CN216754460U - Paster device and wearable equipment - Google Patents

Abstract

The utility model provides a chip mounting device which comprises a first circuit board, wherein the first circuit board comprises a top surface and a bottom surface opposite to the top surface, a first electrode is formed on the bottom surface of the first circuit board by copper leakage, and a conductive adhesive is attached to the first electrode. The utility model further provides wearable equipment. The patch device and the wearable equipment provided by the utility model do not need special electrode plates, are simple in design and low in cost, and can improve the quality of signal transmission.

Description

Paster device and wearable equipment

[ technical field ] A method for producing a semiconductor device

The utility model relates to the technical field of wearable devices, in particular to a patch device and a wearable device.

[ background of the utility model ]

Currently, wearable devices, ECG (Electrocardiogram) devices, are widely used, for example, 24-hour ECG monitors in the medical field, or consumer wearable devices, such as watches, patches, or clothing with ECG. The existing wearable ECG equipment needs special electrodes, such as AgCl electrodes, stainless steel electrodes, coated electrodes and the like, meanwhile, the electrodes also have the problem of fitting degree, and the wearing mode and the using mode can cause the influence on the signal quality.

Particularly, the electrocardiograph monitor needs to use an electrode plate externally connected with a cable and is coated with conductive gel, so that the electrocardiograph monitor needs to be operated by a professional in a matching way and is inconvenient to carry; wearable ECG measuring equipment such as a smart watch is limited by product size, the problem of poor contact often occurs during measurement, the wearing needs to be corrected or the contact mode needs to be adjusted, the measurement is not friendly, the measurement can be performed only by two-lead measurement, the measurement accuracy is limited by the lead mode, and the provided biological information is limited; the conventional electrocardiograph belt needs to be matched with a binding band when being worn, so that the problems of wearing comfort, easy deviation and the like exist.

In view of the above, there is a need to provide a novel patch device and a wearable device to overcome the above-mentioned drawbacks.

[ Utility model ] content

The utility model aims to provide a patch device and wearable equipment, which do not need special electrode plates, are simple in design and low in cost, and can improve the quality of signal transmission.

In order to achieve the above object, in a first aspect, the present invention provides a chip mounting device, including a first circuit board, where the first circuit board includes a top surface and a bottom surface opposite to the top surface, a first electrode is formed on the bottom surface of the first circuit board by copper leakage, and a conductive adhesive is attached to the first electrode.

In a preferred embodiment, the printed circuit board further includes a second circuit board, the second circuit board includes a first surface and a second surface opposite to the first surface, the first surface of the second circuit board is pressed on the top surface of the first circuit board, and a second electrode is formed on the second surface of the second circuit board by copper leakage.

In a preferred embodiment, the printed circuit board further includes a processing module, the processing module is fixed on the top surface of the first circuit board, the first surface of the second circuit board is provided with an accommodating groove, and the processing module is accommodated in the accommodating groove.

In a preferred embodiment, the portable electronic device further comprises a power module, wherein the power module is fixed on the top surface of the first circuit board, and the power module is also accommodated in the accommodating groove.

In a preferred embodiment, the power module is a micro battery.

In a preferred embodiment, an antenna module is disposed in the first circuit board or the second circuit board, and the antenna module is electrically connected to the processing module.

In a preferred embodiment, the first circuit board and the second circuit board are FPCs.

In a second aspect, the present invention also provides a wearable device including the patch device according to any one of the above embodiments.

Compared with the prior art, the chip device and the wearable equipment provided by the utility model have the advantages that the first electrode is formed by copper leakage on the bottom surface of the first circuit board, a special electrode plate is not needed, the design is simple, and the cost is lower; and the first electrode is attached with the conductive adhesive, the conductive adhesive can be well attached to the skin of a user, the wearing mode is simple and reliable, the contact impedance of the skin and the first electrode can be reduced, and the quality of signal transmission is improved.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a block diagram of a patch device provided by the present invention;

fig. 2 is an exploded view of a patch device provided by the present invention.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 and 2, the present invention provides a chip mounting device 100 including a first circuit board 10.

Specifically, the first circuit board 10 includes a top surface 101 and a bottom surface 102 opposite to the top surface 101, the bottom surface 102 of the first circuit board 10 is copper-leaked to form a first electrode 11, and the conductive adhesive 30 is attached to the first electrode 11. When the patch device 100 is applied, the first electrode 11 is attached to the chest position through the conductive adhesive 30, and the ECG monitoring of chest leads near the chest can be realized through the first electrode 11. In the present embodiment, the number of the first electrodes 11 is two.

Therefore, in the chip device 100 provided by the utility model, the first electrode 11 is formed by copper leakage from the bottom surface 102 of the first circuit board 10, no special electrode plate is needed, the design is simple, and the cost is low; moreover, the conductive adhesive 30 is attached to the first electrode 11, and the conductive adhesive 30 can be well attached to the skin of a user, so that the wearing mode is simple and reliable, the contact impedance between the skin and the first electrode 11 can be reduced, and the quality of signal transmission is improved.

Further, the chip device 100 provided by the present invention further includes a second circuit board 20, the second circuit board 20 includes a first surface 201 and a second surface 202 opposite to the first surface 201, the first surface 201 of the second circuit board 20 is pressed on the top surface 101 of the first circuit board 10, and the second surface 202 of the second circuit board 20 is copper-leaked to form a second electrode 21. It is understood that the second electrode 21 and the first electrode 11 can form a standard I lead structure when the patch device 100 is applied, for example, when the first electrode 11 is attached to one wrist position of the user and the finger or wrist of the other hand of the user presses the second electrode 21, the standard I lead ECG monitoring can be realized, and the application of the patch device 100 is more extensive. Specifically, the first Circuit board 10 and the second Circuit board 20 are FPCs (Flexible Printed Circuit boards), have a certain flexibility, and are convenient for a user to wear.

The chip mounting device 100 further includes a processing module 40, the processing module 40 is fixed on the top surface 101 of the first circuit board 10, the first surface 201 of the second circuit board 20 is provided with a receiving slot 203, and the processing module 40 is received in the receiving slot 203. Specifically, the processing module 40 includes an AFE (Analog Front End), an MCU (micro controller Unit), and the like, the processing module 40 may be in the form of an IC or a Die, and the IC or the Die of the processing module may be attached to the top Surface 101 of the first circuit board 10 by an SMT (Surface Mount Technology), and then the second circuit board 20 that is partially grooved is press-fitted to the first circuit board 10. So design, processing module 40 is acceptd in accepting groove 203, processing module 40 is whole to be wrapped up in the space that first circuit board 10 and second circuit board 20 enclose promptly, does not have the chip that exposes, also need not to assemble the casing, simple structure, design paster product form that can be nimble, and, processing module 40's Die's thickness is very thin (250um or below), and then whole thickness of paster device 100 can accomplish below 0.8mm, even 0.5mm, it is very convenient to wear, environmental suitability is strong.

Further, an antenna module is disposed in the first circuit board 10 or the second circuit board 20, and the antenna module is electrically connected to the processing module 40, specifically, the antenna module may be connected to the processing module through a trace in the first circuit board 10 or the second circuit board 20. It can be understood that the processing module 40 can process and calculate the electrical signal collected by the first electrode 11 or the second electrode 21, and the processed electrical signal can be transmitted to a terminal such as a mobile phone through the antenna module for secondary processing or display, so as to facilitate recording of the monitoring result.

Further, the chip mounting device 100 further includes a power module 50, the power module 50 is fixed on the top surface 101 of the first circuit board 10, and the power module 50 is also accommodated in the accommodating groove 203. Specifically, the power module 50 may be a micro battery, which occupies a small space, and the power module 50 is attached to the top surface 101 of the first circuit board 10 by SMT to supply power to the processing module 40. The power module 50 may also be a rechargeable power supply, and a charging contact needs to be added on the surface of the first circuit board 10 or the second circuit board 20 to realize the recycling of the patch device 100.

It is understood that the patch device 100 may be an ECG patch device, and may also be added with other motion sensors or environmental sensors, as a motion patch or a temperature and humidity detection patch, etc., when used for temperature and humidity detection, it is necessary to perform operations such as hole breaking on the first circuit board 10 or the second circuit board 20.

The working principle of the patch device 100, which is an ECG patch device, is explained as follows:

when ECG monitoring of chest leads near the chest is carried out, the first electrode 11 of the 102 on the bottom surface of the first circuit board 10 is attached to the skin surface of the chest position through the conductive adhesive 30, the first electrode 11 is in contact with the skin through the conductive adhesive 30, electrocardio signals and reference signals are transmitted to the AFE position of the processing module 40 through FPC wiring through the first electrode 11 for signal processing, then the processed signals are transmitted to the MCU of the processing module for corresponding calculation, and the processing result can be transmitted to devices such as a mobile phone and the like through radio frequency processing through the antenna module for secondary processing or display.

When performing standard I-lead ECG monitoring, the first electrode 11 of the bottom surface 102 of the first circuit board 10 is attached to the wrist position of one hand by the conductive adhesive 30, and the finger or wrist of the other hand is pressed onto the second electrode 21 of the second surface 202 of the second circuit board 20 to form a signal loop of the processing module first signal channel-FPC trace-first electrode-conductive adhesive-wrist of one hand-finger or wrist of the other hand-second electrode-FPC trace-processing module second signal channel, that is, a standard I-lead structure, the ECG signal and the reference signal are processed by the AFE of the processing module, and then, the processed signals are transmitted to the MCU of the processing module for corresponding calculation, and the processing result can be transmitted to equipment such as a mobile phone and the like for secondary processing or display through the antenna module through radio frequency processing.

The utility model also provides a wearable device comprising the patch device 100. In particular, the wearable device may be, but is not limited to, a watch, a garment, and the like. It should be noted that all embodiments of the patch device 100 provided by the present invention are applicable to the wearable device provided by the present invention, and can achieve the same or similar advantages.

In summary, in the patch device 100 and the wearable device provided by the present invention, the first electrode 11 is formed by copper leakage from the bottom surface 102 of the first circuit board 10, and no special electrode sheet is needed, so that the design is simple and the cost is low; moreover, the conductive adhesive 30 is attached to the first electrode 11, and the conductive adhesive 30 can be well attached to the skin of a user, so that the wearing mode is simple and reliable, the contact impedance between the skin and the first electrode 11 can be reduced, and the quality of signal transmission is improved.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (7)

1. A chip device is characterized by comprising a first circuit board, wherein the first circuit board comprises a top surface and a bottom surface opposite to the top surface, copper is leaked from the bottom surface of the first circuit board to form a first electrode, and conductive adhesive is attached to the first electrode; the chip mounting device further comprises a second circuit board, the second circuit board comprises a first surface and a second surface opposite to the first surface, the first surface of the second circuit board is pressed with the top surface of the first circuit board, and a second electrode is formed on the second surface of the second circuit board through copper leakage.

2. A patch device as claimed in claim 1, further comprising a processing module, wherein the processing module is fixed on the top surface of the first circuit board, the first surface of the second circuit board is provided with a receiving slot, and the processing module is received in the receiving slot.

3. A patch device as recited in claim 2, further comprising a power module secured to the top surface of the first circuit board, the power module also being received in the receiving slot.

4. A patch device as claimed in claim 3, wherein the power module is a miniature battery.

5. The patch device as claimed in claim 2, wherein an antenna module is disposed in the first circuit board or the second circuit board, and the antenna module is electrically connected to the processing module.

6. A patch device as claimed in claim 1, wherein the first and second circuit boards are FPCs.

7. A wearable device comprising the patch device of any of claims 1-6.

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