CN216769109U - Heat dissipation device and flashlight - Google Patents

Abstract

The utility model belongs to the field of lighting technical equipment, and particularly relates to a heat dissipation device and a flashlight. The heat dissipation device is configured to dissipate heat of a target, wherein the target generates heat in a conductive state. The heat sink includes: the lamp shell structure is provided with a placing cavity for accommodating a target object; and the heat dissipation structure is positioned in the placement cavity, the heat dissipation structure comprises a vapor chamber which is horizontally paved at the bottom of the placement cavity and a heat dissipation piece which is arranged relative to the vapor chamber, the target object is clamped between the heat dissipation piece and the vapor chamber, the surfaces of two sides of the target object are respectively abutted to the vapor chamber and the heat dissipation piece, and at least part of the peripheral side surface of the heat dissipation piece is abutted to the cavity wall of the placement cavity. The lamp shell structure conducts heat to the lamp shell structure synchronously in two directions, and then conducts the received heat to the external space, so that the heat dissipation efficiency of the heat dissipation device is improved.

Description

Heat dissipation device and flashlight

Technical Field

The utility model belongs to the field of lighting technical equipment, and particularly relates to a heat dissipation device and a flashlight.

Background

At present, lighting equipment is an essential tool in people's lives, and in order to meet the use requirements in different scenes, different types of lighting lamps are pushed to the market at a time, wherein flashlights are the most common. After the flashlight is used for a long time, a large amount of heat is generated at the lamp holder, and if the heat in the flashlight cannot be timely and effectively conducted out, the use efficiency of the flashlight can be influenced.

Therefore, how to simply and effectively improve the heat dissipation efficiency of the flashlight lamp holder becomes a problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the present application is to provide a heat dissipation device, which aims to solve the problem of how to improve the heat dissipation efficiency of a flashlight.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: there is provided a heat dissipating device configured to dissipate heat of an object, wherein the object generates heat in an electrically conductive state, the heat dissipating device comprising:

the lamp shell structure is provided with a placing cavity for accommodating the target; and

the heat radiation structure is located settle the chamber, heat radiation structure including the tiling set up in settle the soaking pit at the bottom of the chamber and relative the radiating piece that the soaking pit set up, the target clamp is located the radiating piece with between the soaking pit, just the both sides surface butt respectively of target the soaking pit with the radiating piece, the side at least part butt of week of radiating piece settle the chamber wall in chamber.

In some embodiments, the peripheral side of the soaking plate at least partially abuts the wall of the placement chamber.

In some embodiments, the peripheral side surface of the soaking plate is provided with an inclined surface, and the area of the plate surface of the soaking plate, which is abutted against the bottom of the placing cavity, is smaller than the area of the plate surface of the soaking plate, which is abutted against the target object.

In some embodiments, the heat dissipation structure further includes a reflector located in the placement cavity, a light hole is formed in the middle of the heat dissipation member, one end of the reflector is sleeved in the light hole, and the other end of the reflector is connected with the wall of the placement cavity.

In some embodiments, the aperture of the light-transmitting hole increases in a direction in which the target object points to the heat dissipation member, and the peripheral side surface of the reflector is fitted to the hole wall of the light-transmitting hole and presses the heat dissipation member toward the target object.

In some embodiments, the surface of the heat dissipation member facing away from the target object is further provided with a heat dissipation groove, and one end of the heat dissipation groove extends to the hole wall of the light transmission hole.

In some embodiments, the heat dissipation structure further includes a heat dissipation portion, the heat dissipation portion is disposed in a plate shape, the heat dissipation portion is connected to an edge of the heat dissipation member, and a side surface of the heat dissipation portion abuts against a wall of the placement cavity.

In some embodiments, the lamp housing structure includes a lamp cap and a lamp cover, the lamp cap defines the mounting cavity, and the lamp cover covers the opening of the mounting cavity.

In some embodiments, the target includes a circuit board and a component, the circuit board being located between the heat spreader and the heat spreader; the circuit board is provided with a through hole, one end of the component is contained in the through hole and abutted against the soaking plate, and the other end of the component is arranged towards the placing cavity through the light-transmitting hole.

Another object of the present application is to provide a flashlight, which includes the heat dissipation device as described above, and further includes a lamp barrel connected to the lamp housing structure, and a battery disposed in the lamp barrel.

The application provides a heat abstractor's beneficial effect lies in: through pressing from both sides the circuit board and locating between soaking plate and the radiating piece to make the produced heat of circuit board and components and parts, can carry out synchronous conduction to soaking plate and radiating piece respectively through circuit board both sides face, and the soaking plate will be followed the heat that circuit board and/or components and parts received towards the chamber end conduction of settling the chamber, the radiating piece can be with the heat of receiving towards the chamber wall conduction of settling the chamber through its week side, through two directions synchronous heat conduction to the lamp body structure promptly, the lamp body structure is with the heat conduction of receiving to exterior space again, thereby heat abstractor's radiating efficiency has been improved.

The application provides a flashlight's beneficial effect lies in: through pressing from both sides the circuit board and locating between soaking plate and the radiating piece to make the produced heat of circuit board and components and parts, can carry out synchronous conduction to soaking plate and radiating piece respectively through circuit board both sides face, and the soaking plate will be followed the heat that circuit board and/or components and parts received towards the chamber end conduction of settling the chamber, the radiating piece can be with the heat of receiving towards the chamber wall conduction of settling the chamber through its week side, through two directions synchronous heat conduction to the lamp body structure promptly, the lamp body structure is with the heat conduction of receiving to exterior space again, thereby the radiating efficiency of flashlight has been improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic perspective view illustrating a heat dissipation structure of a heat dissipation device according to an embodiment of the present application;

fig. 2 is a schematic cross-sectional view of a heat dissipating device to which the heat dissipating structure of fig. 1 is applied;

FIG. 3 is an enlarged view of a portion of FIG. 2 at N;

fig. 4 is a schematic perspective view of a heat dissipation structure according to another embodiment of the present application;

fig. 5 is a schematic cross-sectional view of a heat dissipating device to which the heat dissipating structure of fig. 4 is applied;

fig. 6 is a perspective view of a heat sink of the heat dissipation structure of fig. 1;

FIG. 7 is a partial view of the heat sink of the embodiment shown in FIG. 2;

fig. 8 is a schematic perspective view of the heat dissipation structure of the embodiment shown in fig. 2;

FIG. 9 is an exploded schematic view of the heat dissipation structure of FIG. 8;

FIG. 10 is a perspective view of a flashlight according to another embodiment of the present application.

Wherein, in the figures, the respective reference numerals:

100. a heat sink; 10. A lamp housing structure; 11. A lamp cap;

12. a lamp cover; 20. A heat dissipation structure; 21. A heat sink;

22. a vapor chamber; 23. A reflector; 24. A heat dissipating section;

30. a light emitting structure; 31. A lamp bead; 32. A circuit board;

40. a lamp barrel; 41. A switch; 50. A threaded hole;

51. a screw; 121. A placement cavity; 211. A heat sink;

212. a light-transmitting hole; 321. A through hole; 200. A flashlight;

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application, and the specific meaning of the terms will be understood by those skilled in the art according to the particular situation. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1 to 3, a heat dissipation device 100 configured to dissipate heat of a target object is provided in an embodiment of the present application, wherein the target object generates heat in a conductive state. Optionally, in this embodiment, the target is the light emitting structure 30, and in other embodiments, the target may also be a control structure or a processor structure. The light emitting structure 30 includes a circuit board 32 and a lamp bead 31 disposed on the circuit board 32. The circuit board 32 provides electric energy for the lamp beads 31, and the lamp beads 31 and the circuit board 32 generate heat simultaneously in a conductive state.

Referring to fig. 1 to 3, the heat dissipation device 100 includes a lamp housing structure 10 and a heat dissipation structure 20. The lamp housing structure 10 has a mounting cavity 121 for accommodating the light emitting structure 30. Optionally, the lamp housing structure 10 is made of a plastic material or a metal material. The heat dissipation structure 20 is located in the seating cavity 121. The heat dissipation structure 20 includes a vapor chamber 22 disposed at the bottom of the accommodating cavity 121 in a tiled manner and a heat dissipation member 21 disposed opposite to the vapor chamber 22, and the light emitting structure 30 is sandwiched between the heat dissipation member 21 and the vapor chamber 22. Alternatively, both side surfaces of the light emitting structure 30 abut the soaking plate 22 and the heat sink 21, respectively. The peripheral side surface of the heat sink 21 at least partially abuts against the wall of the placement chamber 121. In this embodiment, the both sides face of circuit board 32 is butt soaking board 22 and radiating piece 21 respectively, and the heat that circuit board 32 produced is through its both sides face respectively to soaking board 22 and radiating piece 21 conduction, and the heat that lamp pearl 31 produced can be through circuit board 32 conduction to soaking board. In some embodiments, a portion of the heat generated by the lamp beads 31 is conducted to the soaking plate 22 through the circuit board 32, and another portion can be directly conducted to the soaking plate 22 through the lamp beads 31. Alternatively, the soaking plate 22 can conduct the received heat toward the bottom of the housing chamber 121, and the heat sink 21 can conduct the received heat toward the wall of the housing chamber 121 through the peripheral side thereof.

Referring to fig. 1 to 3, the circuit board 32 is sandwiched between the soaking plate 22 and the heat dissipating member 21, so that heat generated by the circuit board 32 and the lamp beads 31 can be conducted to the soaking plate 22 and the heat dissipating member 21 through two side plate surfaces of the circuit board 32, respectively, and the soaking plate 22 conducts the heat received from the circuit board 32 and/or the lamp beads 31 to the bottom of the cavity of the accommodating cavity 121, the heat dissipating member 21 can conduct the received heat to the cavity wall of the accommodating cavity 121 through the peripheral side of the heat dissipating member 21, that is, the heat is conducted to the lamp housing structure 10 through two directions, and the lamp housing structure 10 conducts the received heat to an external space, thereby improving the heat dissipating efficiency of the heat dissipating device 100.

Optionally, the circuit board 32 is provided with wire holes for fixing wires on the circuit board 32.

In some embodiments, the shape of the peripheral side surface of the heat sink 21 is adapted to the shape of the placement cavity 121, that is, the peripheral side surface of the heat sink 21 is entirely abutted against the cavity wall of the placement cavity 121, so that the contact area between the heat sink 21 and the lamp housing structure 10 is increased, and the heat dissipation efficiency is improved.

Referring to fig. 1-3, in some embodiments, the peripheral side of the soaking plate 22 at least partially abuts against the wall of the accommodating chamber 121. The soaking plate 22 conducts heat to the lamp housing structure 10 through the plate surface and the peripheral side surface thereof at the same time, thereby increasing the contact area with the lamp housing structure 10.

Alternatively, the shape of the circumferential side surface of the soaking plate 22 is adapted to the shape of the placing chamber 121 so that the circumferential side surface of the soaking plate 22 entirely abuts against the chamber wall of the placing chamber 121.

Referring to fig. 1 to 3, the heat sink 21 and the soaking plate 22 are made of metallic copper. The copper metal has excellent heat conductivity and is also characterized by abundant resources.

In some embodiments, the peripheral side of the vapor chamber 22 is disposed as an inclined surface, and the area of the plate surface of the vapor chamber 22 abutting against the bottom of the installation cavity 121 is smaller than the area of the plate surface of the vapor chamber 22 abutting against the light emitting structure 30.

Alternatively, the cross section of the soaking plate 22 perpendicular to the plate surface thereof is trapezoidal in shape, and the short bottom side of the trapezoid abuts against the cavity bottom of the placement cavity 121.

Referring to fig. 4 to 6, alternatively, the peripheral side surface of the soaking plate 22, which is disposed in an inclined plane, not only can increase the contact area between the soaking plate 22 and the cavity wall of the placing cavity 121, but also can increase the stability of the connection between the soaking plate 22 and the cavity wall of the placing cavity 121.

In some embodiments, the heat dissipation structure 20 further includes a reflector 23 located in the installation cavity 121, a light hole 212 is formed in a middle position of the heat dissipation member 21, one end of the reflector 23 is sleeved in the light hole 212, and the other end of the reflector 23 is connected to a wall of the installation cavity 121.

Optionally, the lamp bead 31 is partially received in the light-transmitting hole 212 and projects light toward the reflector 23.

Referring to fig. 1 and 3, in some embodiments, the target includes a circuit board (32) and a component, the circuit board 32 is located between the soaking plate 22 and the heat sink 21; the circuit board 32 is formed with a through hole 321, one end of the component is received in the through hole 321 and abuts against the soaking plate 22, and the other end of the component is disposed toward the mounting cavity 121 through the light hole 212. It is understood that the component may be a lamp bead, a display chip, a sensor chip, or other electronic device that generates heat in a conductive state. In this embodiment, the component is a lamp bead 31, and the lamp bead 31 is an LED lamp bead.

Referring to fig. 1 and 3, optionally, the size of the through hole 321 formed in the circuit board 32 is the same as that of the lamp bead 31. One end of the lamp bead 31 is embedded into the through hole 321 of the circuit board 32 and penetrates through the circuit board 32 to be abutted against the soaking plate 22 downwards, so that the lamp bead 31 is in direct contact with the soaking plate 22, and the lamp bead 31 can conduct heat to the soaking plate 22 directly in a conductive state.

Referring to fig. 6, optionally, a light hole 212 is formed at the bottom of the reflector 23, the light hole 212 is used for passing through the lamp bead 31, the bottom of the reflector 23 abuts against the circuit board 32 through the light hole 212, and the outer side wall of the reflector 23 abuts against the hole wall of the light hole 212. The lamp beads 31, the circuit board 32, the heat dissipation member 21, the reflector 23 and the soaking plate 22 are mutually abutted to form a stable structure.

Referring to fig. 4 and 6, one end of the lamp bead 31 abuts against the soaking plate 22 through the through hole 321, the other end of the lamp bead 31 is accommodated in the reflector 23 through the light hole 212 and projects light toward the reflector 23, and the reflector 23 focuses and reflects the light outward.

When the lamp is used, partial heat generated by the lamp beads 31 is directly transmitted to the soaking plate 22 downwards and is transmitted to the radiating piece 21 through the circuit board 32 outwards, the side edges of the soaking plate 22 and the radiating piece 21 are respectively abutted to the lamp holder 11, so that the heat is transmitted to the outside of the lamp holder 11, and the radiating function is realized.

Referring to fig. 4 and 6, it can be understood that four threaded holes 50 are spaced apart from each other at the bottom of the mounting cavity 121. The heat sink 21, the circuit board 32 and the soaking plate 22 are also provided with threaded holes 50 at positions corresponding to the threaded holes 50, and the heat sink 21, the circuit board 32, the soaking plate 22 and the lamp cap 11 are locked together by screws 51.

On one hand, the heat dissipation piece 21 and the soaking plate 22 can efficiently dissipate heat of the lamp beads 31 and the circuit board 32, and can conduct the heat to the outside to the lamp shell structure 10 for heat dissipation treatment, so that the overall heat dissipation efficiency is better; on the other hand, the overall structure of the heat dissipation device 100 is firmer and more compact, and the stability is better.

Referring to fig. 6, in some embodiments, the aperture of the light-transmitting hole 212 is gradually increased along the direction of the light-emitting structure 30 pointing to the heat dissipation member 21, and the outer peripheral side of the reflector 23 is fitted with the hole wall of the light-transmitting hole 212 and presses the heat dissipation member 21 toward the light-emitting structure 30.

Optionally, the reflector 23 presses the heat sink 21 toward the soaking plate 22, thereby making the structure more compact and stable, and also facilitating heat conduction.

Referring to fig. 6, optionally, the hole walls of the light-transmitting holes 212 are disposed obliquely, that is, the hole walls of the light-transmitting holes 212 are disposed to be attached to the outer side wall of the reflector 23, so as to increase the contact area between the reflector 23 and the hole walls.

In some embodiments, the surface of the heat dissipation member 21 facing away from the light emitting structure 30 is further formed with a heat dissipation groove 211, and one end of the heat dissipation groove 211 extends to the wall of the light transmission hole 212.

Referring to fig. 6, optionally, on one hand, the heat dissipation groove 211 may reduce the weight of the heat dissipation member 21, and on the other hand, the heat dissipation groove 211 may also increase the heat dissipation area of the heat dissipation member 21, thereby improving the overall heat dissipation efficiency.

Alternatively, the heat dissipation grooves 211 are provided in plurality at intervals, so that it is possible to increase the heat dissipation area of the heat dissipation member 21 by 40% while reducing the weight of the heat dissipation member 21 by 22%.

Referring to fig. 4 to 6, in some embodiments, the heat dissipation structure 20 further includes a heat dissipation portion 24, the heat dissipation portion 21 is disposed in a plate shape, the heat dissipation portion 24 is connected to an edge of the heat dissipation portion 21, and a side surface of the heat dissipation portion 24 abuts against a cavity wall of the mounting cavity 121.

Optionally, the thickness of the heat dissipation member 21 ranges from 10 mm to 20 mm.

Referring to fig. 4 and 6, alternatively, one end of the heat dissipation part 24 is connected to the heat dissipation member 21, and the other end of the heat dissipation part 24 extends toward the gap between the reflector 23 and the cavity wall of the installation cavity 121, so as to increase the heat dissipation area.

Referring to fig. 4 and 6, optionally, the two opposite side surfaces of the heat dissipation portion 24 respectively abut against the cavity wall of the placement cavity 121 and the reflector 23, so that the connection between the heat dissipation member 21 and other structural members is fastened, the contact area between the heat dissipation member 21 and the lamp housing structure 10 is increased, the heat conduction rate is increased, and the heat dissipation efficiency is increased.

Alternatively, the heat dissipation portion 24 is integrally formed with the heat dissipation member 21.

Referring to fig. 4 and 6, in some embodiments, the heat dissipation portions 24 are disposed at intervals along the circumferential direction of the heat dissipation member 21. A threaded hole 50 is formed between two adjacent heat dissipation portions 24.

Referring to fig. 5, in some embodiments, the lamp housing structure 10 includes a lamp cap 11 and a lamp cover 12, the lamp cap 11 defines a mounting cavity 121, and the lamp cover 12 covers an opening of the mounting cavity 121.

Optionally, the lamp cover 12 is detachably connected to the lamp base 11 by a screw structure.

Referring to fig. 10, the present invention further provides a flashlight 200, the flashlight 200 includes the heat dissipation device 100, the specific structure of the heat dissipation device 100 refers to the above embodiments, and since the flashlight 200 adopts all technical solutions of all the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are also provided, and are not repeated herein.

Optionally, the flashlight 200 provided by the present application includes the heat dissipation device 100, and the circuit board 32 is clamped between the soaking plate 22 and the heat dissipation member 21, so that the heat generated by the circuit board 32 and the components can be conducted to the soaking plate 22 and the heat dissipation member 21 through the two side plate surfaces thereof, and the soaking plate 22 can conduct the heat received from the circuit board 32 and/or the components toward the cavity bottom of the placement cavity 121, and the heat dissipation member 21 can conduct the received heat to the cavity wall of the placement cavity 121 through the peripheral side surface thereof, that is, conduct the heat to the lamp housing structure 10 through two directions, and the lamp housing structure 10 conducts the received heat to the external space, thereby improving the heat dissipation efficiency of the flashlight 200.

Optionally, the component is electrically connected to the circuit board 32 and receives electric energy from the circuit board 32, and in this embodiment, the component is an LED lamp bead.

In some embodiments, flashlight 200 further includes a light cartridge 40 coupled to housing structure 10 and a battery disposed within light cartridge 40.

Optionally, a lamp cartridge 40 is connected to the base 11 and houses a battery. Alternatively, the lamp holder 40 and the lamp head 11 may be detachably connected by the engagement of the screw 51 and the threaded hole 50, or the lamp head 11 and the lamp holder 40 may be integrally formed.

Referring to fig. 10, optionally, a switch 41 for controlling the on/off of the lamp bead 31 is disposed on the lamp barrel 40.

The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims (10)

1. A heat dissipating device (100) configured to dissipate heat of an object, wherein the object generates heat in a conductive state, the heat dissipating device (100) comprising:

a lamp housing structure (10) having a housing cavity (121) for accommodating the target; and

heat radiation structure (20), be located settle chamber (121), heat radiation structure (20) including the tiling set up in vapor chamber (22) and relative at the bottom of settle chamber (121) chamber heat dissipation piece (21) that vapor chamber (22) set up, the target clamp is located heat dissipation piece (21) with between vapor chamber (22), just the both sides surface of target butt respectively vapor chamber (22) with heat dissipation piece (21), the at least partial butt of week side of heat dissipation piece (21) settle the chamber wall in chamber (121).

2. The heat sink (100) of claim 1, wherein: the peripheral side surface of the soaking plate (22) at least partially abuts against the cavity wall of the placing cavity (121).

3. The heat sink (100) of claim 1, wherein: the side surface of the soaking plate (22) is inclined, the soaking plate (22) is abutted to the bottom of the placement cavity (121), and the area of the plate surface of the target object is smaller than that of the plate surface of the soaking plate (22).

4. The heat sink (100) of claim 1, wherein: the heat dissipation structure (20) further comprises a reflector (23) located in the placement cavity (121), a light transmission hole (212) is formed in the middle of the heat dissipation member (21), one end of the reflector (23) is sleeved in the light transmission hole (212), and the other end of the reflector (23) is connected with the cavity wall of the placement cavity (121).

5. The heat sink (100) according to claim 4, wherein: the aperture of the light-transmitting hole (212) is gradually increased along the direction of the target object pointing to the heat dissipation member (21), the peripheral side face of the reflector (23) is matched with the hole wall of the light-transmitting hole (212), and the heat dissipation member (21) is tightly pressed towards the target object.

6. The heat sink (100) according to claim 4, wherein: the surface of the radiating piece (21) departing from the target object is further provided with a radiating groove (211), and one end of the radiating groove (211) extends to the hole wall of the light hole (212).

7. The heat sink (100) of claim 1, wherein: the heat dissipation structure (20) further comprises a heat dissipation part (24), the heat dissipation part (21) is arranged in a plate shape, the heat dissipation part (24) is connected with the edge of the plate of the heat dissipation part (21), and the side surface of the heat dissipation part (24) abuts against the wall of the installation cavity (121).

8. The heat sink (100) of claim 1, wherein: the lamp shell structure (10) comprises a lamp cap (11) and a lamp cover (12), the lamp cap (11) is provided with the placing cavity (121), and the lamp cover (12) covers the opening of the placing cavity (121).

9. The heat sink (100) according to any of claims 4-6, wherein: the target comprises a circuit board (32) and a component, wherein the circuit board (32) is positioned between the soaking plate (22) and the heat dissipation member (21); the circuit board (32) is provided with a through hole (321), one end of the component is contained in the through hole (321) and is abutted against the soaking plate (22), and the other end of the component is arranged towards the arrangement cavity (121) through the light hole (212).

10. A flashlight (200), comprising: the heat sink (100) according to any of claims 1-9, wherein the flashlight (200) further comprises a light tube (40) connected to the lamp housing structure (10) and a battery disposed in the light tube (40).

Images