CN216752648U - Lead frame for packaging semiconductor device - Google Patents
Lead frame for packaging semiconductor device Download PDFInfo
- Publication number
- CN216752648U CN216752648U CN202220045931.3U CN202220045931U CN216752648U CN 216752648 U CN216752648 U CN 216752648U CN 202220045931 U CN202220045931 U CN 202220045931U CN 216752648 U CN216752648 U CN 216752648U
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- mounting plate
- roller mounting
- transverse plate
- lead frame
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Abstract
The utility model discloses a lead frame for packaging a semiconductor device, which comprises a lead frame main body, wherein a horizontal upper transverse plate and a horizontal lower transverse plate are arranged on the outer side of the lead frame main body, three guide rods penetrate through the lower part of a vertical hole on the upper transverse plate and are connected with a horizontal upper roller mounting plate, and springs are sleeved on the guide rods between the upper surface of the upper roller mounting plate and the lower surface of the upper transverse plate; the upper part of the guide rod positioned in the middle part is provided with threads and is connected with an adjusting nut through the threads; the lower transverse plate is upwards connected with a horizontal lower roller mounting plate through a rod piece; the upper roller mounting plate and the lower roller mounting plate are respectively provided with roller shafts arranged side by side in the horizontal direction, and rollers are arranged on the roller shafts. The adjusting nut can adjust the up-down moving distance of the upper roller mounting plate, so that the distance between the upper roller mounting plate and the lower roller mounting plate is adjusted to adapt to the passing of wires with different wire diameters, and the use is convenient; and the elastic extrusion between the rollers is not easy to damage the wire and can keep certain tension.
Description
Technical Field
The utility model relates to the technical field of semiconductor device packaging equipment, in particular to a lead frame for packaging a semiconductor device.
Background
Some semiconductor devices such as circuit boards, sensors and the like need to be packaged by waterproof glue or other protective glue after wires are welded on the circuit boards or the sensors due to waterproof or welding point protection requirements, the welded wires need to use wires with different wire diameters due to different current passing requirements, in the process of feeding the wires to be welded in batch production, the wire frames can be used, and the conventional wire frames are generally designed with relatively large apertures when smoothing out wires, so that the wires with different wire diameters can pass through, and the following problems can occur: when the packaging equipment leads the lead with a smaller wire diameter into welding, the tension on the lead is not enough, so that the lead can be bent in the packaging equipment to influence the process at other positions, and when the lead is cut off, the lead is not straightened, so that the problem of different lengths can be caused.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a lead frame for packaging a semiconductor device, which is suitable for wires with different wire diameters, and can ensure that the introduced wires keep certain tension and improve the processing quality.
In order to achieve the above object, the present invention provides the following technical solutions.
The utility model provides a lead frame for semiconductor device encapsulation, includes line frame main part, is equipped with the line hole of leading-in wire in the line frame main part, its characterized in that: the outer side of the wire rack main body is provided with a horizontal upper transverse plate and a horizontal lower transverse plate, the upper transverse plate is provided with three vertical holes with equal horizontal spacing, three guide rods penetrate through the lower parts of the vertical holes to be connected with a horizontal upper roller mounting plate, and springs are sleeved on the guide rods between the upper surface of the upper roller mounting plate and the lower surface of the upper transverse plate; the upper part of the guide rod positioned in the middle part is provided with threads and is connected with an adjusting nut through the threads; the lower transverse plate is upwards connected with a horizontal lower roller mounting plate through a rod piece; the upper roller mounting plate and the lower roller mounting plate are respectively provided with roller shafts which are arranged side by side in the horizontal direction on the side surface, and rollers are arranged on the roller shafts; the middle part of the roller is of an inwards concave cambered surface structure.
Preferably, the upper part of the adjusting nut is fixedly connected with an adjusting handle.
Preferably, the upper part of the adjusting handle is provided with a rotation angle scale mark, so that the upward or downward moving distance of the guide rod can be accurately adjusted.
Preferably, a gasket is arranged between the upper surface of the upper transverse plate and the adjusting nut, and the gasket is mounted on the upper surface of the upper transverse plate through a bolt.
Preferably, the roller is provided with a bearing at each of two ends of the cambered surface structure to be connected with the roller shaft, so that the rotating stability of the roller is improved.
Preferably, the guide bar is circular in cross section.
The beneficial effects of the utility model are: compared with the prior art, the adjustable wire guide device has the advantages that the up-and-down movement distance of the upper roller mounting plate can be adjusted through the adjusting nut, so that the distance between the upper roller mounting plate and the lower roller mounting plate is adjusted to adapt to the passing of wires with different wire diameters, and the use is convenient; when the wire is pulled by a traction mechanism in the packaging equipment, the rollers on the upper roller mounting plate and the lower roller mounting plate smooth the wire and apply certain tension, and when the rollers on the upper roller mounting plate extrude the wire, the reaction force generated can push the upper roller mounting plate to overcome the resistance of the spring to move upwards, so that the elastic extrusion is not easy to damage the wire and maintain certain tension.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application, and in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the roller of the present invention.
In the figure: 1. a wire frame body; 2. a wire hole; 3. an upper transverse plate; 4. a lower transverse plate; 5. an upper roller mounting plate; 6. a guide bar; 7. adjusting the nut; 8. a spring; 9. a lower roller mounting plate; 10. a roller shaft; 11. a roller; 12. an adjusting handle; 13. a gasket; 14. and (4) conducting wires.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, a lead frame for semiconductor device packaging comprises a lead frame body 1, wherein a wire hole 2 for leading in a lead 14 is arranged on the lead frame body 1, a horizontal upper transverse plate 3 and a horizontal lower transverse plate 4 are arranged on the outer side of the lead frame body 1, three circular vertical holes with equal horizontal intervals are arranged on the upper transverse plate 3, three guide rods 6 with circular cross sections penetrate through the lower parts of the vertical holes and are connected with a horizontal upper roller mounting plate 5, and springs 8 are sleeved on the guide rods 6 between the upper surface of the upper roller mounting plate 5 and the lower surface of the upper transverse plate 3; the upper part of the guide rod 6 positioned in the middle part is provided with threads and is connected with an adjusting nut 7 through the threads; the lower transverse plate 4 is upwards connected with a horizontal lower roller mounting plate 9 through a rod piece; the upper roller mounting plate 5 and the lower roller mounting plate 9 are respectively provided with roller shafts 10 which are arranged side by side in the horizontal direction on the side surface, and rollers 11 are arranged on the roller shafts 10; the middle part of the roller 11 is of an inwards concave cambered surface structure.
The upper part of the adjusting nut 7 is fixedly connected with an adjusting handle 12, and the upper part of the adjusting handle 12 is provided with a rotation angle scale mark, so that the upward or downward moving distance of the guide rod 6 can be conveniently and accurately adjusted.
A gasket 13 is arranged between the upper surface of the upper transverse plate 3 and the adjusting nut 7, and the gasket 13 is installed on the upper surface of the upper transverse plate 3 through a bolt. Thus, the spacer 13 can protect the upper transverse plate 3, and the spacer 13 is easy to detach and replace.
The two ends of the cambered surface structure of the roller 11 are respectively provided with a bearing to be connected with the roller shaft 10, so that the rotating stability of the roller 11 is improved.
When the wire straightening device is used, an unreeled wire 14 penetrates through the space between the cambered structures of the rollers 11 on the upper roller mounting plate 5 and the lower roller mounting plate 9 and then enters the packaging equipment through the wire holes 2, the up-down moving distance of the upper roller mounting plate 5 can be adjusted by rotating the adjusting nut 7, so that the distance between the upper roller mounting plate 5 and the lower roller mounting plate 9 is adjusted to adapt to the passing of the wires 14 with different wire diameters, and when the wires are pulled by a traction mechanism in the packaging equipment, the rollers 11 on the upper roller mounting plate 5 and the lower roller mounting plate 9 straighten the wires 14 and apply certain tension. The wire tension device is convenient to use, and when the roller 11 on the upper roller mounting plate 5 extrudes the wire 14, the generated reaction force can push the upper roller mounting plate 5 to move upwards against the resistance of the spring 8, so that the elastic extrusion is not easy to damage the wire and can keep certain tension.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a lead frame for semiconductor device encapsulation, includes line frame main part, is equipped with the line hole of leading-in wire in the line frame main part, its characterized in that: the outer side of the wire rack main body is provided with a horizontal upper transverse plate and a horizontal lower transverse plate, the upper transverse plate is provided with three vertical holes with equal horizontal spacing, three guide rods penetrate through the lower parts of the vertical holes to be connected with a horizontal upper roller mounting plate, and springs are sleeved on the guide rods between the upper surface of the upper roller mounting plate and the lower surface of the upper transverse plate; the upper part of the guide rod positioned in the middle part is provided with threads and is connected with an adjusting nut through the threads; the lower transverse plate is upwards connected with a horizontal lower roller mounting plate through a rod piece; the upper roller mounting plate and the lower roller mounting plate are respectively provided with roller shafts which are arranged side by side in the horizontal direction on the side surface, and rollers are arranged on the roller shafts; the middle part of the roller is of an inwards concave cambered surface structure.
2. The lead frame for a semiconductor device package according to claim 1, wherein: the upper part of the adjusting nut is fixedly connected with an adjusting handle.
3. The lead frame for a semiconductor device package according to claim 2, wherein: and the upper part of the adjusting handle is provided with a rotation angle scale mark.
4. The lead frame for a semiconductor device package according to claim 1, wherein: a gasket is arranged between the upper surface of the upper transverse plate and the adjusting nut and is installed on the upper surface of the upper transverse plate through a bolt.
5. The lead frame for a semiconductor device package according to claim 1, wherein: the roller is provided with a bearing at each end of the cambered surface structure and connected with the roller shaft.
6. The lead frame for a semiconductor device package according to claim 1, wherein: the cross section of the guide rod is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220045931.3U CN216752648U (en) | 2022-01-10 | 2022-01-10 | Lead frame for packaging semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220045931.3U CN216752648U (en) | 2022-01-10 | 2022-01-10 | Lead frame for packaging semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216752648U true CN216752648U (en) | 2022-06-14 |
Family
ID=81912052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220045931.3U Active CN216752648U (en) | 2022-01-10 | 2022-01-10 | Lead frame for packaging semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216752648U (en) |
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2022
- 2022-01-10 CN CN202220045931.3U patent/CN216752648U/en active Active
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