CN216760537U

CN216760537U - Section seals gluey mould subassembly

Info

Publication number: CN216760537U
Application number: CN202120231866.9U
Authority: CN
Inventors: 许峰; 黎帅; 黄�俊
Original assignee: Sunwin Hubei Optoelectronic Technology Co Ltd
Current assignee: Sunwin Hubei Optoelectronic Technology Co Ltd
Priority date: 2021-01-27
Filing date: 2021-01-27
Publication date: 2022-06-17
Anticipated expiration: 2031-01-27

Abstract

The utility model provides a slice glue sealing mold assembly which comprises a demolding base and a mold body, wherein a mold cavity is processed on the demolding base, the mold body is provided with an insertion end capable of being inserted into the mold cavity, the end face of the insertion end is a sealing face capable of being matched and sealed with the inner bottom face of the mold cavity, and a demolding opening for stripping slices after glue sealing is formed in the sealing face. According to the utility model, the mold assembly is divided into the demolding base and the mold body, the mold body can extend into the mold cavity of the demolding base, the demolding opening is plugged through the inner bottom surface of the mold cavity, the mold body can be easily drawn out from the mold cavity after the resin poured into the mold body is cured, and meanwhile, the cured resin is removed from the mold body from the demolding opening and is retained in the mold cavity, so that sliced materials in the resin cannot be damaged, and the analysis effect is not influenced.

Description

Section seals gluey mould subassembly

Technical Field

The utility model relates to slicing processing, in particular to a slicing and glue sealing mold assembly.

Background

The rapid development of the mobile phone industry directly drives the high-speed growth of a mobile phone camera module, and in the direct operation process, the analysis of many FPC failure problems and the analysis of the internal structure of the camera module are completed by slicing. Slicing is generally divided into sampling, sealing, grinding, polishing, microetching, photographing and other steps, wherein the sealing is one of the key steps.

The glue sealing mould used by people at present is a cylindrical glue mould with a base with the capacity of 10ml, after resin is cured in the mould, a mould measuring cylinder is tightly meshed with the base, and at present, a hexagonal wrench is used for removing the mould in a mode of knocking the resin out of the mould, but the mode easily causes electronic components cured in the resin to be vibrated and deformed or cracked, so that great trouble is brought to subsequent analysis.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides a slicing and sealing mold assembly.

The utility model is realized by the following steps:

the embodiment of the utility model provides a slice glue sealing mold assembly, which comprises a demolding base and a mold body, wherein a mold cavity is processed on the demolding base, the mold body is provided with an insertion end capable of being inserted into the mold cavity, the end surface of the insertion end is a sealing surface capable of being matched and sealed with the inner bottom surface of the mold cavity, and a demolding opening for stripping slices after glue sealing is formed in the sealing surface.

Furthermore, an adhesive layer for bonding the to-be-sealed adhesive slices is arranged in the die cavity.

Further, the die body is cylindrical, the die body is of a hollow structure penetrating through the die body from top to bottom, and the demolding opening is a lower port of the hollow structure.

Furthermore, a plurality of die cavities are processed on the demoulding base, and the die cavities are distributed in an array.

Further, the demolding base is a stainless steel plate, and the mold cavities are formed by inwards sinking the surface of the stainless steel plate.

Further, the cavity depth is 2 mm.

Furthermore, a plurality of bulges are arranged on one side of the stainless steel plate, which is far away from the mold cavity, and the bulges are distributed discretely along the edge of the stainless steel plate.

The utility model has the following beneficial effects:

the die assembly comprises two parts, namely a demolding base and a die body, wherein the demolding opening of the die body is positioned on the sealing surface and is blocked by the inner bottom surface of the die cavity, so that when resin is poured into the die body to seal the slices, the bottoms of the slices are positioned at the demolding opening and are connected with the demolding base, and therefore after the resin is cured, the die body can be easily drawn out of the die cavity, and meanwhile, the cured resin is separated from the die body from the demolding opening and is kept in the die cavity. The whole process is convenient for demoulding, and can ensure the completeness of the material of the resin inner section without influencing the analysis effect.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a dicing molding die assembly according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Referring to fig. 1, an embodiment of the present invention provides a chip-sealing mold assembly, which includes a mold base 1 and a mold body 2, which are matched to form a complete mold for preparing chips, wherein the mold body 2 is a main component of a chip-sealing, and has a cavity 21 for placing chips, and prepared resin can be injected into the cavity 21 for sealing the chips, specifically, a mold cavity 11 is formed on the mold base 1, and the mold body 2 has an insertion end, which can be inserted into the mold cavity 11, although the mold body 2 is not completely inserted into the mold cavity 11, and has at least a partial structure located outside the mold cavity 11, so that the mold body 2 can be conveniently pulled out from the mold cavity 11, and an end surface of the insertion end of the mold body 2 is a sealing surface, that is capable of being attached to and sealed with an inner bottom surface of the mold cavity 11 when the mold body 2 is inserted into the mold cavity 11, the sealing surface is provided with a mold release opening, which means that after the resin poured into the mold body 2 is cured and molded, the cured resin can be completely released from the mold release opening, and the mold release opening is a lower opening of the cavity 21 of the mold body 2. In the utility model, the mould body 2 is matched with the mould cavity 11, when the inserting end of the mould body 2 is inserted into the mould cavity 11, the inner bottom surface of the mould cavity 11 blocks the demoulding opening, namely the lower opening of the cavity 21 of the mould body 2 is blocked, and at the moment, the prepared resin can be injected into the cavity 21 of the mould body 2, after the resin is cured, such as glue overflow phenomenon and the like, can not occur in the glue pouring process, the mould body 2 is only held, the mould body 2 can be pulled out from the mould cavity 11 through slight shaking, and the cured resin is separated from the cavity 21 of the mould body 2 through the demoulding opening and is positioned in the mould cavity 11. Through the mould subassembly of this kind of structure, can be so that the resin after the solidification is more convenient to be deviate from by mould body 2 in, need not with the help of pressure equipment or other instruments, need not to use the release agent, reduce the cost, and can guarantee that the inside section material of resin after the solidification is intact, do not influence the analysis effect, it is also more convenient to clean certainly, can be applicable to FPC, the most material of module, the resin solidification back bottom is level and smooth, need not to grind, promotes 25% work efficiency about.

The above embodiment is optimized, the adhesive layer is arranged in the mold cavity 11, the adhesive layer can be double-faced adhesive tape, the adhesive layer can be laid on the inner bottom surface of the mold cavity 11 before the adhesive layer is inserted into the mold body 2, then the sliced product is placed in the mold cavity 11 by adopting a PE sample clamp, the sliced product can be positioned in the mold cavity 11 through the adhesive layer, then the mold body 2 is placed in the mold cavity 11, the sliced product can extend into the cavity 21 of the mold body 2 through a demolding opening, finally resin can be poured into the mold body 2, and after the resin is cured, the sealing of the sliced product is achieved.

In a preferred embodiment, the mold body 2 is cylindrical and has a hollow structure penetrating vertically, the cavity 21 is the hollow structure, and the demolding opening is a lower port of the hollow structure. The hollow structure of the die body 2 is vertically penetrated and can be a cylindrical through hole, so that a sliced product can be conveniently placed in the hollow structure, the solidified resin can be conveniently removed, and the resin can be conveniently poured into the hollow structure.

Furthermore, a plurality of mold cavities 11 are processed on the demolding base 1, the mold cavities 11 are distributed in an array, correspondingly, a plurality of mold bodies 2 are provided, the mold bodies 2 and the mold cavities 11 are in one-to-one correspondence, and by the method, a plurality of slice samples can be simultaneously sealed, so that the sealing efficiency can be improved. Of course, a sufficient gap should be reserved between two adjacent mold cavities 11, so that each mold body 2 can be conveniently pulled out from the corresponding mold cavity 11 after the molding is completed. Generally, the mold release base 1 may be made of a stainless steel plate, and the specific size may be determined according to the size of the actual sliced product and the size of the mold body 2, for example, when the mold body 2 is a cylindrical structure with an outer diameter of 27.8mm, the inner diameter of the mold cavity 11 is also 27.8mm, correspondingly, the mold release base 1 may be made of a stainless steel plate with a length of 250mm × a width of 150mm × 5mm, and 21 mold cavities 11 are processed on the mold release base 1, and a 3 × 7 array mode is adopted, 3 in the width direction and 7 in the length direction, so that 21 sliced products can be simultaneously sealed. In addition, the depth of the cavity 11 can be selected to be 2mm, which is not favorable for positioning the mold body 2 in the cavity 11 when the depth is too small, and is troublesome for the mold body 2 to be separated from the cavity 11 when the depth is too large.

Furthermore, a plurality of protrusions are arranged on one side of the stainless steel plate, which is far away from the mold cavity 11, and the protrusions are distributed discretely along the edge of the stainless steel plate. In this embodiment, the arch is corrosion resistant plate's supporting legs, steadily supports corrosion resistant plate jointly through a plurality of archs, and when a plurality of corrosion resistant plate stack, can make through the arch and form the clearance between two adjacent corrosion resistant plate, conveniently separates both.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The utility model provides a section is sealed and is glued mould subassembly, includes the drawing of patterns base, its characterized in that: the die comprises a die body, a die cavity is processed on the demolding base, the die body is provided with an insertion end capable of being inserted into the die cavity, the end face of the insertion end is a sealing face capable of being matched and sealed with the inner bottom face of the die cavity, a demolding opening for enabling slices to be separated after the adhesive is sealed is formed in the sealing face, an adhesive layer for bonding the slices to be sealed is arranged in the die cavity, and the outer diameter of the die body is equal to the inner diameter of the die cavity.

2. The dicing molding compound die assembly of claim 1, wherein: the die body is cylindrical, the die body is of a hollow structure penetrating through the die body from top to bottom, and the demolding opening is a lower port of the hollow structure.

3. The dicing molding compound die assembly of claim 1, wherein: the demolding base is provided with a plurality of mold cavities which are distributed in an array.

4. The dicing molding compound die assembly of claim 1, wherein: the demolding base is a stainless steel plate, and the mold cavities are formed by inwards sinking the surface of the stainless steel plate.

5. The slice encapsulation mold assembly of claim 4, wherein: the depth of the die cavity is 2 mm.

6. The slice encapsulation mold assembly of claim 4, wherein: and a plurality of bulges are arranged on one side of the stainless steel plate, which is far away from the die cavity, and the bulges are distributed discretely along the edge of the stainless steel plate.