CN216760629U - Carrier band injection mold for electronic components - Google Patents
Carrier band injection mold for electronic components Download PDFInfo
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- CN216760629U CN216760629U CN202122976583.XU CN202122976583U CN216760629U CN 216760629 U CN216760629 U CN 216760629U CN 202122976583 U CN202122976583 U CN 202122976583U CN 216760629 U CN216760629 U CN 216760629U
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- carrier tape
- carrier
- injection mold
- cavities
- electronic components
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Abstract
The utility model discloses a carrier tape injection mold for electronic components, which comprises an upper mold and a lower mold, wherein a plurality of carrier tape cavities can be formed after the upper mold and the lower mold are closed, a plurality of feeding pipelines are arranged at the bottom of the lower mold, the feeding pipelines are communicated with the bottom of the carrier tape cavities, and at least one air port is arranged at the top of the upper mold; after the die is closed, the tops of all the carrier tape cavities are communicated with each other; the air port is arranged right above the transition part of two adjacent carrier belt cavities; a feed conduit is located directly below each of the carrier cavities. The beneficial effects of the utility model are: the technical scheme has the advantages of simple structure, high yield, low cost and high production efficiency.
Description
Technical Field
The utility model relates to the technical field of carrier tape molds, in particular to a carrier tape injection mold for electronic components.
Background
The carrier tape is mainly used for storing and transporting electronic components, and the electronic components are prevented from being damaged before being used. The carrier tape is a plastic carrier widely used for packaging SMT electronic components such as ICs, resistors, inductors, capacitors, connectors, LEDs, fuses, switches, relays, connectors, oscillators, diodes, triodes, etc., and generally has a receiving hole with a certain shape to receive the above-mentioned components.
The method for processing and forming the accommodating holes of the carrier tape comprises a plurality of methods, wherein some methods need to heat and soften the flat carrier tape to enter a die for intermittent forming, the carrier tape advances by pulling of a pulling device to generate sliding conveying action, and when the pulling force of the pulling device acts on the carrier tape, the softened carrier tape can generate stretching deformation, generate partial sliding and displacement in the conveying process, influence the precision of forming each accommodating hole of the carrier tape, and influence the precision of subsequent punching processing. Therefore, it is necessary to develop a carrier tape injection mold for electronic components having a simple structure and a high yield, and the same technical means as in the present invention has not been found through search.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the technical problem of providing a carrier tape injection mold for electronic components, which has a simple structure and high yield, and solves one or more of the problems in the prior art.
In order to solve the technical problems, the utility model adopts a technical scheme that: the utility model provides a carrier band injection mold for electronic components, its innovation point lies in: including last mould and lower mould, can form one after going up mould and lower mould compound die and have a plurality of carrier band die cavity, the bottom of lower mould is equipped with a plurality of charge-in pipeline, charge-in pipeline all with the bottom intercommunication in carrier band die cavity, the top of going up the mould is equipped with at least one gas port.
In some embodiments, all of the top portions of the carrier cavities communicate with each other after mold clamping.
In some embodiments, the air port is disposed directly above the transition between two adjacent carrier cavities.
In some embodiments, a feed conduit is located directly below each of the carrier cavities.
The utility model has the beneficial effects that: the technical scheme has the advantages of simple structure, high yield, low cost and high production efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic structural view of a carrier tape injection mold for electronic components according to the present invention.
Fig. 2 is a schematic diagram showing a clamped structure of a carrier tape injection mold for electronic components according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2, an embodiment of the present invention includes:
the utility model provides a carrier band injection mold for electronic components, includes mould 1 and lower mould 2, can form one after going up mould 1 and 2 compound dies of lower mould and have a plurality of carrier band die cavity 3, and the bottom of lower mould 2 is equipped with a plurality of charge-in pipeline 21, and charge-in pipeline 21 all communicates with the bottom in carrier band die cavity 3, and the top of going up mould 1 is equipped with at least one gas port 11.
In some embodiments, the tops of all the carrier cavities 3 are communicated with each other after the mold is closed; the air port 11 is arranged right above the transition position of two adjacent carrier belt cavities 3; a feed conduit 21 is located directly below each of the belt cavities 3.
The utility model has the beneficial effects that: the technical scheme has the advantages of simple structure, high yield, low cost and high production efficiency.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (4)
1. The utility model provides a carrier band injection mold for electronic components which characterized in that: including last mould (1) and lower mould (2), it has a plurality of to carry and takes die cavity (3) to form one after going up mould (1) and lower mould (2) compound die, the bottom of lower mould (2) is equipped with a plurality of charge-in pipeline (21), charge-in pipeline (21) all with carry the bottom intercommunication of taking die cavity (3), the top of going up mould (1) is equipped with at least one gas port (11).
2. A carrier tape injection mold for an electronic component as claimed in claim 1, wherein: and the tops of all the carrier tape cavities (3) are communicated with each other after the die assembly.
3. A carrier tape injection mold for an electronic component as claimed in claim 1, wherein: the air ports (11) are arranged right above the transition position of two adjacent carrier belt cavities (3).
4. A carrier tape injection mold for an electronic component as claimed in claim 1, wherein: the feeding pipeline (21) is positioned right below each carrier cavity (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122976583.XU CN216760629U (en) | 2021-11-29 | 2021-11-29 | Carrier band injection mold for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122976583.XU CN216760629U (en) | 2021-11-29 | 2021-11-29 | Carrier band injection mold for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216760629U true CN216760629U (en) | 2022-06-17 |
Family
ID=81965604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122976583.XU Active CN216760629U (en) | 2021-11-29 | 2021-11-29 | Carrier band injection mold for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216760629U (en) |
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2021
- 2021-11-29 CN CN202122976583.XU patent/CN216760629U/en active Active
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