temperature data at the bus connector.

According to the non-contact infrared temperature measuring device, the collector supplies power and communicates with the temperature measuring module through the two buses, the temperature measuring module realizes accurate temperature measurement on the bus connection position by collecting data of the infrared temperature measuring probe, and the terminal can be connected with the collector through RS485 to read temperature data in real time.

The temperature measurement modules 2 are arranged in a plurality of matrix type and distributed in temperature measurement areas of the bus connectors, specifically, the temperature measurement modules can measure the area temperature of 16X4 areas of the bus duct connectors in a large range, and accurate temperature measurement in the range of-10 ℃ to 150 ℃ is realized.

The plurality of temperature measuring modules 2 are respectively connected with the collectors 1, and one collector 1 is connected with 160 temperature measuring modules 2 at most. The temperature measurement module supplies power through two buses, and the biggest difference with traditional contact temperature measurement design is that the temperature measurement module is kept apart with the generating line completely, can not cause the generating line safety problem because of temperature measurement system completely, and can realize inside accurate temperature measurement, early warning generating line temperature rise too high problem in advance. The collector and the temperature measurement module can carry out one-key addressing through the internal communication of the collection and temperature measurement modules, and the product is installed and used on site conveniently.

The collector 1 comprises a first MCU11, a dot matrix liquid crystal display 12, an RS485 communication circuit 13, a key input circuit 14 and a first two-bus interface 15, wherein the first MCU11 is respectively connected with the dot matrix liquid crystal display 12, the RS485 communication circuit 13 and the key input circuit 14. And the RS485 communication circuit 13 is connected with a user terminal. The collector 1 further comprises first

ferroelectric memories

16 and 16 connected to the first MCU11, respectively. The collector 1 further comprises a temperature measuring module automatic addressing and fault positioning circuit which is arranged in the first MCU 11.

The temperature measuring module 2 further comprises a second MCU22, an indicator light 23, an external NTC24, a second ferroelectric memory 25 and a second bus interface 26, wherein the second MCU22 is respectively connected with the infrared temperature measuring probe 21, the indicator light 23, the external NTC24, the second ferroelectric memory 25 and the second bus interface 26. Temperature measurement module 2 still include the temperature and humidity sensor 27 who is connected with second MCU22, the inside and the inside ambient temperature of bus duct of measurement module, and the inside humidity of bus duct, ensure bus duct safety.

While the utility model has been described with reference to specific embodiments, the utility model is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the utility model. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides an infrared temperature measuring device of non-contact bus connector department, its characterized in that, includes collector (1), temperature measurement module (2) and two buses (3), collector (1) be connected with temperature measurement module (2) through two buses (3), temperature measurement module (2) including infrared temperature probe (21) that are used for gathering the temperature data of bus connector department.

2. The infrared temperature measuring device at the non-contact bus connector as recited in claim 1, characterized in that the temperature measuring module (2) is provided in a plurality and distributed in a matrix form in the temperature measuring area at the bus connector.

3. The infrared temperature measuring device at the non-contact bus connector according to claim 2, wherein the plurality of temperature measuring modules (2) are respectively connected with the collector (1).

4. The infrared temperature measuring device at the non-contact bus connector according to claim 1, wherein the collector (1) comprises a first MCU (11), a dot matrix liquid crystal display (12), an RS485 communication circuit (13), a key input circuit (14) and a first two-bus interface (15), and the first MCU (11) is respectively connected with the dot matrix liquid crystal display (12), the RS485 communication circuit (13) and the key input circuit (14).

5. The infrared temperature measuring device at the non-contact bus connector as recited in claim 4, wherein said RS485 communication circuit (13) is connected with a user terminal.

6. The infrared temperature measuring device at the non-contact bus connector according to claim 4, wherein the collector (1) further comprises a first ferroelectric memory (16) and a clock chip RX8025T (17) respectively connected to the first MCU (11).

7. The infrared temperature measuring device at the non-contact bus connector according to claim 4, wherein the collector (1) further comprises a temperature measuring module automatic addressing and fault locating circuit built in the first MCU (11).

8. The infrared temperature measurement device at the non-contact bus connector according to claim 1, wherein the temperature measurement module (2) further comprises a second MCU (22), an indicator light (23), an external NTC (24), a second ferroelectric memory (25) and a second bus interface (26), and the second MCU (22) is respectively connected with the infrared temperature measurement probe (21), the indicator light (23), the external NTC (24), the second ferroelectric memory (25) and the second bus interface (26).

9. The infrared temperature measuring device at the non-contact bus connector according to claim 8, wherein the temperature measuring module (2) further comprises a temperature and humidity sensor (27) connected with the second MCU (22).

10. The infrared temperature measuring device at the non-contact bus connector according to claim 1, wherein one collector (1) is connected with at most 160 temperature measuring modules (2).