CN216763516U - Silicon wafer separation structure - Google Patents
Silicon wafer separation structure Download PDFInfo
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- CN216763516U CN216763516U CN202123349188.5U CN202123349188U CN216763516U CN 216763516 U CN216763516 U CN 216763516U CN 202123349188 U CN202123349188 U CN 202123349188U CN 216763516 U CN216763516 U CN 216763516U
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Abstract
The utility model relates to a silicon wafer separating structure which comprises a separating frame, wherein water cutter sets are arranged on two sides of the separating frame, and a silicon wafer placing frame is arranged in the middle of the separating frame in a sliding mode; the separation frame comprises a separation frame bottom plate, two sides of the separation frame bottom plate are vertically connected with separation frame side plates, the water knife set comprises a water feeding knife and a water discharging knife, the water feeding knife is installed on the upper portion of the separation frame side plates, the water discharging knife is installed in the middle of the separation frame side plates, and two sides of the separation frame bottom plate are horizontally drilled with the separation frame side plates to be connected with screw holes. The utility model has simple structure and small occupied space; the problems of single structure and small pressure of the existing water jet cutter can be solved, and the silicon wafer is smoothly transferred.
Description
Technical Field
The utility model belongs to the technical field of solar silicon wafer processing equipment, and relates to a silicon wafer separation structure.
Background
The silicon slice separating and conveying device needs to separate the tightly attached silicon slice groups one by one, and the existing scheme is to separate the silicon slice groups by adopting a water jet cutter, but the existing water jet cutter is single in arrangement structure and small in pressure and cannot enter a gap of the silicon slice to separate the silicon slice groups.
Disclosure of Invention
The utility model aims to provide a silicon wafer separation structure which can solve the problems of single arrangement structure and small pressure of the existing water jet cutter and can smoothly transfer silicon wafers.
According to the technical scheme provided by the utility model: a silicon wafer separation structure comprises a separation frame, wherein water cutter sets are arranged on two sides of the separation frame, and a silicon wafer placing frame is arranged in the middle of the separation frame in a sliding mode; the separation frame comprises a separation frame bottom plate, two sides of the separation frame bottom plate are vertically connected with separation frame side plates, the water knife set comprises a water feeding knife and a water discharging knife, the water feeding knife is installed on the upper portion of the separation frame side plates, and the water discharging knife is installed in the middle of the separation frame side plates.
As a further improvement of the utility model, the connecting screw holes of the side plates of the separating frame are horizontally drilled at both sides of the bottom plate of the separating frame.
As a further improvement of the utility model, the lower end of the side plate of the separation frame is horizontally drilled with a side plate connecting hole of the separation frame, the middle part of the side plate of the separation frame is provided with a water jet cutter mounting groove, and a water jet cutter connecting hole is drilled below the water jet cutter mounting groove.
As a further improvement of the utility model, the upper parts of the side plates of the two side separation frames are respectively provided with a water feeding knife through a first height adjusting filler strip and a second height adjusting filler strip.
As a further improvement of the utility model, the water feeding cutter comprises a water cutter mounting frame, a water cutter head is mounted in the water cutter mounting frame, a water cutter connecting screw hole is drilled in the lower part of the water cutter mounting frame, a water cutter head mounting groove is formed in one side of the upper part of the water cutter mounting frame, and the water cutter head mounting groove is communicated with a water inlet pipe connecting screw hole; the water cutter head is internally provided with a water containing cavity and a water outlet groove which are communicated, the water cutter head is arranged in a water cutter head mounting groove through a bolt, the water outlet groove faces the middle part of the separation frame, and the other end of the water containing cavity is communicated with a water inlet pipe and is connected with a screw hole.
As a further improvement of the utility model, the water discharging cutter comprises a water cutter mounting frame, a water cutter head is mounted in the water cutter mounting frame, a water cutter connecting screw hole is drilled in the lower part of the water cutter mounting frame, a water cutter head mounting groove is formed in one side of the upper part of the water cutter mounting frame, and the water cutter head mounting groove is communicated with a water inlet pipe connecting screw hole; the water cutter head is internally provided with a water containing cavity and a water outlet groove which are communicated, the water cutter head is arranged in a water cutter head mounting groove through a bolt, the water outlet groove faces the middle part of the separation frame, and the other end of the water containing cavity is communicated with a water inlet pipe and is connected with a screw hole.
As a further improvement of the utility model, the cross section of the water outlet groove is smaller than that of the water containing cavity.
As a further improvement of the utility model, a water jet seal strip is arranged between the water jet mounting frame and the water jet head in a cushioning mode.
As a further improvement of the utility model, a slide rail is laid above the slide rail connecting hole; a sliding rail connecting hole is vertically drilled in the middle of the bottom plate of the separation frame, a sliding rail connecting screw hole is drilled in the bottom of the sliding rail, and the sliding rail connecting screw hole are connected through a bolt.
As a further improvement of the utility model, a silicon wafer material box is arranged on the slide rail in a sliding way, and water inlets are arranged on two sides of the silicon wafer material box.
The positive progress effect of this application lies in:
the utility model has simple structure and small occupied space; the problems of single structure and small pressure of the existing water jet cutter can be solved, and the silicon wafer is smoothly transferred.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a schematic structural diagram of a bottom plate of the separation frame of the present invention.
Fig. 3 is a schematic structural view of a side plate of the separation frame of the present invention.
Fig. 4 is a schematic structural view of the water jet mounting bracket of the present invention.
Fig. 5 is a front view of the water cutter head of the present invention.
Fig. 6 is a top view of a water jet head of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the utility model herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In the figures 1-6, the silicon wafer separating device comprises a separating frame bottom plate 1, a separating frame side plate 2, a water jet mounting frame 3, a water jet head 4, a water jet sealing strip 5, a first height adjusting filler strip 6, a lower water jet 7, an upper water jet 8, a slide rail 9, a second height adjusting filler strip 10, a silicon wafer material box 11, a water inlet 11-1 and the like.
As shown in FIG. 1, the utility model relates to a silicon wafer separating structure, which comprises a separating frame, wherein water knife sets are arranged on two sides of the separating frame, and a silicon wafer placing frame is arranged in the middle of the separating frame in a sliding manner.
The separation frame comprises a separation frame bottom plate 1, two sides of the separation frame bottom plate 1 are vertically connected with separation frame side plates 2, the water knife set comprises a water feeding knife 8 and a water discharging knife, the water feeding knife 8 is installed on the upper portion of each separation frame side plate 2, and the water discharging knife is installed in the middle of each separation frame side plate 2.
As shown in figure 2, a separation frame side plate connecting screw hole 1-1 is horizontally drilled at two sides of a separation frame bottom plate 1.
As shown in figure 3, a separating frame side plate connecting hole 2-1 is horizontally drilled at the lower end of a separating frame side plate 2, a water jet cutting mounting groove 2-2 is formed in the middle of the separating frame side plate 2, and water jet cutting connecting holes 2-3 are drilled below the water jet cutting mounting groove 2-2 and at the upper part of the separating frame side plate 2.
And the bolt penetrates through the connecting hole 2-1 of the side plate of the separation frame and enters the connecting screw hole 1-1 of the side plate of the separation frame, so that the connection between the bottom plate 1 of the separation frame and the side plate 2 of the separation frame is completed.
The upper parts of the two side separation frame side plates 2 are respectively provided with a water feeding knife 8 through a first height adjusting filler strip 6 and a second height adjusting filler strip 10.
The upper water jet cutter 8 and the lower water jet cutter 7 have the same structure and comprise a water jet cutter mounting frame 3, a water jet cutter head 4 is mounted in the water jet cutter mounting frame 3, as shown in figure 4, a water jet cutter connecting screw hole 3-1 matched with the water jet cutter connecting hole 2-3 is drilled in the lower part of the water jet cutter mounting frame 3, a water jet cutter head mounting groove 3-2 matched with the appearance of the water jet cutter head 4 is formed in one side of the upper part of the water jet cutter mounting frame 3, and the water jet cutter head mounting groove 3-2 is communicated with a water inlet pipe connecting screw hole 3-3. As shown in the figures 5-6, a water containing cavity 4-1 and a water outlet groove 4-2 which are communicated are arranged in the water cutter head 4, the water cutter head 4 is arranged in the water cutter head mounting groove 3-2 through a bolt, the water outlet groove 4-2 faces the middle part of the separation frame, and the other end of the water containing cavity 4-1 is communicated with a water inlet pipe connecting screw hole 3-3. The section of the water outlet groove 4-2 is smaller than that of the water containing cavity 4-1, so that the pressure intensity of the outlet water can be improved, and the separation of the silicon wafers is facilitated.
And the bolt penetrates through the water jet connecting hole 2-3 to enter the water jet connecting screw hole 3-1, so that the connection between the separation frame side plate 2 and the water jet mounting frame 3 is completed.
In order to improve the sealing performance of the water jet, a water jet sealing strip 5 is arranged between the water jet mounting frame 3 and the water jet head 4 in a cushioning mode.
A slide rail connecting hole 1-2 is vertically drilled in the middle of the bottom plate 1 of the separation frame. A sliding rail 9 is laid above the sliding rail connecting hole 1-2, a sliding rail connecting screw hole is drilled at the bottom of the sliding rail 9, and the sliding rail connecting screw hole are connected through a bolt. A silicon chip material box 11 is arranged on the slide rail 9 in a sliding way, and water inlets 11-1 are arranged at two sides of the silicon chip material box 11.
The working process of the utility model is as follows:
the silicon wafers are vertically and closely arranged in the silicon wafer material box 11, and the silicon wafer material box 11 slides in the separation frame. The water cutter head 4 pressurizes the water body and then injects the pressurized water body into the silicon wafer material box 11 through the water inlet 11-1, and the water body is flushed into the gaps among the silicon wafers to separate the silicon wafers.
It will be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principles of the present invention, and the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the utility model, and these modifications and improvements are also considered to be within the scope of the utility model.
Claims (10)
1. A silicon wafer separation structure is characterized by comprising a separation frame, wherein water cutter sets are arranged on two sides of the separation frame, and a silicon wafer placing frame is arranged in the middle of the separation frame in a sliding mode; the separation frame comprises a separation frame bottom plate (1), two sides of the separation frame bottom plate (1) are vertically connected with separation frame side plates (2), the water knife set comprises a water feeding knife (8) and a water discharging knife, the water feeding knife (8) is installed on the upper portions of the separation frame side plates (2), and the water discharging knife is installed in the middle of the separation frame side plates (2).
2. The silicon wafer separating structure according to claim 1, wherein the separating frame side plate connection screw holes (1-1) are drilled horizontally on both sides of the separating frame bottom plate (1).
3. The silicon wafer separating structure according to claim 1, wherein a separating shelf side plate connecting hole (2-1) is drilled horizontally at the lower end of the separating shelf side plate (2), a water jet cutting mounting groove (2-2) is formed in the middle of the separating shelf side plate (2), and a water jet cutting connecting hole (2-3) is drilled below the water jet cutting mounting groove (2-2).
4. The silicon wafer separating structure according to claim 1, wherein the upper parts of the side plates (2) of the two side separating frames are respectively provided with the water feeding knives (8) through the first height adjusting filler strips (6) and the second height adjusting filler strips (10).
5. The silicon wafer separation structure according to claim 1, wherein the water feeding cutter (8) comprises a water cutter mounting frame (3), a water cutter head (4) is mounted in the water cutter mounting frame (3), a water cutter connecting screw hole (3-1) is drilled in the lower portion of the water cutter mounting frame (3), a water cutter head mounting groove (3-2) is formed in one side of the upper portion of the water cutter mounting frame (3), and the water cutter head mounting groove (3-2) is communicated with the water inlet connecting screw hole (3-3); the water cutter head (4) is provided with a water containing cavity (4-1) and a water outlet groove (4-2) which are communicated with each other, the water cutter head (4) is arranged in the water cutter head mounting groove (3-2) through a bolt, the water outlet groove (4-2) faces the middle part of the separation frame, and the other end of the water containing cavity (4-1) is communicated with a water inlet pipe and is connected with the screw hole (3-3).
6. The silicon wafer separation structure according to claim 1, wherein the water jet cutter (7) comprises a water jet cutter mounting frame (3), a water jet cutter head (4) is mounted in the water jet cutter mounting frame (3), a water jet cutter connecting screw hole (3-1) is drilled in the lower portion of the water jet cutter mounting frame (3), a water jet cutter head mounting groove (3-2) is formed in one side of the upper portion of the water jet cutter mounting frame (3), and the water jet cutter head mounting groove (3-2) is communicated with the water inlet pipe connecting screw hole (3-3); the water cutter head (4) is provided with a water containing cavity (4-1) and a water outlet groove (4-2) which are communicated with each other, the water cutter head (4) is arranged in the water cutter head mounting groove (3-2) through a bolt, the water outlet groove (4-2) faces the middle part of the separation frame, and the other end of the water containing cavity (4-1) is communicated with a water inlet pipe and is connected with the screw hole (3-3).
7. The silicon wafer separating structure according to claim 5 or 6, wherein the cross section of the water outlet groove (4-2) is smaller than the cross section of the water containing cavity (4-1).
8. The silicon wafer separating structure according to claim 5, wherein a water jet seal strip (5) is padded between the water jet mounting frame (3) and the water jet head (4).
9. The silicon wafer separating structure according to claim 1, wherein a slide rail (9) is laid above the slide rail connecting hole (1-2); a sliding rail connecting hole (1-2) is vertically drilled in the middle of a separating frame bottom plate (1), a sliding rail connecting screw hole is drilled in the bottom of a sliding rail (9), and the sliding rail connecting screw hole are connected through a bolt.
10. The silicon wafer separating structure according to claim 9, wherein the slide rail (9) is slidably mounted with a silicon wafer magazine (11), and water inlets (11-1) are formed at both sides of the silicon wafer magazine (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123349188.5U CN216763516U (en) | 2021-12-28 | 2021-12-28 | Silicon wafer separation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123349188.5U CN216763516U (en) | 2021-12-28 | 2021-12-28 | Silicon wafer separation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216763516U true CN216763516U (en) | 2022-06-17 |
Family
ID=81970230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123349188.5U Active CN216763516U (en) | 2021-12-28 | 2021-12-28 | Silicon wafer separation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216763516U (en) |
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2021
- 2021-12-28 CN CN202123349188.5U patent/CN216763516U/en active Active
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